STTH4R02-Y
Automotive ultrafast recovery diode
Datasheet - production data
Description
A
K
A
This device uses ST's new 200 V planar Pt
doping technology, and it is especially suited for
switching mode base drive and transistor circuits.
A
K
K
SMB
Packaged in SMB, SMC and DPAK, it is intended
for use in low voltage, high frequency inverters,
freewheeling and polarity protection in
automotive applications.
SMC
K
Table 1: Device summary
NC
Symbol
Value
IF(AV)
4A
VRRM
200 V
Features
Tj (max.)
175 °C
VF (typ.)
0.76 V
trr (typ.)
16 ns
A
DPAK
Very low conduction losses
Negligible switching losses
Low forward and reverse recovery times
High junction temperature
PPAP capable
AEC-Q101 qualified
April 2016
DocID17391 Rev 2
This is information on a product in full production.
1/14
www.st.com
Characteristics
1
STTH4R02-Y
Characteristics
Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol
Parameter
VRRM
Repetitive peak reverse voltage
IF(RMS)
Forward rms current
Tj = -40 °C to + 175 °C
DPAK
Tc = 160 °C
SMB, SMC
Tlead = 95 °C
Value
Unit
200
V
10
A
4
A
70
A
IF(AV)
Average forward current
δ = 0.5, square wave
IFSM
Surge non repetitive
forward current
Tstg
Storage temperature range
-65 to +175
°C
Maximum operating junction temperature(1)
-40 to +175
°C
Tj
tp = 10 ms sinusoidal
Notes:
(1)(dP
tot/dTj)
< (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 3: Thermal parameters
Symbol
Parameter
Maximum
Rth(j-c)
Junction to case
DPAK
3.5
Rth(j-l)
Junction to lead
SMB, SMC
20
Unit
°C/W
Table 4: Static electrical characteristics
Symbol
Parameter
Test conditions
IR(1)
Reverse leakage current
VF(2)
Forward voltage drop
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 150 °C
VR = VRRM
IF = 4 A
Notes:
(1)Pulse
test: tp = 5 ms, δ < 2%
(2)Pulse
test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.67 x IF(AV) + 0.04 IF2(RMS)
2/14
DocID17391 Rev 2
Min.
Typ.
-
Max.
3
-
2
20
-
0.95
1.05
-
0.76
0.83
Unit
µA
V
STTH4R02-Y
Characteristics
Table 5: Dynamic characteristics
Symbol
Parameters
Reverse
recovery time
trr
1.1
Test conditions
IRM
Reverse
recovery
current
trr
Reverse
recovery time
Qrr
Reverse
recovery
charges
Tj = 25 °C
Min.
Typ.
Max.
IF = 1 A; dIF/dt = -50 A/μs;
VR = 30 V
-
24
30
IF = 1 A; dIF/dt = -100 A/μs;
VR = 30 V
-
16
20
-
4.4
5.5
-
27
ns
-
60
nC
ns
IF = 4 A; dIF/dt = -200 A/μs;
VR = 160 V
Tj = 125 °C
Unit
A
Characteristics (curves)
Figure 2: Forward voltage drop versus forward
current (typical values)
Figure 1: Peak current versus duty cycle
IFM(A)
50
IM(A)
1.0E+02
T
45
40
Tj=150°C
1.0E+01
δ= tp/T
35
tp
P=5W
30
25
Tj=25°C
1.0E+00
P=2W
20
15
10
δ
5
1.0E-01
P=1W
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
VFM (V)
1.0
1.0E-02
0.0
Figure 3: Forward voltage drop versus forward
current (maximum values)
1.0E+02
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Figure 4: Relative variation of thermal impedance,
junction to case, versus pulse duration
IFM(A)
1.0
Tj =150°C
Zth(j-c)/Rth(j-c)
1.0E+01
DPAK
Tj =25°C
1.0E+00
Single pulse
1.0E-01
t (s)
P
VFM(V)
1.0E-02
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.1
1.E-03
1.E-02
1.E-01
1.E+00
3.5
DocID17391 Rev 2
3/14
Characteristics
STTH4R02-Y
Figure 5: Relative variation of thermal impedance,
junction to ambient, versus pulse duration (SMB)
Figure 6: Relative variation of thermal impedance,
junction to ambient, versus pulse duration (SMC)
Zth(j-a)/Rth(j-a)
1.0
0.9
1.0
SMB
S CU = 1 cm²
0.8
Zth(j-a)/Rth(j-a)
0.9
SMC
SCU = 1 cm²
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
0.1
0.1
t (s)
P
0.0
1.E-01
1.E+00
1.E+01
1.E+02
120
OSC
1.E+01
1.E+02
1.E+03
Figure 8: Reverse recovery charges versus dlF/dt
(typical values)
C(pF)
F = 1 MHz
V
= 30 mV
1.E+00
1.E+03
Figure 7: Junction capacitance versus reverse
applied voltage (typical values)
100
tP(s)
0.0
1.E-01
QRR(nC)
I =4A
F
V R = 160 V
100
RMS
T = 125 °C
j
T = 25 °C
j
80
60
T = 25 °C
j
40
20
VR(V)
10
1
10
100
Figure 9: Reverse recovery time versus dlF/dt
(typical values)
70
0
50
100
150
200
250
300
350
400
450
500
Figure 10: Peak reverse recovery current versus
dlF/dt (typical values)
10
t
(ns)
80 RR
dl /dt (A/µs)
F
0
1000
IRM(A)
IF = 4 A
VR = 160 V
IF = 4 A
VR= 160 V
8
60
50
40
Tj = 125 °C
6
Tj = 25 °C
Tj = 125 °C
4
30
20
10
T j = 25 °C
2
dlF/dt (A/µs)
0
10
100
1000
dlF/dt (A/µs)
0
0
4/14
DocID17391 Rev 2
50
100
150
200
250
300
350
400
450
500
STTH4R02-Y
Characteristics
Figure 11: Dynamic parameters versus junction
temperature
Figure 12: Thermal resistance, junction to ambient,
versus copper surface under tab
Rth(j-a) (°C/W)
100
1.4
DPAK
QRR; IRM [Tj] / QRR; IRM [Tj = 125 °C]
90
IF = 4 A
VR = 160 V
1.2
80
70
1.0
IRM
60
0.8
50
Q RR
40
0.6
30
0.4
10
dlF/dt (A/µs)
0.0
25
50
75
100
125
0
150
5
10
15
20
25
30
35
Rth(j-a)(°C/W)
Epoxy printed board FR4, copper thickness = 35 µm
Epoxy printed board FR4, copper thickness = 35 µm
40
Figure 14: Thermal resistance, junction to ambient,
versus copper surface under each lead
160
Rth(j-a)(°C/W)
180
SCu(cm²)
0
Figure 13: Thermal resistance, junction to ambient,
versus copper surface under each lead
200
Epoxy printed board FR4, e CU= 35 µm
20
0.2
SMC
140
SMB
120
160
140
100
120
80
100
80
60
60
40
40
20
S CU(cm²)
20
SCU(cm²)
0
0
1
2
3
4
5
6
7
8
9
10
0
0
DocID17391 Rev 2
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2
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Package information
2
STTH4R02-Y
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1
DPAK package information
Figure 15: DPAK package outline
6/14
DocID17391 Rev 2
STTH4R02-Y
Package information
Table 6: DPAK mechanical data
Dimensions
Dim.
Millimeters
Min.
Typ.
Inches
Max.
Min.
Typ.
Max.
A
2.20
2.40
0.087
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
b
0.64
0.90
0.025
0.035
b4
5.20
5.40
0.205
0.213
c
0.45
0.60
0.018
0.024
c2
0.48
0.60
0.019
0.024
D
6.00
6.20
0.236
0.244
D1
4.95
5.25
0.201
E
6.40
6.60
0.252
E1
4.60
4.70
4.80
0.181
0.185
0.189
e
2.16
2.28
2.40
0.085
0.090
0.094
e1
4.40
4.60
0.173
0.181
H
9.35
10.10
0.368
0.398
L
1.00
1.50
0.039
0.059
(L1)
2.60
2.80
3.00
0.102
0.110
0.118
L2
0.65
0.80
0.95
0.026
0.031
0.037
L4
0.60
1.00
0.024
R
V2
5.10
0.20
0°
0.195
0.207
0.260
0.039
0.008
8°
DocID17391 Rev 2
0°
8°
7/14
Package information
STTH4R02-Y
Figure 16: DPAK recommended footprint (dimensions are in mm)
8/14
DocID17391 Rev 2
STTH4R02-Y
2.2
Package information
SMC package information
Figure 17: SMC package outline
Table 7: SMC package mechanical data
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.0748
0.0965
A2
0.05
0.20
0.0020
0.0079
b
2.90
3.20
0.1142
0.1260
c
0.15
0.40
0.0059
0.0157
D
5.55
6.25
0.2185
0.2461
E
7.75
8.15
0.3051
0.3209
E1
6.60
7.15
0.2598
0.2815
E2
4.40
4.70
0.1732
0.1850
L
0.75
1.50
0.0295
0.0591
DocID17391 Rev 2
9/14
Package information
STTH4R02-Y
Figure 18: SMC recommended Footprint
1.54
(0.061)
5.11
(0.201)
3.14
(0.124)
8.19
(0.323)
millimeters
(inches)
2.3
SMB package information
Figure 19: SMB package outline
10/14
DocID17391 Rev 2
1.54
(0.061)
STTH4R02-Y
Package information
Table 8: SMB package mechanical data
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.0748
0.0965
A2
0.05
0.20
0.0020
0.0079
b
1.95
2.20
0.0768
0.0867
c
0.15
0.40
0.0059
0.0157
D
3.30
3.95
0.1299
0.1556
E
5.10
5.60
0.2008
0.2205
E1
4.05
4.60
0.1594
0.1811
L
0.75
1.50
0.0295
0.0591
Figure 20: SMB recommended Footprint
1.62
0.064
2.60
(0.102)
1.62
0.064
2.18
(0.086)
5.84
(0.230)
millimeters
(inches)
DocID17391 Rev 2
11/14
Ordering information
3
STTH4R02-Y
Ordering information
Figure 21: Ordering information scheme
STTH 4 R 02 xxx
Ultrafast switching diode
Average forward current
4= 4A
Model R
Repetitive peak reverse voltage
02 = 200 V
Package
BY-TR = DPAK in tape and reel
UY = SMB in tape and reel
SY = SMC in tape and reel
Table 9: Ordering information
12/14
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STTH4R02BY-TR
STTH4 R02BY
DPAK
0.320 g
2500
Tape and reel
STTH4R02UY
4R2UY
SMB
0.110 g
2500
Tape and reel
STTH4R02SY
4R2SY
SMC
0.243 g
2500
Tape and reel
DocID17391 Rev 2
STTH4R02-Y
4
Revision history
Revision history
Table 10: Document revision history
Date
Revision
03-Dec-2010
1
First issue
2
Added device in DPAK.
Updated features and description in cover page.
Updated Table 2: "Absolute ratings (limiting values at 25 °C, unless
otherwise specified)", Table 3: "Thermal parameters" and Table 5:
"Dynamic characteristics".
Updated Figure 2: "Forward voltage drop versus forward current
(typical values)" and Figure 3: "Forward voltage drop versus forward
current (maximum values)".
Updated Section 4: "Ordering information".
14-Apr-2016
Changes
DocID17391 Rev 2
13/14
STTH4R02-Y
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14/14
DocID17391 Rev 2
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