STW62N65M5
Automotive-grade N-channel 650 V, 0.041 Ω typ., 46 A
MDmesh™ M5 Power MOSFET in a TO-247 package
Datasheet - production data
Features
Order code
VDS @ TJmax
RDS(on) max
ID
STW62N65M5
710 V
0.049 Ω
46 A
• Designed for automotive applications and
AEC-Q101 qualified
2
3
• Extremely low RDS(on)
1
• Low gate charge and input capacitance
TO-247
• Excellent switching performance
• 100% avalanche tested
Applications
Figure 1. Internal schematic diagram
• Switching applications
Description
'
This device is an N-channel Power MOSFET
based on MDmesh™ M5 innovative vertical
process technology combined with the wellknown PowerMESH™ horizontal layout. The
resulting product offers extremely low onresistance, making it particularly suitable for
applications requiring high power and superior
efficiency.
*
6
$0Y
Table 1. Device summary
Order code
Marking
Package
Packaging
STW62N65M5
62N65M5
TO-247
Tube
July 2014
This is information on a product in full production.
DocID024837 Rev 3
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www.st.com
Contents
STW62N65M5
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
Test circuits
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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STW62N65M5
1
Electrical ratings
Electrical ratings
Table 2. Absolute maximum ratings
Symbol
VGS
Parameter
Gate-source voltage
Value
Unit
± 25
V
ID
Drain current (continuous) at TC = 25 °C
46
A
ID
Drain current (continuous) at TC = 100 °C
26
A
IDM (1)
Drain current (pulsed)
184
A
PTOT
Total dissipation at TC = 25 °C
330
W
dv/dt
(2)
Peak diode recovery voltage slope
15
V/ns
dv/dt
(3)
MOSFET dv/dt ruggedness
50
V/ns
- 55 to 150
°C
150
°C
Value
Unit
0.38
°C/W
50
°C/W
Value
Unit
12
A
1400
mJ
Tstg
Tj
Storage temperature
Max. operating junction temperature
1. Pulse width limited by safe operating area
2. ISD ≤ 46 A, di/dt ≤ 200 A/µs; VDS peak < V(BR)DSS, VDD=400 V
3. VDS ≤ 520 V
Table 3. Thermal data
Symbol
Parameter
Rthj-case
Thermal resistance junction-case max
Rthj-amb
Thermal resistance junction-ambient max
Table 4. Avalanche characteristics
Symbol
Parameter
IAR
Avalanche current, repetitive or not repetitive
(pulse width limited by Tjmax)
EAS
Single pulse avalanche energy
(starting Tj = 25 °C, ID = IAR, VDD = 50 V)
DocID024837 Rev 3
3/14
14
Electrical characteristics
2
STW62N65M5
Electrical characteristics
(TC = 25 °C unless otherwise specified)
Table 5. On /off states
Symbol
V(BR)DSS
Parameter
Drain-source
breakdown voltage
IDSS
Zero gate voltage
drain current
IGSS
Gate-body leakage
current
Test conditions
VGS = 0, ID = 1 mA
Min.
Typ.
Max.
Unit
650
V
VGS = 0, VDS = 650 V
1
µA
VGS = 0, VDS = 650 V,
TC=125 °C
100
µA
VDS = 0, VGS = ± 25 V
± 100
nA
4
5
V
0.041
0.049
Ω
Min.
Typ.
Max.
Unit
-
6420
-
pF
-
170
-
pF
-
11
-
pF
-
536
-
pF
-
146
-
pF
f = 1 MHz, ID = 0
-
1.2
-
Ω
VDD = 520 V, ID = 23 A,
VGS = 10 V
(see Figure 16)
-
142
-
nC
-
34
-
nC
-
58
-
nC
VGS(th)
Gate threshold voltage VDS = VGS, ID = 250 µA
RDS(on)
Static drain-source
on-resistance
3
VGS = 10 V, ID = 23 A
Table 6. Dynamic
Symbol
Parameter
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Co(tr)(1)
Equivalent
capacitance time
related
Co(er)(2)
Equivalent
capacitance energy
related
RG
Intrinsic gate
resistance
Qg
Total gate charge
Qgs
Gate-source charge
Qgd
Gate-drain charge
Test conditions
VGS = 0, VDS = 100 V,
f = 1 MHz,
VGS = 0, VDS = 0 to 520 V
1. Time related is defined as a constant equivalent capacitance giving the same charging time as Coss when
VDS increases from 0 to 80% VDSS
2. Energy related is defined as a constant equivalent capacitance giving the same stored energy as Coss
when VDS increases from 0 to 80% VDSS
4/14
DocID024837 Rev 3
STW62N65M5
Electrical characteristics
Table 7. Switching times
Symbol
Parameter
td(V)
Voltage delay time
tr(V)
Voltage rise time
tc(off)
Crossing time
tf(i)
Test conditions
VDD = 400 V, ID = 30 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 17 and
Figure 20)
Current fall time
Min.
Typ.
Max
Unit
-
101
-
ns
-
11
-
ns
-
14
-
ns
-
8
-
ns
Min.
Typ.
Table 8. Source drain diode
Symbol
ISD
Parameter
Test conditions
Source-drain current
-
ISDM
(1)
Source-drain current (pulsed)
VSD
(2)
Forward on voltage
trr
VGS = 0, ISD = 46 A
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
trr
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
ISD = 46 A, di/dt = 100 A/µs
VDD = 100 V (see Figure 17)
ISD = 46 A, di/dt = 100 A/µs
VDD = 100 V, Tj = 150 °C
(see Figure 17)
-
Max. Unit
46
A
184
A
1.5
V
-
448
ns
-
10
µC
-
43
A
-
548
ns
-
14
µC
-
51
A
1. Pulse width limited by safe operating area.
2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
DocID024837 Rev 3
5/14
14
Electrical characteristics
2.1
STW62N65M5
Electrical characteristics (curves)
Figure 2. Safe operating area
Figure 3. Thermal impedance
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D
6
LV
RQ
V
V
PV
PV
7M &
7F &
6LQOJH
SXOVH
9'69
Figure 4. Output characteristics
Figure 5. Transfer characteristics
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9*6 9
9
9
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9'' 9
9*69
AM15919v1
RDS(on)
(Ω)
VGS=10 V
0.044
,' $
Figure 7. Static drain-source on-resistance
0.043
0.042
0.041
0.040
0.039
6/14
9'69
Figure 6. Gate charge vs gate-source voltage
9*6
9
9'6 9
9
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,'
$
0.038
4JQ&
DocID024837 Rev 3
0
10
20
30
40
ID(A)
STW62N65M5
Electrical characteristics
Figure 8. Capacitance variations
Figure 9. Output capacitance stored energy
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&
S)
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(RVV
-
&LVV
&RVV
&UVV
Figure 10. Normalized gate threshold voltage vs
temperature
AM05459v2
VGS(th)
(norm)
1.10
9'69
ID=250 µA
VDS=VGS
9'69
Figure 11. Normalized on-resistance vs
temperature
AM15497v1
RDS(on)
(norm)
VGS=10 V
2.5
2
1.00
1.5
0.90
1
0.80
0.5
0.70
-50 -25
0
25
50
Figure 12. Source-drain diode forward
characteristics
AM05461v1
VSD
(V)
0
-55
TJ(°C)
75 100
5
-25
35
65
95
TJ(°C)
Figure 13. Normalized V(BR)DSS vs temperature
AM10399v1
V(BR)DSS
(norm)
TJ=-50°C
1.08
1.2
ID = 1mA
1.06
1.0
1.04
0.8
1.02
TJ=25°C
1.00
0.6
TJ=150°C
0.98
0.4
0.96
0.2
0
0.94
0
10
20
30
40
50 ISD(A)
0.92
-50 -25
DocID024837 Rev 3
0
25
50
75 100
TJ(°C)
7/14
14
Electrical characteristics
STW62N65M5
Figure 14. Switching losses vs gate
resistance(1)
AM12258v1
E
(µJ)
Eon
ID=38A
VDD=400V
VGS=10V
1000
800
600
Eoff
400
200
0
0
10
20
30
40
RG(Ω)
1. Eon including reverse recovery of a SiC diode
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DocID024837 Rev 3
STW62N65M5
3
Test circuits
Test circuits
Figure 15. Switching times test circuit for
resistive load
Figure 16. Gate charge test circuit
VDD
12V
47kΩ
1kΩ
100nF
3.3
μF
2200
RL
μF
IG=CONST
VDD
VGS
100Ω
Vi=20V=VGMAX
VD
RG
2200
μF
D.U.T.
D.U.T.
VG
2.7kΩ
PW
47kΩ
1kΩ
PW
AM01468v1
Figure 17. Test circuit for inductive load
switching and diode recovery times
A
A
AM01469v1
Figure 18. Unclamped inductive load test circuit
L
A
D
G
D.U.T.
FAST
DIODE
B
B
VD
L=100μH
S
3.3
μF
B
25 Ω
1000
μF
D
VDD
2200
μF
3.3
μF
VDD
ID
G
RG
S
Vi
D.U.T.
Pw
AM01470v1
AM01471v1
Figure 19. Unclamped inductive waveform
Figure 20. Switching time waveform
Inductive Load Turn - off
9%5'66
Id
9'
90%Vds
90%Id
td(v)
,'0
Vgs
90%Vgs
on
,'
))
Vgs(I(t))
9''
9''
10%Id
10%Vds
Vds
tr(v)
$0Y
DocID024837 Rev 3
tf(i)
tc(off)
AM05540v1
9/14
14
Package mechanical data
4
STW62N65M5
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
10/14
DocID024837 Rev 3
STW62N65M5
Package mechanical data
Figure 21. TO-247 drawing
0075325_G
DocID024837 Rev 3
11/14
14
Package mechanical data
STW62N65M5
Table 9. TO-247 mechanical data
mm.
Dim.
Min.
Typ.
A
4.85
5.15
A1
2.20
2.60
b
1.0
1.40
b1
2.0
2.40
b2
3.0
3.40
c
0.40
0.80
D
19.85
20.15
E
15.45
15.75
e
5.30
L
14.20
14.80
L1
3.70
4.30
5.45
L2
12/14
Max.
5.60
18.50
∅P
3.55
3.65
∅R
4.50
5.50
S
5.30
5.50
DocID024837 Rev 3
5.70
STW62N65M5
5
Revision history
Revision history
Table 10. Document revision history
Date
Revision
Changes
19-Jun-2013
1
First release.
23-May-2014
2
– Modified: Features in cover page
– Minor text changes
25-Jul-2014
3
– Modified: note 2 in Table 2
– Modified: symbol, parameters, tc(off) and tf(i) in Table 7
– Minor text changes
DocID024837 Rev 3
13/14
14
STW62N65M5
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