STTH3R06RL

STTH3R06 Datasheet 600 V - 3 A high efficiency ultrafast diode Features A K A A K K SMB SMC • • • • • • Ultrafast switching Low forwarded voltage drop Low thermal resistance Low leakage current (platinium doping) Planar technology ECOPACK compliant Applications A • • K Switching diode Auxiliary power supply Description The STTH3R06, which uses ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. DO-201AD Product status STTH3R06 Product summary Symbol Value IF(AV) 3A VRRM 600 V T j(max.) 175 °C VF(typ.) 1.00 V trr(max.) 35 ns DS3697 - Rev 4 - October 2021 For further information contact your local STMicroelectronics sales office. www.st.com STTH3R06 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) Repetitive peak reverse voltage 10 A 3 A IF(AV) Average forward current δ = 0.5, square wave IFSM Surge non repetitive forward current Tstg Storage temperature range Tj DO-201AD TL = 80 °C SMB TL = 55 °C SMC TL = 80 °C DO-201AD 55 tp = 10 ms sinusoidal SMB / SMC A 45 -65 to +175 °C +175 °C Maximum operating junction temperature Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Junction to lead Rth(j-a) Junction to ambient Lead length = 10 mm Max. value SMC 20 SMB 25 °C/W 20 DO-201AD Unit 75 For more information, refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter IR(1) Reverse leakage current VF(2) Forward voltage drop Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C Min. VR = VRRM IF = 3 A Typ. - 3 15 - Max. 100 1.7 1.0 1.25 Unit µA V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 1.03 x IF(AV) + 0.09 x IF2(RMS) For more information, refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS3697 - Rev 4 page 2/14 STTH3R06 Characteristics Table 4. Dynamic characteristics (Tj = 25 °C unless otherwise stated) Symbol Test conditions Min. Typ. Max. Unit IF = 0.5 A, Irr = 0.25 A, IR = 1 A - IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V - Forward recovery time IF = 3 A, dIF/dt = 100 A/µs, VFR = 1.1 VF(max.) - 100 ns Forward recovery voltage IF = 3 A, dIF/dt = 100 A/µs - 10 V trr Reverse recovery time tfr VFP DS3697 - Rev 4 Parameters 30 35 ns page 3/14 STTH3R06 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Conduction losses versus average current 5.0 P(W) Figure 2. Forward voltage drop versus forward current 50 4.5 δ = 0.1 δ = 0.05 δ = 0.2 δ = 0.5 45 4.0 35 3.0 30 2.5 25 2.0 20 1.5 Tj=150°C (maximum values) 40 δ=1 3.5 Tj=150°C (typical values) Tj=25°C (maximum values) 15 T 1.0 10 0.5 δ=tp/T IF(AV) (A) 0.0 5 tp VFM(V) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Figure 3. Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit FR4, Lleads = 10 mm, SCU=1cm2) 0.0 0.5 1.0 1.5 2.0 3.0 3.5 4.0 Figure 4. Peak reverse recovery current versus dIF/dt (typical values) 13 12 0.9 11 0.8 10 VR=400V Tj=125°C IF=2 x IF(AV) 9 0.7 IF=IF(AV) 8 0.6 IF=0.5 x IF(AV) 7 SMC SCu = 1cm2 0.5 2.5 IRM(A) Zth(j-a) /Rt h(j-a) 1.0 6 IF=0.25 x IF(AV) 5 0.4 SMB 2 SCu = 1cm 0.3 0.2 IFM(A) 4 3 DO-201AD Lleads = 10mm Single pulse 0.1 2 1 t p (s) 0.0 1.E-01 1.E+00 dI F/dt(A/µs) 0 1.E+01 1.E+02 1.E+03 Figure 5. Reverse recovery time versus dIF/dt (typical values) 0 450 VR=400V Tj=125°C 100 150 200 250 350 400 450 500 Qrr (nC) VR=400V Tj=125°C 400 350 IF=2 x IF(AV) 300 Figure 6. Reverse recovery charges versus dIF/dt (typical values) t rr (ns) 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 50 IF=2 x IF(AV) 300 IF=IF(AV) 250 IF=0.5 x IF(AV) IF=IF(AV) 200 IF=0.5 x IF(AV) 150 100 50 dI F/dt(A/µs) 0 50 DS3697 - Rev 4 100 150 200 250 300 dI F/dt(A/µs) 0 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500 page 4/14 STTH3R06 Characteristics (curves) Figure 7. Softness factor versus dIF/dt (typical values) Figure 8. Relative variations of dynamic parameters versus junction temperature S factor 3.0 1.0 IF=IF(AV) VR=400V Tj=125°C 2.5 S factor 0.9 IRM 0.8 0.7 2.0 0.6 1.5 QRR 0.5 0.4 1.0 0.3 IF=IF(AV) VR=400V Reference: Tj=125°C 0.2 0.5 0.1 dI F/dt(A/µs) 0.0 0 50 100 150 200 250 300 Tj (°C) 0.0 350 400 450 500 Figure 9. Transient peak forward voltage versus dIF/dt (typical values) 25 50 75 100 125 Figure 10. Forward recovery time versus dIF/dt (typical values) VFP(V) t fr (ns) 200 20 IF=IF(AV) Tj=125°C 18 16 160 14 140 12 120 10 100 8 80 6 60 4 40 2 20 dI F/dt(A/µs) 0 0 20 IF=IF(AV) VFR=1.1 x VF max. Tj=125°C 180 40 60 80 100 120 dI F/dt(A/µs) 0 140 160 180 200 Figure 11. Junction capacitance versus reverse voltage applied (typical values) 0 20 40 60 80 100 120 140 160 180 200 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (typical values) (SMB) C(pF) Rth(j-a) (°C/W) 100 200 F=1MHz VOSC=30mVRMS Tj=25°C Epoxy p ri nted ci rcui t boa rd FR4, coppe r t hi ckness: 35 µm SMB 150 10 100 50 S(Cu)(cm²) VR(V) 1 1 DS3697 - Rev 4 10 0 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 5/14 STTH3R06 Characteristics (curves) Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (typical values) (SMC) Figure 13. Thermal resistance versus lead length (DO-201AD) Rt h (°C/W) Rth(j-a) (°C/W) 160 90 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm DO-201AD R 80 140 th(j - a) 70 SMC 120 60 100 50 80 40 60 Rth(j-l) 30 40 20 20 10 0 5 DS3697 - Rev 4 SCu (cm²) L leads (mm) 10 15 0 20 25 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 6/14 STTH3R06 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 DO-201AD package information • Epoxy meets UL 94, V0 Figure 15. DO-201AD package outline B A E Note 1 B E Note 1 ØD Note 2 ØC Table 5. DO-201AD package mechanical data Dimensions Millimeters Ref. Min. A B 25.40 Inches (for reference only) Typ. Max. - 9.50 - Min. 1.000 Typ. Max. - 0.374 - C - 5.30 - 0.209 D(1) - 1.30 - 0.051 E - 1.25 Note 2(2) 15.00 0.049 0.590 1. The lead diameter D is not controlled over zone E 2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”) DS3697 - Rev 4 page 7/14 STTH3R06 SMB package information 2.2 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 16. SMB package outline E1 D E A1 C A2 L b Table 6. SMB package mechanical data Dimensions Millimeters Ref. DS3697 - Rev 4 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 page 8/14 STTH3R06 SMB package information Figure 17. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS3697 - Rev 4 page 9/14 STTH3R06 SMC package information 2.3 SMC package information • Epoxy meets UL94, V0 Figure 18. SMC package outline E1 D E A1 A2 b C L E2 Table 7. SMC package mechanical data Dimensions Millimeters Ref. DS3697 - Rev 4 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 2.90 3.20 0.1142 0.1260 c 0.15 0.40 0.0059 0.0157 D 5.55 6.25 0.2185 0.2461 E 7.75 8.15 0.3051 0.3209 E1 6.60 7.15 0.2598 0.2815 E2 4.40 4.70 0.1732 0.1850 L 0.75 1.50 0.0295 0.0591 page 10/14 STTH3R06 SMC package information Figure 19. SMC recommended footprint 1.54 (0.061) 5.11 (0.201) 1.54 (0.061) 3.14 (0.124) 8.19 (0.323) millimeters (inches) DS3697 - Rev 4 page 11/14 STTH3R06 Ordering information 3 Ordering information Table 8. Ordering information DS3697 - Rev 4 Order code Marking Package Weight Base qty. Delivery mode STTH3R06 STTH3R06 DO-201AD 1.16 g 600 Ammopack STTH3R06-RL STTH3R06 DO-201AD 1.16 g 1900 Tape and reel STTH3R06U 3R6U SMB 0.107 g 2500 Tape and reel STTH3R06S R6S SMC 0.245 g 2500 Tape and reel page 12/14 STTH3R06 Revision history Table 9. Document revision history Date DS3697 - Rev 4 Revision Changes Mar-2003 1 First issue 07-Sep-2004 2 SMB and SMC packages added 14-Oct-2005 3 Changed marking of STTH3R06U from R06U to 3R6U on page 1. Added ECOPACK statement. 21-Oct-2021 4 Updated pin names. Minor text changes. page 13/14 STTH3R06 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved DS3697 - Rev 4 page 14/14