STTH5L06FP

STTH5L06 Turbo 2 ultrafast high voltage rectifier Main product characteristics IF(AV) VRRM IR (max) Tj (max) VF (max) trr (max) 5A 600 V 125 µA / 150 µA 175 °C 1.05 V 95 ns K A K K A K TO-220AC STTH5L06D TO-220FPAC STTH5L06FP Features and benefits A ■ ■ ■ ■ Ultrafast switching Low reverse recovery current Reduces switching & conduction losses Low thermal resistance NC DPAK STTH5L06B DO-201AD STTH5L06 Description The STTH5L06, which uses ST Turbo 2 600V technology, is specially suited as boost diode in discontinuous or critical mode power factor corrections. This device, available in TO-220AC, TO-220FPAC DPAK and DO-201AD, is also intended for use as a free wheeling diode in power supplies and other power switching applications Order codes Part number STTH5L06 STTH5L06RL STTH5L06D STTH5L06B STTH5L06B-TR STTH5L06FP Marking STTH5L06 STTH5L06 STTH5L06D STTH5L06B STTH5L06B STTH5L06FP March 2007 Rev 2 1/10 www.st.com 10 Characteristics STTH5L06 1 Table 1. Symbol VRRM IF(RMS) Characteristics Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage RMS forward current TO-220AC, DPAK IF(AV) Average forward current DO-210AD TO-220FPAC IFRM Repetitive peak forward current Surge non repetitive forward current TO-220AC, TO-220FPAC, DO-201AD DPAK Tc = 150 °C TI = 50° C Tc = 135 °C δ = 0.5 δ = 0.5 δ = 0.5 65 90 110 60 - 65 + 175 + 175 °C °C A A 5 A Value 600 20 10 Unit V A tp = 5 µs, F = 5 kHz square TO-220AC, TO-220FPAC IFSM tp = 10 ms Sinusoidal DO-201AD DPAK Tstg Tj Storage temperature range Maximum operating junction temperature Table 2. Symbol Rth(j-c) Rth(j-l) Rth(j-a) Thermal parameters Parameter TO-220AC, DPAK TO-220FPAC L = 10 mm DO-201AD 75 Maximu m 3.5 6.0 20 °C/W Unit Junction to case Junction to lead Junction to ambient (1) 1. With recommended pad layout (see Figure 15) Table 3. Symbol Static electrical characteristics Parameter Tests conditions Tj = 25°C Min. Typ. Max. 5 10 25 125 150 1.3 V 0.85 1.05 µA Unit IR Reverse leakage current VR = 600 V TO-220AC, DPAK, Tj = 150°C TO-220FPAC DO-201AD Tj = 25°C Tj = 150°C VF Forward voltage drop IF = 5 A To evaluate the maximum conduction losses use the following equation: P = 0.89 x IF(AV) + 0.033 IF2(RMS) 2/10 STTH5L06 Table 4. Symbol trr tfr VFP Characteristics Dynamic electrical characteristics Parameter Tests conditions IF = 1 A dIF/dt = - 50 A/µs VR = 30V IF = 5 A dIF/dt = 100 A/µs VFR = 1.1 x VFmax IF = 5 A dIF/dt = 100 A/µs Tj = 25°C Tj = 25°C Tj = 25°C Min. Typ. 65 Max. 95 Unit ns Reverse recovery time Forward recovery time Forward recovery time 150 7 ns V Figure 1. P(W) 7 6 5 4 3 Conduction losses versus average Figure 2. current IFM(A) δ = 0.1 Forward voltage drop versus forward current δ = 0.2 δ = 0.5 100.0 Tj=150°C (maximum values) δ = 0.05 δ=1 10.0 Tj=150°C (typical values) Tj=25°C (maximum values) 1.0 2 T 1 IF(AV)(A) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 δ=tp/T 5.0 5.5 tp 0.1 6.0 0.0 0.5 1.0 VFM(V) 1.5 2.0 2.5 3.0 Figure 3. Relative variation of thermal Figure 4. impedance junction to case versus pulse duration (TO-220AC, DPAK) 1.0 0.9 0.8 0.7 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse δ = 0.2 δ = 0.1 δ = 0.5 Zth(j-c)/Rth(j-c) 0.6 0.5 0.4 0.3 δ = 0.5 δ = 0.2 δ = 0.1 T 0.2 0.1 T 0.1 0.0 1.E-03 1.E-02 tp(s) 1.E-01 δ=tp/T tp 0.0 1.E+00 1.E-03 Single pulse tp(s) 1.E-02 1.E-01 δ=tp/T 1.E+00 tp 1.E+01 3/10 Characteristics STTH5L06 Figure 5. Figure 6. Relative variation of thermal impedance junction ambient versus pulse duration (Epoxy FR4, Lleads = 10 mm) (DO-201AD) IRM(A) 8 VR=400V Tj=125°C Peak reverse recovery current versus dIF/dt (90% confidence) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 6 0.7 0.6 δ = 0.5 7 IF=2 x IF(AV) IF=IF(AV) 5 4 IF=0.25 x IF(AV) IF=0.5 x IF(AV) 0.5 0.4 0.3 0.2 δ = 0.1 δ = 0.2 3 T 2 1 0.1 0.0 Single pulse tp(s) 1.E+00 1.E+01 δ=tp/T 1.E+02 tp 0 1.E+03 0 10 20 30 dIF/dt(A/µs) 40 50 60 70 80 90 100 1.E-01 Figure 7. trr(ns) 1000 900 800 700 600 500 400 300 200 100 0 0 10 Reverse recovery time versus dIF/dt Figure 8. (90% confidence) Qrr(nC) 500 VR=400V Tj=125°C Reverse recovery charges versus dIF/dt (90% confidence) 450 400 350 VR=400V Tj=125°C IF=2 x IF(AV) IF=IF(AV) IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) 300 250 200 150 100 IF=0.5 x IF(AV) dIF/dt(A/µs) 20 30 40 50 60 70 80 90 100 50 0 0 10 20 30 dIF/dt(A/µs) 40 50 60 70 80 90 100 Figure 9. Softness factor versus dIF/dt (typical values) Figure 10. Relative variations of dynamic parameters versus junction temperature 1.25 S factor S factor 2.4 2.2 2.0 1.8 IF=IF(AV) VR=400V Tj=125°C 1.00 IRM 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 10 20 30 40 50 60 70 80 90 100 0.75 QRR 0.50 0.25 Tj(°C) dIF/dt(A/µs) 0.00 25 50 75 IF=IF(AV) VR=400V Reference: Tj=125°C 100 125 4/10 STTH5L06 Characteristics Figure 11. Transient peak forward voltage versus dIF/dt (90% confidence) VFP(V) 10 9 8 7 6 5 4 3 2 1 0 0 20 40 60 80 100 120 140 160 180 200 IF=IF(AV) Tj=125°C Figure 12. Forward recovery time versus dIF/dt (90% confidence) tfr(ns) 200 180 160 140 120 100 80 60 40 IF=IF(AV) VFR=1.1 x VF max. Tj=125°C dIF/dt(A/µs) 20 0 0 20 40 60 dIF/dt(A/µs) 80 100 120 140 160 180 200 Figure 13. Junction capacitance versus reverse voltage applied (typical values) C(pF) 100 F=1MHz VOSC=30mV Tj=25°C Figure 14. Thermal resistance junction to ambient versus copper surface under tab (epoxy FR4, eCU = 35 µm) (DPAK) Rth(j-a)(°C/W) 80 70 60 50 10 40 30 20 10 VR(V) 1 1 10 100 1000 SCU(cm²) 0 2 4 6 8 10 12 14 16 18 20 0 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, copper thickness: 35µm) (DO-201AD) Rth(j-a)(°C/W) 80 70 60 DO-201AD 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SCU(cm²) 5/10 Package information STTH5L06 2 Package information ■ ■ ■ ■ Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm (TO-220FPAC) / 0.55 Nm (TO-220AC) Maximum torque value: 1.0 Nm (TO-220FPAC) / 0.70 Nm (TO-220AC) TO-220AC dimensions Dimensions Ref. Millimeters Min. A H2 ØI L5 L7 L6 C A Table 5. Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 C D E F F1 G L2 F1 L9 L4 F D H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E G L5 L6 L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/10 STTH5L06 Package information Table 6. TO-220FPAC dimensions Dimensions Ref. Millimeters Min. A A H B Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 B D E Dia F L6 L2 L3 L5 F1 L4 D L7 F1 G G1 H L2 L3 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G E L4 L5 L6 L7 Dia. Table 7. DO-201AD dimensions Dimensions Ref. Millimeters Min. B Note 1 Inches Min. Max. 0.374 1.000 Max. 9.50 A E E Note 1 B A B 25.40 ØD Note 2 C D E Notes 5.30 1.30 1.25 0.209 0.051 0.049 ØC 1 - The lead diameter ø D is not controlled over zone E 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15mm) 7/10 Package information STTH5L06 Table 8. DPAK dimensions Dimensions Ref. Millimeters Min. A E B2 C2 L2 A Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 Max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 A1 A2 B B2 D H L4 B G A1 R C C2 R C D E A2 0.60 MIN. G H V2 L2 L4 V2 0.80 typ. 0.60 0° 1.00 8° 0.031 typ. 0.023 0° 0.039 8° Figure 16. DPAK footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STTH5L06 Ordering information 3 Ordering information Delivery mode Ammopack Tape & reel Tube Tube Tape & reel Tube Ordering code STTH5L06 STTH5L06RL STTH5L06D STTH5L06B STTH5L06B-TR STTH5L06FP Marking STTH5L06 Package Weight Base qty 600 DO-201AD STTH5L06 STTH5L06D STTH5L06B DPAK STTH5L06B STTH5L06FP TO-220FPAC TO-220AC 1.16 G 1900 1.9 g 0.3 g 2500 1.7 g 50 50 75 4 Revision history Date Nov-2001 31-Mar-2007 Revision 1A 2 Last release. Merge with TO-220AC, TO-220FPAC and DPAK version. Changes 9/10 STTH5L06 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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