T1620T-8G

T1620T-8G 16 A - 800 V - D2PAK Snubberless Triac Features A2 A1 A2 • • • • • High static dV/dt High dynamic turn-off commutation (dl/dt)c 150 °C maximum junction temperature Three quadrants Surge capability VDSM, VRSM = 900 V • Benefits: – High immunity to false turn-on thanks to high static dV/dt – Improved turn-off in high temperature environments thanks higher (dI/dt)c – Increase of thermal margin due to extended working Tj up to 150 °C G D²PAK – Good thermal resistance due to non-insulated tab. A2 Applications A2: Anode2 A1: Anode1 G: Gate G A1 • • • • • • • General purpose AC line load switching Motor control circuits Home appliances Heating Lighting Inrush current limiting circuits Overvoltage crowbar protection Product status link Description T1620T-8G Product summary IT(RMS) 16 A VDRM/VRRM 800 V VDSM/VRSM 900 V IGT 20 mA Available in SMD, the T1620T-8G Triac can be used for the on/off or phase angle control function in general purpose AC switching where high commutation capability is required. The T1620T-8G can be used without a snubber RC circuit when the limits defined are respected. D2PAK package is UL-94,V0 flammability resin compliance. Package environmentally friendly Ecopack2 graded (RoHS and Halogen Free compliance). DS12785 - Rev 2 - July 2020 For further information contact your local STMicroelectronics sales office. www.st.com T1620T-8G Characteristics 1 Characteristics Table 1. Absolute maximum ratings (limiting values) Symbol IT(RMS) ITSM I2t dl/dt Parameter 16 Non repetitive surge peak on-state current tp = 20 ms 120 (full cycle, Tj initial = 25 °C tp = 16.7 ms 126 I2t value for fusing tp = 10 ms 95 A2s 100 A/µs Tj = 125 °C 800 V Tj = 150 °C 600 V tp = 10 ms, Tj = 25 °C 900 V 4 A 5 V 1 W Storage junction temperature range -40 to +150 °C Operating junction temperature range -40 to +150 °C Critical rate of rise of on-state current, IG = 2 x IGT, tr ≤ 100 ns Tj initial = 150 °C, f = 100 Hz IGM Peak gate current VGM Peak Gate Voltage Tj A Tc = 126 °C VDSM/VRSM Non Repetitive peak off-state voltage Tstg Unit RMS on-state current (full sine wave) VDRM/VRRM Repetitive peak off-state voltage (50-60 Hz) PG(AV) Value tp = 20 µs, Tj = 150 °C Tj = 150 °C Average gate power dissipation A Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Symbol Quadrants; Tj Test conditions Value Unit IGT(1) VD = 12 V, RL = 30 Ω I - II - III Max. 20 mA VGT VD = 12 V, RL = 30 Ω I - II - III Max. 1.3 V VGD VD = 600 V, RL = 3.3 kΩ I - II - III Min. 0.2 V I - III Max. 45 mA II Max. 55 mA Max. 40 mA IL IH (2) dV/dt (2) (dl/dt)c (2) IG = 1.2 x IGT Tj = 150 °C IT = 500 mA, gate open VD = 536 V, gate open Tj = 125 °C Min. 1000 V/µs VD = 402 V, gate open Tj = 150 °C Min. 500 V/µs Tj = 125 °C Min. 6 A/ms Tj = 150 °C Min. 4.5 A/ms Without snubber 1. Minimum IGT is guaranteed at 5% of IGT max 2. For both polarities of A2 referenced to A1. DS12785 - Rev 2 page 2/12 T1620T-8G Characteristics Table 3. Static characteristics Symbol Tj Test conditions Value Unit VTM (1) ITM = 22.6 A, tp = 380 µs 25 °C Max. 1.6 V VTO (1) Threshold on-state voltage 150 °C Max. 0.85 V RD (1) Dynamic resistance 150 °C Max. 34 mΩ 5 µA 1.0 mA 3.6 mA Value Unit Max. 1.15 °C/W Typ. 45 °C/W IDRM/IRRM 25 °C VDRM = VRRM = 800 V 125°C VDRM = VRRM = 600 V 150 °C Max. Max. 1. For both polarities of A2 referenced to A1. Table 4. Thermal resistance Symbol Parameter Rth(j-c) Junction to case (AC) Rth(j-a) Junction to ambient (SCU(1) = 2 cm2) D2PAK 1. Scu : copper pad surface under tab, 35 μm copper thickness on FR4 PCB. DS12785 - Rev 2 page 3/12 T1620T-8G Characteristics (curves) 1.1 Characteristics curves Figure 1. Maximum power dissipation versus on-state RMS current (full cycle) Figure 2. On-state RMS current versus case temperature (full cycle) IT(RMS)(A) P(W) 22 18 20 α = 180° α = 180° 16 18 14 16 12 14 12 10 10 8 8 6 6 4 180° 4 2 IT(RMS)(A) 2 0 2 4 6 8 Tc(°C) 0 0 10 12 14 0 16 Figure 3. On-state RMS current versus ambient temperature (free air convection) 25 50 75 100 125 150 Figure 4. Relative variation of thermal impedance versus pulse duration IT(RMS)(A) K = [Zth/Rth] 1.0E+00 4.0 α = 180° 3.5 Zth(j-c) 3.0 2.5 2.0 1.0E-01 1.5 1.0 0.5 Ta(°C) tp(s) 0.0 0 25 50 75 100 125 150 Figure 5. Relative variation of gate trigger voltage and current versus junction temperature (typical values) 1.0E-02 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 1.0E+04 Figure 6. Relative variation of holding current and latching current versus junction temperature (typical values) IGT [Tj] / IGT [Tj = 25 °C] I H, IL [Tj] / I H, IL [Tj = 25 °C] 2.0 2.0 IGT Q3 1.5 IGT Q1-Q2 1.5 1.0 1.0 VGT Q1-Q2-Q3 IL 0.5 0.5 IH Tj (°C) 0.0 -50 -30 DS12785 - Rev 2 -10 10 30 50 70 90 110 130 150 Tj (°C) 0.0 -50 -30 -10 10 30 50 70 90 110 130 150 page 4/12 T1620T-8G Characteristics (curves) Figure 7. Surge peak on-state current versus number of cycles Figure 8. Non repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms ITSM(A) ITSM(A) 130 10000 Tj initial = 25 °C dl/dt limitation: 100 A/µs 120 110 t=20ms 100 One cy cle Non repetitive Tj initial = 25 °C 90 1000 80 70 60 50 Repetitive Tc = 126°C 40 ITSM 100 30 20 10 tP(ms) Number of cycles 0 10 1 10 100 1000 Figure 9. On-state characteristics (maximum values) 0.01 0.10 1.00 10.00 Figure 10. Relative variation of critical rate of decrease of main current versus junction temperature (typical values) ITM(A) 1000 (dl/dt)c [Tj] / (dl/dt)c [Tj = 150 °C] Tj max. Vto = 0.85 V Rd = 34 mΩ 10 9 8 100 7 6 5 Tj = 150 °C 4 10 3 Tj = 25 °C 2 VTM(V) 1 1 0 1 2 3 4 5 Figure 11. Relative variation of critical rate of decrease of main current versus reapplied (dV/dt)c (typical values) Tj(°C) 0 25 50 75 100 125 150 Figure 12. Relative variation of leakage current versus junction temperature for different values of blocking voltage (typical values) (dl/dt)c [(dV/dt)c] / specified (dl/dt)c IDRM, IRRM at [ Tj ] / IDRM, IRRM at [Tj max.]* 4 1.0E+00 VDRM = VRRM = 800 V 3 1.0E-01 2 VDRM = VRRM = 600 V 1.0E-02 VDRM = VRRM = 400 V 1 1.0E-03 *[Tj max = 125 °C; VDRM, VRRM = 800 V] [Tj max = 150 °C; VDRM, VRRM = 600 V] (dV/dt)c (V/µs) 0 0.1 1.0 10.0 100.0 25 DS12785 - Rev 2 Tj(°C) 1.0E-04 50 75 100 125 150 page 5/12 T1620T-8G Characteristics (curves) Figure 13. Thermal resistance junction to ambient versus copper surface under tab Rth(j-a) (°C/W) 80 Epoxy printed circuit board FR4, eCu = 35 µm D²PAK 70 60 50 40 30 20 SCu (cm²) 10 0 0 DS12785 - Rev 2 5 10 15 20 25 30 35 40 page 6/12 T1620T-8G Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 D²PAK package information • • • ECOPACK2 compliant Lead-free package leads finishing Molding compound resin is halogen-free and meets UL94 flammability standard level V0 Figure 14. D²PAK package outline A E E1 E2 H D D1 L2 c2 2 3 D2 L3 1 b2 b e Max resin gate protrusion: 0.5 mm (1) G A1 A2 A3 L R Gauge Plane V2 c (1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical. DS12785 - Rev 2 page 7/12 T1620T-8G D²PAK package information Table 5. D²PAK package mechanical data Dimensions Inches(1) Millimeters Ref. Min. Typ. Max. Min. Typ. Max. A 4.30 4.60 0.1693 0.1811 A1 2.49 2.69 0.0980 0.1059 A2 0.03 0.23 0.0012 A3 0.25 0.0091 0.0098 b 0.70 0.93 0.0276 0.0366 b2 1.25 1.7 0.0492 0.0669 c 0.45 0.60 0.0177 0.0236 c2 1.21 1.36 0.0476 0.0535 D 8.95 9.35 0.3524 0.3681 D1 7.50 8.00 0.2953 0.3150 D2 1.30 1.70 0.0512 0.0669 e 2.54 E 10.00 10.28 0.3937 0.4047 E1 8.30 8.70 0.3268 0.3425 E2 6.85 7.25 0.2697 0.2854 G 4.88 5.28 0.1921 0.2079 H 15 15.85 0.5906 0.6240 L 1.78 2.28 0.0701 0.0898 L2 1.27 1.40 0.0500 0.0551 L3 1.40 1.75 0.0551 0.0689 R V2(2) 0.10000 0.40 0° 0.0157 8° 0° 8° 1. Dimensions in inches are given for reference only 2. Degrees DS12785 - Rev 2 page 8/12 T1620T-8G D²PAK package information Figure 15. D²PAK recommended footprint (dimensions are in mm) 16.90 10.30 5.08 1.30 8.90 3.70 Figure 16. D²PAK stencil definitions (dimensions are in mm) DS12785 - Rev 2 page 9/12 T1620T-8G Ordering information 3 Ordering information Figure 17. Ordering information scheme T 16 20 T - 8 G - TR SnubberlessTM TRIAC T = Triac Current (RMS) / Type 16 = 16 A Gate Current 20 = 20 mA Specific application T = increased (dl/dt) and dV/dt producing reduced ITSM Voltage 8 = 800 V Package G = D²PAK Packing Blank = Tub -TR = Tape and reel Table 6. Ordering information Order code T1620T-8G-TR T1620T-8G DS12785 - Rev 2 Marking Package Weight T1620T-8G D²PAK 1.6 g Base qty. Delivery mode 1000 Tape and reel 50 Tube page 10/12 T1620T-8G Revision history Table 7. Document revision history DS12785 - Rev 2 Date Version Changes 17-Oct-2018 1 Initial release. 10-Jul-2020 2 Updated Table 4. Added Figure 13. page 11/12 T1620T-8G IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. 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Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS12785 - Rev 2 page 12/12