TDA7267
®
2W MONO AMPLIFIER
CAN DELIVER 2W THD 10% 12V/8Ω
INTERNAL FIXED GAIN 32dB
NO FEEDBACK CAPACITOR
NO BOUCHEROT CELL
THERMAL PROTECTION
AC SHORT CIRCUIT PROTECTION
SVR CAPACITOR FOR BETTER RIPPLE
REJECTION
LOW TURN-ON/OFF POP
STAND-BY MODE
MINIDIP (4+4)
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ORDERING NUMBER: TDA7267
DESCRIPTION
The device TDA7267 is a new technology Mono
Audio Amplifier in MINIDIP package specifically
designed for TV application.
Thanks to the fully complementary output configuBLOCK DIAGRAM
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ration the device delivers a rail to rail voltage
swing without need of boostrap capacitors.
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-
VS=12V
VS
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IN
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0.1µF
100µF
IN
470µF
+
-
OUT
SVR
8Ω
47µF
S-GND
P-GND
D94AU165
June1998
1/5
TDA7267
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
VS
Operating Supply Voltage
IO
Top
Output Put Peak Current
Tj
Tstg
Junction Temperature
Operating Temperature Range
Storage Temperature Range
Value
Unit
18
V
1.5
A
0 to 70
°C
150
°C
-40 to 125
°C
PIN CONNECTION (Top view)
VS
1
8
GND
OUT
2
7
GND
SVR
3
6
GND
IN
4
5
GND
D94AU163
THERMAL DATA
Symbol
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Parameter
Rth j-amb
Thermal Resistance Junction to ambient (on PCB)
Rth j-case
Thermal Resistance Junction to case
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Value
Unit
80
°C/W
15
°C/W
ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = 12V; RL = 8Ω; f = 1KHz; unless otherwise specified.)
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Symbol
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AV
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Parameter
Test Condition
Supply Voltage Range
Quiescent Current
Stand-By Current
Min.
Typ.
4.5
20
Pin 3 shorted to GND
Quiescent Output Voltage
Voltage Gain
Unit
18
V
30
0.3
mA
mA
6
32
V
dB
100
KΩ
RIN
Input Impedance
PO
THD
Output Power
Distortion
THD = 10%
PO = 1W
SVR
Supply Voltage Rejection
Vripple = 150mVrms;
Fripple = 1KHz
50
EI
Input Noise Voltage
Rg = 10KΩ; BW = 20Hz to 20KHz
1.5
Vsb
Stand-By Enable Voltage
1.8
Max.
2
1.0
W
%
dB
5
µV
1
V
TDA7267
APPLICATION CIRCUIT
VS=12V
VS
0.1µF
IN
100µF
470µF
IN
OUT
SVR
STAND-BY
47µF
8Ω
P-GND
D94AU166
APPLICATION HINTS:
For 12V supply and 8Ω speaker application, its
maximum power dissipation is about 1W.
Assumming that max ambient temperature is
70°C. Required thermal resistance of the device
and heat dissipating means must be equal to (150
- 70)/1 = 80°C/W.
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Junction to pin thermal resistance of the package
is about 15°C/W. That means external heat sink
of about 65°C/W is required.
Cu ground plane of PCB can be used as heat dissipating means.
Stand-By switches must be able to discharge Csvr
current.
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TDA7267
MINIDIP PACKAGE MECHANICAL DATA
mm
DIM.
MIN.
A
TYP.
MAX.
MIN.
3.3
TYP.
MAX.
0.130
a1
0.7
0.028
B
1.39
1.65
0.055
0.065
B1
0.91
1.04
0.036
0.041
b
0.5
b1
0.38
0.020
0.5
D
0.015
0.020
9.8
0.386
E
8.8
0.346
e
2.54
0.100
e3
7.62
0.300
e4
7.62
0.300
F
7.1
I
4.8
L
0.44
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1.6
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c
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3.3
Z
4/5
inch
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0.017
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0.280
0.189
0.130
0.063
TDA7267
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1998 STMicroelectronics – Printed in Italy – All Rights Reserved
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5/5
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