T2550-12G, T2550-12T, T2550-12I
Datasheet
25 A, 1200 V Snubberless Triacs
Features
A2
G
A1
A2
A2
G
A1
A1
TO-220AB
A2
G
•
•
•
•
On-state RMS current: 25 A
Blocking voltage: 1200 V
High static community and dynamic commutation
IGT = 50 mA
•
•
•
High endurance reliability
Compact high voltage device
UL recognized component : UL1557 standard, reference file E81734
TO-220AB Ins.
Applications
A2
D²PAK
A2
A1
•
•
G
Motor control circuits
Heating control circuits
Description
The T2550-12x is a 25 A 1200 V Snubberless Triac available in three packages:
D²PAK, TO-220AB and TO-220AB insulated.
Its 1200 V blocking voltage enables use in 3-phase industrial application. Its noise
immunity and dynamic commutation makes it suitable for either inductive, capacitive
or resistive load control.
Product status link
T2550-12G, T2550-12T, T2550-12I
Product summary
IT(RMS)
25 A
VDRM/VRRM
1200 V
IGT
50 mA
DS10039 - Rev 5 - September 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
T2550-12G, T2550-12T, T2550-12I
Characteristics
1
Characteristics
Table 1. Absolute maximum ratings (limiting values, Tj = 25 °C, unless otherwise stated)
Symbol
Parameters
IT(RMS)
RMS on-state current (full sine wave)
ITSM
I2t
Tc = 100 °C
TO-220AB Ins.
Tc = 71 °C
Unit
25
A
Non repetitive surge peak on-state current
tp = 20 ms
240
(full cycle, Tj initial = 25 °C)
tp = 16.7 ms
252
I2t value for fusing
tp = 10 ms
380
A2s
100
A/µs
1200
V
Critical rate of rise of on-state current
dl/dt
D²PAK, TO-220AB
Value
IG = 2 x IGT , tr ≤ 100 ns
f = 60 Hz
Tj = 125 °C
A
VDRM/VRRM
Repetitive peak off-state voltage
VDSM/VRSM
Non repetitive surge peak off-state voltage
tp = 10 ms
1300
V
IGM
Peak gate current
tp = 20 µs
4
A
VGM
Peak positive gate voltage
tp = 20 µs
16
V
1
W
Storage junction temperature range
-40 to +150
°C
Operating junction temperature range
-40 to +125
°C
2500
V
PG(AV)
Tstg
Tj
Vins.
Average gate power dissipation
Insulation RMS voltage, 1 minute
TO-220AB Ins.
Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - Snubberless™ (3 quadrants)
Symbol
IGT
Parameters
VD = 12 V, RL = 33 Ω
VGT
VGD
IH
(1)
IL
dV/dt(1)
VD = VDRM, RL = 3,3 kΩ, Tj = 125 °C
Quadrant
2.5
Max.
50
I - II - III
Max.
1.3
V
I - II - III
Min.
0.2
V
Max.
60
mA
Max.
80
mA
Min.
2500
V/µs
Min.
20
A/ms
Typ.
2
µs
I - II - III
VD = 67 % VDRM gate open, Tj = 125 °C
(dI/dt)c(1) Without snubber, Tj = 125 °C
tgt
ITM = 13 A, VD = 400 V, IG = 100 mA, dlG/dt = 100 mA/µs, RL = 30 Ω
Unit
Min.
I - II - III
IT = 500 mA, gate open
IG = 1.2 IGT
Value
I - II - III
mA
1. For both polarities of A2 referenced to A1
DS10039 - Rev 5
page 2/14
T2550-12G, T2550-12T, T2550-12I
Characteristics
Table 3. Static electrical characteristics
Symbol
Test conditions
Tj
Value
Unit
VTM(1)
ITM = 35 A, tp = 380 µs
25 °C
Max.
1.55
V
VTO(1)
threshold on-state voltage
125 °C
Max.
0.85
V
RD(1)
Dynamic resistance
125 °C
Max.
20
mΩ
10
µA
6
mA
IDRM
IRRM
25 °C
VD = VR = 1200 V
125 °C
Max.
1. For both polarities of A2 referenced to A1
Table 4. Thermal resistance
Symbol
Rth(j-c)
Rth(j-a)
Parameters
Junction to case (AC)
Junction to ambient (S = 2 cm²)(1)
Junction to ambient
Value
TO-220AB / D²PAK
TO-220AB insulated
D²PAK
TO-220AB / TO-220AB ins
Max.
Typ.
Unit
0.8
1.7
45
°C/W
60
1. Copper surface under tab.
DS10039 - Rev 5
page 3/14
T2550-12G, T2550-12T, T2550-12I
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Maximum power dissipation versus on-state
RMS current (full cycle)
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
Figure 2. RMS on-state current versus case temperature
(full cycle)
IT(RMS)(A)
P(W)
26
24
α = 180 °
TO-220AB
D²PAK
α = 180°
22
20
18
16
TO-22AB Ins
14
12
10
180°
α
8
α
6
4
IT(RMS)(A)
0
5
10
15
20
25
Figure 3. On-state RMS current versus ambient
temperature (free air convection)
3.5
Tc(°C)
2
0
0
25
50
75
100
Figure 4. Surge peak on-state current versus number of
cycles
ITSM(A)
250
IT(RMS)( A)
3.0
D²PAK
225
SCU = 2 cm²
200
2.5
Non repetitive Tj = 25 °C
tp= 20ms
175
2.0
125
One cycle
150
TO-220AB,
TO-220AB Ins
125
1.5
100
1.0
Tc = 71 °C (TO-220AB Ins)
75
0.5
A
0.0
0
2 5
5 0
7 5
100
125
Figure 5. Relative variation of thermal impedance versus
pulse duration (T2550-12I)
1.0E+00
Repetitive
50
T (°C)
K = [Z / R ]
th th
25 T = 100 °C (TO-220AB, D²PAK)
c
0
1
10
Number of cycles
100
1000
Figure 6. Relative variation of thermal impedance versus
pulse duration
1.0E+00
TO-220AB Ins
K = [Zth / R ]
th
TO-220AB, D²PAK
Zth(j-c)
Zth(j-c)
Zth(j-a)
Zth(j-a)
1.0E-01
1.0E-01
TO-220AB
D²PAK
SCU = 2 cm²
1.0E-02
1.E-03
DS10039 - Rev 5
tp(s)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
tp(s)
1.0E-02
1.0E-02
1.0E+00
1.0E+02
1.0E+04
1.0E-03
1.0E-01
1.0E+01
1.0E+03
page 4/14
T2550-12G, T2550-12T, T2550-12I
Characteristics (curves)
Figure 7. Relative variation of gate trigger current and
gate voltage versus junction temperature (typical values)
2.5
Figure 8. Relative variation of holding current and
latching current versus junction temperature (typical
values)
IGT, VGT [ Tj ] / IGT, VGT [ Tj = 25 °C]
2.0
2.0
IH, IL [ Tj ] / IH, IL [ Tj = 25 °C]
IH
1.8
IGTQ1-Q2
IGT Q3
1.5
1.5
1.0
1.3
VGT
1.0
0.5
0.8
Tj(°C)
0.0
-50
-25
0
25
50
75
100
125
Figure 9. Relative variation of critical rate of decrease of
main current versus junction temperature (typical values)
-25
0
25
50
75
100
125
Figure 10. Relative variation of critical rate of decrease of
main current versus reapplied dV/dt
(dl/dt)c [Tj] / (dl/dt)c [Tj = 125 °C]
8
Tj(°C)
0.5
-50
(dl/dt)c [(dV/dt)c] / Specified (dl/dt)c
4
7
6
3
5
4
2
3
2
1
1
(dV/dt)c (V/µs)
Tj(°C)
0
25
50
75
100
125
Figure 11. Non repetitive surge peak on-state current
versus sinusoidal pulse width (tP < 10 ms)
10000
ITSM(A)
0
0.1
ITM(A)
100
1000
Tj max:
Vto = 0.85 V
Rd = 20 mΩ
10
100
Tj = 125 °C
DS10039 - Rev 5
100.0
Tj initial = 25 °C
ITSM
10
0.01
10.0
Figure 12. On-state characteristics (maximum values)
1000
dl/dt limitation: 100 A/µs
1.0
tp(ms)
0.10
1.00
10.00
1
0.0
0.5
Tj = 25 °C
1.0
1.5
2.0
VTM(V)
2.5
3.0
3.5
4.0
4.5
page 5/14
T2550-12G, T2550-12T, T2550-12I
Characteristics (curves)
Figure 13. Relative variation of leakage current versus
junction temperature for different values of blocking
voltage (typical values)
80
I
1.0E+00
,I
[ T ;V
,V
]/
DRM RRM
j DRM
RRM
I
/I
[ 125 °C; V
= 1200 V,V
= 1200 V]
DRM RRM
DRM
RRM
V
DRM
D²PAK
Epoxy printed board FR4, copper thickness = 35 µm
60
= VRRM = 1200 V
50
V
DRM
= VRRM = 1000 V
40
1.0E-02
30
V
DRM
= VRRM = 800 V
20
1.0E-03
DS10039 - Rev 5
Rth(j-a) (°C/W)
70
1.0E-01
1.0E-04
25
Figure 14. D²PAK thermal resistance junction to ambient
versus copper surface under tab
10
Tj(°C)
50
75
100
125
SCu (cm²)
0
0
5
10
15
20
25
30
35
40
page 6/14
T2550-12G, T2550-12T, T2550-12I
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
D²PAK package information
•
•
Molding epoxy meets UL94 level V0
lead-free plating of package leads
Figure 15. D²PAK package outline
A
E
E1
E2
H
D
D1
L2
c2
2
3
D2
L3
1
b2
b
e
Max resin gate protrusion: 0.5 mm (1)
G
A1
A2
A3
L
R
Gauge Plane
V2
c
(1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical.
DS10039 - Rev 5
page 7/14
T2550-12G, T2550-12T, T2550-12I
D²PAK package information
Table 5. D²PAK package mechanical data
Dimensions
Inches(1)
Millimeters
Ref.
Min.
Typ.
Max.
Min.
Typ.
Max.
A
4.30
4.60
0.1693
0.1811
A1
2.49
2.69
0.0980
0.1059
A2
0.03
0.23
0.0012
A3
0.25
0.0091
0.0098
b
0.70
0.93
0.0276
0.0366
b2
1.25
1.7
0.0492
0.0669
c
0.45
0.60
0.0177
0.0236
c2
1.21
1.36
0.0476
0.0535
D
8.95
9.35
0.3524
0.3681
D1
7.50
8.00
0.2953
0.3150
D2
1.30
1.70
0.0512
0.0669
e
2.54
E
10.00
10.28
0.3937
0.4047
E1
8.30
8.70
0.3268
0.3425
E2
6.85
7.25
0.2697
0.2854
G
4.88
5.28
0.1921
0.2079
H
15
15.85
0.5906
0.6240
L
1.78
2.28
0.0701
0.0898
L2
1.19
1.40
0.0500
0.0551
L3
1.40
1.75
0.0551
0.0689
R
V2
0.1
0.40
0°
0.0157
8°
0°
8°
1. Dimensions in inches are given for reference only
DS10039 - Rev 5
page 8/14
T2550-12G, T2550-12T, T2550-12I
D²PAK package information
Figure 16. D²PAK recommended footprint (dimensions are in mm)
16.90
10.30
5.08
1.30
3.70
8.90
Figure 17. D²PAK footprint and stencil dimensions’ definitions (dimensions in mm)
8,90
4,30
3,70
4,39
3,60
0,05
1,20
1,30
3 × 0,60
5,08
2,54
10,30
10,20
4×2,10
0,05
2×0,27
4×2
0,26
8,81
Note: Blue = Stencil, Black = Footprint
DS10039 - Rev 5
page 9/14
T2550-12G, T2550-12T, T2550-12I
TO-220AB non ins. and insulated package information
2.2
TO-220AB non ins. and insulated package information
•
•
•
Molding compound resin is halogen-free and meets flammability standard UL94 level 0
Lead-free package leads finishing
Recommended torque: 0.4 to 0.6 N.m
Figure 18. TO-220AB non ins. and insulated package outline
C
B
b2
I
Resin gate 0.5 mm
max. protusion(1)
L
F
A
I4
l3
c2
a1
l2
a2
M
b1
e
Resin gate 0.5 mm
max. protusion(1)
c1
(1)Resin gate position accepted in one of the two positions or in the symmetrical opposites.
DS10039 - Rev 5
page 10/14
T2550-12G, T2550-12T, T2550-12I
TO-220AB non ins. and insulated package information
Table 6. TO-220AB non ins. and insulated package mechanical data
Dimensions
Millimeters
Ref.
Min.
A
Typ.
15.20
a1
Inches1
Max.
Min.
15.90
0.5984
3.75
Typ.
Max.
0.6260
0.1476
a2
13.00
14.00
0.5118
0.5512
B
10.00
10.40
0.3937
0.4094
b1
0.61
0.88
0.0240
0.0346
b2
1.23
1.32
0.0484
0.0520
C
4.40
4.60
0.1732
0.1811
c1
0.49
0.70
0.0193
0.0276
c2
2.40
2.72
0.0945
0.1071
e
2.40
2.70
0.0945
0.1063
F
6.20
6.60
0.2441
0.2598
I
3.73
3.88
0.1469
0.1528
L
2.65
2.95
0.1043
0.1161
I2
1.14
1.70
0.0449
0.0669
I3
1.14
1.70
0.0449
0.0669
I4
15.80
16.80
0.6220
M
16.40
2.6
0.6457
0.6614
0.1024
1. Inch dimensions are for reference only.
DS10039 - Rev 5
page 11/14
T2550-12G, T2550-12T, T2550-12I
Ordering information
3
Ordering information
Figure 19. Ordering information scheme
T
25
50 - 12 G - TR
Series
Triac
Current
25 = 25 A
Gate sensitivity
50 = 50 mA
Voltage
12 = 1200 V
Package
T = TO-220AB non insulated
I = TO-220AB insulated
G = D²PAK
Delivery mode
Blank = Tube
TR = Tape and reel
Table 7. Ordering information
Order code
Marking
Package
Weight
T2550-12G
D²PAK
1.50 g
T2550-12T
T2550-12T
TO-220AB
2.3 g
T2550-12I
T2550-12
TO-220AB Ins.
2.3 g
T2550-12G
T2550-12G-TR
DS10039 - Rev 5
Base qty.
Delivery mode
50
Tube
1000
Tape and reel 13"
50
Tube
50
Tube
page 12/14
T2550-12G, T2550-12T, T2550-12I
Revision history
Table 8. Document revision history
Date
Revision
Changes
9-Jan-2014
1
Initial release.
30-Jan-2014
2
Updated table 4.
10-Dec-2015
3
Inserted TO-220AB insulated package information and reformatted to current
standard.
17-May-2019
4
Updated Table 1, Table 4 and Figure 15.
Added Figure 18.
Minor text changed.
23-Sep-2020
DS10039 - Rev 5
5
Updated Section Features and Table 5. D²PAK package mechanical data.
page 13/14
T2550-12G, T2550-12T, T2550-12I
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DS10039 - Rev 5
page 14/14