T1650H-6G

T1635H-6I, T1635H-6T, T1635H-6G T1650H-6I, T1650H-6T, T1650H-6G Datasheet 16 A - 600 V H-series Snubberless Triac Features A2 G A1 A2 A2 G A1 A1 TO-220AB A2 Medium current Triac 150 °C max. Tj turn-off commutation • • • • Low thermal resistance with clip bonding Very high 3 quadrant commutation capabilities Packages are RoHS (2002/95/EC) compliant UL certified (ref. file E81734) G TO-220AB Ins. A2 D²PAK • • Application The 600 V T1635H and T1650H are especially designed to operate in high power density or universal motor applications such as vacuum cleaner, coffee brewers, and inrush current limiter for inverter based home appliances. A2 A1 G Description Available in through-hole or surface mount packages, these Triac series are suitable for general purpose mains power ac switching. These 20 A Triacs provide a very high switching capability up to junction temperatures of 150 °C. The heatsink can be reduced, compared to traditional Triacs, according to the high performance at given junction temperatures. Product status link T1635H-6I, T1635H-6T, T1635H-6G, T1650H-6I, T1650H-6T, T1650H-6G By using an internal ceramic pad, the TO-220AB insulated version provide voltage insulation (rated at 2500 VRMS). The surface mount D²PAK package enables compact SMD based designs for automated manufacturing. Product summary IT(RMS) 16 A VDRM/VRRM 600 V IGT 35 or 50 mA DS5310 - Rev 4 - March 2020 For further information contact your local STMicroelectronics sales office. www.st.com T1635H-6I, T1635H-6T, T1635H-6G, T1650H-6I, T1650H-6T, T1650H-6G Characteristics 1 Characteristics Table 1. Absolute maximum ratings (limiting values) Symbol IT(RMS) ITSM I2t dl/dt VDSM/ VRSM IGM PG(AV) Tstg Tj Parameter Value Unit 16 A D2PAK, TO-220AB Tc = 130 °C TO-220AB Ins. Tc = 113 °C f = 50 Hz t = 20 ms 160 f = 60 Hz t = 16.7 ms 168 tp = 10 ms 169 A2s RMS on-state current (full sine wave) Non repetitive surge peak on-state current (full cycle, Tj initial = 25 °C) I2t value for fusing A Critical rate of rise of on-state current, IG = 2 x IGT, tr ≤ 100 ns, f = 100 Hz f = 120 Hz Tj = 150 °C 100 A/µs Non Repetitive peak off-state voltage tp = 10 ms Tj = 25 °C VDRM/VRRM +100 V Peak gate current tp = 20 µs Tj = 150 °C 4 A Tj = 150 °C 1 W Storage temperature range -40 to +150 °C Operating junction temperature range -40 to +150 °C Average gate power dissipation Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Symbol IGT(1) VGT VGD IL IH (2) dV/dt (2) Test conditions VD = 12 V, RL = 33 Ω I - II - III VD = VDRM, RL = 3.3 kΩ IG = 1.2 x IGT (dl/dt)c (2) Without snubber Max. T1635H T1650H 35 50 Unit mA Max. 1.0 V I - II - III Min. 0.15 V I - III Max. 50 90 II Max. 80 110 Max. 35 75 mA Tj = 150 °C Min. 1000 1500 V/µs Tj = 150 °C Min. 21 28 A/ms IT = 500 mA, gate open VD = 2/3 x VDRM, gate open Value Quadrants mA 1. Minimum IGT is guaranteed at 20% of IGT max. 2. For both polarities of A2 referenced to A1. DS5310 - Rev 4 page 2/13 T1635H-6I, T1635H-6T, T1635H-6G, T1650H-6I, T1650H-6T, T1650H-6G Characteristics Table 3. Static characteristics Symbol VT (1) VTO (1) RD(1) Test conditions Unit ITM = 23 A, tp = 380 µs Tj = 25 °C Max. 1.5 V Threshold voltage Tj = 150 °C Max. 0.80 V Dynamic resistance Tj = 150 °C Max. 23 mΩ 5 µA 4.1 mA Tj = 25 °C VDRM = VRRM IDRM/ IRRM(2) Value Tj = 150°C Max. VD = VR = 400 V, peak voltage Tj = 150 °C Max. 3.5 VD = VR = 200 V, peak voltage Tj = 150 °C Max. 3.0 mA 1. For both polarities of A2 referenced to A1. 2. tp = 380 μs Table 4. Thermal resistance Symbol Rth(j-c) Rth(j-a) Parameter Junction to case (AC) Junction to ambient (Scu = 2 cm2) Junction to ambient DS5310 - Rev 4 Value D2PAK, TO-220AB 1.15 TO-220AB Ins. 2.1 D2PAK, TO-220AB TO-220AB Ins. 45 Unit °C/W °C/W 60 page 3/13 T1635H-6I, T1635H-6T, T1635H-6G, T1650H-6I, T1650H-6T, T1650H-6G Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Maximum power dissipation versus on-state RMS current 18 P(W) IT(RMS) (A) 18 =180 ° 16 Figure 2. On-state RMS current versus case temperature D²PAK TO-220AB 16 TO220AB ins 14 14 12 12 10 10 8 8 6 6 4 4 180° IT(RMS)(A) 0 0 1 2 3 4 5 6 7 8 TC(°C) 2 2 0 9 10 11 12 13 14 15 16 0 IT(RMS) (A) 1.0E+00 Epoxy printed circuit board FR4, copper thickness = 35 µm 3.5 3.0 50 75 100 125 150 Figure 4. Variation of thermal impedance versus pulse duration Figure 3. On-state RMS current versus ambient temperature 4.0 25 K=[Z th /Rth ] = 180° D²PAK SCU= 2 cm² Zth(j-c) Zth(j-a) 2.5 TO220AB ins 2.0 1.0E-01 TO-220AB 1.5 1.0 0.5 Tamb (°C) t P(s) 0.0 0 DS5310 - Rev 4 25 50 75 100 125 150 1.0E-02 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 page 4/13 T1635H-6I, T1635H-6T, T1635H-6G, T1650H-6I, T1650H-6T, T1650H-6G Characteristics (curves) Figure 5. On-state characteristics (maximum values) Figure 6. Surge peak on-state current versus number of cycles ITM (A) 1000 ITSM (A) 180 160 140 t=20ms Non repetitive Tj initial = 25 °C 100 One cycle 120 Tj=150 °C 100 80 Tj=25 °C 10 Repetitive Tc=110 °C 60 VTM(V) 1 0.0 0.5 1.0 1.5 2.0 40 Tj max. : Vt0 = 0.80 V Rd = 23 m Ω 2.5 3.0 3.5 4.0 20 1 ITSM(A) dl/dt limitation: 100 A/µs 100 1000 IGT, IH, IL [T j ] / IGT, IH, IL [Tj = 25 °C] 2.5 Tj initial = 25 °C 10 Figure 8. Relative variation of IGT,IH, IL vs junction temperature (typical values) Figure 7. Non repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms 10000 Number of cycles 0 4.5 IGT 2.0 1000 1.5 ITSM IH & IL 1.0 100 0.5 10 0.01 Tj (°C) tp(ms) 0.10 1.00 0.0 Figure 9. Relative variation of critical rate of decrease of main current (dI/dt)c versus reapplied (dV/dt)c 2.0 -40 10.00 (dI/dt)c [ (dV/dt) c ] / specified (dI/dt) c -20 0 20 40 60 80 100 120 140 160 Figure 10. Relative variation of critical rate of decrease of main current versus junction temperature 8 (dI/dt )c [T j ] / (dI/dt) c [T j = 150°C] typical values 1.8 7 1.6 6 1.4 1.2 5 1.0 4 0.8 3 0.6 2 0.4 1 0.2 T j (°C) (dV/dt) C (V/µs) 0.0 0.1 DS5310 - Rev 4 1.0 0 10.0 100.0 25 50 75 100 125 150 page 5/13 T1635H-6I, T1635H-6T, T1635H-6G, T1650H-6I, T1650H-6T, T1650H-6G Characteristics (curves) Figure 11. Leakage current versus junction temperature for different values of blocking voltage (typical values) 1.0E+04 Figure 12. Thermal resistance junction to ambient versus copper surface under tab IDRM/IRRM(µA) Rth(j-a) (°C/W) 80 Epoxy printed circuit board FR4, eCu = 35 µm VDRM=VRRM=600 V 1.0E+03 D²PAK 70 60 VDRM=VRRM=400 V 1.0E+02 50 VDRM=VRRM=200 V 40 1.0E+01 30 20 1.0E+00 SCu (cm²) 10 T j (°C) 1.0E-01 50 DS5310 - Rev 4 75 100 0 125 150 0 5 10 15 20 25 30 35 40 page 6/13 T1635H-6I, T1635H-6T, T1635H-6G, T1650H-6I, T1650H-6T, T1650H-6G Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 TO-220AB package information • • • • Molding compound resin is halogen-free and meets flammability standard UL94 level 0 Lead-free package leads finishing ECOPACK2 compliant Recommended torque: 0.4 to 0.6 N.m Figure 13. TO-220AB package outline C B b2 I Resin gate 0.5 mm max. protusion(1) L F A I4 l3 c2 a1 l2 a2 M b1 e Resin gate 0.5 mm max. protusion(1) c1 (1)Resin gate position accepted in one of the two positions or in the symmetrical opposites. DS5310 - Rev 4 page 7/13 T1635H-6I, T1635H-6T, T1635H-6G, T1650H-6I, T1650H-6T, T1650H-6G TO-220AB package information Table 5. TO-220AB package mechanical data Dimensions Ref. Min. A Inches(1) Millimeters Typ. 15.20 a1 Max. Min. 15.90 0.5984 3.75 Typ. Max. 0.6260 0.1476 a2 13.00 14.00 0.5118 0.5512 B 10.00 10.40 0.3937 0.4094 b1 0.61 0.88 0.0240 0.0346 b2 1.23 1.32 0.0484 0.0520 C 4.40 4.60 0.1732 0.1811 c1 0.49 0.70 0.0193 0.0276 c2 2.40 2.72 0.0945 0.1071 e 2.40 2.70 0.0945 0.1063 F 6.20 6.60 0.2441 0.2598 I 3.73 3.88 0.1469 0.1528 L 2.65 2.95 0.1043 0.1161 I2 1.14 1.70 0.0449 0.0669 I3 1.14 1.70 0.0449 0.0669 I4 15.80 16.80 0.6220 M 16.40 2.6 0.6457 0.6614 0.1024 1. Inch dimensions are for reference only. DS5310 - Rev 4 page 8/13 T1635H-6I, T1635H-6T, T1635H-6G, T1650H-6I, T1650H-6T, T1650H-6G D²PAK package information 2.2 D²PAK package information Figure 14. D²PAK package outline A E E1 E2 H D D1 L2 c2 2 3 D2 L3 1 b2 b e Max resin gate protrusion: 0.5 mm (1) G A1 A2 A3 L R Gauge Plane V2 c (1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical. DS5310 - Rev 4 page 9/13 T1635H-6I, T1635H-6T, T1635H-6G, T1650H-6I, T1650H-6T, T1650H-6G D²PAK package information Table 6. D²PAK package mechanical data Dimensions Ref. Inches(1) Millimeters Min. Typ. Max. Min. Typ. Max. A 4.30 4.60 0.1693 0.1811 A1 2.49 2.69 0.0980 0.1059 A2 0.03 0.23 0.0012 A3 0.0091 0.25 0.0098 b 0.70 0.93 0.0276 0.0366 b2 1.25 1.7 0.0492 0.0669 c 0.45 0.60 0.0177 0.0236 c2 1.21 1.36 0.0476 0.0535 D 8.95 9.35 0.3524 0.3681 D1 7.50 8.00 0.2953 0.3150 D2 1.30 1.70 0.0512 0.0669 e 2.54 E 10.00 10.28 0.3937 0.4047 E1 8.30 8.70 0.3268 0.3425 E2 6.85 7.25 0.2697 0.2854 G 4.88 5.28 0.1921 0.2079 H 15 15.85 0.5906 0.6240 L 1.78 2.28 0.0701 0.0898 L2 1.27 1.40 0.0500 0.0551 L3 1.40 1.75 0.0551 0.0689 R V2 0.1 0.40 0° 0.0157 8° 0° 8° 1. Dimensions in inches are given for reference only Figure 15. D²PAK recommended footprint (dimensions are in mm) 16.90 10.30 5.08 1.30 8.90 DS5310 - Rev 4 3.70 page 10/13 T1635H-6I, T1635H-6T, T1635H-6G, T1650H-6I, T1650H-6T, T1650H-6G Ordering information 3 Ordering information Figure 16. Ordering information scheme T 16 xx H - 6 y -TR Triac series Current 16 = 16 A Sensitivity 35 = 35 mA 50 = 50 mA High temperature Voltage 6 = 600 V Package G = D²PAK T = TO-220AB I = TO-220AB Ins. Packing Blank = Tube (D²PAK,TO-220AB) -TR = Tape and reel (D²PAK) Table 7. Ordering information Order code Marking Package Weight T16xxH 6G D²PAK 1.5 g T16xxH-6T T16xxH 6T TO-220AB T16xxH-6I T16xxH 6I TO-220AB Ins. T16xxH-6G T16xxH-6G-TR DS5310 - Rev 4 Base qty. Delivery mode 50 Tube 1000 Tape and reel 13" 2.3 g 50 Tube 2.3 g 50 Tube page 11/13 T1635H-6I, T1635H-6T, T1635H-6G, T1650H-6I, T1650H-6T, T1650H-6G Revision history Table 8. Document revision history DS5310 - Rev 4 Date Version Changes 29-May-2007 1 First issue. 20-Sep-2011 2 Updated: Features, Description and Figure 2. 31-Jan-2014 3 Updated Figure 2, Figure 3, Figure 4, Table 2 and Table 5. 23-Mar-2020 4 Updated Table 1. Absolute maximum ratings (limiting values) and Figure 3. On-state RMS current versus ambient temperature. page 12/13 T1635H-6I, T1635H-6T, T1635H-6G, T1650H-6I, T1650H-6T, T1650H-6G IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS5310 - Rev 4 page 13/13