TN6050-12PI
Datasheet
60 A, 1200 V standard SCR
Features
A
G
K
K
A
•
Max. Repetitive Blocking Voltage = VDRM, VRRM = 1200 V
•
IGT maximum = 50 mA
•
High static and dynamic commutation:
–
dI/dt = 100 A/µs
–
dV/dt = 2000 V/µs
•
•
ECOPACK®2 component (RoHS and HF compliance)
Complies with UL 1557 standard (File ref : E81734)
Applications
G
TOP3 Isolated
•
•
•
•
•
•
•
•
•
•
•
•
Product status
TN6050-12PI
Product summary
Order code
TN6050-12PI
Package
TOP3 isolated
IT(RMS)
60 A
VDRM/VRRM
1200 V
IGT
50 mA
Solar / Wind renewable energy inverters and rectifiers
Solid state relay (SSR)
Uninterruptible power supply (UPS)
Industrial SMPS
Bypass
AC DC inrush current limiter (ICL)
Battery charger
AC DC voltage controlled rectifier
Industrial welding systems
Off board automotive battery charger
Soft starter
Heating systems
Description
The TN6050-12PI SCR is suitable in industrial applications where high immunity is
required with a lower gate current and ceramic isolated tab, UL1557 certified rated at
2.5 kV RMS and UL94-V0 resin compliance.
Available in through-hole high power package TOP3 isolated tab.
DS12874 - Rev 1 - December 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
TN6050-12PI
Characteristics
1
Characteristics
Table 1. Absolute maximum ratings (limiting values)
Symbol
Parameter
IT(RMS)
Value
On-state RMS current (180 ° conduction angle)
60
Tc = 82.2 °C
IT(AV)
Average on-state current (180 ° conduction angle)
ITSM
Non repetitive surge peak on-state current ( Tj initial = 25 °C)
Unit
A
38
tp = 8.3 ms
763
tp = 10 ms
700
I2t value for fusing
tp = 10 ms
2450
A2s
dl/dt
Critical rate of rise of on-state current
IG = 100 mA, dIg/dt = 1 A/µs
Tj = 25 °C
100
A/µs
IGM
Maximum peak positive gate current
8
A
VGM
Maximum peak positive gate voltage
5
V
1
W
V
I2t
tp = 20 µs
Tj = 125 °C
PG(AV)
Average gate power dissipation
VRGM
Maximum peak reverse gate voltage
3.5
Tstg
Storage junction temperature range
-40 to +150
Operating junction temperature range
-40 to +125
Tj
Tj = 125 °C
A
°C
Table 2. Electrical characteristics (Tj = 25 °C unless otherwise specified)
Symbol
IGT
Test conditions
Value
VD = 12 V, RL = 33 Ω
VGT
Min.
8
Max.
50
Max.
1.3
V
Min.
0.2
V
mA
VGD
VD = VDRM, RL = 3.3 kΩ
IH
IT = 500 mA, gate open
Max.
100
mA
IL
IG = 1.2 x IGT
Max.
130
mA
Min.
2000
V/µs
Typ.
2
µs
Typ.
100
µs
dV/dt
Tj = 125 °C
Unit
VD = 67% VDRM, gate open
Tj = 125 °C
tgt
IT = 50 A, VD = VDRM, IG = 200 mA, (dIG/dt) max = 0.2 A/µs
tq
ITM = 50 A, VD = 800 V, dlTM/dt = 30 A/µs, VR = 75 V, dVD/dt = 20 V/µs
Tj = 125 °C
Table 3. Static characteristics
Symbol
Value
Unit
VTM
ITM = 120 A, tp = 380 µs
Tj = 25 °C
Max.
1.75
VTO
Threshold voltage
Tj = 125 °C
Max.
0.93
RD
Dynamic resistance
Tj = 125 °C
Max.
7.1
mΩ
10
µA
6.5
mA
IDRM, IRRM
DS12874 - Rev 1
Test conditions
VDRM = VRRM = 1200 V
Tj = 25 °C
Tj = 125 °C
Max.
V
page 2/11
TN6050-12PI
Characteristics
Table 4. Thermal parameters
Symbol
DS12874 - Rev 1
Parameter
Rth(j-c)
Junction to case (DC)
Rth(j-a)
Junction to ambient (DC)
Value
Typ.
0.70
50
Unit
°C/W
page 3/11
TN6050-12PI
Characteristics (curves)
1.1
Characteristics curves
Figure 1. Maximum average power dissipation versus
average on-state current
Figure 2. Average and DC on-state current versus case
temperature
P(W)
65
65
α = 180 °
60
DC
α = 90 °
50
55
50
α = 60 °
45
DC
60
α = 120 °
55
IT(AV) (A)
45
40
α = 180 °
35
35
30
30
α = 120 °
α = 90 °
α = 30 °
40
25
25
15
5
10
5
10
15
20
25
30
35
40
45
0
0
50
Figure 3. On-state characteristics (maximum values)
1000
Tc(°C)
5
IT(AV) (A)
α
0
α = 30 °
15
360 °
10
0
α = 60 °
20
20
25
75
100
125
Figure 4. Average and D.C. on-state current versus
ambient temperature
ITM(A)
I
T(AV)
(A)
3.0
2.5
100
DC
2.0
α = 180 °
Tj max:
Vt0 = 0.93 V
Rd = 7.1 mΩ
10
1.5
1.0
Tj = 125 °C
1
50
0.0
0.5
Tj = 25 °C
1.0
1.5
2.0
0.5
VTM(V)
2.5
3.0
3.5
4.0
4.5
Figure 5. Relative variation of thermal impedance junction
to case and junction to ambient versus pulse duration
1.0E+00
0.0
0
Zth(j-a)
1.0E-01
tP(s)
1.0E-02
1.0E-03
DS12874 - Rev 1
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
50
75
100
125
Figure 6. Surge peak on-state current versus number of
cycles
K = [Z / R ]
th th
Zth(j-c)
25
750
700
650
600
550
500
450
400
350
300
250
200
150
100
50
0
ITSM(A)
Non repetitive Tj = 25 °C
tp=10ms
One cycle
Repetitive Tc = 82.2 °C
Number of cycles
1
10
100
1000
page 4/11
TN6050-12PI
Characteristics (curves)
Figure 7. Non repetitive surge peak on-state current for a
sinusoidal pulse with width tp < 10 ms
10000
Figure 8. Relative variation of gate trigger current and
gate trigger voltage versus junction temperature (typical
value)
ITSM(A)
dl/dt limitation: 100 A/µs
1.8
Tj initial = 25 °C
IGT, VGT [ Tj ] / IGT, VGT [ Tj = 25 °C]
IGT
1.5
ITSM
1000
1.3
VGT
1.0
0.8
100
0.5
tp(ms)
10
0.01
0.10
1.00
0.3
Tj(°C)
10.00
Figure 9. Relative variation of holding and latching
current versus junction temperature (typical value)
1.8
IH, IL [ Tj ] / IH, IL [ Tj = 25 °C]
0.0
-40
-20
0
20
40
60
80
100
120
Figure 10. Relative variation of static dV/dt immunity
versus junction temperature
6
dV/dt [T j] / dV/dt [T j=125 °C]
VD=VR=800 V
IH
1.5
5
1.3
4
IL
1.0
3
0.8
2
0.5
0.3
0.0
1
Tj(°C)
-40
-20
0
20
40
Tj(°C)
60
80
100
0
120
25
50
75
100
125
Figure 11. Relative variation of leakage current versus junction temperature for different values of
blocking voltage (typical values)
I
,I
[ T ;V
,V
]/I
/I
DRM RRM j DRM
RRM DRM RRM
1.0E+00
VDRM=VRRM=1000 V
VDRM=VRRM=1200 V
1.0E-01
1.0E-02
VDRM=VRRM=600 V
1.0E-03
Tj(°C)
1.0E-04
DS12874 - Rev 1
25
50
75
100
125
page 5/11
TN6050-12PI
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1
TOP3 Isolated package information
•
•
•
•
DS12874 - Rev 1
ECOPACK® (Lead-free plating and Halogen free package compliance)
Lead-free package leads finishing
Halogen-free molding compound resin meets UL94 standard level V0
Recommended torque: 1.05 N·m (max. torque: 1.2 N·m)
page 6/11
TN6050-12PI
TOP3 Isolated package information
Figure 12. TOP3 Isolated package outline
DS12874 - Rev 1
page 7/11
TN6050-12PI
TOP3 Isolated package information
Table 5. TOP3 Isolated mechanical data
Dimensions
Ref.
Inches(1)
mm
Min.
Typ.
Max.
Min.
Typ.
Max.
A
4.40
4.60
0.1732
0.1811
B
1.45
1.55
0.0571
0.0610
C
14.35
15.60
0.5650
0.6142
D
0.50
0.70
0.0197
0.0276
E
2.70
2.90
0.1063
0.1142
F
15.80
16.50
0.6220
0.6496
G
20.40
21.10
0.8031
0.8307
H
15.10
15.50
0.5945
0.6102
J
5.40
5.65
0.2126
0.2224
K
3.40
3.65
0.1339
0.1437
L
4.08
4.17
0.1606
0.1642
M
1.20
1.40
0.0472
0.0551
R
4.60
0.1811
1. Inches given for reference only
DS12874 - Rev 1
page 8/11
TN6050-12PI
Ordering information
3
Ordering information
Figure 13. Ordering information scheme
TN 60 50
-
12
PI
Series
TN = SCR
RMS current
60 = 60 A
Gate current
50 = 50 mA
Voltage
12 = 1200 V
Package
PI = TOP3 Isolated
Table 6. Ordering information
DS12874 - Rev 1
Order code
Marking
Package
Weight
Base qty.
Delivery mode
TN6050-12PI
TN605012PI
TOP3 Isolated
4.48 g
30
Tube
page 9/11
TN6050-12PI
Revision history
Table 7. Document revision history
DS12874 - Rev 1
Date
Revision
14-Dec-2018
1
Changes
Initial release.
page 10/11
TN6050-12PI
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
DS12874 - Rev 1
page 11/11
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