STTH6010WY

STTH6010-Y Automotive ultrafast recovery - high voltage diode Datasheet - production data Description $ The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability like automotive applications. . $ These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. . '2 The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. Features  AEC-Q101 qualified Table 1. Device summary  Ultrafast, soft recovery IF(AV) 60 A  Very low conduction and switching losses VRRM 1000 V  High frequency and/or high pulsed current operation Tj (max.) 175 °C  High reverse voltage capability VF (typ) 1.3 V  High junction temperature trr (typ) 49 ns  ECOPACK®2 compliant component April 2015 This is information on a product in full production. DocID018924 Rev 2 1/9 www.st.com Characteristics 1 STTH6010-Y Characteristics Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Value Unit 1000 V 80 A IF(AV) Average forward current Tc = 75 °C, = 0.5, square wave 60 A IFRM Repetitive peak forward current tp = 5 µs, F = 5 kHz square 450 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 400 A Tstg Storage temperature range -65 to + 175 °C Operating junction temperature range -40 to + 175 °C Value Unit 0.78 °C/W Tj Table 3. Thermal parameters Symbol Rth(j-c) Parameter Junction to case Table 4. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Forward voltage drop Tj = 100 °C IF = 60 A 1. Pulse test: tp = 5 ms,  < 2% 2. Pulse test: tp = 380 µs,  < 2% To evaluate the conduction losses use the following equation: P = 1.3 x IF(AV) + 0.0067 IF2(RMS) DocID018924 Rev 2 Unit 20 µA - 20 - Tj = 150 °C 2/9 Typ. Max. VR = VRRM Tj = 25 °C VF(2) Min. 200 2.0 - 1.4 1.8 - 1.3 1.7 V STTH6010-Y Characteristics Table 5. Dynamic characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit IF = 1 A, dlF/dt = -50 A/µs, VR = 30 V, Tj = 25 °C - IF = 1 A, dlF/dt = -100 A/µs, VR = 30 V, Tj = 25 °C - 61 80 IF = 1 A, dlF/dt = -200 A/µs, VR = 30 V, Tj = 25 °C - 49 65 Reverse recovery current IF = 60 A, dlF/dt = -200 A/µs, VR = 600 V, Tj = 125 °C - 31 40 A S Softness factor IF = 60 A, dlF/dt = -200 A/µs, VR = 600 V, Tj = 125 °C - 1 tfr Forward recovery time IF = 60 A, dlF/dt = 100 A/µs, VFR = 1.5 x VFmax, Tj = 25 °C - 750 ns Forward recovery voltage IF = 60 A, dlF/dt = 100 A/µs, Tj = 25 °C - Reverse recovery time trr IRM VFP Figure 1. Conduction losses versus average current 115 4 ns V Figure 2. Forward voltage drop versus forward current ,)0$  3:       7M ƒ& 0D[LPXPYDOXHV      7M ƒ&   7\SLFDOYDOXHV  7M ƒ& 0D[LPXPYDOXHV     7   ,)$9 $            9)09   DocID018924 Rev 2       3/9 9 Characteristics STTH6010-Y Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Peak reverse recovery current versus dlF/dt (typical values) =WKMF5WKMF ,50$   6LQJOHSXOVH  9  9 5 7M ƒ&   , [, ) )$9 ,  , ) )$9     , )  [, )$9        W S V ( ( GO)GW$—V   (  ( Figure 5. Reverse recovery time versus dlF/dt (typical values)           Figure 6. Reverse recovery charges versus dlF/dt (typical values) W UU QV 4UU—&   95 9 7M ƒ&  ,) [,)$9  ,  [, ) )$9  95 9 7M ƒ&   ,) ,)$9   ,  , ) )$9    ,) [,)$9     ,  [, ) )$9  GO)GW$—V  GO)GW$—V              Figure 7. Softness factor versus dlF/dt (typical values)           Figure 8. Relative variations of dynamic parameters versus junction temperature 6IDFWRU   ,) [,)$9 95 9 7M ƒ&   ,) ,)$9 95 9 5HIHUHQFH7M ƒ& 6IDFWRU       ,50    W55 455  GO)GW$—V   4/9        7Mƒ&      DocID018924 Rev 2     STTH6010-Y Characteristics Figure 9. Transient peak forward voltage versus dlF/dt (typical values) Figure 10. Forward recovery times versus dlF/dt (typical values) WIUQV 9)39   ,) ,)$9 9)5 [9)PD[ ,) ,)$9 7M ƒ&  7M ƒ&             GO)GW$—V GO)GW$—V         Figure 11. Junction capacitance versus reverse voltage applied (typical values)       Figure 12. Threshold voltage versus junction temperature &S) 9W9   ) 0+] 926& P9506 7M ƒ&   0D[LPXPYDOXHV      7\SLFDOYDOXHV   959    7Mƒ&           Figure 13. Dynamic resistance versus junction temperature  5GPȍ   0D[LPXPYDOXHV        7\SLFDOYDOXHV   7Mƒ&        DocID018924 Rev 2 5/9 9 Package information 2 STTH6010-Y Package information  Epoxy meets UL94, V0  Cooling method: by conduction (C)  Recommended torque value: 0.80 N·m  Maximum torque value: 1.0 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 DO-247 package information Figure 14. DO-247 package outline 9 'LD 9 $ + / / / ) / / / ) ' 9 ) * 6/9 DocID018924 Rev 2 0 ( STTH6010-Y Package information Table 6. DO-247 package mechanical data Dimensions Ref. Inches(1) Millimeters Typ. Min. Max. A 4.85 D Min. Max. 5.15 0.191 0.203 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 0.078 0.094 F2 2.00 F3 G Typ. 0.078 2.00 2.40 10.90 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.145 0.169 0.559 0.582 0.078 0.118 0.139 0.143 L2 18.50 L3 0.728 14.20 14.80 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 V 5° 5° V2 60° 60° Dia. 3.55 3.65 1. Values in inches are converted from mm and rounded to 4 decimal digits. DocID018924 Rev 2 7/9 9 Ordering information 3 STTH6010-Y Ordering information Table 7. Ordering information 4 Order code Marking Package Weight Base qty. Delivery mode STTH6010WY STTH6010WY DO-247 4.4 g 30 Tube Revision history Table 8. Document revision history 8/9 Date Revision Changes 04-Nov-2011 1 Initial release. 22-Apr-2015 2 Added Figure 12 and Figure 13. Document updated to current standard. DocID018924 Rev 2 STTH6010-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved DocID018924 Rev 2 9/9 9