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STU80N4F6

STU80N4F6

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO-251-3

  • 描述:

    MOSFET N CH 40V 80A IPAK

  • 数据手册
  • 价格&库存
STU80N4F6 数据手册
STU80N4F6 N-channel 40 V, 5.8 mΩ typ., 80 A STripFET™ VI DeepGATE™ Power MOSFET in a IPAK package Datasheet − production data Features TAB Order code VDS RDS(on) max ID STU80N4F6 40 V 6.3 mΩ 80 A • Low gate charge 3 • Very low on-resistance 2 1 • High avalanche ruggedness IPAK Applications • Switching applications Figure 1. Internal schematic diagram Description This device is an N-channel Power MOSFET developed using the 6th generation of STripFET™ DeepGATE™ technology, with a new gate structure. The resulting Power MOSFET exhibits the lowest RDS(on) in all packages. ' Ć7$% *  6  $0Y Table 1. Device summary Order code Marking Package Packaging STU80N4F6 80N4F6 IPAK Tube February 2014 This is information on a product in full production. DocID023839 Rev 4 1/13 www.st.com 13 Contents STU80N4F6 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) .............................. 6 3 Test circuits 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2/13 .............................................. 8 DocID023839 Rev 4 STU80N4F6 1 Electrical ratings Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage 40 V VGS Gate-source voltage ± 20 V Drain current (continuous) at TC = 25 °C 80 A Drain current (continuous) at TC = 100 °C 56 A Drain current (pulsed) 320 A Total dissipation at TC = 25 °C 70 W IAV Avalanche current, repetitive or not-repetitive (pulse width limited by TJmax) 40 A EAS Single pulse avalanche energy (starting Tj = 25 °C, ID = IAV, VDD = 25 V) 149 mJ Derating factor 0.47 W/°C ID (1) ID(1) IDM (2) PTOT Tstg Storage temperature °C -55 to 175 Tj Max. operating junction temperature °C 1. Current limited by package. 2. Pulse width limited by safe operating area Table 3. Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case max 2.14 °C/W Rthj-amb Thermal resistance junction-ambient max 100 °C/W DocID023839 Rev 4 3/13 Electrical characteristics 2 STU80N4F6 Electrical characteristics (TC = 25 °C unless otherwise specified) Table 4. On /off states Symbol V(BR)DSS Parameter Drain-source breakdown voltage Test conditions ID = 250 μA, VGS = 0 IDSS Zero gate voltage VDS = 40 V drain current (VGS = 0) VDS = 40 V, TC=125 °C IGSS Gate-body leakage current (VDS = 0) Min. Typ. 40 Gate threshold voltage VDS = VGS, ID = 250 μA RDS(on) Static drain-source on-resistance Unit V 1 100 μA μA ± 100 nA 4 V 5.8 6.3 mΩ Min. Typ. Max. Unit - 2150 - pF - 335 - pF - 160 - pF - 36 - nC - 11 - nC - 9 - nC Min. Typ. Max Unit - 10.5 - ns - 7.6 - ns - 46.1 - ns - 11.9 - ns VGS = ± 20 V VGS(th) Max. 2 VGS = 10 V, ID = 40 A Table 5. Dynamic Symbol Parameter Ciss Input capacitance Coss Output capacitance Crss Reverse transfer capacitance Qg Total gate charge Qgs Gate-source charge Qgd Gate-drain charge Test conditions VDS = 25 V, f = 1 MHz, VGS = 0 VDD = 20 V, ID = 80 A, VGS = 10 V (see Figure 14) Table 6. Switching times Symbol td(on) tr td(off) tf 4/13 Parameter Test conditions Turn-on delay time Rise time Turn-off delay time VDD = 20 V, ID = 40 A, RG = 4.7 Ω, VGS = 10 V (see Figure 15) Fall time DocID023839 Rev 4 STU80N4F6 Electrical characteristics Table 7. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit Source-drain current - 80 A ISDM (1) Source-drain current (pulsed) - 320 A VSD (2) Forward on voltage - 1.3 V ISD trr ISD = 40 A, VGS = 0 Reverse recovery time Qrr Reverse recovery charge IRRM Reverse recovery current ISD = 80 A, di/dt = 100 A/μs VDD = 32 V (see Figure 17) - 41.1 ns - 43.6 nC - 2.1 A 1. Pulse width limited by safe operating area. 2. Pulsed: pulse duration = 300 μs, duty cycle 1.5% DocID023839 Rev 4 5/13 Electrical characteristics 2.1 STU80N4F6 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance AM15599v1 ID (A) s ai re n) s a (o thi RDS n i x on ma y ati er d b p e O it Lim 100 100µs 10 1ms 10ms Tj=175°C Tc=25°C 1 Single pulse 0.1 0.1 10 1 VDS(V) Figure 4. Output characteristics Figure 5. Transfer characteristics AM15600v1 ID (A) VGS= 7, 8, 9, 10 V 200 AM15601v1 ID (A) VDS= 2 V 180 140 VGS= 6 V 120 150 100 80 100 60 VGS= 5 V 40 50 20 VGS= 4 V 0 0 0 2 VDS(V) 4 Figure 6. Gate charge vs gate-source voltage AM15602v1 VGS (V) VDD=20V 12 2 3 4 5 6 8 9 10 VGS(V) Figure 7. Static drain-source on-resistance AM15603v1 RDS(on) (mΩ) VGS= 10V 6.5 ID=80A 7 10 6 8 5.5 6 5 4 4.5 2 4 0 0 6/13 10 20 30 40 Qg(nC) DocID023839 Rev 4 0 20 40 60 80 ID(A) STU80N4F6 Electrical characteristics Figure 8. Capacitance variations Figure 9. Drain-source diode forward characteristics AM15352v1 C (pF) 2500 AM15604v1 VSD (V) TJ=-50°C 1.0 Ciss 2000 0.8 1500 0.6 1000 0.4 10 30 20 40 Coss Crss VDS(V) Figure 10. Normalized gate threshold voltage vs temperature AM15354v1 VGS(th) (norm) 0 0 20 40 60 80 ISD(A) Figure 11. Normalized on-resistance vs temperature AM15356v1 RDS(on) (norm) VGS=10V ID=40A 1.2 1 TJ=25°C 0.2 500 0 0 TJ=150°C 2 ID=250 µA 1.5 0.8 0.6 1 0.4 0.5 0.2 0 -75 -50 -25 0 25 50 75 100 125 TJ(°C) 0 -75 -50 -25 0 25 50 75 100 125 150 TJ(°C) Figure 12. Normalized V(BR)DSS vs temperature AM15353v1 V(BR)DSS (norm) 1.3 ID = 1mA 1.2 1.1 1 0.9 0.8 0.7 0.6 -75 -50 -25 0 25 50 75 100 125 150 TJ(°C) DocID023839 Rev 4 7/13 Test circuits 3 STU80N4F6 Test circuits Figure 13. Switching times test circuit for resistive load Figure 14. Gate charge test circuit VDD 12V 47kΩ 1kΩ 100nF 3.3 μF 2200 RL μF IG=CONST VDD VGS 100Ω Vi=20V=VGMAX VD RG 2200 μF D.U.T. D.U.T. VG 2.7kΩ PW 47kΩ 1kΩ PW AM01468v1 Figure 15. Test circuit for inductive load switching and diode recovery times A A AM01469v1 Figure 16. Unclamped inductive load test circuit L A D G D.U.T. FAST DIODE B B VD L=100μH S 3.3 μF B 25 Ω 1000 μF D VDD 2200 μF 3.3 μF VDD ID G RG S Vi D.U.T. Pw AM01470v1 AM01471v1 Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform Inductive Load Turn - off V(BR)DSS Id VD 90%Vds 90%Id td(v) IDM Vgs 90%Vgs on ID )) Vgs(I(t)) VDD VDD 10%Id 10%Vds Vds tr(v) AM01472v1 8/13 DocID023839 Rev 4 tf(i) tc(off) AM05540v1 STU80N4F6 4 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DocID023839 Rev 4 9/13 Package mechanical data STU80N4F6 Figure 19. IPAK (TO-251) drawing 0068771_K 10/13 DocID023839 Rev 4 STU80N4F6 Package mechanical data Table 8. IPAK (TO-251) mechanical data mm. DIM min. typ. max. A 2.20 2.40 A1 0.90 1.10 b 0.64 0.90 b2 b4 0.95 5.20 B5 5.40 0.30 c 0.45 0.60 c2 0.48 0.60 D 6.00 6.20 E 6.40 6.60 e e1 2.28 4.40 H 4.60 16.10 L 9.00 9.40 L1 0.80 1.20 L2 0.80 V1 10° DocID023839 Rev 4 1.00 11/13 Revision history 5 STU80N4F6 Revision history Table 9. Document revision history 12/13 Date Revision Changes 26-Oct-2012 1 Initial release. 01-Mar-2013 2 – Added: IPAK package – The part number STI80N4F6 has been moved to a separate datasheet – Added: Figure 2, 3, 4, 5, 6, 7 and 9 05-Mar-2013 3 – Minor text changes – Modified: Table 3 28-Feb-2014 4 – The part number STD80N4F6 has been moved to a separate datasheet – Minor text changes DocID023839 Rev 4 STU80N4F6 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2014 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com DocID023839 Rev 4 13/13
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