TN815-X00B

® TN8, TS8 and TYNx08 Series 8A SCRS A SENSITIVE & STANDARD Table 1: Main Features Symbol IT(RMS) VDRM/VRRM IGT Value 8 600 to 1000 0.2 to 15 Unit A V mA A G K A DESCRIPTION Available either in sensitive (TS8) or standard (TN8 / TYN) gate triggering levels, the 8A SCR series is suitable to fit all modes of control, found in applications such as overvoltage crowbar protection, motor control circuits in power tools and kitchen aids, inrush current limiting circuits, capacitive discharge ignition and voltage regulation circuits... Available in through-hole or surface-mount packages, they provide an optimized performance in a limited space area. KA G K A G DPAK (TN8-B / TS8-B) A IPAK (TN8-H / TS8-H) A K A G K A G TO-220AB (TS8-T) TO-220AB (TYNx08RG) Table 2: Order Codes Part Numbers TN805-x00B TN805-x00B-TR TN805-x00H TN815-x00B TN815-x00B-TR TN815-x00H TS820-x00B TS820-x00B-TR TS820-x00H TS820-x00T TYNx08RG Marking TN805x00 TN805x00 TN805x00 TN815x00 TN815x00 TN815x00 TS820x00 TS820x00 TS820x00 TS820x00T TYNx08 February 2006 REV. 5 1/10 TN8, TS8 and TYNx08 Series Table 3: Absolute Ratings (limiting values) Symbol IT(RMS) IT(AV) ITSM I²t dI/dt IGM PG(AV) Tstg Tj VRGM Parameter RMS on-state current (180° conduction angle) Tc = 110°C Value TS8/TN8 8 5 73 70 24.5 50 4 1 - 40 to + 150 - 40 to + 125 5 100 95 45 A A 2S A/µs A W °C V TYN08 Unit A A Average on-state current (180° conduction angle) Tc = 110°C Non repetitive surge peak onstate current I²t Value for fusing tp = 8.3 ms tp = 10 ms tp = 10 ms Tj = 25°C Tj = 25°C Tj = 125°C Tj = 125°C Tj = 125°C Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 60 Hz Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range tp = 20 µs Maximum peak reverse gate voltage (for TN8 & TYN08 only) Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified) ■ SENSITIVE Test Conditions VD = 12 V VD = VDRM IRG = 10 µA IT = 50 mA IG = 1 mA ITM = 16 A RGK = 1 kΩ RGK = 1 kΩ RGK = 220 Ω Tj = 125°C Tj = 25°C Tj = 125°C Tj = 125°C Tj = 25°C Tj = 125°C tp = 380 µs RL = 140 Ω RL = 3.3 kΩ RGK = 220 Ω Tj = 125°C MAX. MAX. MIN. MIN. MAX. MAX. MIN. MAX. MAX. MAX. MAX. TS820 200 0.8 0.1 8 5 6 5 1.6 0.85 46 5 1 Unit µA V V V mA mA V/µs V V mΩ µA mA IGT VGT VGD VRG IH IL dV/dt VTM Vt0 Rd IDRM IRRM Symbol VD = 65 % VDRM Threshold voltage Dynamic resistance VDRM = VRRM RGK = 220 Ω 2/10 TN8, TS8 and TYNx08 Series ■ STANDARD Test Conditions MIN. VD = 12 V VD = VDRM IT = 100 mA IG = 1.2 IGT VD = 67 % VDRM ITM = 16 A Gate open Tj =125°C Tj = 25°C Tj = 125°C Tj = 125°C Tj = 25°C Tj = 125°C RL = 33 Ω RL = 3.3 kΩ Gate open Tj = 125°C MAX. MAX. MIN. MAX. MAX. MIN. MAX. MAX. MAX. MAX. 25 30 50 TN805 0.5 5 TN815 TYNx08 2 15 1.3 0.2 40 50 150 1.6 0.85 46 5 2 30 70 150 2 15 Unit mA V V mA mA V/µs V V mΩ µA mA Symbol IGT VGT VGD IH IL dV/dt VTM Vt0 Rd IDRM IRRM tp = 380 µs Threshold voltage Dynamic resistance VDRM = VRRM Table 6: Thermal resistance Symbol Rth(j-c) Junction to case (D.C.) S = 0.5 cm² Rth(j-a) Junction to ambient (D.C.) DPAK IPAK TO-220AB S = Copper surface under tab. Parameter Value 20 70 100 60 Unit °C/W °C/W Figure 1: Maximum average power dissipation versus average on-state current P(W) 8 7 6 5 4 3 360° α = 180° Figure 2: Average and D.C. on-state current versus case temperature IT(AV)(A) 10.0 D.C. 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 α = 180° 2 1 0 0 1 2 3 4 5 6 IT(AV)(A) α 1.0 0.0 0 25 50 Tcase(°C) 75 100 125 3/10 TN8, TS8 and TYNx08 Series Figure 3: Average and D.C. on-state current versus ambient temperature (device mounted on FR4 with recommended pad layout) (DPAK) IT(AV)(A) 2.0 1.8 1.6 D.C. Figure 4: Relative variation of thermal impedance junction to case versus pulse duration K=[Zth(j-c)/Rth(j-c)] 1.0 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 25 50 75 100 125 α = 180° 0.5 0.2 Tamb(°C) tp(s) 0.1 1E-3 1E-2 1E-1 1E+0 Figure 5: Relative variation of thermal impedance junction to ambient versus pulse duration (recommended pad layout, FR4 PC board for DPAK) K=[Zth(j-a)/Rth(j-a)] 1.00 Figure 6: Relative variation of gate trigger current and holding current versus junction temperature for TS8 series IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 2.0 1.8 IGT 1.6 1.4 DPAK 1.2 0.10 TO-220AB / IPAK 1.0 0.8 0.6 0.4 IH & IL RGK = 1kΩ tp(s) 0.01 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 0.2 0.0 -40 -20 0 20 Tj(°C) 40 60 80 100 120 140 Figure 7: Relative variation of gate trigger current and holding current versus junction temperature for TN8 & TYN08 series IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 0 20 40 60 80 100 120 140 IH & IL IGT Figure 8: Relative variation of holding current versus gate-cathode resistance (typical values) for TS8 series IH[RGK] / IH[RGK=1kΩ] 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 Tj = 25°C Tj(°C) 1.0 0.5 0.0 1E-2 1E-1 RGK(kΩ) 1E+0 1E+1 4/10 TN8, TS8 and TYNx08 Series Figure 9: Relative variation of dV/dt immunity versus gate-cathode resistance (typical values) for TS8 series dV/dt[RGK] / dV/dt[RGK=220Ω] 10.00 Tj = 125°C VD = 0.67 x VDRM Figure 10: Relative variation of dV/dt immunity versus gate-cathode capacitance (typical values) for TS8 series dV/dt[CGK] / dV/dt[RGK=220Ω] 15.0 VD = 0.67 x VDRM Tj = 125°C RGK = 220Ω 12.5 1.00 10.0 7.5 0.10 5.0 2.5 RGK(kΩ) 0.01 0 200 400 600 800 1000 1200 1400 1600 1800 2000 CGK(nF) 0.0 0 20 40 60 80 100 120 140 160 180 200 220 Figure 11: Surge peak on-state current versus number of cycles Figure 12: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding values of I²t ITSM(A), I t (A s) 1000 Tj initial = 25°C 2 2 ITSM(A) 100 90 80 70 60 50 40 TN8 / TS8 Non repetitive Tj initial=25°C TYN08 tp=10ms One cycle ITSM TYN08 dI/dt limitation TN8 / TS8 100 TYN08 30 20 10 0 1 Repetitive TC=110°C I2t TN8 / TS8 Number of cycles 10 10 100 1000 tp(ms) 0.01 0.10 1.00 10.00 Figure 13: On-state characteristics (maximum values) Figure 14: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board FR4, copper thickness: 35µm) (DPAK) Rth(j-a)(°C/W) 100 ITM(A) 50.0 Tj max.: Vt0=0.85V Rd=46mΩ 80 10.0 Tj=max 60 1.0 Tj=25°C 40 20 VTM(V) 0.1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 0 2 4 6 8 S(cm²) 10 12 14 16 18 20 5/10 TN8, TS8 and TYNx08 Series Figure 17: Ordering Information Scheme (TN8 series) TN 8 05 - 600 B (-TR) Standard SCR series Current 8 = 8A Sensitivity 05 = 5mA 15 = 15mA Voltage 600 = 600V 800 = 800V Package B = DPAK H = IPAK Packing mode Blanck = Tube -TR = Tape & Reel Figure 18: Ordering Information Scheme (TS8 series) TS 8 20 - 600 B (-TR) Sensitive SCR series Current 8 = 8A Sensitivity 20 = 200µA Voltage 600 = 600V 700 = 700V Package B = DPAK H = IPAK T = TO-220AB Packing mode Blanck = Tube -TR = Tape & Reel Figure 19: Ordering Information Scheme (TYN08 series) TYN Standard SCR series Voltage 6 = 600V 8 = 800V 10 = 100V Current 8 = 8A Packing mode RG = Tube 6 08 RG 6/10 TN8, TS8 and TYNx08 Series Table 7: Product Selector Part Numbers TN805-xxxB TN805-xxxH TN815-xxxB TN815-xxxH TS820-xxxB TS820-xxxH TS820-xxxT TYNx08RG Voltage (xxx) 600 V X X X X X X X X X X X X X 700 V 800 V X X X X 1000 V Sensitivity 5 mA 5 mA 15 mA 15 mA 0.2 mA 0.2 mA 0.2 mA 15 mA Package DPAK IPAK DPAK IPAK DPAK IPAK TO-220AB TO-220AB Figure 20: DPAK Package Mechanical Data REF. E B2 C2 L2 A D H L4 B G A1 C R R A2 0.60 MIN. V2 A A1 A2 B B2 C C2 D E G H L2 L4 V2 DIMENSIONS Millimeters Inches Min. Max Min. Max. 2.20 2.40 0.086 0.094 0.90 1.10 0.035 0.043 0.03 0.23 0.001 0.009 0.64 0.90 0.025 0.035 5.20 5.40 0.204 0.212 0.45 0.60 0.017 0.023 0.48 0.60 0.018 0.023 6.00 6.20 0.236 0.244 6.40 6.60 0.251 0.259 4.40 4.60 0.173 0.181 9.35 10.10 0.368 0.397 0.80 typ. 0.031 typ. 0.60 1.00 0.023 0.039 0° 8° 0° 8° Figure 21: DPAK Foot Print Dimensions (in millimeters) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 7/10 TN8, TS8 and TYNx08 Series Figure 22: IPAK Package Mechanical Data REF. A A1 A3 B B2 B3 B5 C C2 D E e G H L L1 L2 V1 DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 2.20 2.40 0.086 0.90 1.10 0.035 0.70 1.30 0.027 0.64 0.90 0.025 5.20 5.40 0.204 0.95 0.30 0.035 0.45 0.60 0.017 0.48 0.60 0.019 6 6.20 0.236 6.40 6.60 0.252 2.28 0.090 4.40 4.60 0.173 16.10 0.634 9 9.40 0.354 0.8 1.20 0.031 0.80 1 0.031 10° 10° A E B2 L2 C2 Max. 0.094 0.043 0.051 0.035 0.212 0.037 0.023 0.023 0.244 0.260 0.181 0.370 0.047 0.039 D H L L1 B3 B V1 A1 e G B5 C A3 Figure 23: TO-220AB Package Mechanical Data REF. H2 Dia L5 L7 L6 L2 F2 F1 L9 L4 F G1 G M E D C A A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 2.40 2.70 0.094 0.106 10 10.40 0.393 0.409 16.4 typ. 0.645 typ. 13 14 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151 8/10 TN8, TS8 and TYNx08 Series Figure 24: TO-220AB Package Mechanical Data REF. B ØI L F A I4 l3 a1 l2 c2 b2 C a2 M b1 e c1 A a1 a2 B b1 b2 C c1 c2 e F ØI I4 L l2 l3 M DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 15.20 15.90 0.598 3.75 0.147 13.00 14.00 0.511 10.00 10.40 0.393 0.61 0.88 0.024 1.23 1.32 0.048 4.40 4.60 0.173 0.49 0.70 0.019 2.40 2.72 0.094 2.40 2.70 0.094 6.20 6.60 0.244 3.75 3.85 0.147 15.80 16.40 16.80 0.622 0.646 2.65 2.95 0.104 1.14 1.70 0.044 1.14 1.70 0.044 2.60 0.102 Max. 0.625 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.661 0.116 0.066 0.066 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 8: Ordering Information Ordering type TN805-x00B TN805-x00B-TR TN805-x00H TN815-x00B TN815-x00B-TR TN815-x00H TS820-x00B TS820-x00B-TR TS820-x00H TS820-x00T TYNx08RG Note: x = voltage Marking TN805x00 TN805x00 TN805x00 TN815x00 TN815x00 TN815x00 TS820x00 TS820x00 TS820x00 TS820x00T TYNx08 Package DPAK DPAK IPAK DPAK DPAK IPAK DPAK DPAK IPAK TO-220AB TO-220AB Weight 0.3 g 0.3 g 0.4 g 0.3 g 0.3 g 0.4 g 0.3 g 0.3 g 0.4 g 2.3 g 2.3 g Base qty 75 2500 75 75 2500 75 75 2500 75 50 50 Delivery mode Tube Tape & reel Tube Tube Tape & reel Tube Tube Tape & reel Tube Tube Tube Table 9: Revision History Date Apr-2002 13-Feb-2006 Revision 4A 5 Last update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. 9/10 Description of Changes TN8, TS8 and TYNx08 Series Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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