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T2550-12T

T2550-12T

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO-220-3

  • 描述:

    TRIAC ALTERNISTOR 1.2KV TO220AB

  • 数据手册
  • 价格&库存
T2550-12T 数据手册
T2550-12G, T2550-12T, T2550-12I Datasheet 25 A, 1200 V Snubberless Triacs Features A2 G A1 A2 A2 G A1 A1 TO-220AB A2 G • • • • On-state RMS current: 25 A Blocking voltage: 1200 V High static community and dynamic commutation IGT = 50 mA • • • High endurance reliability Compact high voltage device UL recognized component : UL1557 standard, reference file E81734 TO-220AB Ins. Applications A2 D²PAK A2 A1 • • G Motor control circuits Heating control circuits Description The T2550-12x is a 25 A 1200 V Snubberless Triac available in three packages: D²PAK, TO-220AB and TO-220AB insulated. Its 1200 V blocking voltage enables use in 3-phase industrial application. Its noise immunity and dynamic commutation makes it suitable for either inductive, capacitive or resistive load control. Product status link T2550-12G, T2550-12T, T2550-12I Product summary IT(RMS) 25 A VDRM/VRRM 1200 V IGT 50 mA DS10039 - Rev 5 - September 2020 For further information contact your local STMicroelectronics sales office. www.st.com T2550-12G, T2550-12T, T2550-12I Characteristics 1 Characteristics Table 1. Absolute maximum ratings (limiting values, Tj = 25 °C, unless otherwise stated) Symbol Parameters IT(RMS) RMS on-state current (full sine wave) ITSM I2t Tc = 100 °C TO-220AB Ins. Tc = 71 °C Unit 25 A Non repetitive surge peak on-state current tp = 20 ms 240 (full cycle, Tj initial = 25 °C) tp = 16.7 ms 252 I2t value for fusing tp = 10 ms 380 A2s 100 A/µs 1200 V Critical rate of rise of on-state current dl/dt D²PAK, TO-220AB Value IG = 2 x IGT , tr ≤ 100 ns f = 60 Hz Tj = 125 °C A VDRM/VRRM Repetitive peak off-state voltage VDSM/VRSM Non repetitive surge peak off-state voltage tp = 10 ms 1300 V IGM Peak gate current tp = 20 µs 4 A VGM Peak positive gate voltage tp = 20 µs 16 V 1 W Storage junction temperature range -40 to +150 °C Operating junction temperature range -40 to +125 °C 2500 V PG(AV) Tstg Tj Vins. Average gate power dissipation Insulation RMS voltage, 1 minute TO-220AB Ins. Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - Snubberless™ (3 quadrants) Symbol IGT Parameters VD = 12 V, RL = 33 Ω VGT VGD IH (1) IL dV/dt(1) VD = VDRM, RL = 3,3 kΩ, Tj = 125 °C Quadrant 2.5 Max. 50 I - II - III Max. 1.3 V I - II - III Min. 0.2 V Max. 60 mA Max. 80 mA Min. 2500 V/µs Min. 20 A/ms Typ. 2 µs I - II - III VD = 67 % VDRM gate open, Tj = 125 °C (dI/dt)c(1) Without snubber, Tj = 125 °C tgt ITM = 13 A, VD = 400 V, IG = 100 mA, dlG/dt = 100 mA/µs, RL = 30 Ω Unit Min. I - II - III IT = 500 mA, gate open IG = 1.2 IGT Value I - II - III mA 1. For both polarities of A2 referenced to A1 DS10039 - Rev 5 page 2/14 T2550-12G, T2550-12T, T2550-12I Characteristics Table 3. Static electrical characteristics Symbol Test conditions Tj Value Unit VTM(1) ITM = 35 A, tp = 380 µs 25 °C Max. 1.55 V VTO(1) threshold on-state voltage 125 °C Max. 0.85 V RD(1) Dynamic resistance 125 °C Max. 20 mΩ 10 µA 6 mA IDRM IRRM 25 °C VD = VR = 1200 V 125 °C Max. 1. For both polarities of A2 referenced to A1 Table 4. Thermal resistance Symbol Rth(j-c) Rth(j-a) Parameters Junction to case (AC) Junction to ambient (S = 2 cm²)(1) Junction to ambient Value TO-220AB / D²PAK TO-220AB insulated D²PAK TO-220AB / TO-220AB ins Max. Typ. Unit 0.8 1.7 45 °C/W 60 1. Copper surface under tab. DS10039 - Rev 5 page 3/14 T2550-12G, T2550-12T, T2550-12I Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Maximum power dissipation versus on-state RMS current (full cycle) 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 Figure 2. RMS on-state current versus case temperature (full cycle) IT(RMS)(A) P(W) 26 24 α = 180 ° TO-220AB D²PAK α = 180° 22 20 18 16 TO-22AB Ins 14 12 10 180° α 8 α 6 4 IT(RMS)(A) 0 5 10 15 20 25 Figure 3. On-state RMS current versus ambient temperature (free air convection) 3.5 Tc(°C) 2 0 0 25 50 75 100 Figure 4. Surge peak on-state current versus number of cycles ITSM(A) 250 IT(RMS)( A) 3.0 D²PAK 225 SCU = 2 cm² 200 2.5 Non repetitive Tj = 25 °C tp= 20ms 175 2.0 125 One cycle 150 TO-220AB, TO-220AB Ins 125 1.5 100 1.0 Tc = 71 °C (TO-220AB Ins) 75 0.5 A 0.0 0 2 5 5 0 7 5 100 125 Figure 5. Relative variation of thermal impedance versus pulse duration (T2550-12I) 1.0E+00 Repetitive 50 T (°C) K = [Z / R ] th th 25 T = 100 °C (TO-220AB, D²PAK) c 0 1 10 Number of cycles 100 1000 Figure 6. Relative variation of thermal impedance versus pulse duration 1.0E+00 TO-220AB Ins K = [Zth / R ] th TO-220AB, D²PAK Zth(j-c) Zth(j-c) Zth(j-a) Zth(j-a) 1.0E-01 1.0E-01 TO-220AB D²PAK SCU = 2 cm² 1.0E-02 1.E-03 DS10039 - Rev 5 tp(s) 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 tp(s) 1.0E-02 1.0E-02 1.0E+00 1.0E+02 1.0E+04 1.0E-03 1.0E-01 1.0E+01 1.0E+03 page 4/14 T2550-12G, T2550-12T, T2550-12I Characteristics (curves) Figure 7. Relative variation of gate trigger current and gate voltage versus junction temperature (typical values) 2.5 Figure 8. Relative variation of holding current and latching current versus junction temperature (typical values) IGT, VGT [ Tj ] / IGT, VGT [ Tj = 25 °C] 2.0 2.0 IH, IL [ Tj ] / IH, IL [ Tj = 25 °C] IH 1.8 IGTQ1-Q2 IGT Q3 1.5 1.5 1.0 1.3 VGT 1.0 0.5 0.8 Tj(°C) 0.0 -50 -25 0 25 50 75 100 125 Figure 9. Relative variation of critical rate of decrease of main current versus junction temperature (typical values) -25 0 25 50 75 100 125 Figure 10. Relative variation of critical rate of decrease of main current versus reapplied dV/dt (dl/dt)c [Tj] / (dl/dt)c [Tj = 125 °C] 8 Tj(°C) 0.5 -50 (dl/dt)c [(dV/dt)c] / Specified (dl/dt)c 4 7 6 3 5 4 2 3 2 1 1 (dV/dt)c (V/µs) Tj(°C) 0 25 50 75 100 125 Figure 11. Non repetitive surge peak on-state current versus sinusoidal pulse width (tP < 10 ms) 10000 ITSM(A) 0 0.1 ITM(A) 100 1000 Tj max: Vto = 0.85 V Rd = 20 mΩ 10 100 Tj = 125 °C DS10039 - Rev 5 100.0 Tj initial = 25 °C ITSM 10 0.01 10.0 Figure 12. On-state characteristics (maximum values) 1000 dl/dt limitation: 100 A/µs 1.0 tp(ms) 0.10 1.00 10.00 1 0.0 0.5 Tj = 25 °C 1.0 1.5 2.0 VTM(V) 2.5 3.0 3.5 4.0 4.5 page 5/14 T2550-12G, T2550-12T, T2550-12I Characteristics (curves) Figure 13. Relative variation of leakage current versus junction temperature for different values of blocking voltage (typical values) 80 I 1.0E+00 ,I [ T ;V ,V ]/ DRM RRM j DRM RRM I /I [ 125 °C; V = 1200 V,V = 1200 V] DRM RRM DRM RRM V DRM D²PAK Epoxy printed board FR4, copper thickness = 35 µm 60 = VRRM = 1200 V 50 V DRM = VRRM = 1000 V 40 1.0E-02 30 V DRM = VRRM = 800 V 20 1.0E-03 DS10039 - Rev 5 Rth(j-a) (°C/W) 70 1.0E-01 1.0E-04 25 Figure 14. D²PAK thermal resistance junction to ambient versus copper surface under tab 10 Tj(°C) 50 75 100 125 SCu (cm²) 0 0 5 10 15 20 25 30 35 40 page 6/14 T2550-12G, T2550-12T, T2550-12I Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 D²PAK package information • • Molding epoxy meets UL94 level V0 lead-free plating of package leads Figure 15. D²PAK package outline A E E1 E2 H D D1 L2 c2 2 3 D2 L3 1 b2 b e Max resin gate protrusion: 0.5 mm (1) G A1 A2 A3 L R Gauge Plane V2 c (1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical. DS10039 - Rev 5 page 7/14 T2550-12G, T2550-12T, T2550-12I D²PAK package information Table 5. D²PAK package mechanical data Dimensions Inches(1) Millimeters Ref. Min. Typ. Max. Min. Typ. Max. A 4.30 4.60 0.1693 0.1811 A1 2.49 2.69 0.0980 0.1059 A2 0.03 0.23 0.0012 A3 0.25 0.0091 0.0098 b 0.70 0.93 0.0276 0.0366 b2 1.25 1.7 0.0492 0.0669 c 0.45 0.60 0.0177 0.0236 c2 1.21 1.36 0.0476 0.0535 D 8.95 9.35 0.3524 0.3681 D1 7.50 8.00 0.2953 0.3150 D2 1.30 1.70 0.0512 0.0669 e 2.54 E 10.00 10.28 0.3937 0.4047 E1 8.30 8.70 0.3268 0.3425 E2 6.85 7.25 0.2697 0.2854 G 4.88 5.28 0.1921 0.2079 H 15 15.85 0.5906 0.6240 L 1.78 2.28 0.0701 0.0898 L2 1.19 1.40 0.0500 0.0551 L3 1.40 1.75 0.0551 0.0689 R V2 0.1 0.40 0° 0.0157 8° 0° 8° 1. Dimensions in inches are given for reference only DS10039 - Rev 5 page 8/14 T2550-12G, T2550-12T, T2550-12I D²PAK package information Figure 16. D²PAK recommended footprint (dimensions are in mm) 16.90 10.30 5.08 1.30 3.70 8.90 Figure 17. D²PAK footprint and stencil dimensions’ definitions (dimensions in mm) 8,90 4,30 3,70 4,39 3,60 0,05 1,20 1,30 3 × 0,60 5,08 2,54 10,30 10,20 4×2,10 0,05 2×0,27 4×2 0,26 8,81 Note: Blue = Stencil, Black = Footprint DS10039 - Rev 5 page 9/14 T2550-12G, T2550-12T, T2550-12I TO-220AB non ins. and insulated package information 2.2 TO-220AB non ins. and insulated package information • • • Molding compound resin is halogen-free and meets flammability standard UL94 level 0 Lead-free package leads finishing Recommended torque: 0.4 to 0.6 N.m Figure 18. TO-220AB non ins. and insulated package outline C B b2 I Resin gate 0.5 mm max. protusion(1) L F A I4 l3 c2 a1 l2 a2 M b1 e Resin gate 0.5 mm max. protusion(1) c1 (1)Resin gate position accepted in one of the two positions or in the symmetrical opposites. DS10039 - Rev 5 page 10/14 T2550-12G, T2550-12T, T2550-12I TO-220AB non ins. and insulated package information Table 6. TO-220AB non ins. and insulated package mechanical data Dimensions Millimeters Ref. Min. A Typ. 15.20 a1 Inches1 Max. Min. 15.90 0.5984 3.75 Typ. Max. 0.6260 0.1476 a2 13.00 14.00 0.5118 0.5512 B 10.00 10.40 0.3937 0.4094 b1 0.61 0.88 0.0240 0.0346 b2 1.23 1.32 0.0484 0.0520 C 4.40 4.60 0.1732 0.1811 c1 0.49 0.70 0.0193 0.0276 c2 2.40 2.72 0.0945 0.1071 e 2.40 2.70 0.0945 0.1063 F 6.20 6.60 0.2441 0.2598 I 3.73 3.88 0.1469 0.1528 L 2.65 2.95 0.1043 0.1161 I2 1.14 1.70 0.0449 0.0669 I3 1.14 1.70 0.0449 0.0669 I4 15.80 16.80 0.6220 M 16.40 2.6 0.6457 0.6614 0.1024 1. Inch dimensions are for reference only. DS10039 - Rev 5 page 11/14 T2550-12G, T2550-12T, T2550-12I Ordering information 3 Ordering information Figure 19. Ordering information scheme T 25 50 - 12 G - TR Series Triac Current 25 = 25 A Gate sensitivity 50 = 50 mA Voltage 12 = 1200 V Package T = TO-220AB non insulated I = TO-220AB insulated G = D²PAK Delivery mode Blank = Tube TR = Tape and reel Table 7. Ordering information Order code Marking Package Weight T2550-12G D²PAK 1.50 g T2550-12T T2550-12T TO-220AB 2.3 g T2550-12I T2550-12 TO-220AB Ins. 2.3 g T2550-12G T2550-12G-TR DS10039 - Rev 5 Base qty. Delivery mode 50 Tube 1000 Tape and reel 13" 50 Tube 50 Tube page 12/14 T2550-12G, T2550-12T, T2550-12I Revision history Table 8. Document revision history Date Revision Changes 9-Jan-2014 1 Initial release. 30-Jan-2014 2 Updated table 4. 10-Dec-2015 3 Inserted TO-220AB insulated package information and reformatted to current standard. 17-May-2019 4 Updated Table 1, Table 4 and Figure 15. Added Figure 18. Minor text changed. 23-Sep-2020 DS10039 - Rev 5 5 Updated Section Features and Table 5. D²PAK package mechanical data. page 13/14 T2550-12G, T2550-12T, T2550-12I IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS10039 - Rev 5 page 14/14
T2550-12T 价格&库存

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T2550-12T
    •  国内价格 香港价格
    • 10+14.4990910+1.80500
    • 40+14.3083140+1.78125
    • 125+14.11753125+1.75750
    • 400+13.92676400+1.73375
    • 1250+13.545201250+1.68625

    库存:0

    T2550-12T
    •  国内价格 香港价格
    • 1+38.642431+4.81062
    • 50+19.7673950+2.46086
    • 100+17.93930100+2.23328
    • 500+14.73509500+1.83438
    • 1000+13.706231000+1.70630
    • 2000+13.318502000+1.65803

    库存:978

    T2550-12T
    •  国内价格
    • 1+26.29800
    • 10+22.66920
    • 30+20.50920

    库存:21