TDA7267T

TDA7267T 2 W mono amplifier Features „ 2 W output power into 8 Ω at 12 V, THD = 10% „ Internally fixed gain of 32 dB „ No feedback capacitor „ No boucherot cell „ Thermal protection „ AC short-circuit protection „ SVR capacitor for better ripple rejection „ Low turn-on/off “pop” noise „ Standby mode DIP-8 (4+4) Description The TDA7267T is a new technology mono audio amplifier in a DIP-8 package specifically designed for TV applications. Thanks to the fully complementary output configuration the device delivers a rail-to-rail voltage swing without the need for boostrap capacitors. Table 1. Device summary Order code TDA7267T May 2009 Operating Temp. range 0° to 70° C Package DIP-8 (4+4) Doc ID 15776 Rev 2 Packaging Tube 1/10 www.st.com 10 Block diagram and applications circuit 1 TDA7267T Block diagram and applications circuit Figure 1. Applications circuit showing internal block diagram VS=12V VS 0.1 F IN IN 100 F 470 F + - OUT SVR 8Ω 47 F S-GND P-GND D94AU165 2/10 Doc ID 15776 Rev 2 TDA7267T 2 Pin description Pin description Figure 2. Pin connection (top view, PCB view) VS 1 8 GND OUT 2 7 GND SVR 3 6 GND IN 4 5 GND D94AU163 Doc ID 15776 Rev 2 3/10 Electrical specifications TDA7267T 3 Electrical specifications 3.1 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol 3.2 Parameter Unit VS DC supply voltage 18 V IO Peak output current 1.5 A Top Operating temperature range 0 to 70 °C Tj Junction temperature 150 °C Tstg Storage temperature range -40 to 150 °C Thermal data Table 3. Thermal data Symbol 3.3 Value Parameter Min Typ Max Unit Rth j-amb Thermal resistance, junction to ambient (on PCB) - 76 - °C/W Rth j-case Thermal resistance, junction to case pin (6 or 7) - 23 - °C/W Electrical specifications Unless otherwise stated, the results in Table 4 below are given for the conditions: VS = 12 V, RL = 8 Ω, f = 1 kHz and Tamb = 25° C. Table 4. Symbol 4/10 Electrical specifications Parameter Condition Min Typ Max Unit VS Supply voltage range - 4.5 - 18 V Iq Total quiescent current - - 20 30 mA ISTBY Current in standby Pin 3 shorted to GND - - 0.3 mA VO Quiescent output voltage - - 6 - V AV Voltage gain - - 32 - dB RIN Input resistance - - 100 - kΩ PO Output power THD = 10% 1.8 2.0 - W THD Total harmonic distortion PO = 1 W - - 1.0 % SVR Supply voltage rejection fripple = 1 kHz, Vripple = 150 mV RMS - 50 - dB Doc ID 15776 Rev 2 TDA7267T Electrical specifications Table 4. Symbol Electrical specifications (continued) Parameter Condition Min Typ Max Unit EI Input noise voltage RG = 10 kΩ, BW = 20 Hz to 20 kHz - 1.5 5.0 µV VSTBY Standby enable voltage - - - 1.0 V Doc ID 15776 Rev 2 5/10 Applications information 4 TDA7267T Applications information For 12-V supply and 8-Ω speaker applications the maximum power dissipation is approximately 1.2 W. Assuming that the maximum ambient temperature is 70° C the required thermal resistance of the devices must be equal to (150 - 70) / 1.2 = 67 °C/W. The junction-to-pin thermal resistance of the package is about 23 °C/W. This means that an external heatsink of around 43 °C/W is required. The copper ground plane of the PCB can be used for dissipating this heat. Standby switches must be able to discharge the CSVR current. Figure 3. Thermal resistance junction-to-ambient vs copper area on PCB 80.00 78.00 76.00 Rth j-a (oC/W) 74.00 72.00 70.00 68.00 66.00 64.00 62.00 60.00 0 0.5 1 1.5 2 2.5 3 3.5 4 Cu Area on PCB (cm2) Figure 4. Power derating curve 2.20 Maximum Power Dissipation (W) 2.00 1.80 Copper Area 3 Cm2 1.60 1.40 1.20 1.00 0.80 0.60 NO Copper Area (others than tracks) 0.40 0.20 0.00 0 10 20 30 40 50 60 70 80 90 Tambient (oC) 6/10 Doc ID 15776 Rev 2 100 110 120 130 140 150 160 TDA7267T Applications information Power dissipation vs output power 1.50 1.40 1.30 1.20 Power Dissipation (W) Figure 5. 1.10 1.00 0.90 0.80 VS = 12V F = 1 KHz Rl = 8 Ohm 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Output Power (W) Doc ID 15776 Rev 2 7/10 Package mechanical data 5 TDA7267T Package mechanical data The TDA7267T comes in a 8-pin DIP package. Figure 6 below gives the package outline and dimensions. Figure 6. DIP-8 outline drawing and dimensions mm inch DIM. MIN. A TYP. MAX. MIN. 3.32 TYP. MAX. 0.131 a1 0.51 B 1.15 1.65 0.045 0.065 b 0.356 0.55 0.014 0.022 b1 0.020 0.204 0.304 0.008 D E 0.012 10.92 7.95 9.75 0.430 0.313 0.384 e 2.54 0.100 e3 7.62 0.300 e4 7.62 0.300 F 6.6 0.260 I 5.08 0.200 L Z 3.18 OUTLINE AND MECHANICAL DATA 3.81 1.52 0.125 0.150 DIP-8 0.060 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 8/10 Doc ID 15776 Rev 2 TDA7267T 6 Revision history Revision history Table 5. Document revision history Date Revision Changes Dec-2005 1 Initial release. 29-May-2009 2 Updated temperature to 70° C in Chapter 4 on page 6. Doc ID 15776 Rev 2 9/10 TDA7267T Please Read Carefully: Information in this document is provided solely in connection with ST products. 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