STTH4R02
Ultrafast recovery diode
Datasheet production data
Description
$
.
The STTH4R02 uses ST's new 200 V planar Pt
doping technology, and it is specially suited for
switching mode base drive and transistor circuits.
$
.
$
.
60%
Packaged in DPAK, SMB and SMC, this device is
intended for use in low voltage, high frequency
inverters, freewheeling and polarity protection.
60&
Table 1. Device summary
.
.
1&
1&
$
$
'3$.
Symbol
Value
IF(AV)
4A
VRRM
200 V
VF (typ)
0.76 V
Tj (max)
175 °C
trr (typ)
16 ns
Features
Negligible switching losses
High junction temperature
Very low conduction losses
Low forward and reverse recovery times
ECOPACK®2 compliant component for DPAK
on demand
November 2016
This is information on a product in full production.
DocID12360 Rev 6
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www.st.com
14
Characteristics
1
STTH4R02
Characteristics
Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol
Parameter
VRRM
Repetitive peak reverse voltage
IF(RMS)
Forward rms current
Unit
200
V
DPAK
10
SMB / SMC
70
A
Average forward current,
δ = 0.5, square wave
DPAK
IF(AV)
Tc = 160 °C
SMB / SMC
TL = 95 °C
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
Tstg
Storage temperature range
Maximum operating junction temperature
Tj
Value
4
A
70
A
-65 to +175
°C
175
°C
Max. value
Unit
Table 3. Thermal parameters
Symbol
Parameter
Rth(j-c)
Junction to case
DPAK
3.5
Rth(j-l)
Junction to lead
SMB / SMC
20
°C/W
Table 4. Static electrical characteristics
Symbol
IR(1)
VF
(2)
Parameter
Reverse leakage current
Test conditions
Tj = 25 °C
Tj = 125 °C
Forward voltage drop
Tj = 25 °C
Tj = 150 °C
Min.
-
VR = VRRM
IF = 12 A
IF = 4 A
µA
20
-
1.15
1.25
-
0.95
1.05
-
0.76
0.83
To evaluate the conduction losses, use the following equation:
DocID12360 Rev 6
Unit
3
2
1. Pulse test: tp = 5 ms, < 2%
P = 0.67 x IF(AV) + 0.04 x IF2(RMS)
Max.
-
2. Pulse test: tp = 380 µs, < 2%
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Typ.
V
STTH4R02
Characteristics
Table 5. Dynamic electrical characteristics
Symbol
trr
IRM
tfr
Parameter
Reverse recovery time
Reverse recovery current
Tests conditions
IF = 1 A
dIF/dt = -50 A/µs
VR = 30 V
-
IF = 1 A
dIF/dt = -100 A/µs
VR = 30 V
-
16
20
IF = 4 A
Tj = 125 °C dIF/dt = -200 A/µs
VR = 160 V
-
4.4
5.5
IF = 4 A
dIF/dt = 50 A/µs
VFR = 1.1 x VFmax
-
80
ns
IF = 4 A
dIF/dt = 50 A/µs
-
1.6
V
Tj = 25 °C
Forward recovery time
Tj = 25 °C
VFP
Forward recovery voltage
Min. Typ. Max. Unit
DocID12360 Rev 6
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30
ns
A
3/14
Characteristics
STTH4R02
Figure 1. Peak current versus duty cycle
Figure 2. Forward voltage drop versus forward
current (typical values)
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Figure 3. Forward voltage drop versus forward
current (maximum values)
Figure 4. Relative variation of thermal
impedance, junction to case, versus pulse
duration
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Figure 5. Relative variation of thermal
impedance, junction to ambient, versus pulse
duration (SMB)
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Figure 6. Relative variation of thermal
impedance, junction to ambient, versus pulse
duration (SMC)
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DocID12360 Rev 6
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STTH4R02
Characteristics
Figure 7. Junction capacitance versus reverse
applied voltage (typical values)
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Figure 8. Reverse recovery charges versus
dIF/dt (typical values)
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Figure 11. Dynamic parameters versus junction
temperature (reference: Tj = 125 °C)
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Figure 12. Thermal resistance, junction to
ambient, versus copper surface under each
lead
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Figure 10. Peak reverse recovery current
versus dIF/dt (typical values)
Figure 9. Reverse recovery time versus dIF/dt
(typical values)
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DocID12360 Rev 6
5/14
Characteristics
STTH4R02
Figure 13. Thermal resistance, junction to
ambient, versus copper surface under each
lead
Figure 14. Thermal resistance, junction to
ambient, versus copper surface under tab
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DocID12360 Rev 6
STTH4R02
2
Package information
Package information
Epoxy meets UL94,V0
Cooling method: by conduction (C)
Band indicates cathode
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1
DPAK package information
Figure 15. DPAK package outline
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Note:
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This package drawing may slightly differ from the physical package. However, all the
specified dimensions are guaranteed.
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Package information
STTH4R02
Table 6. DPAK package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
Inches
Max.
Min.
Typ.
Max.
A
2.18
2.40
0.085
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
b
0.64
0.90
0.025
0.035
b4
4.95
5.46
0.194
0.214
c
0.46
0.61
0.018
0.024
c2
0.46
0.60
0.018
0.023
D
5.97
6.22
0.235
0.244
D1
4.95
5.60
0.194
0.220
E
6.35
6.73
0.250
0.264
E1
4.32
5.50
0.170
0.216
e
2.28
0.090
e1
4.40
4.70
0.173
0.185
H
9.35
10.40
0.368
0.409
L
1.00
1.78
0.039
0.070
L2
1.27
0.050
L4
0.60
1.02
0.023
0.040
V2
-8°
+8°
-8°
8°
Figure 16. DPAK footprint dimensions (in mm)
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STTH4R02
2.2
Package information
SMB package information
Figure 17. SMB package outline
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Table 7. SMB package mechanical data
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
L
0.75
1.50
0.030
0.059
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Package information
STTH4R02
Figure 18. SMB footprint, dimensions in mm (inches)
10/14
DocID12360 Rev 6
STTH4R02
2.3
Package information
SMC package information
Figure 19. SMC package outline
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E
11/14
Package information
STTH4R02
Table 8. SMC package mechanical data
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
(1)
b
2.90
3.20
0.114
0.126
c(1)
0.15
0.40
0.006
0.016
D
5.55
6.25
0.218
0.246
E
7.75
8.15
0.305
0.321
E1
6.60
7.15
0.260
0.281
E2
4.40
4.70
0.173
0.185
L
0.75
1.50
0.030
0.059
1. Dimensions b and c apply to plated leads
Figure 20. SMC footprint, dimensions in mm (inches)
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STTH4R02
3
Ordering information
Ordering information
Table 9. Ordering information
4
Order code
Marking
Package
Weight
Base qty Delivery mode
STTH4R02B-TR
STTH 4R02
DPAK
0.32 g
2500
Tape and reel
STTH4R02U
4R2U
SMB
0.110 g
2500
Tape and reel
STTH4R02S
4R2S
SMC
0.243 g
2500
Tape and reel
Revision history
Table 10. Document revision history
Date
Revision
Changes
03-May-2006
1
First issue.
10-Oct-2006
2
Added SMC package
13-Apr-2010
3
Updated ECOPACK statement. Updated dimensions
tables for SMB and SMC.
01-Jul-2010
4
Separated junction to lead values from junction to case
values in Table 3.
20-Nov-2014
5
Removed TO-220AC, TO-220FPAC and DO-201AB
package informations.
02-Nov-2016
6
Updated DPAK package information and reformatted to
current standard.
DocID12360 Rev 6
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STTH4R02
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