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STV300NH02L

STV300NH02L

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    PowerSO_10裸露底部焊盘

  • 描述:

    MOSFET N-CH 24V 280A POWERSO-10

  • 数据手册
  • 价格&库存
STV300NH02L 数据手册
STV300NH02L N-channel 24V - 0.8mΩ - 280A - PowerSO-10 STripFET™ Power MOSFET PRELIMINARY DATA General features Type STV300NH02L ■ ■ ■ ■ VDSS 24V RDS(on) 0.001Ω ID 280A 10 1 RDS(on)*Qg industry’s benchmark Conduction losses reduced Low profile, very low parasitic inductance Switching losses reduced PowerSO-10 Description This product utilizes the latest advanced design rules of ST’s proprietary STripFET™ technology. This is suitable for high current OR-ing application. Internal schematic diagram Applications ■ Switching application – OR-ing – Specially designed and optimized for high efficiency DC/DC converters. Connection diagram (top view) Order code Part number STV300NH02L Marking V300NH02L Package PowerSO-10 Packaging Tape & reel February 2007 Rev 1 1/9 www.st.com 9 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. Electrical ratings STV300NH02L 1 Electrical ratings Table 1. Symbol VDS VGS ID (1) ID (1) IDM (2) PTOT (3) Absolute maximum ratings Parameter Drain-source voltage (vgs = 0) Gate-source voltage Drain current (continuous) at TC = 25°C Drain current (continuous) at TC = 100°C Drain current (pulsed) Total dissipation at TC = 25°C Derating factor Value 24 ± 20 280 200 1120 300 2 2296 -55 to 175 Operating junction temperature Unit V V A A A W W/°C mJ °C EAS (4) Tstg Tj Single pulse avalanche energy Storage temperature 1. This value is limited by package 2. Pulse with limited by safe operating area 3. This value is rated according to Rthj-c 4. Starting Tj = 25°C, ID = 60A, VDD = 20V Table 2. Thermal data 0.5 50 °C/W °C/W Rthj-case Thermal resistance junction-case max Rthj-amb Thermal resistance junction-ambient max 2/9 STV300NH02L Electrical characteristics 2 Electrical characteristics (Tcase =25°C unless otherwise specified) Table 3. Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on) RDS(on) On /off states Parameter Drain-source breakdown voltage Test conditions ID = 1mA, VGS= 0 Min. 24 1 10 ±100 1 1.5 0.8 1.1 2 1 Typ. Max. Unit V µA µA nA V mΩ mΩ VDS = Max rating, Zero gate voltage drain current (VGS = 0) VDS = Max rating, Tc=125°C Gate body leakage current (VDS = 0) VDS = ± 20V Gate threshold voltage VDS= VGS, ID = 250µA Static drain-source on resistance Static drain-source on resistance VGS= 10V, ID= 80A VGS= 10V, ID= 80A @100°C Table 4. Symbol Ciss Coss Crss Qg Qgs Qgd RG Dynamic Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-source charge Gate-drain charge Gate input resistance Test conditions Min. Typ. 7055 3251 307 109.4 30.2 26.4 4.4 Max. Unit pF pF pF nC nC nC Ω VDS = 15V, f = 1 MHz, VGS =0 VDD= 12V, ID= 120A, VGS= 10V (see Figure 2) VDS = 0V, f = 1 MHz, VGS =0 3/9 Electrical characteristics STV300NH02L Table 5. Symbol td(on) tr td(off) tf Switching times Parameter Turn-on delay time Rise time Test conditions VDD = 12V, ID = 60A , RG= 4.7Ω VGS= 10V, (see Figure 1) VDD = 12V, ID = 60A , RG= 4.7Ω VGS= 10V, (see Figure 1) Min. Typ. 18 275 Max Unit ns ns Turn-off delay time Fall time 138 94.4 ns ns Table 6. Symbol ISD ISDM VSD (1) trr Qrr IRRM trr Qrr IRRM 1. Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 120A, VGS = 0 ISD = 120A,di/dt = 100A/µs VDD = 20V, Tj = 25°C (see Figure 6) ISD = 120A,di/dt = 100A/µs VDD = 20V, Tj = 150°C (see Figure 6) 63 85 2.7 63.2 88 2.8 Test conditions Min. Typ. Max. Unit 300 1200 1.3 A A V ns nC A ns nC A Pulsed: Pulse duration = 300 µs, duty cycle 1.5% 4/9 STV300NH02L Test circuits 3 Figure 1. Test circuits Switching times test circuit for resistive load Figure 2. Gate charge test circuit Figure 3. Test circuit for inductive load Figure 4. switching and diode recovery times Unclamped inductive load test circuit Figure 5. Unclamped inductive waveform Figure 6. Switching time waveform 5/9 Package mechanical data STV300NH02L 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 6/9 STV300NH02L Package mechanical data PowerSO-10 MECHANICAL DATA DIM. MIN. A A1 B C D D1 e E E1 E2 E3 E4 F h H L q α 0o 13.80 1.20 1.70 8o 9.30 7.20 7.20 6.10 5.90 1.25 0.50 14.40 1.80 0.543 0.047 0.067 3.35 0.00 0.40 0.35 9.40 7.40 1.27 9.50 7.40 7.60 6.35 6.10 1.35 0.366 0.283 0.283 0.240 0.232 0.049 0.002 0.567 0.071 mm TYP. MAX. 3.65 0.10 0.60 0.55 9.60 7.60 MIN. 0.132 0.000 0.016 0.013 0.370 0.291 0.050 0.374 0.291 0.300 0.250 0.240 0.053 inch TYP. MAX. 0.144 0.004 0.024 0.022 0.378 0.300 B 0.10 A B 10 = = 6 = = H = E = = E2 E3 E1 = E4 = = A 1 5 = SEATING PLANE DETAIL "A" Q e 0.25 M B C h D = D1 = = = SEATING PLANE A F A1 = A1 L DETAIL "A" α 0068039-C 7/9 Revision history STV300NH02L 5 Revision history Table 7. Date 08-Feb-2007 Revision history Revision 1 First release Changes 8/9 STV300NH02L Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9
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