TDA1904

TDA1904 ® 4W AUDIO AMPLIFIER HIGH OUTPUT CURRENT CAPABILITY PROTECTION AGAINST CHIP OVERTEMPERATURE LOW NOISE HIGH SUPPLY VOLTAGE REJECTION SUPPLY VOLTAGE RANGE: 4V TO 20V DESCRIPTION The TDA 1904 is a monolithic integrated circuit in POWERDIP package intended for use as low-frequency power amplifier in wide range of applications in portable radio and TV sets. Powerdip (8 + 8) ORDERING NUMBER : TDA 1904 c u d ABSOLUTE MAXIMUM RATINGS Symbol Parameter VS Supply voltage IO Peak output current (non repetitive) IO Peak output current (repetitive) Ptot Total power dissipation at Tamb = 80°C at Tpins = 60°C Tstg, Tj (s) Storage and junction temperature b O - t c u TEST AND APPLICATION CIRCUIT so e t le o r P ) s t( Value Unit 20 V 2.5 A 2 A 1 W 6 W -40 to 150 °C d o r P e t e l o s b O (*) R4 is necessary only for Vs < 6V. September 2003 1/10 TDA1904 PIN CONNECTION OUTPUT 1 16 GND +VS 2 15 GND BOOTSTRAP 3 14 GND N.C. 4 13 GND N.C. 5 12 GND INVERT. IN 6 11 GND SVR 7 10 GND NON INVERT. IN 8 9 GND D95AU319 c u d SCHEMATIC DIAGRAM e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O THERMAL DATA Symbol Parameter Value Unit Rth-j-case Thermal resistance junction-pins max 15 °C/W Rth-j-amb Thermal resistance junction-ambient max 70 °C/W 2/10 TDA1904 ELECTRICAL CHARACTERISTICS (Refer to the test circuit, Tamb = 25 °C, Rth (heatsink) = 20 °C/W, unless otherwisw specified) Symbol Parameter Test conditions Vs Supply voltage Vo Quiescent output voltage Id Po d Min. 4 Vs = 4V Vs = 14V 2.1 7.2 Quiescent drain current Vs = 9V Vs = 14V 8 10 Output power d = 10% Vs = 9V Vs = 14V Vs = 12V Vs = 6V f = 1 KHz RL = 4Ω 1.8 4 3.1 0.7 Input saturation voltage (rms) Vs = 9V Vs = 14V 0.8 1.3 Ri Input resistance (pin 8) f = 1 KHz 55 h Efficiency f = 1 KHz Vs = 9V Vs = 14V BW Small signal bandwidth (-3 dB) Vs = 14V Gv Voltage gain (open loop) Vs = 14V f = 1 KHz Gv Voltage gain (closed loop) Vs = 14V f = 1 KHz eN Total input noise Rg = 50Ω Rg = 10 KΩ Rg = 50Ω Rg = 10 KΩ du Supply voltage rejection Tsd o r P e ) s ( ct Thermal shut-down case temperature RL = 4Ω RL = 4Ω Vs = 12V fripple = 100 Hz Vripple = 0.5 Vrms Ptot = 2W V 15 18 mA W 0.3 39.5 % ) s t( V uc 150 P e let o s b O RL = 4Ω Po = 1W 20 d o r Po = 2W Po = 4.5W RL = 4Ω Unit V 0.1 Vi Max. 2 4.5 f = 1 KHz RL = 4Ω Vs = 9V Po = 50 mW to 1.2W Harmonic distortion SVR Typ. 70 65 KΩ % 40 to 40,000 Hz 75 dB 40 40.5 dB (°) 1.2 2 4 µV (°°) 2 3 µV 50 dB 120 ÉC Rg = 10 KΩ 40 t e l o Note: (°) Weighting filter = curve A. (°°) Filter with noise bendwidth: 22Hz to 22 KHz. s b O 3/10 TDA1904 Figure 1. Test and application circuit c u d (*) R4 is necessary only for VS < 6V e t le o s b O - Figure 2. P.C. board and components layout of fig. 1 (1 : 1 scale) ) s ( ct u d o r P e t e l o s b O 4/10 o r P ) s t( TDA1904 APPLICATION SUGGESTION The recommended values of the external components are those shown on the application circuit of fig. 1. When the supply voltage VS is less than 6V, a 68Ω resistor must be connected between pin 2 and pin Components Recomm. value 3 in order to obtain the maximum output power. Different values can be used. The following table can help the designer. Larger than recommended value Purpose Smaller than recommended value Allowed range Min. R1 10 KΩ Increase of gain. Decrease of gain. Increase quiescent current. Decrease of gain. Increase of gain. Feedback resistors R2 100 Ω R3 4.7 Ω Frequency stability R4 68 Ω Increase of the output swing with low supply voltage. C1 2.2 µF Input DC decoupling. C2 0.1 µF Supply voltage bypass. C3 22 µF Ripple rejection C4 2.2 µF Inverting input DC decoupling. C7 o r P 39 Ω 220 Ω 100ΩF Higher low frequency cutoff. Higher noise. Danger of oscillations. Degradation of SVR. 2.2 µF Increase of the switch-on noise Higher low frequency cutoff. 0.1 ΩF Bootstrap. Increase of the distortion at low frequency. 10 µF 0.22 µF Frequency stability. Danger of oscillation. 1000 µF Output DC decoupling Higher low frequency cutoff. t c u od r P e 47 µF t e l o s b O ) s t( Increase of SVR increase of the switch-on time. C5 C6 (s) c u d e t le o s b O - 9R3 1 KΩ Danger of oscillation at high frequencies with inductive loads. Higher cost lower noise. Max. 100µF 5/10 TDA1904 Figure 3. Quiescent output voltage vs. supply voltage Figure 4. Quiescent drain current vs. supply voltage Figure 5. Output power vs. supply voltage Fi gure 6. Distor tion vs. output power Fi gure 7. Distor tion vs. output power Fig ure 8. Distortion vs. output power c u d e t le ) s ( ct u d o r P e Fi gure 9. Distor tion vs. output power t e l o s b O 6/10 ) s t( o r P o s b O - Figure 10. Distortion vs. output power Figure 11. Distortion vs. output power TDA1904 Figure 12. Distortion vs. frequency Figure 13. Distortion vs. frequency Figure 14. Distortion vs. frequency Figure 15. Distortion vs. frequency Figure 16. Supply voltage rejection vs. frequency Fi g ure 1 7. Total power dissipation and efficiency vs. output power c u d e t le ) s ( ct u d o r P e Fi g ur e 18. Total p ower dissipation and efficiency vs. output power t e l o ) s t( o r P o s b O - F ig ur e 19. Total p ower dissipation and efficiency vs. output power Fi g ure 2 0. Total power dissipation and efficiency vs. output power s b O 7/10 TDA1904 THERMAL SHUT-DOWN The presence of a thermal limiting circuit offers the following advantages: 1) An overload on the output (even if it is permanent), or an above limit ambient temperature can be easily tolerated since the Tj cannot be higher than 150°C. 2) The heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no possibility of device damage due to high junction temperature. If for any reason, the junction temperature increase up to 150°C, the thermal shut-down simply reduces the power dissipation and the current consumption. MOUNTING INSTRUCTION The TDA 1904 is assembled in the Powerdip, in which 8 pins (from 9 to 16) are attached to the frame and remove the heat produced by the chip. Figure 21 shows a PC board copper area used as a heatsink (I = 65 mm). The thermal resistance junction-ambient is 35°C. Figure 21. Example of heatsink using PC board copper (l = 65 mm) c u d e t le ) s ( ct u d o r P e t e l o s b O 8/10 o s b O - o r P ) s t( TDA1904 mm DIM. MIN. a1 0.51 B 0.85 b TYP. inch MAX. MIN. TYP. 0.020 1.40 0.033 0.055 0.50 b1 MAX. 0.38 0.020 0.50 D 0.015 0.020 20.0 0.787 E 8.80 0.346 e 2.54 0.100 e3 17.78 0.700 F 7.10 0.280 I 5.10 0.201 L OUTLINE AND MECHANICAL DATA 3.30 c u d 0.130 ) s t( o r P Powerdip 16 Z 1.27 e t le 0.050 ) s ( ct o s b O - u d o r P e t e l o s b O 9/10 TDA1904 c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2003 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES Australia – Belgium - Brazil - Canada - China – Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States www.st.com 10/10