T2535T-8G-TR

T2535T-8G Datasheet 25 A - 800 V - T-series Triac in D²PAK A2 A1 A2 G D²PAK A2 A2: Anode2 A1: Anode1 G: Gate G A1 Features • • 25 A medium current Triac 150 °C maximum junction temperature TJ • Surge capability VDSM, VRSM = 900 V • • • • Three triggering quadrants High noise immunity - static dV/dt Robust dynamic turn-off commutation - (dI/dt)c ECOPACK2 compliant component Applications • • • • • • • • General purpose AC line load control AC induction and universal motor control Heating: water heater, e-bidet Power tools Cooker, oven Lighting and automation I/O control Inrush current limiting circuits Overvoltage crowbar protection Description Product status link T2535T-8G Product summary The T2535T-8G Triac in SMD D2PAK package can be used for the on/off or phase angle control function in general purpose AC switching. Based on the ST Snubberless technology, it offers higher specified turn-off commutation and noise immunity levels up to 150 °C. IT(RMS) 25 A SMD D2PAK package is suitable for automatic assembly line. VDRM, VRRM 800 V VDSM, VRSM 900 V The T2535T-8G safely optimizes the control of the motors and heaters loads for the most constraining environments of home appliances. IGT 35 mA DS13451 - Rev 1 - September 2020 For further information contact your local STMicroelectronics sales office. www.st.com T2535T-8G Characteristics 1 Characteristics Table 1. Absolute maximum ratings (limiting values) Symbol IT(RMS) ITSM I2t dl/dt Parameter Value Unit Tc = 121 °C 25 A t = 16.7 ms 210 t = 20 ms 200 I2t value for fusing tp = 10 ms 264 A2s Critical rate of rise of on-state current, IG = 2 x IGT, tr ≤ 100 ns, f = 100 Hz f = 120 Hz 100 A/µs Tj = 125 °C 800 Tj = 150 °C 600 RMS on-state current (full sine wave) Non repetitive surge peak on-state current (full cycle, Tj initial = 25 °C) A VDRM/ VRRM Repetitive peak off-state voltage VDSM/ VRSM Non Repetitive peak off-state voltage tp = 10 ms Tj = 25 °C 900 V IGM Peak gate current tp = 20 µs Tj = 150 °C 4 A pGM Maximum gate power dissipation tp = 20 μs Tj = 150 °C 5 W Tj = 150 °C 1 W Storage temperature range -40 to +150 °C Tj Operating junction temperature range -40 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C Value Unit PG(AV) Tstg Average gate power dissipation V Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Symbol IGT Test conditions VD = 12 V, RL = 30 Ω Quadrants Min. 5 Max. 35 Max. 1 V I - II - III Min. 0.15 V I - III Max. 50 II Max. 80 Max. 35 mA I - II - III VGT VGD IL IH (1) dV/dt (1) VD = VDRM, RL = 3.3 kΩ, Tj = 150 °C IG = 1.2 x IGT IT = 500 mA, gate open mA mA VD = 536 V, gate open Tj = 125 °C Min. 1500 V/µs VD = 402 V, gate open Tj = 150 °C Min. 1000 V/µs Tj = 125 °C Min. 28 A/ms Tj = 150 °C Min. 18 A/ms (dl/dt)c (1) Without snubber network 1. For both polarities of A2 referenced to A1. DS13451 - Rev 1 page 2/12 T2535T-8G Characteristics Table 3. Static characteristics Symbol VTM (1) VTO (1) RD (1) Test conditions Unit ITM = 35 A, tp = 380 µs Tj = 25 °C Max. 1.5 V Threshold voltage Tj = 150 °C Max. 0.80 V Dynamic resistance Tj = 150 °C Max. 17 mΩ 5 µA 5 mA Tj = 25 °C VD = VR = 800 V, peak voltage IDRM/IRRM Value Tj = 125 °C Max. VD = VR = 600 V, peak voltage Tj = 150 °C Max. 6 VD = VR = 400 V, peak voltage Tj = 150 °C Max. 5 mA 1. For both polarities of A2 referenced to A1. Table 4. Thermal resistance Symbol Parameter Value Rth(j-c) Junction to case (AC) Max. 1 Rth(j-a) Junction to ambient (SCU = 2 cm2) Typ. 45 Unit °C/W 1. Scu : copper pad surface under tab, 35 μm copper thickness on FR4 PCB. DS13451 - Rev 1 page 3/12 T2535T-8G Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Maximum power dissipation versus on-state RMS current (full cycle) P(W) 35 Figure 2. On-state RMS current versus case temperature (full cycle) I T(RMS)(A) 30 30 25 α = 180 ° 25 20 α = 180° 20 15 15 10 10 5 5 IT(RMS)(A) Tc (°C) 0 0 0 5 10 15 20 25 0 Figure 3. On-state RMS current versus ambient temperature (free air convection) 25 50 75 100 125 150 Figure 4. On-state characteristics (maximum) I TM (A) 1000 I (A) 4.5 T(RMS) T j max VTO = 0.8 V RD = 17 mΩ 4 α = 180 ° 3.5 100 3 2.5 2 Tj = 150°C Tj = 25°C 10 1.5 1 0.5 Ta (°C) 0 0 DS13451 - Rev 1 25 50 V TM (V) 75 100 125 150 1 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 page 4/12 T2535T-8G Characteristics (curves) Figure 5. Relative variation of IGT,IH, IL vs junction temperature (typical values) IGT, IH, IL [T j ] / IGT, IH, IL [Tj = 25 °C] 2.5 Figure 6. Relative variation of critical rate of decrease of main current versus junction temperature 8 (dI/dt )c [T j ] / (dI/dt) c [T j = 150°C] 7 IGT 2.0 6 5 1.5 4 IH & IL 1.0 3 2 0.5 1 Tj (°C) T j (°C) 0.0 0 -40 -20 0 20 40 60 80 100 120 140 160 Figure 7. Relative variation of critical rate of decrease of current (dI/dt)c versus reapplied (dV/dt)c 2.0 25 50 75 100 125 150 Figure 8. Surge peak on-state current versus number of cycles (dI/dt)c [ (dV/dt) c ] / specified (dI/dt) c typical values 1.8 250 1.6 I TSM(A) 200 1.4 1.2 150 1.0 Repe titive Tc = 121°C 100 0.8 0.6 Non repetitive Tj initial = 25°C 50 0.4 Number of cycles 0.2 0 (dV/dt) C (V/µs) 0.0 0.1 1.0 1 10.0 Figure 9. Non repetitive surge peak on-state current for a sinusoidal pulse width tP < 10 ms 100 1000 Figure 10. Relative variation of thermal impedance versus pulse duration ITSM(A) 1.0E+00 10000 10 100.0 K=[Z th /Rth ] Tj initial=25 °C Zth(j-c) dI/dt limitation: 100 A/µs Zth(j-a) 1.0E-01 1000 ITSM 1.0E-02 t P(ms) 100 0.01 DS13451 - Rev 1 0.10 1.00 10.00 t P(s) 1.0E-03 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 page 5/12 T2535T-8G Characteristics (curves) Figure 11. Leakage current versus junction temperature for different values of blocking voltage (typical values) 1.0E+04 IDRM/IRRM(µA) VD=V=V DRM RRM R =600 V 1.0E+03 V=V DRM D =V RRMR=400 1.0E+02 V VDRM V=V D =V RRM R =200 V 1.0E+01 1.0E+00 T j (°C) 1.0E-01 50 DS13451 - Rev 1 75 100 125 150 page 6/12 T2535T-8G Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 D²PAK package information • • • ECOPACK2 compliant Lead-free package leads finishing Molding compound resin is halogen-free and meets UL94 flammability standard level V0 Figure 12. D²PAK package outline A E E1 E2 H D D1 L2 c2 2 3 D2 L3 1 b2 b e Max resin gate protrusion: 0.5 mm (1) G A1 A2 A3 L R Gauge Plane V2 c (1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical. DS13451 - Rev 1 page 7/12 T2535T-8G D²PAK package information Table 5. D²PAK package mechanical data Dimensions Inches(1) Millimeters Ref. Min. Typ. Max. Min. Typ. Max. A 4.30 4.60 0.1693 0.1811 A1 2.49 2.69 0.0980 0.1059 A2 0.03 0.23 0.0012 A3 0.25 0.0091 0.0098 b 0.70 0.93 0.0276 0.0366 b2 1.25 1.7 0.0492 0.0669 c 0.45 0.60 0.0177 0.0236 c2 1.21 1.36 0.0476 0.0535 D 8.95 9.35 0.3524 0.3681 D1 7.50 8.00 0.2953 0.3150 D2 1.30 1.70 0.0512 0.0669 e 2.54 E 10.00 10.28 0.3937 0.4047 E1 8.30 8.70 0.3268 0.3425 E2 6.85 7.25 0.2697 0.2854 G 4.88 5.28 0.1921 0.2079 H 15 15.85 0.5906 0.6240 L 1.78 2.28 0.0701 0.0898 L2 1.19 1.40 0.0460 0.0551 L3 1.40 1.75 0.0551 0.0689 R V2(2) 0.10000 0.40 0° 0.0157 8° 0° 8° 1. Dimensions in inches are given for reference only 2. Degrees DS13451 - Rev 1 page 8/12 T2535T-8G D²PAK package information Figure 13. D²PAK recommended footprint (dimensions are in mm) 16.90 10.30 5.08 1.30 8.90 3.70 Figure 14. D²PAK stencil definitions (dimensions are in mm) DS13451 - Rev 1 page 9/12 T2535T-8G Ordering information 3 Ordering information Figure 15. Ordering information scheme T 25 35 T - 8 G - TR Triac series RMS current 25 = 25 A Gate triggering current 35 = 35 mA High temperature T = T series Voltage 8 = 800 V Package G = D²PAK Packing TR = tape and reel, blank = tube Table 6. Ordering information DS13451 - Rev 1 Order code Marking T2535T-8G T2535T-8G T2535T-8G-TR T2535T-8G Package Weight D²PAK 1.6 g Base Qty. Delivery mode 50 Tube 2500 Tape and reel page 10/12 T2535T-8G Revision history Table 7. Document revision history DS13451 - Rev 1 Date Version 23-Sep-2020 1 Changes Initial release. page 11/12 T2535T-8G IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS13451 - Rev 1 page 12/12