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TN1515-600B

TN1515-600B

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO252-3

  • 描述:

    IC SCR 15A 600V DPAK

  • 数据手册
  • 价格&库存
TN1515-600B 数据手册
TN1515-600B Standard 15 A SCRs Datasheet - production data Description $ The TN1515-600B is a 15 A thyristor SCR housed in DPAK package. It fits any high voltage application that requires a high power density and compact housing design. * Table 1. Device summary . $ . Symbol Value Unit IT(RMS) 15 A VDRM/VRRM 600 V IGT (Q1) 15 mA $ * '3$. Features • On-state RMS current, IT(RMS): 15 A • Repetitive peak off-state voltage, VDRM/VRRM: 600 V • Triggering gate current, IGT: 15 mA • DPAK surface mount package Application • Universal motor DC phase control • Power supply crowbar circuit • Power Supply inrush limiter • Motor soft start controller • AC-DC voltage regulator Benefits • High AC surge current density • Compact DPAK foot print September 2015 This is information on a product in full production. DocID12231 Rev 3 1/8 www.st.com Characteristics 1 TN1515-600B Characteristics Table 2. Absolute ratings (limiting values) Symbol IT(RMS) Parameter Value Unit On-state RMS current (180° conduction angle) Tc = 109 °C 15 A IT(AV) Average on-state current (180° conduction angle) Tc = 109 °C 9.5 A ITSM Non repetitive surge peak on-state current tp = 8.3 ms I2t value for fusing tp = 10 ms Tj = 25 °C 113 A2S dI/dt Critical rate of rise of on-state current IG = 2 x IGT, tr ≤ 100 ns F = 120 Hz Tj = 125 °C 50 A/µs IGM Peak gate current tp = 20 µs Tj = 125 °C 4 A Tj = 125 °C 1 W I2t PG(AV) tp = 10 ms Average gate power dissipation 165 Tj = 25 °C A 150 Tstg Tj Storage junction temperature range Operating junction temperature range - 40 to + 150 - 40 to + 125 °C VRGM Maximum peak reverse gate voltage 5 V Table 3. Standard electrical characteristics (Tj = 25 °C, unless otherwise specified) Symbol IGT Vout = 12 V, RL = 33 Ω VGT Vout = 12 V, RL = 33 Ω VGD VD = VDRM, RL = 3.3 kΩ Values Tj = 25 °C Tj = 125 °C Unit MIN. 2 MAX. 15 MAX. 1.3 V MIN. 0.2 V mA IH IT = 500 mA MAX. 40 mA IL IG = 1.2 IGT MAX. 60 mA dV/dt VD = 67% VDRM, gate open Tj =125 °C MIN. 200 V/µs VTM ITM = 30 A Tj = 25 °C MAX. 1.6 V VTO Threshold voltage Tj = 125 °C MAX. 0.85 V RD Dynamic resistance Tj = 125 °C MAX. 25 mΩ 5 µA 2 mA IDRM IRRM 2/8 Test conditions tp = 380 µs VD/VR = VDRM = VRRM Tj = 25 °C Tj = 125 °C DocID12231 Rev 3 MAX. TN1515-600B Characteristics Table 4. Thermal resistance Symbol Parameter Value Unit 1.2 °C/W 70 °C/W Junction to case (DC) Rth(j-c) Junction to ambient Rth(j-a) S (1) = 0.5 cm 2 1. S = Copper surface under tab Figure 1. Maximum average power dissipation versus average on-state current Figure 2. Average and DC on-state current versus case temperature P(W) IT(AV) (A) 14 16 α=180° 12 14 10 12 8 10 D.C. α=180° 8 6 6 4 4 360° 2 2 I T(AV) (A) 0 TC (°C) 0 0 1 2 3 4 5 6 7 8 9 10 Figure 3. Average and DC on-state current versus ambient temperature, PCB FR4, copper thickness 35 µm 0 25 50 75 100 125 Figure 4. Thermal impedance junction to ambient versus pulse duration, PCB FR4, copper thickness 35 µm Zth( j-a) (°C/W) IT(AV) (A) 100 2.5 SCU= 0.5 cm² SCU=0.5cm² α=180° 2.0 1.5 D.C. 10 1.0 0.5 T amb (°C) 0.0 0 25 50 75 100 125 1 1.E-03 DocID12231 Rev 3 t P (s) 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 3/8 8 Characteristics TN1515-600B Figure 5. Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) Figure 6. Surge peak on-state current versus number of cycles ITSM (A) IGT, IH, IL [T j] / IGT, IH, IL [T j=25°C] 2.4 180 2.2 160 2.0 IGT 1.8 140 1.6 1.4 1.2 tp=10ms Non repetitive Tj initial=25°C One cycle 120 100 I H & IL 1.0 80 0.8 60 0.6 Repetitive TC=109°C 40 0.4 20 Tj(°C) 0.2 0.0 Number of cycles 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100110120130 1 Figure 7. Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms 10 100 1000 Figure 8. On-state characteristics (maximum values) ITM (A) ,760 $ 100.0 ( 7M LQLWLDO ƒ& G,GW OLPLWDWLRQ 10.0 Tj=125°C ( Tj=25°C ,760 1.0 (  W 3 PV Tj max. : Vto = 0.85 V RD = 25 mΩ VTM (V)   0.1 0.0  0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Figure 9. Junction to ambient thermal resistance versus copper surface under tab, PCB FR4, copper thickness 35μm Rth(j-a) (°C/W) 100 80 60 40 20 SCU (cm²) 0 0 4/8 5 10 15 20 25 DocID12231 Rev 3 30 35 40 TN1515-600B 2 Package information Package information • Epoxy meets UL94, V0 • Lead-free packages • Halogen-free molding resin • Recommended torque: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 DPAK package information Figure 10. DPAK package outline $ ( E F / ' ' + $ ( / H E H F $ Note: ' 9 / This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID12231 Rev 3 5/8 8 Package information TN1515-600B Table 5. DPAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 2.18 2.40 0.086 0.0944 A1 0.9 1.10 0.035 0.0433 A2 0.03 0.23 0.0011 0.0090 b 0.64 0.90 0.0251 0.0354 b4 4.95 5.46 0.1948 0.2149 c 0.46 0.61 0.0181 0.0240 c2 0.46 0.60 0.0181 0.0236 D 5.97 6.22 0.2350 0.2448 D1 4.95 E 6.35 E1 4.32 0.1948 6.73 0.2500 0.2649 0.1700 e 2.286 0.09 e1 4.572 0.18 H 9.35 10.40 0.3681 0.4094 L 1.0 1.78 0.039 0.0700 L2 1.27 0.0500 L4 0.6 1.02 0.023 0.0401 V2 -8° +8° -8° +8° Figure 11. Footprint (dimensions in mm)      % 7KHGHYLFHPXVWEHSRVLWLRQHGZLWKLQ Note: 6/8 $   $ % This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID12231 Rev 3 TN1515-600B 3 Ordering information Ordering information Figure 12. Ordering information schema 71% 75 6&5VHULHV 506&XUUHQW  $ 6HQVLWLYLW\  P$ 9ROWDJH   9 3DFNDJH % '3$. 3DFNLQJPRGH %ODQN 7XEH 75 7DSHDQGUHHO Table 6. Ordering information Order code 4 Marking Package Weight Base qty Delivery mode TN1515-600B TN15 15600 DPAK 0.3 g 75 Tube TN1515-600B-TR TN15 15600 DPAK 0.3 g 2500 Tape and reel Revision history Table 7. Document revision history Date Revision Changes 13-Mar-2006 1 Last update. 11-Jul-2007 2 TO-220AB delivery mode changed from bulk to tube. 21-Sep-2015 3 Updated Features, Application, Description and Benefits on cover page.Updated Figure 7, package information and reformatted to current standard. DocID12231 Rev 3 7/8 8 TN1515-600B IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 8/8 DocID12231 Rev 3
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