STB8N65M5, STD8N65M5, STF8N65M5 STI8N65M5, STP8N65M5, STU8N65M5
N-channel 650 V, 0.56 Ω 7 A MDmesh™ V Power MOSFET , in D²PAK, I²PAK, TO-220, TO-220FP, DPAK and IPAK
Features
Type STB8N65M5 STD8N65M5 STF8N65M5 STI8N65M5 STP8N65M5 STU8N65M5
■ ■ ■ ■ ■ ■
VDSS @ TJmax
RDS(on) max.
ID
3 1
3 1 2
DPAK
3 1 2
710 V
< 0.6 Ω
7A
TO-220FP
TO-220
Worldwide best RDS(on) * area Higher VDSS rating High dv/dt capability Excellent switching performance Easy to drive 100% avalanche tested Figure 1. Internal schematic diagram
I²PAK
3
3 12
1
1
3 2
D²PAK
IPAK
Applications
■
Switching applications
Description
These devices are N-channel MDmesh™ V Power MOSFETs based on an innovative proprietary vertical process technology, which is combined with STMicroelectronics’ well-known PowerMESH™ horizontal layout structure. The resulting product has extremely low onresistance, which is unmatched among siliconbased Power MOSFETs, making it especially suitable for applications which require superior power density and outstanding efficiency. Table 1. Device summary
Order codes STB8N65M5 STD8N65M5 STF8N65M5 STI8N65M5 STP8N65M5 STU8N65M5 July 2011 Marking Package D²PAK DPAK TO-220FP I²PAK TO-220 IPAK Doc ID 16531 Rev 3 Packaging Tape and reel Tape and reel Tube Tube Tube Tube 1/25
www.st.com 25
8N65M5
Contents
STB/D/F/I/P/U8N65M5
Contents
1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................ 6
3 4 5 6
Test circuits
.............................................. 9
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2/25
Doc ID 16531 Rev 3
STB/D/F/I/P/U8N65M5
Electrical ratings
1
Electrical ratings
Table 2. Absolute maximum ratings
Value Symbol Parameter TO-220, D²PAK I²PAK IPAK DPAK, ± 25 7 4.4 28 70 2 120 15 2500 -55 to 150 150 7
(1) (1) (1)
Unit TO-220FP V A A A W A mJ V/ns V °C °C
VGS ID ID IDM
(2)
Gate- source voltage Drain current (continuous) at TC = 25 °C Drain current (continuous) at TC = 100 °C Drain current (pulsed) Total dissipation at TC = 25 °C Max current during repetitive or single pulse avalanche (pulse width limited by TJMAX) Single pulse avalanche energy (starting Tj = 25°C, ID = IAR, VDD = 50V) Peak diode recovery voltage slope Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s; TC = 25 °C) Storage temperature Max. operating junction temperature
4.4 28
PTOT IAR EAS dv/dt (3) VISO Tstg Tj
25
1. Limited only by maximum temperature allowed. 2. Pulse width limited by safe operating area. 3. ISD ≤ 7A, di/dt ≤ 400 A/µs, VPeak < V(BR)DSS.
Table 3.
Symbol
Thermal data
Value Parameter DPAK IPAK TO-220 I²PAK D²PAK TO-220FP Thermal resistance junction-case max Thermal resistance junction-ambient max Thermal resistance junction-pcb max Maximum lead temperature for soldering purpose 50 100 Unit
Rthj-case Rthj-amb Rthj-pcb(1)
1.79 62.5 30
5 62.5
°C/W °C/W °C/W
Tl
300
300
°C
1. When mounted on 1 inch² FR-4 board, 2oz Cu.
Doc ID 16531 Rev 3
3/25
Electrical characteristics
STB/D/F/I/P/U8N65M5
2
Electrical characteristics
(TC = 25 °C unless otherwise specified) Table 4.
Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on
On /off states
Parameter Drain-source breakdown voltage Test conditions ID = 1 mA, VGS = 0 Min. 650 1 100 100 3 4 0.56 5 0.6 Typ. Max. Unit V µA µA nA V Ω
VDS = Max rating Zero gate voltage drain current (VGS = 0) VDS = Max rating, TC=125 °C Gate-body leakage current (VDS = 0) VGS = ± 25 V
Gate threshold voltage VDS = VGS, ID = 250 µA Static drain-source on resistance VGS = 10 V, ID = 3.5 A
Table 5.
Symbol Ciss Coss Crss Co(er)(1)
Dynamic
Parameter Input capacitance Output capacitance Reverse transfer capacitance Equivalent output capacitance energy related Equivalent output capacitance time related Intrinsic gate resistance Total gate charge Gate-source charge Gate-drain charge Test conditions Min. Typ. 690 18 2 Max. Unit pF pF pF
VDS = 100 V, f = 1 MHz, VGS = 0
-
-
VGS = 0, VDS = 0 to 520 V
-
17
-
pF
Co(tr)(2)
VGS = 0, VDS = 0 to 520 V
-
52
-
pF
RG Qg Qgs Qgd
f = 1 MHz open drain VDD = 520 V, ID = 3.5 A, VGS = 10 V (see Figure 19)
-
2.4 15 3.6 6
-
Ω nC nC nC
-
-
1. Co(er) is a constant capacitance value that gives the same stored energy as Coss while VDS is rising from 0 to 80% VDSS 2. Co(tr) is a constant capacitance value that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS
4/25
Doc ID 16531 Rev 3
STB/D/F/I/P/U8N65M5
Electrical characteristics
Table 6.
Symbol td(off) tr(V) tc(off) tf(i)
Switching times
Parameter Turn-off delay time Rise time Cross time Fall time Test conditions VDD = 400 V, ID = 4A, RG = 4.7 Ω, VGS = 10 V (see Figure 20) (see Figure 23) Min. Typ. 50 14 20 11 Max. Unit ns ns ns ns
-
-
Table 7.
Symbol ISD ISDM (1) VSD (2) trr Qrr IRRM trr Qrr IRRM
Source drain diode
Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 7 A, VGS = 0 ISD = 7 A, di/dt = 100 A/µs VDD = 100 V (see Figure 20) ISD = 7 A, di/dt = 100 A/µs VDD = 100 V, Tj = 150 °C (see Figure 20) Test conditions Min. 200 1.6 16 263 1.9 15 Typ. Max. Unit 7 28 1.5 A A V ns µC A ns µC A
-
1. Pulse width limited by safe operating area 2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Doc ID 16531 Rev 3
5/25
Electrical characteristics
STB/D/F/I/P/U8N65M5
2.1
Figure 2.
ID (A)
Electrical characteristics (curves)
Safe operating area for TO-220, I²PAK, D²PAK
AM08194v1
Figure 3.
Thermal impedance for TO-220, I²PAK, D²PAK
O Li per m at ite io d ni by n m this ax a R rea
is
10
D S(
10µs 100µs 1ms 10ms
1
0.1
Tj=150°C Tc=25°C Single pulse
0.01 0.1
on
)
1
10
100
VDS(V)
Figure 4.
ID (A)
Safe operating area for DPAK, IPAK Figure 5.
AM08195v1
Thermal impedance for DPAK, IPAK
O Li per m at ite io d ni by n m this ax a R rea
D
S( o
n)
is
10
10µs 100µs 1ms 10ms
1
0.1
Tj=150°C Tc=25°C Single pulse
0.01 0.1
1
10
100
VDS(V)
Figure 6.
ID (A)
Safe operating area for TO-220FP
AM08196v1
Figure 7.
Thermal impedance for TO-220FP
O Li per m at ite io d ni by n m this ax a R rea
is
D S( on )
10
10µs 100µs 1ms 10ms
Tj=150°C Tc=25°C Single pulse
1
0.1
0.01 0.1
1
10
100
VDS(V)
6/25
Doc ID 16531 Rev 3
STB/D/F/I/P/U8N65M5 Figure 8.
ID (A) 12 10 8 6 4 2 0 0 6V 4 2 0 3
Electrical characteristics Figure 9.
AM08197v1
Output characteristics
VGS=10V 7V 7.5V
Transfer characteristics
AM08198v1
ID (A) 12 VDS=20V 10
6.5V
8 6
5.5V 5 10 15 5V VDS(V)
4
5
6
7
8
9
VGS(V)
Figure 10. Gate charge vs gate-source voltage Figure 11. Static drain-source on resistance
VGS (V) 12 10 8 300 6 200 4 2 0 0 5 10 15 100 0 Qg(nC) 0.52 0.54 VDS
AM03195v1
VDD=520V ID=3.5A
VGS 500 400
RDS(on) (Ohm) VGS=10V 0.58
AM08200v1
0.56
0.50 0 2 4 6 ID(A)
Figure 12. Capacitance variations
C (pF)
AM08202v1
Figure 13. Output capacitance stored energy
Eoss (µJ) 3.5
AM08201v1
1000
Ciss
3.0 2.5
100
2.0 1.5
10
Coss Crss
1.0 0.5 0 0 100 200 300 400 500 600 VDS(V)
1 0.1
1
10
100
VDS(V)
Doc ID 16531 Rev 3
7/25
Electrical characteristics Figure 14. Normalized gate threshold voltage vs temperature
VGS(th)
(norm)
STB/D/F/I/P/U8N65M5 Figure 15. Normalized on resistance vs temperature
RDS(on)
(norm)
AM08204v1
AM08205v1
1.10 2.0 1.00 1.5 0.90
VGS=10V ID=3.5A
0.80
1.0
0.70 -50 -25
0
25
50
75 100
TJ(°C)
0.5 -50 -25
0
25
50
75 100
TJ(°C)
Figure 16. Switching losses vs gate resistance Figure 17. Normalized BVDSS vs temperature
(1)
E (μJ)
AM08206v1
BVDSS 1.07 1.05
AM08203v1
(norm)
ID=4A VCL=400V VGS=10V
ID=1mA
Eoff
100 Eon
1.03 1.01 0.99
10 0.97 0.95 1 0 10 20 30 40 RG(Ω) 0.93 -50 -25 0 25 50 75 100 TJ(°C)
1. Eon including reverse recovery of a SiC diode
8/25
Doc ID 16531 Rev 3
STB/D/F/I/P/U8N65M5
Test circuits
3
Test circuits
Figure 19. Gate charge test circuit
VDD 12V
2200
Figure 18. Switching times test circuit for resistive load
47kΩ 100nF
1kΩ
RL VGS VD RG PW D.U.T.
μF
3.3 μF
VDD Vi=20V=VGMAX
2200 μF
IG=CONST 2.7kΩ 47kΩ PW 1kΩ
100Ω
D.U.T. VG
AM01468v1
AM01469v1
Figure 20. Test circuit for inductive load Figure 21. Unclamped inductive load test switching and diode recovery times circuit
A D G S B 25 Ω D.U.T.
A FAST DIODE B
A L=100μH B D G 3.3 μF 1000 μF
L
VD
2200 μF
3.3 μF
VDD
VDD
ID
RG
S
Vi
D.U.T.
Pw
AM01470v1 AM01471v1
Figure 22. Unclamped inductive waveform
V(BR)DSS VD
Figure 23. Switching time waveform
Concept waveform for Inductive Load Turn-off
Id
90%Vds
90%Id
Tdelay-off -off
IDM
Vgs 90%Vgs on
ID
Vgs(I(t)) ))
VDD
VDD
Vds
10%Vds
10%Id
Trise
Tfall
AM01472v1
Tcross -over
AM05540v1
Doc ID 16531 Rev 3
9/25
Package mechanical data
STB/D/F/I/P/U8N65M5
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
10/25
Doc ID 16531 Rev 3
STB/D/F/I/P/U8N65M5 Table 8.
Dim. Min. A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 Dia 28.6 9.8 2.9 15.9 9 3 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 16 Typ.
Package mechanical data TO-220FP mechanical data
mm Max. 4.6 2.7 2.75 0.7 1 1.70 1.70 5.2 2.7 10.4
30.6 10.6 3.6 16.4 9.3 3.2
Figure 24. TO-220FP drawing mechanical data
L7 E
A B
D Dia L6 L5
F1
F2 F
H G1
G
L2 L3
L4
7012510_Rev_K
Doc ID 16531 Rev 3
11/25
Package mechanical data Table 9.
Dim. Min. A A1 b b2 c c2 D D1 E E1 e e1 H J1 L L1 L2 R V2 0° 4.88 15 2.49 2.29 1.27 1.30 0.4 4.40 0.03 0.70 1.14 0.45 1.23 8.95 7.50 10 8.50 2.54 Typ.
STB/D/F/I/P/U8N65M5
D²PAK (TO-263) mechanical data
mm Max. 4.60 0.23 0.93 1.70 0.60 1.36 9.35
10.40
5.28 15.85 2.69 2.79 1.40 1.75
8°
12/25
Doc ID 16531 Rev 3
STB/D/F/I/P/U8N65M5 Figure 25. D²PAK (TO-263) drawing
Package mechanical data
0079457_S
Figure 26. D²PAK footprint(a)
16.90
12.20
5.08
1.60
3.50 9.75
Footprint
a. All dimension are in millimeters
Doc ID 16531 Rev 3
13/25
Package mechanical data
STB/D/F/I/P/U8N65M5
Table 10.
DIM.
I²PAK (TO-262) mechanical data
mm. min. typ max. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40
A A1 b b1 c c2 D e e1 E L L1 L2
4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27
Figure 27. I²PAK (TO-262) drawing
0004982_Rev_H
14/25
Doc ID 16531 Rev 3
STB/D/F/I/P/U8N65M5
Package mechanical data
Table 11.
Dim.
TO-220 type A mechanical data
mm Min. Typ. Max. 4.60 0.88 1.70 0.70 15.75 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93
A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30
4.40 0.61 1.14 0.48 15.25
∅P
Q
Doc ID 16531 Rev 3
15/25
Package mechanical data Figure 28. TO-220 type A drawing
STB/D/F/I/P/U8N65M5
0015988_typeA_Rev_S
16/25
Doc ID 16531 Rev 3
STB/D/F/I/P/U8N65M5
Package mechanical data
Table 12.
Dim.
DPAK (TO-252) mechanical data
mm Min. Typ. Max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 5.10 6.40 4.70 2.28 4.40 9.35 1 2.80 0.80 0.60 0.20 0° 8° 1 4.60 10.10 1.50 6.60
A A1 A2 b b4 c c2 D D1 E E1 e e1 H L L1 L2 L4 R V2
2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00
Doc ID 16531 Rev 3
17/25
Package mechanical data Figure 29. DPAK (TO-252) drawing
STB/D/F/I/P/U8N65M5
0068772_H
Figure 30. DPAK footprint(b)
6.7 1.8 3 1.6
2.3 6.7 2.3
1.6
AM08850v1
b. All dimension are in millimeters
18/25
Doc ID 16531 Rev 3
STB/D/F/I/P/U8N65M5
Package mechanical data
Table 13.
DIM.
IPAK (TO-251) mechanical data
mm. min. typ max. 2.40 1.10 0.90 0.95 5.20 0.3 0.45 0.48 6.00 6.40 2.28 4.40 16.10 9.00 0.80 0.80 10
o
A A1 b b2 b4 B5 c c2 D E e e1 H L L1 L2 V1
2.20 0.90 0.64
5.40
0.60 0.60 6.20 6.60
4.60
9.40 1.20 1.00
Doc ID 16531 Rev 3
19/25
Package mechanical data Figure 31. IPAK (TO-251) drawing
STB/D/F/I/P/U8N65M5
0068771_H
AM09214V1
20/25
Doc ID 16531 Rev 3
STB/D/F/I/P/U8N65M5
Packaging mechanical data
5
Packaging mechanical data
Table 14. D²PAK (TO-263) tape and reel mechanical data
Tape mm Dim. Min. A0 B0 D D1 E F K0 P0 P1 P2 R T W 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 0.35 24.3 Max. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 Base qty Bulk qty 1000 1000 A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 Dim. Min. Max. 330 Reel mm
Doc ID 16531 Rev 3
21/25
Packaging mechanical data
STB/D/F/I/P/U8N65M5
Table 15.
DPAK (TO-252) tape and reel mechanical data
Tape mm Reel mm Dim. Min. Max. 7 10.6 12.1 1.5 1.5 1.65 7.4 2.55 3.9 7.9 1.9 40 0.25 15.7 0.35 16.3 1.85 7.6 2.75 4.1 8.1 2.1 Base qty. Bulk qty. 2500 2500 1.6 A B C D G N T 1.5 12.8 20.2 16.4 50 22.4 18.4 13.2 Min. Max. 330 6.8 10.4
Dim. A0 B0 B1 D D1 E F K0 P0 P1 P2 R T W
22/25
Doc ID 16531 Rev 3
STB/D/F/I/P/U8N65M5 Figure 32. Tape for DPAK and D²PAK
10 pitches cumulative tolerance on tape +/- 0.2 mm T Top cover tape P0 D
Packaging mechanical data
P2 E F
K0
W B0
A0
P1
D1
User direction of feed
R
Bending radius
User direction of feed
AM08852v2
Figure 33. Reel for DPAK and D²PAK
REEL DIMENSIONS 40mm min. Access hole At sl ot location B D C A N T
Full radius
Tape slot in core for tape start 25 mm min. width
G measured at hub
AM08851v2
Doc ID 16531 Rev 3
23/25
Revision history
STB/D/F/I/P/U8N65M5
6
Revision history
Table 16.
Date 23-Oct-2009 14-Oct-2010 05-Jul-2011
Document revision history
Revision 1 2 3 First release Document status promoted from preliminary data to datasheet. Table 7: Source drain diode has been updated. Changes
24/25
Doc ID 16531 Rev 3
STB/D/F/I/P/U8N65M5
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
Doc ID 16531 Rev 3
25/25