STTH802SFY
Datasheet
Automotive 200 V ultrafast recovery diode
Features
•
•
•
•
•
AEC-Q101 qualified
Very low conduction losses
Negligible switching losses
175 °C maximum junction temperature
VRRM guaranteed from -40 °C to 175 °C
•
•
Wettable flanks for automatic visual inspection
PPAP capable
•
ECOPACK®2 compliant component
Application
•
•
•
•
•
DC/DC converters
Reverse polarity protection
Snubber
Boost function
Freewheeling diode
Description
Product status link
STTH802SFY
Product summary
Symbol
Value
IF(AV)
8A
VRRM
200 V
Tj (max.)
175 °C
VF (typ.)
0.79 V
trr (typ.)
17 ns
The STTH802SFY ultrafast recovery diode has been designed for automotive
applications.
Packaged in PSMC (TO-277A), this device provides a high level of performance in a
compact and flat package which can withstand high operating junction temperature.
DS12467 - Rev 1 - July 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
STTH802SFY
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified with 2 anode terminals
short-circuited)
Symbol
Parameter
Value
Unit
200
V
8
A
150
A
VRRM
Repetitive peak reverse voltage (Tj = -40 °C to +175 °C)
IF(AV)
Average forward current
Tc = 145 °C , δ = 0.5 square pulse
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
Tstg
Storage temperature range
-65 to +175
°C
Operating junction temperature range(1)
-40 to +175
°C
Tj
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameters
Symbol
Parameter
Rth(j-c)
Junction to case
Typ.
Unit
2.4
°C/W
For more information, please refer to the following application note:
•
AN5088: Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics (anode terminals short-circuited)
Symbol
IR(1)
Parameter
Reverse leakage current
Test conditions
Tj = 25 °C
Tj = 125 °C
VR = VRRM
Tj = 25 °C
(2)
VF
Forward voltage drop
Tj = 125 °C
IF = 8 A
Tj = 150 °C
Min.
Typ.
Max.
-
Unit
6
µA
-
6
60
-
0.94
1.08
-
0.79
0.91
-
0.75
0.87
V
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.77 x IF(AV) + 0.018 x IF2(RMS)
For more information, please refer to the following application notes related to the power losses:
•
AN604: Calculation of conduction losses in a power rectifier
•
AN4021: Calculation of reverse losses in a power diode
Table 4. Dynamic electrical characteristics (Tj = 25°C, unless otherwise specified)
Symbol
trr
DS12467 - Rev 1
Parameter
Reverse recovery time
Test conditions
Min.
IF = 1.0 A, dIF/dt = -50 A/µs, VR = 30 V
-
IF = 1.0 A, dIF/dt = -100 A/µs, VR = 30 V
-
Typ.
Max.
35
17
22
Unit
ns
page 2/13
STTH802SFY
Characteristics
Symbol
DS12467 - Rev 1
Parameter
IRM
Reverse recovery current
Qrr
Reverse recovery charge
Test conditions
IF = 8 A, dlF/dt = -200 A/µs, VR = 160 V, Tj = 125 °C
Min.
Typ.
Max.
Unit
-
5.8
7.5
A
-
100
nC
page 3/13
STTH802SFY
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
10
P(W)
Figure 2. Forward voltage drop versus forward current
(typical values)
1.0E+02
δ = 0.1
δ = 0.2
IF (A)
δ=1
δ = 0.5
δ = 0.05
8
Tj = 150 °C
1.0E+01
6
Tj = 125 °C
Tj = 25 °C
1.0E+00
4
1.0E-01
T
2
tp
tp
=tp/T
δ
δ =tp/T
IF(AV)(A)
0
0
1
2
3
4
5
6
7
8
9
10
Figure 3. Forward voltage drop versus forward current
(maximum values)
1.0E+02
IF (A)
1.0E-02
0.0
1.0
1.5
2.0
Figure 4. Relative variation of thermal impedance junction
to case versus pulse duration
1.0
0.9
1.0E+01
VF(V)
0.5
Zth(j-c) /Rth(j-c)
PSMC (TO-277A)
0.8
Tj = 150 °C
Tj = 125 °C
0.7
0.6
Tj = 25 °C
1.0E+00
0.5
0.4
0.3
1.0E-01
0.2
0.1
1.0E-02
0.0
DS12467 - Rev 1
VF(V)
0.5
1.0
1.5
2.0
Single pulse
0.0
1.E-03
t P(s)
1.E-02
1.E-01
1.E+00
page 4/13
STTH802SFY
Characteristics (curves)
Figure 5. Peak reverse recovery current versus dIF/dt
(typical values)
IRM(A)
12
60
IF = IF(AV)
VR = 160 V
Tj = 125 °C
10
Figure 6. Reverse recovery time versus dIF/dt (typical
values)
t RR(ns)
IF = IF(AV)
VR = 160 V
Tj = 125 °C
50
8
40
6
30
4
20
2
10
dIF/dt(A/µs)
dI F/dt(A/µs)
0
0
0
100
200
300
400
500
Figure 7. Reverse recovery charges versus dIF/dt (typical
values)
QRR(nC)
180
100
200
300
400
500
Figure 8. Reverse recovery softness factor versus dIF/dt
(typical values)
SFACTOR
0.6
IF = IF(AV)
VR = 160 V
Tj = 125 °C
160
0
IF = IF(AV)
VR = 160 V
Tj = 125 °C
0.5
140
0.4
120
100
0.3
80
60
0.2
40
0.1
20
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
100
200
300
400
500
Figure 9. Relative variations of dynamic parameters
versus junction temperature
2.0
0
100
200
300
400
500
Figure 10. Junction capacitance versus reverse voltage
applied (typical values)
1000
IF = IF(AV)
VR = 160 V
Reference: Tj = 125 °C
1.6
0.0
C(pF)
F = 1 MHz
VOSC = 30 mVRMS
Tj = 25 °C
SFACTOR
1.2
100
0.8
IRM
0.4
QRR
T j (°C)
0.0
25
DS12467 - Rev 1
50
75
100
VR(V)
125
10
1
10
100
1000
page 5/13
STTH802SFY
Characteristics (curves)
Figure 11. Thermal resistance junction to ambient versus copper surface under tab (typical values, epoxy
printed board FR4, eCu = 35 µm) (PSMC (TO-277A))
120
Rth(j-a) (°C/W)
PSMC (TO-277A)
100
80
60
40
20
SCu (cm²)
0
0
DS12467 - Rev 1
1
2
3
4
5
6
7
8
9
10
page 6/13
STTH802SFY
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1
PSMC (TO277-A) package information
Figure 12. PSMC (TO-277A) package outline
Table 5. PSMC (TO-277A) package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
Max.
Min.
Typ.
Max.
A
1.00
1.10
1.20
0.039
0.043
0.047
b
1.05
1.20
1.35
0.041
0.047
0.053
b2
1.90
2.05
2.20
0.075
0.081
0.087
b4
DS12467 - Rev 1
Inches (for reference only)
0.75
0.029
c
0.15
0.23
0.40
0.006
0.009
0.016
D
4.45
4.60
4.75
0.175
0.181
0.187
D1
4.25
4.40
4.45
0.167
0.173
0.175
D2
3.40
3.60
3.70
0.134
0.142
0.146
E
6.35
6.50
6.65
0.250
0.256
0.262
E1
6.05
6.10
6.15
0.238
0.240
0.242
page 7/13
STTH802SFY
PSMC (TO-277A) package information
Dimensions
Ref.
E2
Millimeters
Inches (for reference only)
Min.
Typ.
Max.
Min.
Typ.
Max.
4.50
4.60
4.70
0.177
0.181
0.185
E3
3.94
1.55
e
2.13
0.084
e1
3.33
0.131
G
1.20
0.047
G1
0.70
0.027
L
0.90
1.05
1.24
0.035
L4
0.02
0.0008
L5
0.02
0.0008
0.041
0.049
Figure 13. PSMC (TO-277A) package footprint
DS12467 - Rev 1
page 8/13
STTH802SFY
PSMC (TO-277A) package information
Figure 14. PSMC (TO-277A) marking
Figure 16. Tape and reel orientation
Figure 15. Package orientation in reel
Figure 17. 13'' reel dimension values
DS12467 - Rev 1
Figure 18. Inner box dimension values
page 9/13
STTH802SFY
PSMC (TO-277A) package information
Figure 19. Tape outline
Table 6. Tape dimension values
Dimensions
Ref.
DS12467 - Rev 1
Millimeters
Min.
Typ.
Max.
D0
1.5
1.55
1.6
D1
1.5
F
5.45
5.5
5.55
K0
1.3
1.4
1.5
P0
3.9
4.0
4.1
P1
7.9
8.0
8.1
P2
1.95
2.0
2.05
W
11.7
12
12.3
page 10/13
STTH802SFY
Ordering information
3
Ordering information
Table 7. Ordering information
DS12467 - Rev 1
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STTH802SFY
TH802Y
PSMC (TO-277A)
90 mg
6000
Tape and Reel
page 11/13
STTH802SFY
Revision history
Table 8. Document revision history
DS12467 - Rev 1
Date
Version
07-Jul-2018
1
Changes
Initial release.
page 12/13
STTH802SFY
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products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
DS12467 - Rev 1
page 13/13
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