TDA2050V

TDA2050 ® 32W Hi-Fi AUDIO POWER AMPLIFIER HIGH OUTPUT POWER (50W MUSIC POWER IEC 268.3 RULES) HIGH OPERATING SUPPLY VOLTAGE (50V) SINGLE OR SPLIT SUPPLY OPERATIONS VERY LOW DISTORTION SHORT CIRCUIT PROTECTION (OUT TO GND) THERMAL SHUTDOWN DESCRIPTION The TDA 2050 is a monolithic integrated circuit in Pentawatt package, intended for use as an audio class AB audio amplifier. Thanks to its high power capability the TDA2050 is able to provide up to 35W true rms power into 4 ohm load @ THD = 10%, VS = ±18V, f = 1KHz and up to 32W into 8ohm load @ THD = 10%, VS = ±22V, f = 1KHz. Moreover, the TDA 2050 delivers typically 50W music power into 4 ohm load over 1 sec at VS= 22.5V, f = 1KHz. Pentawatt ORDERING NUMBERS: TDA2050V TDA2050H The high power and very low harmonic and crossover distortion (THD = 0.05% typ, @ VS = ±22V, PO = 0.1 to 15W, RL=8ohm, f = 100Hz to 15KHz) make the device most suitable for both HiFi and high class TV sets. TEST AND APPLICATION CIRCUIT March 2002 1/13 This is advanced information on a new product now in development or undergoing evaluation. Details are subject to change without notice. TDA2050 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit V VS Supply Voltage ±25 Vi Input Voltage VS Vi Differential Input Voltage ±15 IO Output Peak Current (internally limited) 5 A Power Dissipation TCASE = 75°C 25 W -40 to 150 °C Ptot Tstg, Tj Storage and Junction Temperature V PIN CONNECTION (Top view) SCHEMATIC DIAGRAM THERMAL DATA Symbol Rth j-case 2/13 Description Thermal Resistance junction-case Max Value Unit 3 °C/W TDA2050 ELECTRICAL CHARACTERISTICS (Refer to the Test Circuit, VS = ±18V, Tamb = 25°C, f = 1 kHz; unless otherwise specified) Symbol Parameter VS Id Supply Voltage Range Quiescent Drain Current Ib Test Condition Min. Typ. ±4.5 VS = ±4.5V VS = ±25V 30 55 0.1 Max. Unit ±25 V 50 90 mA mA Input Bias Current VS = ±22V 0.5 µA VOS Input Offset Voltage VS = ±22V ±15 mV IOS Input Offset Current VS = ±22V ±200 nA PO RMS Output Power d = 0.5% RL = 4Ω RL = 8Ω VS = ±22V RL = 8Ω d = 10% RL = 4Ω RL = 8Ω VS = ±22V RL = 8Ω d 24 22 28 18 25 W W W 35 22 32 W W W 50 W Music Power IEC268.3 RULES d = 10%; T = 1s VS = ±22.5V; RL = 4Ω Total Harmonic Distortion RL = 4Ω f = 1kHz, PO = 0.1 to 24W f = 100Hz to 10kHz, PO = 0.1 to 18W 0.03 VS = ±22V RL = 8Ω f = 1kHz, PO = 0.1 to 20W f = 100Hz to 10kHz, PO = 0.1 to 15W 0.02 SR Slew Rate 5 8 GV GV Open Loop Voltage Gain Closed Loop Voltage Gain 30 80 30.5 BW eN Power Bandwidth (-3dB) Total Input Noise Ri Input Resistance (pin 1) SVR η Tsd-j RL = 4Ω Vi = 200mV curve A B = 22Hz to 22kHz Rs = 22kΩ; f = 100Hz; Vripple = 0.5Vrms Efficiency PO = 28W; R L = 4Ω PO = 25W; R L = 8Ω; VS = ±22V Thermal Shut-down Junction Temperature % % 0.5 % % V/µs 31 dB dB 20 to 80,000 4 5 10 Hz µV µV 500 Supply Voltage Rejection 0.5 0.5 kΩ 45 dB 65 % 67 % 150 °C 3/13 TDA2050 Figure 1: Split Supply Typical Application Circuit Figure 2: P.C. Board and Components Layout of the Circuit of Fig. 1 (1:1) TDA2050 RL R4 R3 +Vs R2 C7 C5 C2 C3 R1 C4 C6 C1 Vi 4/13 -Vs TDA2050 SPLIT SUPPLY APPLICATION SUGGESTIONS The recommended values of the external components are those shown on the application circuit of fig. 2. Different values can be used. The following table can help the designer. Larger than Recommended Value Smaller than Recommended Value Component Recommended Value R1 22kΩ Input Impedance R2 680Ω Feedback Resistor R3 22kΩ R4 2.2Ω Frequency Stability C1 1µF Input Decoupling DC C2 22µF C3 C4 100nF Inverting Input DC Decoupling Supply Voltage Bypass C5 C6 220µF Supply Voltage Bypass Danger of Oscillations C7 0.47µF Frequency Stability Danger of Oscillations Purpose Increase of Input Impedance Decrease of Input Impedance Decrease of Gain (*) Increase of Gain Increase of Gain Decrease of Gain (*) Danger of Oscillations Higher Low-frequency cut-off Increase of Switch ON/OFF Noise Higher Low-frequency cut-off Danger of Oscillations (*) The gain must be higher than 24dB PRINTED CIRCUIT BOARD The layout shown in fig. 2 should be adopted by the designers. If different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the ground return of the output in which a high current flows. 5/13 TDA2050 Figure 3: Single Supply Typical Application Circuit Figure 4: P.C. Board and Components Layout of the Circuit of Fig. 3 (1:1) 6/13 TDA2050 SINGLE SUPPLY APPLICATION SUGGESTIONS The recommended values of the external components are those shown on the application circuit Component Recommended Value Purpose of fig. 3. Different values can be used. The following table can help the designer. Larger than Recommended Value Smaller than Recommended Value R1, R2, R3 22kΩ R4 680Ω Biasing Resistor R5 22kΩ R6 2.2Ω Frequency Stability C1 2.2µF Input Decoupling DC C2 100µF Supply Voltage Rejection C3 1000µF Supply Voltage Bypass C4 22µF Inverting Input DC Decoupling C5 100nF Supply Voltage Bypass Danger of Oscillations C6 0.47µF Frequency Stability Danger of Oscillations C7 1000µF Output DC Decoupling Higher Low-frequency cut-off Feedback Resistors Increase of Gain Decrease of Gain (*) Decrease of Gain (*) Increase of Gain Danger of Oscillations Higher Low-frequency cut-off Worse Turn-off Transient Worse Turn-on Delay Danger of Oscillations Worse of Turn-off Transient Increase of Switching ON/OFF Higher Low-frequency cut-off (*) The gain must be higher than 24dB NOTE If the supply voltage is lower than 40V and the load is 8ohm (or more) a lower value of C2 can be used (i.e. 22µF). C7 can be larger than 1000uF only if the supply voltage does not exceed 40V. TYPICAL CHARACTERISTICS (Split Supply Test Circuit unless otherwise specified) Figure 5: Output Power vs. Supply Voltage Figure 6: Distortion vs. Output Power 7/13 TDA2050 Figure 7: Output Power vs. Supply Voltage Figure 8: Distortion vs. Output Power Figure. 9: Distortion vs. Frequency Figure 10: Distortion vs. Frequency Figure 11: Quiescent Current vs. Supply Voltage Figure 12: Supply Voltage Rejection vs. Frequency 8/13 TDA2050 Figure 13: Supply Voltage Rejection vs. Frequency (Single supply) for Different values of C2 (circuit of fig. 3) Figure 16: Total Power Dissipation and Efficiency vs. Output Power Figure 14: Supply Voltage Rejection vs. Frequency (Single supply) for Different values of C2 (circuit of fig. 3) SHORT CIRCUIT PROTECTION The TDA 2050 has an original circuit which limits the current of the output transistors. The maximum output current is a function of the collector emitter voltage; hence the output transistors work within their safe operating area. This function can therefore be considered as being peak power limiting rather than simple current limiting. It reduces the possibility that the device gets damaged during an accidental short circuit from AC output to ground. Figure 15: Total Power Dissipation and Efficiency vs. Output Power THERMAL SHUTDOWN The presence of a thermal limiting circuit offers the following advantages: 1)An overload on the output (even if it is permanent), or an above limit ambient temperature can be easily tolerated since the Tj cannot be higher than 150°C. 2)The heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no possibility of device damage due to high junction temperature. If for any reason, the junction temperature increases up to 150°C, the thermal shutdown simply reduces the power dissipation and the current consumption. The maximum allowable power dissipation depends upon the thermal resistance junction-ambi9/13 TDA2050 ent. Fig. 17 shows this dissipable power as a function of ambient temperature for different thermal resistance. Figure 17: Maximum Allowable Power Dissipation vs. Ambient Temperature cient. Between the heatsink and the package is better to insert a layer of silicon grease, to optimize the thermal contact; no electrical isolation is needed between the two surfaces. Fig. 18 shows an example of heatsink. Dimension suggestion The following table shows the length that the heatsink in fig. 18 must have for several values of Ptot and Rth. Ptot (W) 12 8 6 Lenght of heatsink (mm) 60 40 30 Rth of heatsink (°C/W) 4.2 6.2 8.3 Figure 18: Example of heat-sink MOUNTING INSTRUCTIONS The power dissipated in the circuit must be removed by adding an external heatsink. Thanks to the PENTAWATT package, the heatsink mounting operation is very simple, a screw or a compression spring (clip) being suffi- APPENDIX A A.1 - MUSIC POWER CONCEPT MUSIC POWER is (according to the IEC clauses n.268-3 of Jan 83) the maximum power which the amplifier is capable of producing across the rated load resistance (regardless of non linearity) 1 sec after the application of a sinusoidal input signal of frequency 1 KHz. According to this definition our method of measurement comprises the following steps: - Set the voltage supply at the maximum operating value; - Apply a input signal in the form of a 1KHz tone burst of 1 sec duration: the repetition period of the signal pulses is 60 sec; - The output voltage is measured 1 sec from the start of the pulse; - Increase the input voltage until the output signal shows a THD=10%; - The music power is then V2out /RL, where Vout is the output voltage measured in the condition of point 4 and RL is the rated load impedance; 10/13 The target of this method is to avoid excessive dissipation in the amplifier. A.2 - INSTANTANEOUS POWER Another power measurement (MAXIMUM INSTANTANEOUS OUTPUT POWER) was proposed by IEC in 1988 (IEC publication 268-3 subclause 19.A). We give here only a brief extract of the concept, and a circuit useful for the measurement. The supply voltage is set at the maximum operating value. The test signal consists of a sinusoidal signal whose frequency is 20 Hz, to which are added alternate positive and negative pulses of 50 µs duration and 500 Hz repetition rate. The amplitude of the 20 Hz signal is chosen to drive the amplifier to its voltage clipping limits, while the amplitude of the pulses takes the amplifier alternately into its current-overload limits. TDA2050 A circuit for generating the test signal is given in fig. 19. The load network consists of a 40 µF capacitor, in series with a 1 ohm resistor. The capacitor limits the current due to the 20 Hz signal to a low value, whereas for he short pulses the effective load impedance is of the order of 1 ohm, and a high output current is produced. Using this signal and load network the measurement may be made without causing excessive dissipation in the amplifier. The dissipation in the 1 ohm resistor is much lower than a rated output power of the amplifier, because the duty-cycle of the high output current is low. By feeding the amplifier output voltage to the Xplates of an oscilloscope, and the voltage across the 1 ohm resistor (representing the output current) to the Y=plates, it is possible to read on the display the value of the maximum instantaneous output power. The result of this test applied at the TDA 2050 is: PEAK POWER = 100W typ Figure 19: Test circuit for peak power measurement 11/13 TDA2050 DIM. A C D D1 E E1 F F1 G G1 H2 H3 L L1 L2 L3 L4 L5 L6 L7 L9 L10 M M1 V4 V5 Dia MIN. mm TYP. 2.4 1.2 0.35 0.76 0.8 1.0 3.2 6.6 3.4 6.8 10.05 17.55 15.55 21.2 22.3 17.85 15.75 21.4 22.5 2.6 15.1 6.0 2.1 4.3 4.23 3.75 4.5 4.0 3.65 MAX. MIN. 4.8 1.37 2.8 0.094 1.35 0.047 0.55 0.014 1.19 0.030 1.05 0.031 1.4 0.039 3.6 0.126 7.0 0.260 10.4 10.4 0.396 18.15 0.691 15.95 0.612 21.6 0.831 22.7 0.878 1.29 3.0 0.102 15.8 0.594 6.6 0.236 2.7 0.008 4.8 0.17 4.75 0.167 4.25 0.148 40˚ (typ.) 90˚ (typ.) 3.85 0.144 inch TYP. 0.134 0.268 0.703 0.620 0.843 0.886 0.178 0.157 MAX. 0.189 0.054 0.110 0.053 0.022 0.047 0.041 0.055 0.142 0.276 0.409 0.409 0.715 0.628 0.850 0.894 0.051 0.118 0.622 0.260 0.106 0.189 0.187 0.167 OUTLINE AND MECHANICAL DATA Weight: 2.00gr Pentawatt V 0.152 L L1 E M1 A M D C D1 L5 V5 L2 H2 L3 F E E1 V4 H3 G G1 Dia. F F1 L9 L4 L10 L7 L6 H2 V4 RESIN BETWEEN LEADS PENTVME 0015981 12/13 TDA2050 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2002 STMicroelectronics – Printed in Italy – All Rights Reserved PENTAWATT® is a Registered Trademark of SGS-THOMSON Microelectronics STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 13/13