STW13009

STW13009 High voltage fast-switching NPN power transistor Features ■ Low spread of dynamic parameters ■ High voltage capability ■ Minimum lot-to-lot spread for reliable operation ■ Very high switching speed 3 Application ■ 2 1 Switch mode power supplies TO-247 Description The device is manufactured using high voltage multi-epitaxial planar technology for high switching speeds and medium voltage capability. It uses a Hollow emitter structure to enhance switching speeds. Table 1. Figure 1. Internal schematic diagram Device summary Order code Marking (1) Package Packaging TO-247 Tube W13009 L STW13009 W13009 H 1. Product is pre-selected in DC current gain (group L and group H). STMicroelectronics reserves the right to ship either groups according to production availability. Please contact your nearest STMicroelectronics sales office for delivery details. October 2007 Rev 1 1/11 www.st.com 11 Contents STW13009 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2/11 STW13009 1 Electrical ratings Electrical ratings Table 2. Absolute maximum rating Symbol Parameter Value Unit VCEV Collector-emitter voltage (VBE = -1.5 V) 700 V VCEO Collector-emitter voltage (IB = 0) 400 V VEBO Emitter-base voltage (IC = 0) 12 V Collector current 12 A Collector peak current (tP < 5ms) 24 A Base current 6 A IBM Base peak current (tP < 5ms) 12 A Ptot Total dissipation at Tc = 25°C 125 W Tstg Storage temperature -65 to 150 °C 150 °C Value Unit 1 °C/W IC ICM IB TJ Table 3. Symbol Rthj-case Max. operating junction temperature Thermal data Parameter Thermal resistance junction-case ____M __mMax 3/11 Electrical characteristics 2 STW13009 Electrical characteristics (Tcase = 25°C unless otherwise specified) Table 4. Symbol Electrical characteristics Parameter ICEV Collector cut-off current (VBE = -1.5 V) IEBO Emitter cut-off current (IC = 0) Collector-emitter VCEO(sus) (1) sustaining voltage (IB = 0) VCE(sat) (1) VBE(sat) (1) hFE (1)(2) Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain Test conditions ts Storage time tf Fall time Typ. VCE = 700 V VCE = 700 V TC = 100°C VEB = 10 V IC = 10 mA _ IC = 5 A _ _ Unit 10 500 µA µA 10 µA V IB = 0.8 A IB = 1 A IC = 8 A _ _ IB = 1.6 A IC = 12 A _ _ IB = 3 A IC = 5 A _ IB = 1 A IC = 8 A _ _ IB = 1.6 A IC = 5 A _ VCE = 5 V Group L Group H IC = 8 A _ _ IB1 = 1 A Max. 400 IC = 4 A IC = 5 A Inductive load Min. VCE = 5 V 0.85 0.9 1.25 2.5 V V V V 1.2 1.6 V V 15 28 23 36 10 30 VCC = 250 V IB2 = -2 A L = 200 µH 1.6 2.5 µs 60 110 ns see Figure 9 Inductive load ts Storage time tf Fall time IC = 5 A VCC = 125 V IB1 = - IB2 = 1.6 A L = 200 µH tc = 125 °C 2.3 µs 110 ns see Figure 9 1. Pulsed duration = 300 ms, duty cycle ≤1.5 % 2. Product is pre-selected in DC current gain (group L and group H). STMicroelectronics reserves the right to ship either groups according to production availability. Please contact your nearest STMicroelectronics sales office for delivery details. 4/11 STW13009 2.1 Electrical characteristics Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Derating curve Figure 4. DC current gain Figure 5. DC current gain Figure 6. Collector-emitter saturation voltage Figure 7. Base-emitter saturation voltage 5/11 Electrical characteristics Figure 8. 6/11 Reverse biased operating area STW13009 STW13009 3 Test circuit Test circuit Figure 9. Inductive load switching test circuit 1) Fast electronic switch 2) Non-inductive resistor 3) Fast recovery rectifier 7/11 Package mechanical data 4 STW13009 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 8/11 STW13009 Package mechanical data TO-247 Mechanical data mm. Dim. A Min. 4.85 A1 2.20 Typ Max. 5.15 2.60 b 1.0 1.40 b1 2.0 2.40 b2 3.0 3.40 c 0.40 0.80 D 19.85 20.15 E 15.45 15.75 e 5.45 L 14.20 14.80 L1 3.70 4.30 L2 18.50 øP 3.55 3.65 øR 4.50 5.50 S 5.50 9/11 Revision history 5 STW13009 Revision history Table 5. 10/11 Document revision history Date Revision 25-Oct-2007 1 Changes Initial release STW13009 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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