TDA2006
®
12W AUDIO AMPLIFIER
DESCRIPTION
The TDA2006 is a monolithic integrated circuit in
Pentawatt package, intended for use as a low
frequency class "AB" amplifier. At ±12V, d = 10 %
typically it provides 12W output power on a 4Ω load
and 8W on a 8Ω . The TDA2006 provides high
output current and has very low harmonic and
cross-over distortion. Further the device incorporates an original (and patented) short circuit protection system comprising an arrangement for
automatically limiting the dissipated power so as to
keep the working point of the output transistors
within their safe operating area. A conventional
thermal shutdown system is also included. The
TDA2006 is pin to pin equivalent to the TDA2030.
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TYPICAL APPLICATION CIRCUIT
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PENTAWATT
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ORDERING NUMBERS : TDA2006V
TDA2006H
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September 2003
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TDA2006
SCHEMATIC DIAGRAM
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ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Vs
Supply Voltage
Vi
Input Voltage
Vi
Differential Input Voltage
Io
Output Peak Current (internaly limited)
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Value
Unit
± 15
V
Vs
± 12
ct
V
3
A
Ptot
Power Dissipation at Tcase = 90 °C
20
W
Tstg, Tj
Storage and Junction Temperature
– 40 to 150
°C
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THERMAL DATA
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Symbol
Rth (j-c)
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PIN CONNECTION
2/12
Parameter
Thermal Resistance Junction-case
Max
Value
Unit
3
°C/W
TDA2006
ELECTRICAL CHARACTERISTICS
(refer to the test circuit ; VS = ± 12V, Tamb = 25oC unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
±6
Max.
Unit
± 15
V
Vs
Supply Voltage
Id
Quiescent Drain Current
Vs = ± 15V
40
80
mA
Ib
Input Bias Current
Vs = ± 15V
0.2
3
µA
VOS
Input Offset Voltage
Vs = ± 15V
±8
mV
IOS
Input Offset Current
Vs = ± 15V
± 80
nA
VOS
Output Offset Voltage
Vs = ± 15V
± 10
Output Power
d = 10%, f = 1kHz
RL = 4Ω
RL = 8Ω
Po
Distortion
Po = 0.1 to 8W, RL = 4Ω, f = 1kHz
Po = 0.1 to 4W, RL = 8Ω, f = 1kHz
Vi
Input Sensitivity
Po = 10W, RL = 4Ω, f = 1kHz
Po = 6W, RL = 8Ω, f = 1kHz
B
Frequency Response (– 3dB)
Po = 8W, RL = 4Ω
Ri
Input Resistance (pin 1)
f = 1kHz
Gv
Voltage Gain (open loop)
f = 1kHz
Gv
Voltage Gain (closed loop)
f = 1kHz
eN
Input Noise Voltage
iN
Input Noise Current
SVR
ro
Id
Drain Current
Tj
Thermal Shutdown Junction
Temperature
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0.5
W
0.2
0.1
%
%
200
220
mV
mV
20Hz to 100kHz
5
MΩ
75
dB
30.5
dB
B (– 3dB) = 22Hz to 22kHz, RL = 4Ω
3
10
µV
B (– 3dB) = 22Hz to 22kHz, RL = 4Ω
80
200
pA
RL = 4Ω, Rg = 22kΩ, fripple = 100Hz (*)
Po = 12W, RL = 4Ω
Po = 8W, RL = 8Ω
29.5
mV
30
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Supply Voltage Rejection
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d
12
8
(s)
± 100
40
50
dB
850
500
mA
mA
145
°C
(*) Referring to Figure 15, single supply.
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TDA2006
Output Power versus Supply Voltage
Figure 1 :
Figure 2 :
Distortion versus Output Power
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Distortion versus Frequency
Figure 3 :
Figure 4 :
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Distortion versus Frequency
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4/12
P
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let
Figure 5 :
Sensitivity versus Output Power
Figure 6 :
Sensitivity versus Output Power
TDA2006
Figure 7 :
Frequency Response with different values of the rolloff Capacitor C8 (see
Figure 13)
Figure 8 :
Value of C8 versus Voltage Gain for different Bandwidths (see Figure 13)
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Figure 9 :
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Quiescent Current versus
Supply Voltage
Figure 10 : Supply Voltage Rejection versus
Voltage Gain
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Figure 11 : Power Dissipation and Efficiency versus Output Power
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Figure 12 : Maximum Power Dissipation versus
Supply Voltage
(sine wave operation)
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TDA2006
Figure 13 : Application Circuit with Spilt Power Supply
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Figure 14 : P.C. Board and Components Layout of the Circuit of Figure 13 (1:1 scale)
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TDA2006
Figure 15 : Application Circuit with Single Power Supply
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Figure 16 : P.C. Board and Components Layout of the Circuit of Figure 15 (1:1 scale)
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TDA2006
Figure 17 : Bridge Amplifier Configuration with Split Power Supply (PO = 24W, VS = ± 12V)
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PRACTICAL CONSIDERATIONS
Printed Circuit Board
The layout shown in Figure 14 should be adopted
by the designers. If different layout are used, the
ground points of input 1 and input 2 must be well
decoupled from ground of the output on which a
rather high current flows.
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Assembly Suggestion
No electrical isolation is needed between the packTable 1
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R1
R2
R3
Recommanded
Value
22 kΩ
680 Ω
22 kΩ
R4
1Ω
Closed Loop Gain Setting
Closed Loop Gain Setting
Non Inverting Input
Biasing
Frequency Stability
R5
3 R2
Upper Frequency Cut-off
C1
2.2 µF
Input DC Decoupling
C2
22 µF
C3C4
C5C6
C7
0.1 µF
100 µF
0.22 µF
1
2πBR1
1N4001
Inverting Input DC
Decoupling
Supply Voltage by Pass
Supply Voltage by Pass
Frequency Stability
Component
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C8
D1D2
Purpose
Upper Frequency Cut-off
age and the heat-sink with single supply voltage
configuration.
Application Suggestion
The recommended values of the components are
the ones shown on application circuits of Figure 13.
Different values can be used. The table 1 can help
the designers.
Larger Than
Recommanded Value
Increase of Gain
Decrease of Gain (*)
Increase of Input
Impedance
Danger of Oscillation at
High Frequencies with
Inductive Loads
Poor High Frequencies
Attenuation
Smaller Than
Recommanded Value
Decrease of Gain (*)
Increase of Gain
Decrease of Input
Impedance
Danger of Oscillation
Increase of Low
Frequencies Cut-off
Increase of Low
Frequencies Cut-off
Danger of Oscillation
Danger of Oscillation
Danger of Oscillation
Lower Bandwidth
To Protect the Device Against Output Voltage Spikes.
(*) Closed loop gain must be higher than 24dB.
8/12
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Larger Bandwidth
TDA2006
SHORT CIRCUIT PROTECTION
The TDA2006 has an original circuit which limits
the current of the output transistors. Figure 18
shows that the maximum output current is a function of the collector emitter voltage ; hence the
output transistors work within their safe operating
area (Figure 19).
This function can therefore be considered as being
peak power limiting rather than simple current limiting.
It reduces the possibility that the device gets damaged during an accidental short circuit from AC
output to ground.
Figure 19 : Safe Operating Area and Collector
Characteristics of the Protected
Power Transistor
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THERMAL SHUT DOWN
The presence of a thermal limiting circuit offers the
following advantages :
1) an overload on the output (even if it is
permanent), or an above limit ambient
temperature can be easily supported since the
Tj cannot be higher than 150°C.
2) the heatsink can have a smaller factor of safety
compared with that of a conventional circuit.
There is no possibility of device damage due to
high junction temperature.
If for any reason, the junction temperature increases up to 150 °C, the thermal shutdown simply
reduces the power dissipation and the current consumption.
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Figure 20 : Output Power and Drain Current versus Case Temlperature (RL = 4Ω)
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The maximum allowable power dissipation depends upon the size of the external heatsink (i.e.
its thermal resistance) ; Figure 22 shows the dissipable power as a function of ambient temperature
for different thermal resistances.
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Figure 18 : Maximum Output Current versus
Voltage VCE (sat) accross each Output Transistor
Figure 21 : Output Power and Drain Current versus Case Temlperature (RL = 8Ω)
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TDA2006
Figure 22 : Maximum Allowable Power Dissipation versus Ambient Temperature
DIMENSION SUGGESTION
The following table shows the length of the heatsink
in Figure 23 for several values of Ptot and Rth.
Ptot (W)
Lenght of Heatsink (mm)
Rth of Heatsink (°C/W)
12
60
4.2
8
40
6.2
6
30
8.3
Figure 23 : Example of Heatsink
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TDA2006
DIM.
A
C
D
D1
E
E1
F
F1
G
G1
H2
H3
L
L1
L2
L3
L4
L5
L6
L7
L9
L10
M
M1
V4
V5
DIA
MIN.
mm
TYP.
2.40
1.20
0.35
0.76
0.80
1.00
3.20
6.60
3.40
6.80
10.05
17.55
15.55
21.2
22.3
17.85
15.75
21.4
22.5
2.60
15.10
6.00
2.10
4.30
4.23
3.75
4.5
4.0
3.65
MAX. MIN.
4.80
1.37
2.80
0.094
1.35
0.047
0.55
0.014
1.19
0.030
1.05
0.031
1.40
0.039
3.60
0.126
7.00
0.260
10.40
10.40 0.395
18.15 0.691
15.95 0.612
21.6
0.831
22.7
0.878
1.29
3.00
0.102
15.80 0.594
6.60
0.236
2.70
0.083
4.80
0.170
4.75
0.167
4.25
0.148
40˚ (Typ.)
90˚ (Typ.)
3.85
0.143
inch
TYP.
0.134
0.267
0.703
0.620
0.843
0.886
0.178
0.157
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Pentawatt V
E
M1
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D1
L5
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L1
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Weight: 2.00gr
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OUTLINE AND
MECHANICAL DATA
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MAX.
0.188
0.054
0.11
0.053
0.022
0.047
0.041
0.055
0.142
0.275
0.41
0.409
0.715
0.628
0.850
0.894
0.051
0.118
0.622
0.260
0.106
0.189
0.187
0.187
V5
L2
H2
L3
F
E
E1
V4
H3
G G1
Dia.
F
F1
L9
L4
L10
L7
L6
H2
V4
RESIN BETWEEN
LEADS
PENTVME
0015981 F
11/12
TDA2006
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems
without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2003 STMicroelectronics - All rights reserved
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