TDA2822

TDA2822 ® DUAL POWER AMPLIFIER .. .. SUPPLY VOLTAGE DOWN TO 3 V LOW CROSSOVER DISTORSION LOW QUIESCENT CURRENT BRIDGE OR STEREO CONFIGURATION POWERDIP (Plastic 12+2+2) c u d ORDERING NUMBER : TDA2822 DESCRIPTION The TDA2822 is a monolithic integrated circuit in 12+2+2 powerdip, intended for use as dual audio power amplifier in portable radios and TS sets. e t le o r P o s b O - TYPICAL APPLICATION CIRCUIT (STEREO) ) s ( ct ) s t( u d o r P e t e l o s b O September 2003 1/11 TDA2822 PIN CONNECTION (top view) INPUT+(1) 1 16 INPUT+(2) N.C. 2 15 N.C. INPUT-(1) 3 14 INPUT-(2) GND 4 13 GND GND 5 12 GND OUTPUT(1) 6 11 OUTPUT(2) N.C. 7 10 N.C. +VS 8 9 N.C. D95AU321 SCHEMATIC DIAGRAM c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O ABSOLUTE MAXIMUM RATINGS Symbol Vs Io Ptot Tstg, Tj 2/11 Value Unit Supply Voltage Output Peak Current Parameter 15 1.5 V A Total Power Dissipation at Tamb = 50 °C at Tcase = 70 °C Storage and Junction Temperature 1.25 4 W W – 40 to 150 °C TDA2822 THERMAL DATA Symbol Rth j-amb Rth j-case Parameter Thermal Resistance Junction-ambient Thermal Resistance Junction-pins Max Max Value Unit 80 20 °C/W °C/W ELECTRICAL CHARACTERISTICS (Vs = 6 V, Tamb = 25 °C, unless otherwise specified) STEREO (test circuit of fig. 1) Symbol Parameter Test Condition Vs Vc Supply Voltage Quiescent Output Voltage Id Ib Quiescent Drain Current Po Output Power (each channel) d = 10 % Vs = 9 V Vs = 6 V Vs = 4.5 V Closed Loop Voltage Gain Input Resistance Total Input Noise Ri N Vs = 9 V Vs = 6 V f = 1 kHz f = 1 kHz 36 100 39 Rs = 10 kΩ B = 22 Hz to 22 kHz Curve A o r P Vos Output Offset Voltage RL = 8 Ω Gv Ri e d o r P e Closed Loop Voltage Gain Input Resistance t e l o N s b O SVR Total Input Noise Supply Voltage Rejection mA W W W RL = ∞ Distortion (f = 1 kHz) 12 1.7 0.65 0.32 Supply Voltage Quiescent Drain Current d V V 1.3 0.45 f = 1 kHz RL = 4 Ω RL = 4 Ω RL = 4 Ω e t le Rg = 10 kΩ f = 1 kHz (s) o s b O - d = 10 % f = 1 kHz Vs = 9 V RL = 8 Ω Vs = 6 V RL = 8 Ω Vs = 4.5 V RL = 4 Ω RL = 8 Ω f = 1 kHz f = 1 kHz ) s t( 41 c u d 24 Po = 0.5 W kΩ 30 50 dB 3 2.7 0.9 dB µV µV dB 2.5 2 f = 100 Hz t c u V nA Vs Id Input Bias Current Output Power Unit 15 4 2.7 6 Supply Voltage Rejection Channel Separation Ib Max. 100 SVR CS Po Typ. 3 Input Bias Current Gv e Min. 6 15 12 V mA 10 60 mV 100 nA 3.2 1.35 1 W W W 0.2 % 39 dB 100 kΩ Rs = 10 kΩ B = 22 Hz to 22 kHz Curve A 3 2.5 f = 100 Hz 40 µV µV dB 3/11 TDA2822 Figure 1 : Test Circuit (stereo). Figure 2 : P.C. Board and Components Layout of the Circuit of Figure 1 (1:1 scale). e t le ) s ( ct u d o r P e t e l o s b O 4/11 o s b O - o r P c u d ) s t( TDA2822 Figure 3 : Test Circuit (bridge). Figure 4 : P.C. Board and Components Layout of the Circuit of Figure 3 (1:1 scale). e t le ) s ( ct c u d ) s t( o r P o s b O - u d o r P e t e l o s b O 5/11 TDA2822 Figure 5 : Output Power vs. Supply Voltage (Stereo). Figure 6 : Output Power vs. Supply Voltage (Bridge). Figure 7 : Distorsion vs. Output Power (Bridge). Figure 8 : Distorsion vs. Output Power (Bridge). c u d e t le ) s ( ct du Figure 9 : Supply Voltage Rejection vs. Frequency. o r P e t e l o s b O 6/11 ) s t( o r P o s b O - Figure 10 : Quiescent Current vs. Supply Voltage. TDA2822 Figure 11 : Total Power Dissipation vs. Output Power (Stereo). Figure 12 : Total Power Dissipation vs. Output Power (Bridge). Figure 13 : Total Power Dissipation vs. Output Power (Bridge). ) s t( c u d e t le ) s ( ct o r P o s b O - u d o r P e t e l o s b O 7/11 TDA2822 Figure 14 : Application Circuit for Portable Radios. MOUNTING INSTRUCTION The Rth j-amb of the TDA2822 can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Figure 15) or to an external heatsink (Figure 16). The diagram of Figure 17 shows the maximum dissipable power Ptot and the Rth j-amb as a function of the side "∂" of two equal square copper areas having a thickness of 35 µ (1.4 mils). (s) Figure 15 : Example of P.C. Board Copper Area which is used as Heatsink. t c u d o r P e t e l o s b O 8/11 c u d ) s t( o r P During soldering the pins temperature must not exceed 260 °C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. e t le o s b O - Figure 16 : External Heatsink Mounting Example. TDA2822 Figure 6 : Maximum Dissipable Power and Junction to Ambient Thermal Resistance vs. Side "∂". Figure 7 : Maximum Allowable Power Dissipation vs. Ambient Temperature. c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 9/11 TDA2822 mm DIM. MIN. a1 0.51 B 0.85 TYP. inch MAX. MIN. TYP. 0.020 1.40 b 0.033 0.055 0.50 b1 MAX. OUTLINE AND MECHANICAL DATA 0.38 0.020 0.50 D 0.015 0.020 20.0 0.787 E 8.80 0.346 e 2.54 0.100 e3 17.78 0.700 F 7.10 0.280 I 5.10 0.201 L 3.30 c u d 0.130 o r P Powerdip 16 Z 1.27 ) s ( ct u d o r P e t e l o s b O 10/11 e t le 0.050 o s b O - ) s t( TDA2822 c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. s b O The ST logo is a registered trademark of STMicroelectronics. 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