TMMBAT46FILM

TMMBAT 46 ® SMALL SIGNAL SCHOTTKY DIODE MINIMELF (Glass) DESCRIPTION General purpose, metal to silicon diode featuring high breakdown voltage low turn-on voltage. ABSOLUTE RATINGS (limiting values) Symbol VRRM Parameter Repetitive Peak Reverse Voltage Value Unit 100 V Forward Continuous Current Tl = 25 °C 150 mA IFRM Repetitive Peak Fordware Current tp ≤ 1s δ ≤ 0.5 350 mA IFSM Surge non Repetitive Forward Current tp = 10ms 750 mA Ptot Power Dissipation Tl = 80 °C 150 mW Tstg Tj Storage and Junction Temperature Range - 65 to + 150 - 65 to + 125 °C °C TL Maximum Temperature for Soldering during 15s 260 °C Value Unit 300 °C/W IF THERMAL RESISTANCE Symbol Rth(j-l) Test Conditions Junction-leads August 1999 Ed: 1A 1/4 TMMBAT 46 ELECTRICAL CHARACTERISTICS STATIC CHARACTERISTICS Symbol Test Conditions Min. Typ. Max. 100 Tj = 25°C IR = 100µA VF* Tj = 25°C IF = 0.1mA 0.25 Tj = 25°C IF = 10mA 0.45 Tj = 25°C IF = 250mA Tj = 25°C VR = 1.5V IR* Unit V VBR V 1 0.5 µA 5 Tj = 60°C VR = 10V Tj = 25°C 0.8 7.5 Tj = 60°C VR = 50V Tj = 25°C 2 15 Tj = 60°C VR = 75V Tj = 25°C 5 20 Tj = 60°C DYNAMIC CHARACTERISTICS Symbol C Test Conditions Tj = 25°C VR = 0V Tj = 25°C VR = 1V Min. f = 1MHz Typ. 10 Max. Unit pF 6 * Pulse test: tp ≤ 300µs δ < 2%. Figure 1. Forward current versus forward voltage at different temperatures (typical values). 2/4 Figure 2. Forward current versus forward voltage (typical values). TMMBAT 46 Figure 3. Reverse current versus junction temperature (typical values). Figure 4. Reverse current versus continuous reverse voltage. Figure 5. Forward current versus forward voltage (typical values). 3/4 TMMBAT 46 PACKAGE MECHANICAL DATA MINIMELF Glass DIMENSIONS REF. A /B O C C Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 3.30 3.40 3.6 0.130 0.134 0.142 B 1.59 1.60 1.62 0.063 0.063 0.064 C 0.40 0.45 0.50 0.016 0.018 0.020 D 1.50 0.059 FOOT PRINT DIMENSIONS (Millimeter) 2 2.5 5 Marking: ring at cathode end. Weight: 0.05g Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 4/4