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STW55NM60N

STW55NM60N

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO247

  • 描述:

    MOSFET N-CH 600V 51A TO-247

  • 数据手册
  • 价格&库存
STW55NM60N 数据手册
STW55NM60N N-channel 600 V, 0.047 Ω, 51 A, MDmesh™ II Power MOSFET TO-247 Features Type VDSS (@Tjmax) RDS(on) max ID STW55NM60N 650 V < 0.060 Ω 51 A ■ 100% avalanche tested ■ Low input capacitance and gate charge ■ Low gate input resistance Application ■ e t e ol Switching applications Description ) (s This series of devices is designed using the second generation of MDmesh™ technology. This revolutionary Power MOSFET associates a new vertical structure to the company’s strip layout to yield one of the world’s lowest on-resistance and gate charge. It is therefore suitable for the most demanding high efficiency converters. du 2 o r P TO-247 s b O Figure 1. ) s ( ct 1 3 Internal schematic diagram t c u d o r P e t e l o s b O Table 1. Device summary Order code Marking Package Packaging STW55NM60N W55NM60N TO-247 Tube July 2008 Rev 4 1/12 www.st.com 12 Contents STW55NM60N Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 Test circuit ................................................ 8 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ) s ( ct u d o r P e t e l o ) (s t c u d o r P e t e l o s b O 2/12 s b O STW55NM60N 1 Electrical ratings Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Drain-source voltage (VGS = 0) 600 V VGS Gate- source voltage ±25 V ID Drain current (continuous) at TC = 25°C 51 A ID Drain current (continuous) at TC = 100°C 32 A Drain current (pulsed) 204 Total dissipation at TC = 25°C 350 Peak diode recovery voltage slope 15 (1) PTOT dv/dt (2) Tj 2. ISD ≤ 51 A, di/dt ≤ 400 A/µs, VDD = 80% V(BR)DSS Table 3. Thermal data Symbol s b O Parameter ) (s Rthj-case Thermal resistance junction-case max Rthj-amb Thermal resistance junction-ambient max Tl Maximum lead temperature for soldering purpose ct du o r P Table 4. Symbol ct W V/ns –55 to 150 °C 150 °C Value Unit 0.36 °C/W 50 °C/W 300 °C Value Unit 15 A 1600 mJ t e l o 1. Pulse width limited by safe operating area e t e ol P e Max. operating junction temperature (s) A du ro Storage temperature Tstg O Unit VDS IDM bs Value Avalanche characteristics Parameter IAS Avalanche current, repetitive or not-repetitive (pulse width limited by Tj max) EAS Single pulse avalanche energy (starting Tj = 25 °C, ID= IAS, VDD = 50 V) 3/12 Electrical characteristics 2 STW55NM60N Electrical characteristics (TCASE=25°C unless otherwise specified) Table 5. On/off states Symbol Parameter Test conditions V(BR)DSS Drain-source breakdown voltage ID = 1mA, VGS = 0 dv/dt (1) Drain source voltage slope VDD= 480 V, ID = 51 A, VGS =10 V IDSS Zero gate voltage drain current (VGS = 0) VDS = Max rating VDS = Max rating, @125 °C IGSS Gate-body leakage current (VDS = 0) VGS = ± 20 V VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA RDS(on) Static drain-source on resistance VGS = 10 V, ID = 25.5 A Table 6. Symbol b O Parameter s ( t c gfs (1) Forward transconductance Ciss Coss Crss Max. Unit 30 2 Min. V/ns ) s ( ct u d o r P e Test conditions V 3 1 100 µA µA 100 nA 4 V Ω 0.047 0.060 Typ. Max. Unit VDS=15 V, ID = 25.5 A 45 S Input capacitance Output capacitance Reverse transfer capacitance VDS = 50 V, f = 1 MHz, VGS = 0 5800 300 30 pF pF pF Equivalent output capacitance VGS = 0, VDS = 0 to 480 V 900 pF Qg Qgs Qgd Total gate charge Gate-source charge Gate-drain charge VDD = 480 V, ID = 51 A, VGS = 10 V, (see Figure 15) 190 30 90 nC nC nC Rg Gate input resistance f=1 MHz gate DC bias=0 Test signal level = 20 mV open drain 2.5 Ω ete l o s O ) Dynamic Typ. 600 let o s b 1. Characteristic value at turn off on inductive load Min. du o r P Coss eq. (2) 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % 2. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDS 4/12 STW55NM60N Electrical characteristics Table 7. Switching times Symbol td(on) tr td(off) tf Table 8. Parameter Turn-on delay time Rise time Turn-off delay time Fall time ISDM (1) VSD (2) trr Qrr IRRM trr Qrr IRRM Min. Typ. Max. Unit 40 30 225 70 VDD = 300 V, ID = 25.5 A RG = 4.7 Ω VGS = 10 V (see Figure 14) ns ns ns ns Source drain diode Symbol ISD Test conditions Parameter Test conditions Min Typ. ISD = 25.5 A, VGS = 0 Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 51 A, di/dt = 100 A/µs VDD = 100 V (see Figure 16) Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 51 A, di/dt = 100 A/µs VDD = 100 V, Tj = 150 °C (see Figure 16) 1. Pulse width limited by safe operating area o s b 51 204 A A 1.3 V t c u od r P e let Unit (s) Source-drain current Source-drain current (pulsed) Forward on voltage Max 600 15 51 ns µC A 750 18 51 ns µC A O ) 2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % s ( t c u d o r P e t e l o s b O 5/12 Electrical characteristics STW55NM60N 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance ) s ( ct Figure 4. Output characteristics Figure 5. u d o r P e Transfer characteristics t e l o ) (s s b O t c u d o r o s b O 6/12 P e let Figure 6. Transconductance Figure 7. Static drain-source on resistance STW55NM60N Figure 8. Electrical characteristics Gate charge vs gate-source voltage Figure 9. Figure 10. Normalized gate threshold voltage vs temperature Capacitance variations ) s ( ct u d o Figure 11. Normalized on resistance vs temperature r P e t e l o ) (s s b O t c u d o r P e Figure 12. Source-drain diode forward characteristics Figure 13. Normalized BVDSS vs temperature t e l o s b O 7/12 Test circuit 3 STW55NM60N Test circuit Figure 14. Switching times test circuit for resistive load Figure 15. Gate charge test circuit ) s ( ct u d o r P e Figure 16. Test circuit for inductive load Figure 17. Unclamped inductive load test switching and diode recovery times circuit t e l o ) (s s b O t c u d o r P e t e l o Figure 18. Unclamped inductive waveform s b O 8/12 Figure 19. Switching time waveform STW55NM60N 4 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 9/12 Package mechanical data STW55NM60N TO-247 Mechanical data mm. Dim. A Min. 4.85 Typ A1 2.20 2.60 b 1.0 1.40 b1 2.0 2.40 b2 3.0 3.40 c 0.40 0.80 D 19.85 E 15.45 ) s ( ct 14.20 L1 3.70 L2 øP 3.55 øR 4.50 ) (s S t c u d o r P e s b O 10/12 t e l o s b O ro P e 5.45 L du 20.15 e t e l o Max. 5.15 15.75 14.80 4.30 18.50 3.65 5.50 5.50 STW55NM60N 5 Revision history Revision history Table 9. Document revision history Date Revision Changes 06-Nov-2007 1 Initial release 19-Dec-2007 2 Figure 9: Capacitance variations has been updated 16-Jan-2008 3 Document status promoted from preliminary data to datasheet. 31-Jul-2008 4 EAS value has been updated in Table 4 ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 11/12 STW55NM60N ) s ( ct Please Read Carefully: u d o Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. r P e All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. t e l o No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. ) (s s b O UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. t c u UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. d o r P e t e l o Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. s b O ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 12/12
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