T4050-6PF

T4050-6PF Datasheet 40 A Snubberless™ Triac Features A2 G A1 • • • High current Triac High surge current = 400 A Max. blocking voltage = VDRM, VRRM = 600 V • Max. surge voltage = VDSM, VRSM = 700 V • IGT maximum = 50 mA • • • High static and dynamic commutation: – (dI/dt)c = 25.1 A/ms – dV/dt = 1000 V/μs UL1557 certified (file ref. 81734) = 2.5 kV Snubberless™ device • ECOPACK®2 compliant (RoHS and HF compliance) G A2 A1 TO-3PF Applications • • • • Product status link T4050-6PF Product summary IT(RMS) 40 A VDRM, VRRM 600 V VDSM, VRSM 700 V IGT 50 mA Heater, ventilation and air conditioning (HVAC) Solid state relay (SSR) Motor soft starter SMPS inrush current limiter Description The device is packaged in a through-hole TO-3PF full plastic insulated. The T4050-6PF is optimized for the ON/OFF function or phase angle control in applications such as static relays, heating regulation, induction motor starting circuits, light dimmers, motor speed controllers and in many other industrial applications where high immunity and high surge current are required. DS12857 - Rev 1 - December 2018 For further information contact your local STMicroelectronics sales office. www.st.com T4050-6PF Characteristics 1 Characteristics Table 1. Absolute maximum ratings (limiting values) Symbol IT(RMS) ITSM I2t dl/dt Parameter Unit A RMS on-state current (full sine wave) Tc = 76 °C 40 Non repetitive surge peak on-state current t = 16.7 ms 420 (full cycle,Tj initial = 25 °C) t = 20 ms 400 I2t value for fusing tp = 10 ms 1000 A2s 50 A/µs 600 V 700 V 8 A 8 V 1 W 2.5 kV Critical rate of rise of on-state current, IG = 2 x IGT, tr ≤ 100 ns VDRM/VRRM Repetitive peak off-state voltage (50-60 Hz) VDSM/VRSM Non repetitive peak off-state voltage IGM Peak gate current VGM Peak gate voltage PG(AV) Value Average gate power dissipation F = 120 Hz, Tj = 25 °C tp = 10 ms, Tj = 25 °C tp = 20 µs, Tj = 125 °C Tj = 125 °C A Vins. Insulation RMS voltage, 1 minute (UL1557 file E81734) Tstg Storage temperature range -40 to +150 °C Tj Operating junction temperature range -40 to +125 °C TL Maximum lead temperature for soldering during 10 s 260 °C Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Symbol IGT(1) VGT VGD IL IH (2) dV/dt (2) (dl/dt)c (2) Test conditions VD = 12 V, RL = 33 Ω VD = 600 V, RL = 3.3 kΩ IG = 1.2 x IGT Quadrants; Tj Value Unit Max. 50 mA Max. 1.3 V Min. 0.2 V I - III Max. 70 mA II Max. 160 mA Max. 85 mA I - II - III I - II - III Tj = 125 °C IT = 500 mA, gate open VD = 402 V, gate open Tj = 125 °C Min. 1000 V/µs Snubberless™ (dV/dt)c > 20 V/μs Tj = 125 °C Min. 25.1 A/ms 1. Minimum IGT is guaranteed at 5% of IGT max 2. For both polarities of A2 referenced to A1. DS12857 - Rev 1 page 2/11 T4050-6PF Characteristics Table 3. Static electrical characteristics Symbol VTM(1) Tj Test conditions Value Unit ITM = 60 A, tp = 380 µs 25 °C Max. 1.4 V VTO Threshold voltage 125 °C Max. 0.85 V RD(1) Dynamic resistance 125 °C Max. 10 mΩ 5 µA 7.5 mA Value Unit (1) IDRM/IRRM 25 °C VDRM = VRRM = 600 V 125°C Max. 1. For both polarities of A2 referenced to A1. Table 4. Thermal resistance Symbol DS12857 - Rev 1 Parameter Rth(j-c) Junction to case (AC) Rth(j-a) Junction to ambient Max. 1.45 Typ. 1.1 Typ. 50 °C/W page 3/11 T4050-6PF Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Maximum power dissipation versus on-state RMS current P(W) 48 Figure 2. On-state RMS current versus case temperature 44 44 40 40 36 36 32 32 28 28 24 24 20 20 16 16 12 12 IT(RMS)(A) 8 180° 8 4 4 IT(RMS)(A) TC(°C) 0 0 0 0 4 8 12 16 20 24 28 32 36 Figure 3. On-state RMS current versus ambient temperature (free air convection) 3.5 25 50 75 100 125 40 IT(RMS)(A) Figure 4. Relative variation of thermal impedance versus pulse duration 1.0E+00 K=[Z th /Rth ] Zth(j-c) 3.0 Zth(j-a) 2.5 2.0 1.0E-01 1.5 1.0 0.5 Ta(°C) 0.0 0 DS12857 - Rev 1 25 50 75 100 125 1.0E-02 t P(s) 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 1.0E+04 1.0E+05 page 4/11 T4050-6PF Characteristics (curves) Figure 5. Relative variation of gate trigger voltage and current versus junction temperature (typical values) Figure 6. Relative variation of holding current and latching current versus junction temperature (typical values) IGT, VGT[T j] / I GT, VGT[T j= 25 °C] 2.0 1.5 IH, IL [T j] / I H, IL [T j = 25 °C] IGT Q3 1.5 IGT Q1-Q2 1.0 IL 1.0 VGT Q1-Q2-Q3 0.5 0.5 IH Tj(°C) Tj(°C) 0.0 -50 -25 0 25 50 75 100 Figure 7. Relative variation of static dV/dt immunity versus junction temperature 6 0.0 125 dV/dt [Tj ] / dV/dt [Tj = 125 °C] -50 0 25 50 75 100 125 Figure 8. Relative variation of critical rate of decrease of main current versus junction temperature 7 VD = VR = 402 V -25 (dI/dt) c [T j] / (dI/dt) c [T j = 125 °C] 6 5 5 4 4 3 3 2 2 1 1 Tj(°C) 0 25 50 75 100 125 Figure 9. Surge peak on-state current versus number of cycles 450 ITSM(A) Tj(°C) 0 25 50 75 100 Figure 10. Non repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms 10000 ITSM(A) Tj initial = 25 °C dI/dt limitation: 50 A/µs 400 350 125 t=20ms One cycle Non repetitive Tj initial = 25 °C 300 1000 250 200 150 100 100 Repetitive TC = 76 °C 50 t P(ms) Number of cycles 0 10 1 DS12857 - Rev 1 10 100 1000 0.01 0.10 1.00 10.00 page 5/11 T4050-6PF Characteristics (curves) Figure 11. On-state characteristics (maximum values) 1000 Figure 12. Relative variation of Leakage current versus junction temperature ITM (A) 1.0E+00 IDRM/IRRM[Tj] / IDRM/IRRM[Tj = 125 °C] 1.0E-01 100 VDRM=VRRM = 600 V Tj = 125 °C 1.0E-02 Tj = 25 °C 10 1.0E-03 Tj max : Vto = 0.85 V Rd = 10 mΩ VTM (V) Tj(°C) 1 0 DS12857 - Rev 1 1 2 3 4 5 1.0E-04 25 50 75 100 125 page 6/11 T4050-6PF Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 TO-3PF package information • • • Epoxy meets UL94, V0 Lead-free package and HF package Recommended torque: 0.8N·m (max. 1.0 N·m) Figure 13. TO-3PF package outline A H C DIA L5 L L2 L3 L6 L4 N F2(3X) D1 D R L7 F(3X) E G1 G Projection DS12857 - Rev 1 page 7/11 T4050-6PF TO-3PF package information Table 5. TO-3PF mechanical data Dimensions Ref. Inches(1) mm Min. Typ. Max. Min. Typ. Max. A 5.30 5.70 0.2087 0.2244 C 2.80 3.20 0.1102 0.1260 D 3.10 3.50 0.1220 0.1378 D1 1.80 2.20 0.0709 0.0866 E 0.80 1.10 0.0315 0.0433 F 0.65 0.95 0.0256 0.0374 F2 1.80 2.20 0.0709 0.0866 G 10.30 11.50 0.4055 0.4528 G1 5.45 H 15.30 L 9.80 L2 0.2146 15.70 0.6024 10.20 0.3858 22.80 23.20 0.8976 0.9134 L3 26.30 26.70 1.0354 0.0512 L4 43.20 44.40 1.7008 1.7480 L5 4.30 4.70 0.1693 0.1850 L6 24.30 24.70 0.9567 0.9724 L7 14.60 15.00 0.5748 0.5906 N 1.80 2.20 0.0709 0.0866 R 3.80 4.20 0.1496 0.1654 Dia 3.40 3.80 0.1339 0.1496 10.00 0.6181 0.3937 0.4016 1. Inches given for reference only DS12857 - Rev 1 page 8/11 T4050-6PF Ordering information 3 Ordering information Figure 14. Ordering information scheme T 40 50 - 6 PF SnubberlessTM Triac Current (RMS) / type 40 = 40 A Gate current 50 = 50 mA Voltage 6 = 600 V Package PF = TO-3PF Table 6. Ordering information DS12857 - Rev 1 Order code Marking Package Weight Base qty. Delivery mode T4050-6PF T4050-6PF TO-3PF 5.2 g 30 Tube page 9/11 T4050-6PF Revision history Table 7. Document revision history DS12857 - Rev 1 Date Version 03-Dec-2018 1 Changes Initial release. page 10/11 T4050-6PF IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS12857 - Rev 1 page 11/11