TDA7562
MULTIFUNCTION QUAD POWER AMPLIFIER
WITH BUILT-IN DIAGNOSTICS FEATURES
■
■
■
■
■
■
■
■
■
■
DMOS POWER OUTPUT
HIGH OUTPUT POWER CAPABILITY 4x25W/
4 @ 14.4V, 1KHZ, 10% THD, 4x35W EIAJ
MAX. OUTPUT POWER 4x60W/2
MULTIPOWER BCD TECHNOLOGY
MOSFET OUTPUT POWER STAGE
FULL I2C BUS DRIVING:
– ST-BY
– INDEPENDENT FRONT/REAR SOFT PLAY/
MUTE
– SELECTABLE GAIN 30dB - 16dB (FOR
LOW NOISE LINE OUTPUT FUNCTION)
– I2C BUS DIGITAL DIAGNOSTICS
FULL FAULT PROTECTION
DC OFFSET DETECTION
FOUR INDEPENDENT SHORT CIRCUIT
PROTECTION
CLIPPING DETECTOR PIN WITH
SELECTABLE THRESHOLD (2%/10%)
ST-BY/MUTE PIN
ESD PROTECTION
DESCRIPTION
The TDA7562 is a new BCD technology Quad
FLEXIWATT27 (Vertical)
Bridge type of car radio amplifier in Flexiwatt27V
package specially intended for car radio applications. Thanks to the DMOS output stage the
TDA7562 has a very low distortion allowing a clear
powerful sound. This device is equipped with a full
diagnostics array that communicates the status of
each speaker through the I2C bus.The possibility
to control the configuration and the behaviour of
the device by means of the I2C bus makes
TDA7562 a very flexible machine.
BLOCK DIAGRAM
CLK
DATA
VCC1
VCC2
ST-BY/MUTE
Thermal
Protection
& Dump
I2CBUS
Mute1 Mute2
IN RF
Reference
CD_OUT
Clip
Detector
F
OUT RF+
16/30dB
IN RR
Short Circuit
Protection &
Diagnostic
R
OUT RFOUT RR+
16/30dB
IN LF
OUT RR-
Short Circuit
Protection &
Diagnostic
F
OUT LF+
16/30dB
IN LR
OUT LF-
Short Circuit
Protection &
Diagnostic
R
OUT LR+
16/30dB
Short Circuit
Protection &
Diagnostic
SVR
AC_GND
RF RR
LF LR
OUT LR-
TAB
S_GND
PW_GND
September 2013
1/17
TDA7562
ABSOLUTE MAXIMUM RATINGS
Symbol
Value
Unit
Vop
Operating Supply Voltage
18
V
VS
DC Supply Voltage
28
V
Vpeak
Peak Supply Voltage (for t = 50ms)
50
V
VCK
CK pin Voltage
6
V
Data Pin Voltage
6
V
IO
Output Peak Current (not repetitive t = 100s)
8
A
IO
Output Peak Current (repetitive f > 10Hz)
6
A
Power Dissipation Tcase = 70°C
85
W
-55 to 150
°C
VDATA
Ptot
Tstg, Tj
Parameter
Storage and Junction Temperature
THERMAL DATA
Symbol
Rth j-case
Parameter
Max.
Thermal Resistance Junction to case
PIN CONNECTION (Top view)
27
TAB
26
DATA
25
PW_GND RR
24
OUT RR-
23
CK
22
OUT RR+
21
VCC2
20
OUT RF-
19
PW_GND RF
18
OUT RF+
17
AC GND
16
IN RF
15
IN RR
14
S_GND
13
IN LR
12
IN LF
11
SVR
10
OUT LF+
9
PW_GND LF
8
OUT LF-
7
VCC1
6
OUT LR+
5
CD-OUT
4
OUT LR-
3
PW_GND LR
2
STBY
1
TAB
D00AU1230
2/17
Value
Unit
1
°C/W
TDA7562
Figure 1. Application Circuit
C8
0.1μF
C7
3300μF
Vcc1
V(4V .. VCC)
2
DATA
26
CLK
23
Vcc2
7
21
18
+
19
20
I2C BUS
22
OUT RF
+
25
C1 0.22μF
IN RF
16
24
10
C2 0.22μF
IN RR
15
+
9
8
C3 0.22μF
IN LF
OUT RR
6
12
OUT LF
+
3
C4 0.22μF
IN LR
4
13
S-GND
14
17
11
5
1, 27
OUT LR
TAB
47K
C5
1μF
C6
10μF
V
D00AU1231A
CD OUT
3/17
TDA7562
ELECTRICAL CHARACTERISTICS
(Refer to the test circuit, VS = 14.4V; RL = 4; f = 1KHz; Tamb = 25°C; unless otherwise specified.)
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
18
V
150
300
mA
POWER AMPLIFIER
VS
Supply Voltage Range
Id
Total Quiescent Drain Current
PO
Output Power
THD
Total Harmonic Distortion
8
EIAJ (VS = 13.7V)
32
35
W
THD = 10%
THD = 1%
22
25
20
W
W
RL = 2; EIAJ (VS = 13.7V)
RL = 2; THD 10%
RL = 2; THD 1%
RL = 2; MAX POWER
50
32
55
38
30
60
W
W
W
W
PO = 1W to 10W; f = 1kHz
0.04
0.1
%
PO = 1-10W, f = 10kHz
0.02
0.5
%
0.02
0.05
GV = 16dB; VO = 0.1 to 5VRMS
CT
Cross Talk
RIN
Input Impedance
GV1
Voltage Gain 1
GV1
GV2
f = 1KHz to 10KHz, Rg = 600
Voltage Gain Match 1
60
60
100
130
K
29.5
30
30.5
dB
-1
Voltage Gain 2
%
50
15.5
dB
1
dB
16
16.5
dB
GV2
Voltage Gain Match 2
1
dB
EIN1
Output Noise Voltage 1
Rg = 600 20Hz to 22kHz
50
100
V
EIN2
Output Noise Voltage 2
Rg = 600; GV = 16dB
20Hz to 22kHz
15
30
V
SVR
Supply Voltage Rejection
f = 100Hz to 10kHz; Vr = 1Vpk;
Rg = 600
-1
50
BW
Power Bandwidth
100
ASB
Stand-by Attenuation
90
ISB
Stand-by Current
60
KHz
110
2
AM
Mute Attenuation
VOS
Offset Voltage
VAM
Min. Supply Mute Threshold
TON
Turn ON Delay
D2/D1 (IB1) 0 to 1
D2/D1 (IB1) 1 to 0
Mute & Play
dB
dB
100
A
100
mV
80
100
-100
0
dB
7
7.5
8
V
5
20
ms
20
ms
TOFF
Turn OFF Delay
VSBY
St-By/Mute pin for St-By
0
1.5
V
VMU
St-By/Mute pin for Mute
3.5
5
V
VOP
St-By/Mute pin for Operating
IMU
St-By/Mute pin Current
5
VS
V
VSTBY/MUTE = 8.5V
7
20
40
A
A
VSTBY/MUTE < 1.5V
0
10
CDLK
Clip Det High Leakage Current
CD off
0
15
CDSAT
Clip Det Sat. Voltage
CD on; ICD = 1mA
CDTHD
Clip Det THD level
4/17
300
A
mV
D0 (IB1) = 1
5
10
15
%
D0 (IB1) = 0
1
2
3
%
TDA7562
ELECTRICAL CHARACTERISTICS (continued)
(Refer to the test circuit, VS = 14.4V; RL = 4; f = 1KHz; Tamb = 25°C; unless otherwise specified.)
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
1.2
V
DIAGNOSTICS (Power Amplifier Mode or Line Driver Mode)
Pgnd
Short to GND det. (below this
limit, the Output is considered in
Short Circuit to GND)
Pvs
Short to VS det. (above this limit,
the Output is considered in Short
Circuit to VS)
Vs -1.2
Pnop
Normal operation thresholds.
(Within these limits, the Output is
considered without faults).
1.8
Lsc
VO
Shorted Load det.
Offset Detection
Power Amplifier in Mute or Play,
one or more short circuits
protection activated
V
Vs -1.8
V
Power Amplifier Mode
0.5
Line Driver Mode
1.5
±2.5
V
±1.5
±2
2
I C BUS INTERFACE
fSCL
Clock Frequency
VIL
Input Low Voltage
VIH
Input High Voltage
400
KHz
1.5
2.3
V
V
5/17
TDA7562
Figure 2. Quiescent Current vs. Supply Voltage
Figure 5. Distortion vs. Output Power (4)
THD (%)
Id (mA)
10
250
230
Vs = 14.4 V
RL = 4 Ohm
Vin = 0
NO LOADS
210
190
1
170
f = 10 KHz
150
130
0.1
110
f = 1 KHz
90
70
50
8
10
121
Vs (V)
41
6
18
0.01
0.1
1
10
Po (W)
Figure 3. Output Power vs. Supply Voltage (4)
Figure 6. Distortion vs. Output Power (2)
THD (%)
Po (W)
10
70
65
60
Po-max
RL = 4 Ohm
f = 1 KHz
55
Vs = 14.4 V
RL = 2 Ohm
50
1
THD = 10 %
45
f = 10 KHz
40
35
30
f = 1 KHz
0.1
25
THD = 1 %
20
15
10
5
8
9
10
11
12
13
Vs (V)
14
15
16
17
18
0.01
0.1
1
10
Po (W)
Figure 4. Output Power vs. Supply Voltage (2)
Figure 7. Distortion vs. Output Power (4)
Po (W)
THD (%)
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
10
Po-max
RL = 2 Ohm
f = 1 KHz
Vs = 14.4 V
RL = 4 Ohm
Po = 4 W
1
THD = 10 %
0.1
THD = 1 %
8
6/17
9
10
11
12
Vs (V)
13
14
15
16
0.01
10
100
f (Hz)
1000
10000
TDA7562
Figure 8. Distortion vs. Frequency (2)
Figure 11. Power Dissipation & Efficiency vs.
Output Power (4, STD, SINE)
THD (%)
n (%)
Ptot (W)
10
90
90
Vs = 14.4 V
RL = 4 x 4 Ohm
f = 1 KHz SINE
80
70
Vs = 14.4 V
RL = 2 Ohm
Po = 8 W
1
80
n
70
60
60
50
50
Ptot
0.1
0.01
10
100
1000
10000
f (Hz)
40
40
30
30
20
20
10
10
0
0
2
4
6
8
10
12 14
Po (W)
16
18
20
22
24
0
26
Figure 12. Power Dissipation vs. Average
Ouput Power (Audio Program
Simulation, 4)
Figure 9. Crosstalk vs. Frequency
CROSSTALK (dB)
90
Ptot (W)
45
80
40
70
Vs = 14 V
RL = 4 x 4 Ohm
GAUSSIAN NOISE
35
60
RL = 4 Ohm
Po = 4 W
Rg = 600 Ohm
50
CLIP
START
30
25
40
20
30
15
20
10
100
1000
10000
10
f (Hz)
5
0
1
3
2
4
5
Po (W)
Figure 10. Supply Voltage Rejection vs. Freq.
SVR (dB)
90
Figure 13. Power Dissipation vs. Average
Ouput Power (Audio Program
Simulation, 2)
Ptot (W)
90
80
80
70
Vs = 14 V
RL = 4 x 2 Ohm
GAUSSIAN NOISE
70
60
50
40
CLIP
START
60
50
Rg = 600 Ohm
Vripple= 1 Vpk
40
30
30
20
20
10
100
1000
10000
10
f (Hz)
0
0
1
2
3
4
Po (W)
5
6
7
8
7/17
TDA7562
DIAGNOSTICS FUNCTIONAL DESCRIPTION:
Detectable conventional faults are:
– SHORT TO GND
– SHORT TO Vs
– SHORT ACROSS THE SPEAKER
The following additional features are provided:
– OUTPUT OFFSET DETECTION
The TDA7562 has 2 operating statuses:
1)) RESTART mode. The diagnostic is not enabled. Each audio channel operates independently from each other. If any of the a.m. faults occurs, only the channel(s) interested is shut down. A check of the output status
is made every 1 ms (fig. 14). Restart takes place when the overload is removed.
2)) DIAGNOSTIC mode. It is enabled via I2C bus and self activates if an output overload (such to cause the
intervention of the short-circuit protection) occurs to the speakers outputs . Once activated, the diagnostics
procedure develops as follows (fig. 15):
– To avoid momentary re-circulation spikes from giving erroneous diagnostics, a check of the output
status is made after 1ms: if normal situation (no overloads) is detected, the diagnostic is not performed and the channel returns back active.
– Instead, if an overload is detected during the check after 1 ms, then a diagnostic cycle having a duration of about 100 ms is started.
– After a diagnostic cycle, the audio channel interested by the fault is switched to RESTART mode. The
relevant data are stored inside the device and can be read by the microprocessor. When one cycle
has terminated, the next one is activated by an I2C reading. This is to ensure continuous diagnostics
throughout the car-radio operating time.
– To check the status of the device a sampling system is needed. The timing is chosen at microprocessor level (over half a second is recommended).
Figure 14. Restart timing without Diagnostic Enable (Each 1mS time, a sampling of the fault is done)
Out
1-2mS
1mS
1mS
1mS
1mS
t
Overcurrent and short
circuit protection intervention
(i.e. short circuit to GND)
Short circuit removed
Figure 15. Restart timing with Diagnostic Enable
1mS
100mS
1mS
1mS
t
Overcurrent and short
Short circuit removed
(i.e. short circuit to GND)
8/17
TDA7562
As for SHORT TO GND / Vs the fault-detection thresholds remain unchanged from 30 dB to 16 dB gain setting.
They are as follows:
S.C. to GND
0V
x
1.2V
Normal Operation
1.8V
VS-1.8V
x
S.C. to Vs
VS-1.2V
D01AU1253
VS
Concerning SHORT ACROSS THE SPEAKER , the threshold varies from 30 dB to 16 dB gain setting, since
different loads are expected (either normal speaker's impedance or high impedance). The values in case of 30
dB gain are as follows:
S.C. across Load
0V
x
0.5Ω
Normal Operation
1.5Ω
Infinite
D01AU1254mod
If the Line-Driver mode (Gv= 16 dB and Line Driver Mode diagnostic = 1) is selected, the same thresholds will
change as follows:
S.C. across Load
0Ω
1.5Ω
x
Normal Operation
4.5Ω
infinite
D01AU1252mod
OUTPUT DC OFFSET DETECTION
Any DC output offset exceeding ± 2V are signalled out. This inconvenient might occur as a consequence of initially defective or aged and worn-out input capacitors feeding a DC component to the inputs, so putting the
speakers at risk of overheating.
This diagnostic has to be performed with low-level output AC signal (or Vin = 0).
The test is run with selectable time duration by microprocessor (from a "start" to a "stop" command):
– START = Last reading operation or setting IB1 - D5 - (OFFSET enable) to 1
– STOP = Actual reading operation
Excess offset is signalled out if persistent throughout the assigned testing time. This feature is disabled if any
overloads leading to activation of the short-circuit protection occurs in the process.
MULTIPLE FAULTS
When more misconnections are simultaneously in place at the audio outputs, it is guaranteed that at least one
of them is initially read out. The others are notified after successive cycles of I2C reading and faults removal,
provided that the diagnostic is enabled.
The table below shows all the couples of double-fault possible. It should be taken into account that a short circuit
9/17
TDA7562
with the 4 ohm speaker unconnected is considered as double fault.
Double fault table for Turn On Diagnostic
S. GND (so)
S. GND (sk)
S. Vs
S. Across L.
S. GND (so)
S. GND
S. GND
S. Vs + S. GND
S. GND
S. GND (sk)
/
S. GND
S. Vs
S. GND
S. Vs
/
/
S. Vs
S. Vs
S. Across L.
/
/
/
S. Across L.
S. GND (so) / S. GND (sk) in the above table make a distinction according to which of the 2 outputs is shorted
to ground (test-current source side= so, test-current sink side = sk). More precisely, so = CH+, sk = CH-.
FAULTS AVAILABILITY
All the results coming from I2Cbus, by read operations, are the consequence of measurements inside a defined
period of time. If the fault is stable throughout the whole period, it will be sent out.
To guarantee always resident functions, every kind of diagnostic cycles will be reactivate after any I2C reading
operation. So, when the micro reads the I2C, a new cycle will be able to start, but the read data will come from
the previous diag. cycle (i.e. The device is in turned On, with a short to Gnd, then the short is removed and micro
reads I2C. The short to Gnd is still present in bytes, because it is the result of the previous cycle. If another I2C
reading operation occurs, the bytes do not show the short). In general to observe a change in Diagnostic bytes,
two I2C reading operations are necessary.
I2C PROGRAMMING/READING SEQUENCES
A correct turn on/off sequence respectful of the diagnostic timings and producing no audible noises could be as
follows (after battery connection):
TURN-ON: PIN2 > 7V --- 10ms --- (STAND-BY OUT + DIAG ENABLE) --- 500 ms (min) --- MUTING OUT
TURN-OFF: MUTING IN --- 20 ms --- (DIAG DISABLE + STAND-BY IN) --- 10ms --- PIN2 = 0
Car Radio Installation: PIN2 > 7V --- 10ms DIAG ENABLE (write) --- 200 ms --- I2C read (repeat until All faults
disappear).
OFFSET TEST: Device in Play (no signal) -- OFFSET ENABLE - 30ms - I2C reading (repeat I2C reading until
high-offset message disappears).
FAST MUTING
The muting time can be shortened to less than 1ms by setting (IB2) D5 = 1. This option can be useful in transient
battery situations (i.e. during car engine cranking) to quickly turnoff the amplifier for avoiding any audible effects
caused by noise/transients being injected by preamp stages.
10/17
TDA7562
I2C BUS INTERFACE
Data transmission from microprocessor to the TDA7562 and viceversa takes place through the 2 wires I2C BUS interface, consisting of the two lines SDA and SCL (pull-up resistors to positive supply voltage must be connected).
Data Validity
As shown by fig. 16, the data on the SDA line must be stable during the high period of the clock. The HIGH and
LOW state of the data line can only change when the clock signal on the SCL line is LOW.
Start and Stop Conditions
As shown by fig. 17 a start condition is a HIGH to LOW transition of the SDA line while SCL is HIGH. The stop
condition is a LOW to HIGH transition of the SDA line while SCL is HIGH.
Byte Format
Every byte transferred to the SDA line must contain 8 bits. Each byte must be followed by an acknowledge bit.
The MSB is transferred first.
Acknowledge
The transmitter* puts a resistive HIGH level on the SDA line during the acknowledge clock pulse (see fig. 18).
The receiver** the acknowledges has to pull-down (LOW) the SDA line during the acknowledge clock pulse, so
that the SDAline is stable LOW during this clock pulse.
* Transmitter
– master (P) when it writes an address to the TDA7562
– slave (TDA7562) when the P reads a data byte from TDA7562
** Receiver
– slave (TDA7562) when the P writes an address to the TDA7562
– master (P) when it reads a data byte from TDA7562
Figure 16. Data Validity on the I2CBUS
SDA
SCL
DATA LINE
STABLE, DATA
VALID
CHANGE
DATA
ALLOWED
D99AU1031
Figure 17. Timing Diagram on the I2CBUS
SCL
I2CBUS
SDA
D99AU1032
START
STOP
Figure 18. Acknowledge on the I2CBUS
SCL
1
2
3
7
8
9
SDA
MSB
START
D99AU1033
ACKNOWLEDGMENT
FROM RECEIVER
11/17
TDA7562
SOFTWARE SPECIFICATIONS
All the functions of the TDA7562 are activated by I2C interface.
The bit 0 of the "ADDRESS BYTE" defines if the next bytes are write instruction (from P to TDA7562) or read
instruction (from TDA7562 to P).
Chip Address:
D7
D0
1
1
0
1
1
X = 0 Write to device
X = 1 Read from device
If R/W = 0, the P sends 2 "Instruction Bytes": IB1 and IB2.
IB1
D7
X
D6
Diagnostic enable (D6 = 1)
Diagnostic defeat (D6 = 0)
D5
Offset Detection enable (D5 = 1)
Offset Detection defeat (D5 = 0)
D4
Front Channel
Gain = 30dB (D4 = 0)
Gain = 16dB (D4 = 1)
D3
Rear Channel
Gain = 30dB (D3 = 0)
Gain = 16dB (D3 = 1)
D2
Mute front channels (D2 = 0)
Unmute front channels (D2 = 1)
D1
Mute rear channels (D1 = 0)
Unmute rear channels (D1 = 1)
D0
CD 2% (D0 = 0)
CD 10% (D0 = 1)
D7
X
D6
used for testing
D5
Normal muting time (D5 = 0)
Fast muting time (D5 = 1)
D4
Stand-by on - Amplifier not working - (D4 = 0)
Stand-by off - Amplifier working - (D4 = 1)
D3
Power amplifier mode diagnostic (D3 = 0)
Line driver mode diagnostic (D3 = 1)
D2
X
D1
X
D0
X
IB2
12/17
0
0
X
D8 Hex
TDA7562
If R/W = 1, the TDA7562 sends 4 "Diagnostics Bytes" to P: DB1, DB2, DB3 and DB4.
DB1
D7
Thermal warning active (D7 = 1)
D6
Diag. cycle not activated or not terminated (D6 = 0)
Diag. cycle terminated (D6 = 1)
D5
X
D4
X
D3
Channel LF
Normal load (D3 = 0)
Short load (D3 = 1)
D2
Channel LF
No output offset (D2 = 0)
Output offset detection (D2 = 1)
D1
Channel LF
No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
D0
Channel LF
No short to GND (D1 = 0)
Short to GND (D1 = 1)
D7
Offset detection not activated (D7 = 0)
Offset detection activated (D7 = 1)
D6
X
D5
X
D4
X
D3
Channel LR
Normal load (D3 = 0)
Short load (D3 = 1)
D2
Channel LR
No output offset (D2 = 0)
Output offset detection (D2 = 1)
D1
Channel LR
No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
D0
Channel LR
No short to GND (D1 = 0)
Short to GND (D1 = 1)
DB2
13/17
TDA7562
B3
D7
Stand-by status (= IB1 - D4)
D6
Diagnostic status (= IB1 - D6)
D5
X
D4
Channel RF
Turn-on diagnostic (D4 = 0)
X
D3
Channel RF
Normal load (D3 = 0)
Short load (D3 = 1)
D2
Channel RF
No output offset (D2 = 0)
Output offset detection (D2 = 1)
D1
Channel RF
No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
D0
Channel RF
No short to GND (D1 = 0)
Short to GND (D1 = 1)
D7
X
D6
X
D5
X
D4
X
D3
Channel RR
RNormal load (D3 = 0)
Short load (D3 = 1)
D2
Channel RR
No output offset (D2 = 0)
Output offset detection (D2 = 1)
D1
Channel RR
No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
D0
Channel RR
No short to GND (D1 = 0)
Short to GND (D1 = 1)
DB4
14/17
TDA7562
Examples of bytes sequence
1 - Turn-On of the power amplifier with 30dB gain, mute on, diagnostic defeat, CD = 2%.
Start
Address byte with D0 = 0
ACK
IB1
ACK
X0000000
IB2
ACK
STOP
ACK
STOP
ACK
STOP
XXX1XX11
2 - Turn-Off of the power amplifier
Start
Address byte with D0 = 0
ACK
IB1
ACK
X0XXXXXX
IB2
XXX0XXXX
3 - Offset detection procedure enable
Start
Address byte with D0 = 0
ACK
IB1
ACK
XX1XX11X
IB2
XXX1XXXX
4 - Offset detection procedure stop and reading operation (the results are valid only for the offset detection bits
(D2 of the bytes DB1, DB2, DB3, DB4).
Start
■
■
Address byte with D0 = 1
ACK
DB1
ACK
DB2
ACK
DB3
ACK
DB4
ACK
STOP
The purpose of this test is to check if a D.C. offset (2V typ.) is present on the outputs, produced by input
capacitor with anomalous leackage current or humidity between pins.
The delay from 4 to 5 can be selected by software, starting from T.B.D. ms
15/17
TDA7562
DIM.
MIN.
4.45
1.80
A
B
C
D
E
F (1)
G
G1
H (2)
H1
H2
H3
L (2)
L1
L2 (2)
L3
L4
L5
M
M1
N
O
R
R1
R2
R3
R4
V
V1
V2
V3
0.75
0.37
0.80
25.75
28.90
22.07
18.57
15.50
7.70
3.70
3.60
mm
TYP.
4.50
1.90
1.40
0.90
0.39
1.00
26.00
29.23
17.00
12.80
0.80
22.47
18.97
15.70
7.85
5
3.5
4.00
4.00
2.20
2
1.70
0.5
0.3
1.25
0.50
MAX.
4.65
2.00
MIN.
0.175
0.070
1.05
0.42
0.57
1.20
26.25
29.30
0.029
0.014
0.031
1.014
1.139
22.87
19.37
15.90
7.95
0.869
0.731
0.610
0.303
4.30
4.40
0.145
0.142
inch
TYP.
0.177
0.074
0.055
0.035
0.015
0.040
1.023
1.150
0.669
0.503
0.031
0.884
0.747
0.618
0.309
0.197
0.138
0.157
0.157
0.086
0.079
0.067
0.02
0.12
0.049
0.019
MAX.
0.183
0.079
OUTLINE AND
MECHANICAL DATA
0.041
0.016
0.022
0.047
1.033
1.153
0.904
0.762
0.626
0.313
0.169
0.173
5˚ (Typ.)
3˚ (Typ.)
20˚ (Typ.)
45˚ (Typ.)
Flexiwatt27 (vertical)
(1): dam-bar protusion not included
(2): molding protusion included
V
C
B
V
H
H1
V3
A
H2
O
H3
R3
L4
R4
V1
R2
L2
N
L3
R
L
L1
V1
V2
R2
D
R1
L5
Pin 1
R1
R1
E
G
G1
F
FLEX27ME
M
M1
7139011
AG00601v1
16/17
TDA7562
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE
SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B)
AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS
OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS
AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS
EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY
DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE
DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2013 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
DocID8328 Rev 5
17/17