TMM6263FILM

TMM 6263 ® SMALL SIGNAL SCHOTTKY DIODE DESCRIPTION Metal to silicon junction diode featuring high breakdown, low turn-on voltage and ultrafast switching. Primarly intended for high level UHF/VHF detection and pulse application with broad dynamic range. MINIMELF (Glass) ABSOLUTE MAXIMUM RATINGS (limiting values) Symbol VRRM Parameter Repetitive Peak Reverse Voltage Value Unit 60 V Forward Continuous Current Ti = 25 °C 15 mA IFSM Surge non Repetitive Forward Current tp ≤ 1s 50 mA Tstg Tj Storage and Junction Temperature Range - 65 to 200 -65 to 200 °C TL Maximum Temperature for Soldering during 15s 260 °C Value Unit 400 °C/W IF THERMAL RESISTANCE Symbol Rth(j-l) Test Conditions Junction-leads ELECTRICAL CHARACTERISTICS STATIC CHARACTERISTICS Symbol Test Conditions Min. Typ. Max. 60 Unit V VBR Tamb = 25°C IR = 10µA VF* Tamb = 25°C IF = 1mA 0.41 Tamb = 25°C IF = 15mA 1 Tamb = 25°C VR = 50V 0.2 µA Max. Unit IR* V DYNAMIC CHARACTERISTICS Symbol Test Conditions Min. Typ. C Tamb = 25°C VR = 0V f = 1MHz 2.2 pF τ Tamb = 25°C IF = 5mA Krakauer Method 100 ps * Pulse test: tp ≤ 300µs δ < 2%. Matched batches available on request. Test conditions (forward voltage and/or capacitance) according to customer specification. August 1999 Ed: 1A 1/3 TMM 6263 Figure 1. Forward current versus forward voltage (typical values). Figure 2. Capacitance C versus reverse applied voltage VR (typical values). Figure 3. Reverse current versus ambient temperature. Figure 4. Reverse current versus continuous reverse voltage (typical values). 2/3 TMM 6263 PACKAGE MECHANICAL DATA MINIMELF Glass DIMENSIONS A REF. /B O Min. Typ. A 3.30 B 1.59 C 0.40 D C C Millimeters Inches Max. Min. 3.40 3.6 0.130 0.134 0.142 1.60 1.62 0.063 0.063 0.064 0.45 0.50 0.016 0.018 0.020 1.50 Typ. Max. 0.059 FOOT PRINT DIMENSIONS (Millimeter) 2 2.5 5 Marking: ring at cathode end. Weight: 0.05g Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 3/3