STW60N65M5
STFW60N65M5
N-channel 650 V, 0.049 Ω, 46 A MDmesh™ V Power MOSFET
in TO-247, TO-3PF
Features
■
Order codes
VDSS @
TJmax
RDS(on)
max
ID
STFW60N65M5
STW60N65M5
710 V
< 0.059 Ω
46 A
Worldwide best RDS(on) * area amongst the
silicon based devices
2
Higher VDSS rating
■
High dv/dt capability
■
Excellent switching performance
■
Easy to drive
■
100% avalanche tested
e
t
e
ol
)
(s
Application
Switching applications
Description
u
d
o
3
1
TO-247
■
)
s
(
ct
1
s
b
O
Figure 1.
Pr
1
TO-3PF
Internal schematic diagram
t
c
u
$
d
o
r
The devices are N-channel MDmesh™ V Power
MOSFET based on an innovative proprietary
vertical process technology, which is combined
with STMicroelectronics’ well-known
PowerMESH™ horizontal layout structure. The
resulting product has extremely low onresistance, which is unmatched among siliconbased Power MOSFETs, making it especially
suitable for applications which require superior
power density and outstanding efficiency.
P
e
'
t
e
l
o
bs
3
O
Table 1.
!-V
Device summary
Order codes
Marking
Package
Packaging
STFW60N65M5
STW60N65M5
60N65M5
TO-3PF
TO-247
Tube
May 2011
3
2
Doc ID 18222 Rev 2
1/16
www.st.com
16
Contents
STFW60N65M5, STW60N65M5
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................ 6
3
Test circuits
.............................................. 9
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
2/16
Doc ID 18222 Rev 2
STFW60N65M5, STW60N65M5
1
Electrical ratings
Electrical ratings
Table 2.
Absolute maximum ratings
Value
Symbol
Parameter
Unit
TO-247
VGS
Gate-source voltage
TO-3PF
± 25
V
ID
Drain current (continuous) at TC = 25 °C
46
A
ID
Drain current (continuous) at TC = 100 °C
29
A
Drain current (pulsed)
184
(s)
IDM
(1)
PTOT
Total dissipation at TC = 25 °C
255
IAR
Avalanche current, repetitive or notrepetitive (pulse width limited by Tj max)
EAS
Single pulse avalanche energy
(starting Tj = 25 °C, ID = IAR, VDD = 50 V)
dv/dt (2)
Insulation withstand voltage (RMS) from all
three leads to external heat sink
(t=1s; Tc=25°C)
Tstg
Storage temperature
so
)-
b
O
du
o
r
P
1400
e
t
e
l
ct
79
12
Peak diode recovery voltage slope
VISO
Tj
A
15
W
A
mJ
V/ns
3500
V
- 55 to 150
°C
150
°C
Max. operating junction temperature
s
(
t
c
1. Pulse width limited by safe operating area
2. ISD ≤ 46 A, di/dt ≤ 400 A/µs, VDD = 400 V, VPeak < V(BR)DSS
Table 3.
u
d
o
Thermal data
r
P
e
Symbol
s
b
O
t
e
l
o
Value
Parameter
Unit
TO-247
TO-3PF
0.49
1.58
Rthj-case
Thermal resistance junction-case max
Rthj-amb
Thermal resistance junction-ambient max
50
°C/W
Tl
Maximum lead temperature for soldering
purpose
300
°C
Doc ID 18222 Rev 2
°C/W
3/16
Electrical characteristics
2
STFW60N65M5, STW60N65M5
Electrical characteristics
(TC = 25 °C unless otherwise specified)
Table 4.
On /off states
Symbol
V(BR)DSS
Parameter
Drain-source
breakdown voltage
VDS = Max rating
Zero gate voltage
drain current (VGS = 0) VDS = Max rating, TC=125 °C
IGSS
Gate-body leakage
current (VDS = 0)
Gate threshold voltage VDS = VGS, ID = 250 µA
RDS(on)
Static drain-source on
resistance
Co(tr)(1)
ete
e
t
e
ol
Parameter
u
d
o
s
b
O
Test conditions
)-
s
(
t
c
VDS = 100 V, f = 1 MHz,
VGS = 0
Equivalent
capacitance time
related
Pr
Co(er)(2)
VGS = 10 V, ID = 23 A
Dynamic
Input capacitance
Output capacitance
Reverse transfer
capacitance
Ciss
Coss
Crss
Equivalent
capacitance energy
related
Min.
Typ.
Max.
Unit
650
V
1
100
µA
µA
100
nA
5
V
0.049
0.059
Ω
Min.
Typ.
Max.
Unit
-
6810
141
6.2
-
pF
pF
pF
-
480
-
pF
-
140
-
pF
-
1
-
Ω
-
139
34
52
-
nC
nC
nC
)
s
(
ct
VGS = ± 25 V
VGS(th)
Symbol
b
O
ID = 1 mA, VGS = 0
IDSS
Table 5.
l
o
s
Test conditions
u
d
o
3
Pr
4
VDS = 0 to 520 V, VGS = 0
RG
Intrinsic gate
resistance
f = 1 MHz open drain
Qg
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain charge
VDD = 520 V, ID = 23 A,
VGS = 10 V
(see Figure 17)
1. Co(tr) is a constant capacitance value that gives the same charging time as Coss while VDS is rising from 0
to 80% VDSS.
2. Co(er) is a constant capacitance value that gives the same stored energy as Coss while VDS is rising from 0
to 80% VDSS.
4/16
Doc ID 18222 Rev 2
STFW60N65M5, STW60N65M5
Table 6.
Switching times
Symbol
td (v)
tr (v)
tf (i)
tc(off)
Electrical characteristics
Parameter
Test conditions
Parameter
ISD
Source-drain current
Source-drain current (pulsed)
ISDM
VSD (2)
trr
Qrr
IRRM
trr
Qrr
IRRM
-
90
11
13
16
Min.
Typ.
Max
Unit
-
ns
ns
ns
ns
Source drain diode
Symbol
(1)
Typ.
VDD = 400 V, ID = 30 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 18)
(see Figure 21)
Voltage delay time
Voltage rise time
Current fall time
Crossing time
Table 7.
Min.
Test conditions
Forward on voltage
ISD = 46 A, VGS = 0
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 46 A, di/dt = 100 A/µs
VDD = 100 V (see Figure 21)
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 46 A, di/dt = 100 A/µs
VDD = 100 V, Tj = 150 °C
(see Figure 21)
1. Pulse width limited by safe operating area
)
(s
)
s
(
ct
-
s
b
O
e
t
e
ol
u
d
o
-
Pr
Max. Unit
46
184
A
A
1.5
V
-
448
10
45
ns
µC
A
-
534
14
52
ns
µC
A
2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
Doc ID 18222 Rev 2
5/16
Electrical characteristics
STFW60N65M5, STW60N65M5
2.1
Electrical characteristics (curves)
Figure 2.
Safe operating area for TO-3FP
Figure 3.
Thermal impedance for TO-3FP
AM09126v1
ID
(A)
TO3PF
K
Tj=150°C
δ=0.5
Tc=25°C
Single pulse
100
0.2
a
e
ar
is
(o
is DS
th
in ax R
ion m
at by
r
e
d
Op mite
Li
10
n)
0.1
10µs
100µs
-1
10
0.05
1ms
10ms
0.02
)
s
(
ct
0.01
1
Single pulse
Figure 4.
10
1
100
10 -5
10
VDS(V)
Safe operating area for TO-247
ID
(A)
10µs
is
a
s
hi
e
ar
)
n
(o
S
t
R
x
in
n ma
tio y
ra d b
e
e
p
O mit
Li
100µs
ct
u
d
o
1
r
P
e
0.1
0.1
10
1
t
e
l
o
Figure 6.
s
b
O
)
(s
D
100
-1
10
tp (s)
r
P
e
Thermal impedance for TO-247
1ms
10ms
VDS(V)
Figure 7.
AM09128v1
VGS=10V
7.5V
7V
120
10
s
b
O
Output characteristics
ID
(A)
140
-2
-3
10
t
e
l
o
Tj=150°C
Tc=25°C
Single pulse
100
-4
10
Figure 5.
AM09127v1
10
u
d
o
-2
0.1
0.1
Transfer characteristics
AM09129v1
ID
(A)
140
VDS=20V
120
100
6.5V
100
80
80
60
60
6V
40
20
40
20
5.5V
0
0
6/16
2
4
6
8
0
10 12 14 16 18 VDS(V)
Doc ID 18222 Rev 2
3
4
5
6
7
8
9
VGS(V)
STFW60N65M5, STW60N65M5
Figure 8.
Electrical characteristics
Gate charge vs gate-source voltage Figure 9.
AM09130v1
VGS
(V)
VDS
12
VDD=520V
ID=23A
Static drain-source on resistance
AM09131v1
RDS(on)
(Ω)
VGS=10V
0.057
500
0.055
10
400
0.053
8
0.051
300
6
0.049
200
4
0.047
2
100
0
0
Qg(nC)
100
50
0
150
)
s
(
ct
0.045
0.043
0
Figure 10. Capacitance variations
20
10
30
u
d
o
40
ID(A)
Figure 11. Output capacitance stored energy
AM09132v1
C
(pF)
Eoss
(µJ)
e
t
e
ol
25
10000
Ciss
Pr
AM09133v1
s
b
O
20
1000
)
(s
Coss
100
t
c
u
10
1
0.1
od
1
r
P
e
10
100
t
e
l
o
O
bs
10
Crss
5
0
0
VDS(V)
Figure 12. Normalized gate threshold voltage
vs temperature
VGS(th)
15
AM09134v1
(norm)
100
200 300
400 500 600
VDS(V)
Figure 13. Normalized on resistance vs
temperature
AM09135v1
RDS(on)
(norm)
ID=250µA
1.10
2.1
ID=23A
1.9
1.00
1.7
1.5
0.90
1.3
1.1
0.80
0.9
0.7
0.70
-50
-25
0
25
50
75 100 125 TJ(°C)
0.5
-50 -25
Doc ID 18222 Rev 2
0
25
50
75 100 125 TJ(°C)
7/16
Electrical characteristics
STFW60N65M5, STW60N65M5
Figure 14. Normalized BVDSS vs temperature
Figure 15. Switching losses vs gate resistance
(1)
AM09136v1
1.07
E
(μJ)
800
1.05
700
BVDSS
(norm)
ID=1mA
AM09137v1
Eon
ID=30A
VDD=400V
VGS=10V
600
1.03
Eoff
500
1.01
400
0.99
300
0.97
0.95
100
0.93
-50 -25
0
25
50
75
100 125
0
TJ(°C)
0
10
1. Eon including reverse recovery of a SiC diode
e
t
e
ol
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
8/16
)
s
(
ct
200
Doc ID 18222 Rev 2
du
20
o
r
P
30
40
RG(Ω)
STFW60N65M5, STW60N65M5
3
Test circuits
Test circuits
Figure 16. Switching times test circuit for
resistive load
Figure 17. Gate charge test circuit
VDD
12V
47kΩ
1kΩ
100nF
3.3
μF
2200
RL
μF
IG=CONST
VDD
VGS
100Ω
Vi=20V=VGMAX
VD
RG
2200
μF
D.U.T.
)
s
(
t
VG
2.7kΩ
c
u
d
PW
47kΩ
1kΩ
PW
D.U.T.
AM01468v1
e
t
e
ol
o
r
P
AM01469v1
Figure 18. Test circuit for inductive load
Figure 19. Unclamped inductive load test
switching and diode recovery times
circuit
A
A
D.U.T.
FAST
DIODE
B
B
A
D
G
S
s
(
t
c
3.3
μF
B
25 Ω
D
1000
μF
RG
S
r
P
e
2200
μF
3.3
μF
VDD
ID
Vi
D.U.T.
Pw
let
AM01470v1
Figure 20. Unclamped inductive waveform
b
O
L
VD
VDD
u
d
o
G
so
)-
L=100μH
s
b
O
V(BR)DSS
AM01471v1
Figure 21. Switching time waveform
Concept waveform for Inductive Load Turn-off
Id
VD
90%Vds
90%Id
Tdelay-off
-off
IDM
Vgs
90%Vgs
on
ID
Vgs(I(t))
))
VDD
VDD
10%Id
10%Vds
Vds
Trise
AM01472v1
Doc ID 18222 Rev 2
Tfall
Tcross --over
AM05540v2
9/16
Package mechanical data
4
STFW60N65M5, STW60N65M5
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com. ECOPACK
is an ST trademark.
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
10/16
Doc ID 18222 Rev 2
STFW60N65M5, STW60N65M5
Table 8.
Package mechanical data
TO-3PF mechanical data
mm
Dim.
Min.
Typ.
Max.
A
5.30
5.70
C
2.80
3.20
D
3.10
3.50
D1
1.80
2.20
E
0.80
1.10
F
0.65
0.95
F2
1.80
2.20
G
10.30
)
s
(
ct
11.50
G1
5.45
H
15.30
L
9.80
L2
22.80
L3
26.30
L4
43.20
L5
4.30
L6
24.30
14.60
du
N
ro
R
P
e
Dia
ete
10
ol
)-
s
b
O
s
(
t
c
L7
du
o
r
P
15.70
10.20
23.20
26.70
44.40
4.70
24.70
15
1.80
2.20
3.80
4.20
3.40
3.80
t
e
l
o
s
b
O
Doc ID 18222 Rev 2
11/16
Package mechanical data
STFW60N65M5, STW60N65M5
Figure 22. TO-3PF drawing
L3
L
D
E
A
C
D1
Dia
L2
L6
L7
)
s
(
ct
F2(3x)
F(3x)
du
G1
H
ro
P
e
G
R
t
e
l
o
L5
N
s
b
O
L4
)
(s
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
12/16
Doc ID 18222 Rev 2
7627132_C
STFW60N65M5, STW60N65M5
Table 9.
Package mechanical data
TO-247 mechanical data
mm
Dim.
Min.
Typ.
Max.
A
4.85
5.15
A1
2.20
2.60
b
1.0
1.40
b1
2.0
2.40
b2
3.0
3.40
c
0.40
0.80
D
19.85
20.15
E
15.45
)
s
(
ct
15.75
e
5.45
L
14.20
L1
3.70
du
ete
l
o
s
L2
o
r
P
14.80
4.30
18.50
∅P
3.55
∅R
4.50
)-
S
b
O
3.65
5.50
5.50
s
(
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
Doc ID 18222 Rev 2
13/16
Package mechanical data
STFW60N65M5, STW60N65M5
Figure 23. TO-247 drawing
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
0075325_F
t
e
l
o
s
b
O
14/16
Doc ID 18222 Rev 2
STFW60N65M5, STW60N65M5
5
Revision history
Revision history
Table 10.
Document revision history
Date
Revision
Changes
15-Nov-2010
1
First release.
05-May-2011
2
Document status promoted from preliminary data to datasheet.
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
Doc ID 18222 Rev 2
15/16
STFW60N65M5, STW60N65M5
)
s
(
ct
Please Read Carefully:
u
d
o
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
r
P
e
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
t
e
l
o
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
)
(s
s
b
O
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
t
c
u
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
d
o
r
P
e
t
e
l
o
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
s
b
O
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
16/16
Doc ID 18222 Rev 2