TDA7267A

TDA7267A ® 3W MONO AMPLIFIER CAN DELIVER 3W THD 10% 14.5V/8Ω INTERNAL FIXED GAIN 32dB NO FEEDBACK CAPACITOR NO BOUCHEROT CELL THERMAL PROTECTION AC SHORT CIRCUIT PROTECTION SVR CAPACITOR FOR BETTER RIPPLE REJECTION LOW TURN-ON/OFF POP STAND-BY MODE ) s ( ct u d o PowerDIP 8+8 r P e ORDERING NUMBER: TDA7267A DESCRIPTION The device TDA7267A is a new technology Mono Audio Amplifier in PowerDIP package specifically designed for TV application. Thanks to the fully complementary output configu- t e l o ) (s BLOCK DIAGRAM s b O ration the device delivers a rail to rail voltage swing without need of boostrap capacitors. t c u d o r P e let o s b O IN VS=14.5V VS C4 100µF 1 C1 0.1µF IN 4 SVR 3 + 2 - C3 47µF OUT 8Ω 6 S-GND C5 470µF 9 to 16 P-GND D98AU827 June 1998 1/7 TDA7267A ABSOLUTE MAXIMUM RATINGS Symbol Parameter VS Operating Supply Voltage IO Top Output Put Peak Current Tj Tstg Junction Temperature Unit 18 V 1.5 A 0 to 70 °C 150 °C -40 to 125 °C Operating Temperature Range Storage Temperature Range Value PIN CONNECTION (Top view) VS 1 16 P-GND OUT 2 15 P-GND SVR 3 14 P-GND IN 4 13 P-GND N.C. 5 12 S-GND 6 N.C. 7 bs N.C. 8 11 O ) s ( t c u d o THERMAL RESISTANCE JUNCTION TO AMBIENT(˚C/W) let 54 o s b O 52 D98AU830 50 48 46 44 42 40 38 36 34 0 2 4 6 8 10 ON BOARD HEAT-SINK AREA (sq.cm) 2/7 u d o r P e t e l o P-GND P-GND 10 P-GND 9 P-GND D98AU829 Rth with "on Board" Square Heat Sink vs. Copper Area r P e ) s ( ct 12 Example of heatsink using PC board copper TDA7267A THERMAL DATA Symbol Parameter Value Unit Rth j-amb Thermal Resistance Junction to ambient 70 °C/W Rth j-case Thermal Resistance Junction to case 15 °C/W ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = 14.5V; RL = 8Ω; f = 1KHz; unless otherwise specified.) Symbol Parameter Test Condition Min. Typ. Max. 23 35 mA 0.3 mA 5 VS Supply Voltage Range IS Isb Quiescent Current VO Quiescent Output Voltage AV RIN Voltage Gain 31 Input Impedance 50 100 KΩ PO Output Power THD = 10% 2.7 3 W Distortion Supply Voltage Rejection PO = 1W Vripple = 150mVrms; Fripple = 1KHz EI Input Noise Voltage Rg = 10KΩ; BW = 20Hz to 20KHz Vsb Stand-By Enable Voltage Stand-By Current THD SVR 18 Pin 3 shorted to GND c u d 33 o r P 0.1 e t e ol bs u d o so IN SVR C3 47µF % dB 10 µV 1 V C4 100µF C5 470µF 1 4 2 OUT 8Ω 3 6 STAND-BY dB VS=14.5V VS Pr C1 0.1µF IN V O ) s ( t c e t e l 0.3 50 5 V ) s ( t 7.5 Figure 1. Application Circuit b O Unit 9 to 16 S-GND APPLICATION HINTS: For 14.5V supply and 8Ω speaker application, its maximum power dissipation is about 1.8W. Assumming that max ambient temperature is 70°C, the required thermal resistance of the device mounted on the PCB with a dissipating area P-GND D98AU828 must be equal to: (150 - 70)/1.8 = 44.4°C/W. Junction to pin thermal resistance of the package is about 15°C/W. That means external heat sink of about 30°C/W is required. Cu ground plane of PCB can be used as heat dissipating means. 3/7 TDA7267A Figure 2. PCB And Components Layout Of The Application Circuit of Figure 1 ) s ( ct u d o r P e t e l o Components C2 and C6 must be ignored. t c u Figure 3. Distortion vs Output Power 10 ) (s d o r THD+N(%) s b O Figure 4. Distortion vs Output Power 10 P e t e l o 1 s b O 1 f = 1KHz 0.1 0.1 0.010 0.1 1 Pout(W) 5 0.010 0.1 Remark: all the characterization curves refer to the electrical test conditions. 4/7 THD+N(%) f = 10KHz Pout(W) 1 5 TDA7267A Figure 5. Distortion vs Output Power 10 Figure 6. Output Power vs Supply Voltage Pout (W) THD+N(%) 10 f = 1KHz THD=10% 1 f = 1KHz THD= 1% 1 f = 15KHz 0.1 0.1 4.000 0.010 0.1 Pout(W) 1 6.000 Figure 7. Distortion vs Frequency 1 )- s ( t c u d o t e l o 1k f(Hz) 16.00 18.00 20.00 t e l o s b O 25 r P e 14.00 r P e Iq(mA) 30 Pout = 1W Vs = 14.5V Rl = 8 Ohm u d o 12.00 Vs(V) THD(%) 0.1 10.00 Figure 8. Quiescent current vs Supply Voltage 10 0.010 100 8.000 5 ) s ( ct 20 15 10 5 10k 20k 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Vs(V) s b O Figure 9. Power dissipation vs Output Power Pd(W) 1.9 1.8 1.7 1.6 Vs = 14.5V Rl = 8 Ohm F = 1KHz 1.5 1.4 1.3 0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 Pout(W) 5/7 TDA7267A POWERDIP 8+8 PACKAGE MECHANICAL DATA mm DIM. MIN. a1 0.51 B 0.77 TYP. inch MAX. TYP. 1.65 0.030 0.065 b 0.5 0.020 b1 0.25 0.010 ) s ( ct 20 0.787 u d o E 8.5 0.335 e 2.54 0.100 e3 17.78 7.1 I 5.1 L 3.3 )- Z s ( t c u d o r P e t e l o r P e 0.700 F s b O MAX. 0.020 D 6/7 MIN. s b O t e l o 1.27 0.280 0.201 0.130 0.050 TDA7267A ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 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