STTH812G-TR

STTH812 Ultrafast recovery - 1200 V diode Main product characteristics A K IF(AV) VRRM Tj VF (typ) trr (typ) 8A 1200 V 175° C 1.25 V 50 ns A K TO-220AC STTH812D A K TO-220FPAC STTH812FP Features and benefits ■ ■ ■ ■ ■ ■ Ultrafast, soft recovery Very low conduction and switching losses High frequency and/or high pulsed current operation High reverse voltage capability High junction temperature Insulated packages: – TO-220Ins Electrical insulation = 2500 VRMS Capacitance = 7 pF – TO-220FPAC Electrical insulation = 2000 VRMS Capacitance = 12 pF K A K TO-220Ins STTH812DI A NC D2PAK STTH812G Order codes Part Number Marking STTH812D STTH812G STTH812G STTH812FP STTH812DI STTH812D STTH812G STTH812G-TR STTH812FP STTH812DI Description The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. March 2006 Rev 1 www.st.com 1/11 11 Characteristics STTH812 1 Table 1. Symbol VRRM IF(RMS) Characteristics Absolute ratings (limiting values at 25° C, unless otherwise specified) Parameter Repetitive peak reverse voltage TO-220AC / D PAK / TO-220FPAC RMS forward current TO-220AC Ins TO-220AC / D2PAK IF(AV) Average forward current, δ = 0.5 TO-220FPAC TO-220AC Ins IFRM IFSM Tstg Tj Repetitive peak forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Tc = 140° C Tc = 75° C Tc = 115° C 100 80 -65 to + 175 175 A A °C °C 8 A 20 2 Value 1200 30 Unit V A tp = 5 µs, F = 5 kHz square tp = 10 ms Sinusoidal Table 2. Symbol Thermal parameters Parameter TO-220AC / D 2PAK Value 1.9 5.4 3.1 Unit Rth(j-c) Junction to case TO-220FPAC TO-220AC Ins °C/W Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Tj = 25° C VR = VRRM Min. Typ Max. 8 µA 5 50 2.2 IF = 8 A 1.30 1.25 2.0 1.9 V Unit VF (2) Forward voltage drop Tj = 125° C Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 1.5 x IF(AV) + 0.05 IF2(RMS) 2/11 STTH812 Table 4. Symbol Characteristics Dynamic characteristics Parameter Test conditions IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25° C IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25° C Reverse recovery current Softness factor Forward recovery time Forward recovery voltage IF = 8 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C IF = 8 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C dIF/dt = 50 A/µs IF = 8 A VFR = 1.5 x VFmax, Tj = 25° C IF = 8 A, dIF/dt = 50 A/µs, Tj = 25° C 7 50 14 2 400 ns V Min. Typ Max. 100 ns 70 21 A Unit trr Reverse recovery time IRM S tfr VFP Figure 1. P(W) 20 18 16 14 12 10 8 6 Conduction losses versus average current δ = 0.1 δ = 0.2 δ = 0.5 Figure 2. IFM(A) 80 70 Forward voltage drop versus forward current δ = 0.05 δ=1 60 50 40 30 Tj=150°C (typical values) Tj=25°C (maximum values) Tj=150°C (maximum values) T 4 2 0 0 1 2 3 4 5 6 7 8 9 10 20 10 IF(AV)(A) δ=tp/T tp 0 0.0 0.5 1.0 1.5 2.0 VFM(V) 2.5 3.0 3.5 4.0 4.5 5.0 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Single pulse TO-220AC D2PAK TO-220Ins Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse TO-220FPAC tp(s) 0.1 0.0 1.E-03 1.E-02 tp(s) 1.E-01 1.E+00 1.E+01 3/11 Characteristics STTH812 Figure 5. IRM(A) 35 30 25 20 15 10 5 VR=600V Tj=125°C Peak reverse recovery current versus dIF/dt (typical values) Figure 6. trr(ns) 500 450 Reverse recovery time versus dIF/dt (typical values) VR=600V Tj=125°C IF=2 x IF(AV) IF=2 x IF(AV) 400 IF=IF(AV) IF=0.5 x IF(AV) 350 300 250 200 150 100 IF=IF(AV) IF=0.5 x IF(AV) dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 50 0 0 50 100 150 dIF/dt(A/µs) 200 250 300 350 400 450 500 Figure 7. Qrr(µC) 3.0 VR=600V Tj=125°C Reverse recovery charges versus dIF/dt (typical values) Figure 8. S factor 4.0 3.5 Softness factor versus dIF/dt (typical values) IF ≤ 2xIF(AV) VR=600V Tj=125°C 2.5 IF=2 x IF(AV) 3.0 2.0 IF=IF(AV) 2.5 2.0 1.5 1.0 1.5 IF=0.5 x IF(AV) 1.0 0.5 dIF/dt(A/µs) 0.0 0 50 100 150 200 250 300 350 400 450 500 0.5 0 50 100 150 dIF/dt(A/µs) 200 250 300 350 400 450 500 Figure 9. Relative variations of dynamic parameters versus junction temperature IF=IF(AV) VR=600V Reference: Tj=125°C S factor Figure 10. Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 45 40 35 30 25 IF=IF(AV) Tj=125°C 2.25 2.00 1.75 1.50 1.25 1.00 trr 20 15 10 0.75 0.50 0.25 0.00 25 IRM QRR Tj(°C) 50 75 100 125 5 0 0 100 dIF/dt(A/µs) 200 300 400 500 4/11 STTH812 Characteristics Figure 11. Forward recovery time versus dIF/dt Figure 12. Junction capacitance versus (typical values) reverse voltage applied (typical values) tfr(ns) 700 IF=IF(AV) VFR=1.5 x VF max. Tj=125°C C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C 600 100 500 400 10 300 dIF/dt(A/µs) 200 0 100 200 300 400 500 1 1 10 VR(V) 100 1000 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, ecu = 35 µm) Rth(j-a)(°C/W) 80 70 60 50 40 30 20 10 SCU(cm²) 0 0 5 10 15 20 25 30 35 40 5/11 Package mechanical data STTH812 2 Package mechanical data Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC) Maximum torque value: 0.7 Nm (TO-220AC) Table 5. T0-220AC dimensions DIMENSIONS REF. Millimeters Min. H2 ØI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 A C D E F F1 G 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 F1 L9 L4 F D H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E G L5 L6 L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/11 STTH812 Table 6. T0-220Ins dimensions Package mechanical data DIMENSIONS REF Millimeters Min. A B ØI L F A I4 b2 C Inches Min. Max. 0.625 0.147 Max. 15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 4.80 6.20 3.75 15.90 0.598 a1 a2 B b1 b2 14.00 0.511 10.40 0.393 0.88 1.32 4.60 0.70 2.72 5.40 6.60 3.85 0.024 0.048 0.173 0.019 0.094 0.189 0.244 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.212 0.259 0.151 a1 l2 c2 C c1 a2 c2 M b1 e c1 e F ØI I4 L l2 M 15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 2.60 2.95 1.70 0.104 0.044 0.102 0.116 0.066 7/11 Package mechanical data Table 7. T0-220FPAC dimensions DIMENSIONS REF Millimeters Min. A H B STTH812 Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 A B D 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 Dia L6 L2 L3 L5 F1 L4 D L7 E F F1 G G1 H L2 L3 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 E L4 L5 G L6 L7 Dia. 8/11 STTH812 Table 8. D2PAK dimensions Package mechanical data DIMENSIONS REF. Millimeters Min. A A E L2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 C2 A2 D L L3 A1 B2 B R B B2 C C C2 D G E A2 G M * L V2 L2 * FLAT ZONE NO LESS THAN 2mm L3 M R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 14. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information STTH812 3 Ordering information Part Number STTH812D STTH812DI STTH812FP STTH812G STTH812G-TR Marking STTH812D STTH812DI STTH812FP STTH812G STTH812G Package TO-220AC TO-220Ins TO-220FPAC D2 D2 PAK PAK Weight 1.86 g 1.86 g 2.2 g 1.48 g 1.48 g Base qty 50 50 50 50 1000 Delivery mode Tube Tube Tube Tube Tape & reel 4 Revision history Date 02-Mar-2006 Revision 1 First issue. Description of Changes 10/11 STTH812 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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