STTH8R04D

STTH8R04 Ultrafast recovery diode Datasheet - production data A Description K K This device uses ST's new 400 V planar Pt doping technology. It is specially suited for switching mode base drive and transistor circuits. NC A TO-220AC A K TO-220AC Ins K Packaged in through-the-hole and surface mount packages, this device is intended for use in low voltage, high frequency inverters, freewheeling and polarity protection. K K A A NC NC D 2PAK Table 1: Device summary Symbol Value IF(AV) 8A VRRM 400 V Tj (max) 175 °C VF (typ) 0.9 V trr (typ) 25 ns Features      Very low switching losses High frequency and high pulsed current operation High junction temperature Insulated package: TO-220AC Ins  Insulating voltage = 2500 VRMS sine ECOPACK®2 compliant component for D²PAK on demand August 2017 DocID13390 Rev 2 This is information on a product in full production. 1/14 www.st.com Characteristics 1 STTH8R04 Characteristics Table 2: Absolute ratings (limiting values, at 25 °C, unless otherwise specified) Symbol VRRM Parameter Repetitive peak reverse voltage IF(RMS) Forward rms current IF(AV) Average forward current δ = 0.5, square wave Value Unit 400 V TO-220AC, D²PAK 30 TO-220AC Ins 20 TO-220AC, D²PAK TC = 145 °C TO-220AC Ins TC = 115 °C A 8 A IFRM Repetitive peak forward current tp = 10 µs, F = 1 kHz 165 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 120 A Tstg Storage temperature range -65 to +175 °C Operating junction temperature range -40 to +175 °C Tj Table 3: Thermal parameter Symbol Rth(j-c) Parameter Max. value TO-220AC, D2PAK 2.5 TO-220AC Ins 5.5 Junction to case Unit °C/W Table 4: Static electrical characteristics Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C VR = VRRM Tj = 25 °C VF(2) Forward voltage drop Tj = 100 °C IF = 8 A Notes: test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.83 x IF(AV) + 0.034 x IF2(RMS) 2/14 DocID13390 Rev 2 Typ. Max. 10 100 - 10 - Tj = 150 °C (1)Pulse Min. Unit µA 1.50 - 1.05 1.30 - 0.90 1.10 V STTH8R04 Characteristics Table 5: Dynamic electrical characteristics Symbol Parameter Test conditions IF = 1 A, dIF/dt = -50 A/μs, VR = 30 V trr IRM Sfactor tfr Reverse recovery time Reverse recovery current IF = 1 A, dIF/dt = -100 A/μs, VR = 30 V Tj = 125 °C Softness factor Forward recovery time Peak forward voltage Typ. Max. - 35 50 Tj = 25 °C Tj = 25 °C VFP Min. IF = 8 A, dIF/dt = -200 A/μs, VR = 320 V ns - 25 35 - 5.5 8.0 - 0.4 IF = 8 A, dIF/dt = 100 A/μs VFR = 1.1 x VFmax - IF = 8 A, dIF/dt= 100 A/µs - DocID13390 Rev 2 Unit 150 2.9 A ns V 3/14 Characteristics 1.1 STTH8R04 Characteristics (curves) Figure 2: Forward voltage drop versus forward current Figure 1: Conduction losses versus average current P(W) 13 12 δ=0.05 δ=0.1 δ=0.5 δ=0.2 IF (A) 200 δ=1 11 180 10 160 9 TjJ =150°C (Maximum values) 140 8 120 7 6 100 5 80 4 TjJ =150°C (Typical values) 60 T 3 40 TjJ =25°C (Maximum values) 2 δ=tp/T IF(AV)(A) 1 20 tp VF (V) 0 0 0 1 2 3 4 5 6 7 8 9 10 0.0 11 Figure 3: Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c) /Rth(j-c) Single pulse 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 Figure 4: Peak reverse recovery current versus dIF/dt (typical values) IRM(A) 12 1.0 0.4 IF = 8 A VR =320 V 11 10 9 8 7 6 Tj=125 °C 5 4 3 Tj=25 °C 2 1 tp(s) 0.1 1.E-03 1.E-02 1.E-01 1.E+00 Figure 5: Reverse recovery time versus dIF/dt (typical values) 140 dIF/dt(A/µs) 0 10 100 Figure 6: Reverse recovery charges versus dIF/dt (typical values) t rr (ns) 200 IF = 8 A VR =320 V 120 1000 Qrr (nC) IF= 8 A VR =320 V 180 160 100 140 Tj=125 °C 120 80 100 60 Tj=125 °C 40 Tj=25 °C 80 60 Tj=25 °C 40 20 20 dIF/dt(A/µs) 0 10 4/14 100 1000 DocID13390 Rev 2 dIF/dt(A/µs) 0 10 100 1000 STTH8R04 Characteristics Figure 7: Relative variation of dynamic parameters versus junction temperature (reference: Tj = 125 °C) 1.4 Figure 8: Transient peak forward voltage versus dIF/dt (typical values) V Fp(V) 5.0 IF = 8 A VR =320 V 1.2 IF =8 A Tj=125 °C 4.5 4.0 1.0 3.5 IRM 0.8 3.0 2.5 0.6 2.0 Qrr 0.4 1.5 1.0 0.2 0.5 Tj (°C) 0.0 dI F/dt(A/µs) 0.0 25 50 75 100 125 150 0 Figure 9: Forward recovery time versus dIF/dt (typical values) 700 t fr (ns) 50 10 0 15 0 20 0 25 0 30 0 35 0 45 0 500 Figure 10: Junction capacitance versus reverse voltage applied (typical values) 100 C(pF) IF=8 A Vfr =1.1 x VF max. Tj=125°C 600 40 0 F=1MHz VOSC =30mVRMS Tj=25°C 500 400 300 200 100 dIF/dt(A/µs) VR(V) 0 0 100 200 300 400 10 500 1 10 100 1000 Figure 11: Thermal resistance junction to ambient versus copper surface under tab for D²PAK 80 Rth(j-a) (°C/W) 70 60 50 40 30 20 Epoxy printed board FR4, eCU= 35 µm 10 SCu(cm²) 0 0 5 10 15 20 DocID13390 Rev 2 25 30 35 40 5/14 Package information 2 STTH8R04 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.     6/14 Cooling method: by conduction (C) Epoxy meets UL94,V0 Recommended torque value: 0.55 N·m (for TO-220AC and TO-220AC Ins) Maximum torque value: 0.70 N·m (for TO-220AC and TO-220AC Ins) DocID13390 Rev 2 Package information STTH8R04 2.1 D²PAK package information Figure 12: D²PAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID13390 Rev 2 7/14 Package information STTH8R04 Table 6: D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R V2 0.4 typ. 0° 0.015 8° 0° Figure 13: D²PAK recommended footprint (dimensions in mm) 8/14 DocID13390 Rev 2 8° Package information STTH8R04 2.2 TO-220AC package information Figure 14: TO-220AC package outline DocID13390 Rev 2 9/14 Package information STTH8R04 Table 7: TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M ØI 10/14 Inches 2.6 typ. 3.75 0.102 typ. 3.85 DocID13390 Rev 2 0.147 0.151 Package information STTH8R04 2.3 TO-220AC Ins package information Figure 15: TO-220AC Ins package outline DocID13390 Rev 2 11/14 Package information STTH8R04 Table 8: TO-220AC Ins package mechanical data Dimensions Ref. Millimeters Min. A 15.20 a1 Max. Min. 15.90 0.598 3.75 Typ. Max. 0.625 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 4.80 5.40 0.189 0.212 F 6.20 6.60 0.244 0.259 L 2.65 2.95 0.104 0.116 I2 1.14 1.70 0.044 0.066 I4 15.80 16.80 0.622 M ØI 12/14 Typ. Inches 16.40 2.60 3.75 0.645 0.661 0.102 3.85 DocID13390 Rev 2 0.147 0.151 Ordering information STTH8R04 3 Ordering information Table 9: Ordering information Order code 4 Marking Package Weight Base qty Delivery mode STTH8R04D STTH8R04D TO-220AC 1.9 g 50 Tube STTH8R04DI STTH 8R04DI TO-220AC Ins 1.8 g 50 Tube STTH8R04G-TR STTH8R04G D2PAK 1.4 g 1000 Tape and reel Revision history Table 10: Document revision history Date Revision Changes 11-Mar-2007 1 First issue. 01-Aug-2016 2 Updated D²PAK package information. DocID13390 Rev 2 13/14 STTH8R04 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 14/14 DocID13390 Rev 2