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STTH8R06_08

STTH8R06_08

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

  • 描述:

    STTH8R06_08 - Turbo 2 ultrafast high voltage rectifier - STMicroelectronics

  • 数据手册
  • 价格&库存
STTH8R06_08 数据手册
STTH8R06 Turbo 2 ultrafast high voltage rectifier Features ■ ■ ■ ■ ■ Ultrafast switching Low reverse recovery current Low thermal resistance Reduces switching losses Package insulation voltage: TO-220AC Ins: 2500 V rms TO-220FPAC: 2000 V dc K K A A K TO-220AC STTH8R06D TO-220FPAC STTH8R06FP K Description The STTH8R06, which uses ST Turbo 2 600 V technology, is specially suited as boost diode in continuous mode power factor corrections and hard switching conditions. K A NC A K NC D2PAK STTH8R06G I2PAK STTH8R06R K A TO-220AC Insulated STTH8R06DIRG Table 1. Device summary IF(AV) VRRM IRM (typ) Tj VF (typ) trr (max) 8A 600 V 5.5 A 175°C 1.4 V 25 ns April 2008 Rev 6 1/12 www.st.com 12 Characteristics STTH8R06 1 Table 2. Symbol VRRM IF(RMS) Characteristics Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage TO-220AC / TO-220FPAC / D PAK / I PAK Forward current rms TO-220AC Ins. TO-220AC / D2PAK / I2PAK IF(AV) Average forward current δ = 0.5 TO-220FPAC TO-220AC Ins. IFSM Tstg Tj Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Tc = 130 °C Tc = 85 °C Tc = 100 °C tp = 10ms sinusoidal 80 -65 to + 175 175 A °C °C 8 A 24 2 2 Value 600 30 Unit V A Table 3. Symbol Thermal resistance Parameter TO-220AC / D2PAK / I2PAK Value (max) 2.2 4.6 3.8 °C/W Unit Rth(j-c) Junction to case TO-220FPAC TO-220AC Ins. Table 4. Symbol IR Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Forward voltage drop Tj = 25 °C Tj = 125 °C VR = VRRM Min Typ Max 30 µA 35 400 2.9 IF = 8 A V 1.4 1.8 Unit VF To evaluate the conduction losses use the following equation: P = 1.16 x IF(AV) + 0.08 IF2(RMS) Table 5. Symbol trr IRM Dynamic characteristics Parameter Reverse recovery time Reverse recovery current I = 8 A, VR = 400 V, Tj = 125 °C F dIF/dt = -200 A/µs IF = 8 A, dIF/dt = 64 A/µs VFR = 1.1 x VFmax Tj = 25 °C Test conditions IF = 0.5 A, Irr = 0.25 A, IR =1 A IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V 5.5 0.3 150 150 5 Tj = 25°C nC ns V Min Typ Max Unit 25 ns 45 7.2 A S factor Softness factor Qrr tfr VFP Reverse recovery charges Forward recovery time Forward recovery voltage 2/12 STTH8R06 Characteristics Figure 1. P(W) 24 22 20 18 16 14 12 10 8 6 4 2 0 0 Conduction losses versus average current Figure 2. IFM(A) 100 Forward voltage drop versus forward current δ = 0.05 δ = 0.1 δ = 0.2 90 δ = 0.5 Tj=125°C (maximum values) 80 70 δ=1 Tj=125°C (typical values) 60 50 40 30 Tj= 25°C (maximum values) T 20 10 IF(AV)(A) 2 4 6 δ=tp/T 8 tp 0 10 0 1 2 3 VFM(V) 4 5 6 7 Figure 3. Figure 4. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, I2PAK, D2PAK) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC Insulated) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 Single pulse Zth(j-c)/Rth(j-c) 0.3 T T 0.2 0.1 Single pulse tp(s) δ=tp/T tp 0.0 1.E+00 1.E-03 1.E-02 tp(s) 1.E-01 δ=tp/T 1.E+00 tp 1.E+01 Figure 5. IRM(A) 22 20 18 16 14 12 10 VR=400V Tj=125°C Peak reverse recovery current versus dIF/dt (typical values) Figure 6. trr(ns) 120 Reverse recovery time versus dIF/dt (typical values) VR=400V Tj=125°C IF=2 x IF(AV) 110 100 IF=IF(AV) 90 80 IF=0.5 x IF(AV) 70 60 IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) IF=0.25 x IF(AV) 50 40 30 20 8 6 4 2 0 0 200 400 600 800 1000 dIF/dt(A/µs) 10 0 0 200 dIF/dt(A/µs) 400 600 800 1000 3/12 Characteristics STTH8R06 Figure 7. Qrr(nC) 350 VR=400V Tj=125°C Reverse recovery charges versus dIF/dt (typical values) Figure 8. S factor 0.70 0.65 0.60 IF≤2 x IF(AV) VR=400V Tj=125°C Softness factor versus dIF/dt (typical values) 300 IF=2 x IF(AV) 250 IF=IF(AV) 0.55 0.50 0.45 200 IF=0.5 x IF(AV) 0.40 0.35 0.30 150 100 50 0.25 0.20 dIF/dt(A/µs) 0 0 200 400 600 800 1000 0.15 0.10 0 200 dIF/dt(A/µs) 400 600 800 1000 Figure 9. Relative variations of dynamic parameters versus junction temperature Figure 10. Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 12 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 25 50 75 100 125 IRM S factor IF=IF(AV) VR=400V Reference: Tj=125°C 11 10 9 8 7 6 5 4 IF=IF(AV) Tj=125°C QRR 3 2 Tj(°C) 1 0 0 100 dIF/dt(A/µs) 200 300 400 500 4/12 STTH8R06 Characteristics Figure 11. Forward recovery time versus dIF/dt (typical values) tfr(ns) 160 140 120 100 80 60 40 20 IF=IF(AV) VFR=1.1 x VF max. Tj=125°C Figure 12. Junction capacitance versus reverse voltage applied (typical values) C(pF) 100 F=1MHz VOSC=30mVRMS Tj=25°C dIF/dt(A/µs) 0 0 100 200 300 400 500 10 1 10 VR(V) 100 1000 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (epoxy FR4, eCU = 35 µm) (D2PAK) Rth(j-a)(°C/W) 70 60 50 40 30 20 10 S(Cu)(cm²) 0 0 5 10 15 20 25 30 35 40 5/12 Package information STTH8R06 2 Package information ● ● ● Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque values: 0.8 to 1.0 N·m (TO-220FPAC), 0.4 to 0.6 N·m to (TO-220AC) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 6. TO-220AC dimensions Dimensions Ref. Millimeters Min. A H2 ØI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 C D E F F1 G F1 L9 L4 F D H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E L5 L6 G L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/12 STTH8R06 Table 7. TO-220FPAC dimensions Package information Dimensions Ref. Millimeters Min. A A H B Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 B D E Dia F L6 L2 L3 L5 F1 L4 D L7 F1 G G1 H L2 L3 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G E L4 L5 L6 L7 Dia. 7/12 Package information Table 8. TO-220AC (nIns. and ins. 20-up) dimensions Dimensions Ref. Millimeters Min. A B ØI L F b2 C STTH8R06 Inches Min. Typ. Max. 0.625 0.147 Typ. Max. 15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 4.80 6.20 3.75 15.90 0.598 a1 a2 B b1 14.00 0.511 10.40 0.393 0.88 0.024 1.32 0.048 4.60 0.173 0.70 0.019 2.72 0.094 5.40 0.189 6.60 0.244 3.85 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.212 0.259 0.151 A I4 b2 C c2 a1 l2 c1 c2 e a2 M b1 e c1 F ØI I4 L l2 M 15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 2.60 2.95 0.104 1.70 0.044 0.102 0.116 0.066 8/12 STTH8R06 Table 9. I2PAK dimensions Package information Dimensions Ref. Millimeters Min. A E L2 c2 Inches Min. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.195 0.394 0.512 0.138 0.050 Max. 0.181 0.107 0.035 0.067 0.028 0.052 0.368 0.106 0.203 0.409 0.551 0.155 0.055 Max. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 A A1 b b1 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 D c c2 L1 L b1 A1 D e e1 E b e e1 c L L1 L2 9/12 Package information Table 10. D2PAK dimensions Dimensions Ref. Millimeters Min. A A E L2 C2 STTH8R06 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D L L3 A1 B2 B G A2 R B2 C C2 C D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 14. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 10/12 STTH8R06 Ordering information 3 Ordering information Table 11. Ordering information Marking STTH8R06D STTH8R06G STTH8R06G STTH8R06FP STTH8R06R STTH8R06DI Package TO-220AC D PAK D2 PAK 2 Ordering type STTH8R06D STTH8R06G STTH8R06G-TR STTH8R06FP STTH8R06R STTH8R06DIRG Weight 1.90 g 1.48 g 1.48 g 1.70 g 1.5 g 1.86 g Base qty 50 50 1000 50 50 50 Delivery mode Tube Tube Tape and reel Tube Tube Tube TO-220FPAC I2 PAK TO-220AC Ins. 4 Revision history Table 12. Date May-2001 January-2002 18-Oct-2004 05-Dec-2004 10-Aug-2006 Document revision history Revision 1 2 3 4 5 First issue D2PAK and I2PAK packages added TO-220AC Insulated package added D2PAK foot print correction Reformatted to current standard. Added package insulation voltage data on page 1. Changed order code STTH8R06DI to STTH8R06DIRG. Reformatted to current standards. Corrected label for right hand curve in Figure 2 from Tj = 125 °C to Tj = 25 °C. Updated torque value recomendations and added ECOPACK statement in Section 2: Package information. Corrected order code in Table 11. Changes 16-Apr-2008 6 11/12 STTH8R06 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 12/12
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