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TS274AIPT

TS274AIPT

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TSSOP-14_5X4.4MM

  • 描述:

    IC OPAMP GP 4 CIRCUIT 14TSSOP

  • 数据手册
  • 价格&库存
TS274AIPT 数据手册
TS274 High performance CMOS quad operational amplifier Features ■ Output voltage can swing to ground ■ Excellent phase margin on capacitive loads ■ Gain bandwidth product: 3.5 MHz ■ Unity gain stable ■ Two input offset voltage selections DIP14 (Plastic package) Description SO-14 (Plastic micropackage) The TS274 devices are low cost, quad operational amplifiers designed to operate with single or dual supplies. These operational amplifiers use the ST silicon gate CMOS process giving an excellent consumption-speed ratio. These series are ideally suited for low consumption applications. TSSOP14 (Thin shrink small outline package) Three power consumptions are available thus offering the best consumption-speed ratio for your application: ■ ICC = 10 µA/amp: TS27L4 (very low power) ■ ICC = 150 µA/amp: TS27M4 (low power) ■ ICC = 1 mA/amp: TS274 (standard) Pin connections (top view) - - 13 Inverting Input 4 + + 12 Non-inverting Input 4 11 VCC - Non-inverting Input 2 5 + + 10 Non-inverting Input 3 Inverting Input 2 6 - - 9 Inverting Input 3 8 Output 3 Output 2 7 For enhanced features of TS274, in particular railto-rail capability and low offset voltage, two new Part number Inverting Input 1 2 Non-inverting Input 1 3 VCC + 4 These CMOS amplifiers offer very high input impedance and extremely low input currents. The major advantage versus JFET devices is the very low input currents drift with temperature (see Figure 5 on page 6). Table 1. 14 Output 4 Output 1 1 families, TSV91x and TSV99x will better suit low voltage applications. Enhanced related families VCC range (V) Rail-torail I/O Vio max (mV) Iib max (pA) Avd min (dB) ICC max (mA) GBP typ (MHz) SR typ (V/µs) TSV914 2.5 - 5.5 I/O 1.5/4.5 10 80 1.1 8 4.5 SO-14, TSSOP14 TSV994 2.5 - 5.5 I/O 1.5/4.5 10 80 1.1 20 (G ≥3) 10 SO-14, TSSOP14 February 2008 Rev 3 Packages 1/14 www.st.com 14 Absolute maximum ratings and operating conditions 1 TS274 Absolute maximum ratings and operating conditions Table 2. Absolute maximum ratings (AMR) Symbol VCC+ Vid Parameter TS274C/AC Supply voltage (1) Differential input voltage Unit 18 V ±18 V -0.3 to 18 V (2) (3) TS274I/AI Vin Input voltage Io Output current for VCC+ ≥ 15V ±30 mA Iin Input current ±5 mA Toper Operating free-air temperature range Tstg Storage temperature range Rthja Thermal resistance junction to ambient(4) SO-14 TSSOP14 DIP14 103 100 80 Rthjc Thermal resistance junction to case SO-14 TSSOP14 DIP14 31 32 33 °C/W HBM: human body model(5) 500 V 100 V 800 V ESD MM: machine 0 to +70 -40 to +125 °C -65 to +150 model(6) (7) CDM: charged device model °C °C/W 1. All values, except differential voltage are with respect to network ground terminal. 2. Differential voltages are the non-inverting input terminal with respect to the inverting input terminal. 3. The magnitude of the input and the output voltages must never exceed the magnitude of the positive supply voltage. 4. Short-circuits can cause excessive heating and destructive dissipation. Values are typical. 5. Human body model: A 100pF capacitor is charged to the specified voltage, then discharged through a 1.5kΩ resistor between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating. 6. Machine model: A 200pF capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5Ω). This is done for all couples of connected pin combinations while the other pins are floating. 7. Charged device model: all pins and the package are charged together to the specified voltage and then discharged directly to the ground through only one pin. This is done for all pins. Table 3. Operating conditions Symbol Value Unit Supply voltage 3 to 16 V Vicm Common mode input voltage range VCC+ V Toper Operating free-air temperature range TS274C TS274I VCC+ 2/14 Parameter 0 to - 1.5 0 to 70 -40 to 125 °C TS274 2 Block diagram and circuit schematics Block diagram and circuit schematics Figure 1. Block diagram VCC Current source xI Input differential Second stage Output stage Output VCC E E 3/14 4/14 T20 T19 T21 T 18 R2 T 25 VCC T 22 T 23 T 26 T29 T 28 T27 Input T3 T1 T5 T4 T2 C1 Input R1 T7 T6 T9 T8 T 13 T11 T 10 T 14 T 12 T16 Output T 15 Figure 2. T17 T24 VCC Block diagram and circuit schematics TS274 Schematic diagram (for 1/4 TS274) TS274 Electrical characteristics 3 Electrical characteristics Table 4. VCC+ = +10V, VCC-= 0V, Tamb = +25°C (unless otherwise specified) TS274C/AC Symbol Parameter Unit Min Vo = 1.4V, Vic = 0V TS274C/I TS274AC/AI Vio DVio Input offset voltage Typ 1.1 0.9 Tmin ≤ Tamb ≤ Tmax TS274C/I TS274AC/AI Max Min Typ 10 5 1.1 0.9 12 6.5 Input offset voltage drift 2 Iio Input offset current (1) Vic = 5V, Vo = 5V Tmin ≤ Tamb ≤ Tmax 1 Iib Input bias current (1) Vic = 5V, Vo = 5V Tmin ≤ Tamb ≤ Tmax 1 VOH High level output voltage Vid = 100mV, RL = 10kΩ Tmin ≤ Tamb ≤ Tmax VOL Low level output voltage Vid = -100mV Avd Large signal voltage gain ViC = 5V, RL = 10kΩ, Vo = 1V to 6V Tmin ≤ Tamb ≤ Tmax mV 12 6.5 mV µV/°C 200 1 8.4 300 8.2 8 8.4 50 10 10 5 1 150 8.2 8.1 Max 2 100 15 pA V 50 10 pA mV 15 V/mV 7 6 GBP Gain bandwidth product Av = 40dB, RL = 10kΩ, CL = 100pF, fin = 100kHz CMR Common mode rejection ratio Vic = 1V to 7.4V, Vo = 1.4V 65 80 SVR Supply voltage rejection ratio VCC+ = 5V to 10V, Vo = 1.4V 60 70 Supply current (per amplifier) Av = 1, no load, Vo = 5V Tmin ≤ Tamb ≤ Tmax ICC TS274I/AI Conditions 3.5 1000 1500 1600 3.5 MHz 65 80 dB 60 70 dB 1000 1500 1700 µA Output short circuit current Vo = 0V, Vid = 100mV 60 60 mA Isink Output sink current Vo = VCC, Vid = -100mV 45 45 mA SR Slew rate at unity gain RL = 10kΩ, CL = 100pF, Vin = 3 to 7V 5.5 5.5 V/µs φm Phase margin at unity gain Av = 40dB, RL = 10kΩ, CL = 100pF 40 40 Degrees KOV Overshoot factor 30 30 % 30 30 nV/√Hz 120 120 dB Io en Equivalent input noise voltage f = 1kHz, Rs = 100Ω Vo1/Vo2 Channel separation 1. Maximum values including unavoidable inaccuracies of the industrial test. 5/14 Electrical characteristics Tamb = 25°C AV = 1 VO = VCC / 2 1.5 1.0 0.5 0 4 8 12 SUPPLY VOLTAGE, VCC (V) Figure 5. INPUT BIAS CURRENT, I IB (pA) OUTPUT VOLTAGE, V OH (V) 2.0 Supply current (each amplifier) vs. Figure 4. supply voltage Input bias current vs. free-air temperature 16 VCC = 10V Vic = 5V 10 12 4 0 -50 0.8 Figure 8. T amb = 25˚C V id = 100mV 4 3 VCC = 5V 2 VCC = 3V 1 0 6/14 OUTPUT VOLTAGE, VOL (V) OUTPUT VOLTAGE, V OH (V) 5 -10 -8 -6 -4 -2 OUTPUT CURRENT, I OH (mA) 0 V CC = 3V V CC = 5V T amb = 25°C V ic = 0.5V V id = -100mV 0.2 TEMPERATURE, T amb (˚C) Figure 7. 0 0.4 High level output voltage vs. high level output current 100 -10 OH (mA) Low level output voltage vs. low level output current 0.6 0 75 -40 -30 -20 OUTPUT CURRENT, I 1.0 125 50 VCC = 10V 8 1 25 T amb = 25˚C V id = 100mV VCC = 16V Figure 6. 100 High level output voltage vs. high level output current 20 16 OUTPUT VOLTAGE, VOL (V) SUPPLY CURRENT, I CC (µ A) Figure 3. TS274 3 1 2 OUTPUT CURRENT, I OL (mA) Low level output voltage vs. low level output current V CC = 10V VCC = 16V 2 1 3 T amb = 25°C V i = 0.5V V = -100mV id 0 4 8 12 16 OUTPUT CURRENT, I OL (mA) 20 TS274 Electrical characteristics Open loop frequency response and Figure 10. Phase margin vs. capacitive load phase shift 40 0 G A IN G A IN (d B ) 30 45 PHASE 20 Phase Margin T a m b = 2 5 °C V C C+ = 1 0 V R L = 10kΩ C L = 100pF A VC L = 100 10 0 135 10 10 3 180 Gain Bandwidth Product -1 0 2 90 10 4 10 5 10 6 10 P H A S E (D e g re e s ) 50 P H A S E M A R G IN , φ m (D e g re e s ) Figure 9. 70 Ta m b = 2 5 °C R L = 10kΩ AV = 1 VC C = 10V 60 50 40 30 7 0 20 40 60 C A P A C IT A N C E , C F R E Q U E N C Y , f (H z ) 80 L 100 (p F ) 7 5 S L E W R A T E S , S R (V / μs ) G A IN B A N D W . P R O D ., G B P (M H z ) Figure 11. Gain bandwidth product vs. supply Figure 12. Slew rate vs. supply voltage voltage 4 3 2 Ta m b = 2 5 °C R L = 10kΩ CL = 1 0 0 p F AV = 1 1 4 0 8 12 4 SR 3 4 6 8 10 12 S U P P L Y V O L T A G E , VC C S U P P L Y V O L T A G E , V C C (V ) 48 44 40 36 Ta m b = 2 5 °C R L = 10kΩ CL = 1 0 0 p F AV = 1 32 28 0 4 8 12 S U P P L Y V O L T A G E , V C C (V ) 16 14 (V ) 16 Figure 14. Input voltage noise vs. frequency E Q U IV A L E N T IN P U T N O IS E V O L T A G E (n V /V H z ) P H A S E M A R G IN , φ m (D e g re e s ) Figure 13. Phase margin vs. supply voltage SR 5 2 16 Ta m b = 2 5 °C R L = 10kΩ CL = 1 0 0 p F 6 300 VC C = 1 0 V Tamb = 2 5 °C R S = 1 0 0Ω 200 100 0 1 10 100 1000 F R E Q U E N C Y (H z ) 7/14 Macromodel TS274 4 Macromodel 4.1 Important note concerning this macromodel Please consider the following remarks before using this macromodel. ● All models are a trade-off between accuracy and complexity (i.e. simulation time). ● Macromodels are not a substitute to breadboarding; rather, they confirm the validity of a design approach and help to select surrounding component values. ● A macromodel emulates the nominal performance of a typical device within specified operating conditions (temperature, supply voltage, for example). Thus the macromodel is often not as exhaustive as the datasheet, its purpose is to illustrate the main parameters of the product. Data derived from macromodels used outside of the specified conditions (VCC, temperature, for example) or even worse, outside of the device operating conditions (VCC, Vicm, for example), is not reliable in any way. 4.2 Macromodel code ******************************** .SUBCKT TS27X 1 2 3 4 5 *** INP- = 1, INP+ =2, OUT = 3 VDD=4 VSS = 5 *** TYPE = TS271/TS272/TS274 .MODEL MDTH D IS=1E-8 KF=2.664E-16 CJO=10F ***INPUT STAGE CIP 2 5 1E-12 CIN 1 5 1E-12 EIP 10 5 2 5 1 EIN 16 5 1 5 1 RIP 10 11 8 RIN 15 16 8 RIS 11 15 223.84 CPS 11 15 1E-9 DIP 11 120 MDTH 400E-12 DIN 15 140 MDTH 400E-12 RDEG1 12 120 4400 RDEG2 14 140 4400 VOFP 12 13 DC 0 VOFN 13 14 DC 0 IPOL 13 5 38E-6 ***ICC DICC1 4 31 MDTH 400E-12 DICC2 31 32 MDTH 400E-12 DICC3 32 33 MDTH 400E-12 DICC4 33 34 MDTH 400E-12 RICC 34 5 20E3 ICC 4 5 600E-6 ***COMMON MODE INPUT LIMITATION DINN 17 13 MDTH 400E-12 VIN 17 5 DC -0.1 8/14 TS274 Macromodel DINR 15 18 MDTH 400E-12 VIP 4 18 DC 2.2 ***GM1 STAGE FGM1P 119 5 VOFP 1 FGM1N 119 5 VOFN 1 RAP 119 4 1E6 RAN 119 5 1E6 ***GM2 STAGE G2P 19 5 119 5 4E-4 G2N 19 5 119 4 4E-4 R2P 19 4 450E3 R2N 19 5 450E3 ***COMPENSATION CC 19 119 7p ***BUFFER EBUF 20 5 19 5 1 ***SHORT-CIRCUIT LIMITATIONS( ISINK, ISOURCE) DOPM 19 22 MDTH 400E-12 DONM 21 19 MDTH 400E-12 HOPM 22 28 VOUT 910 VIPM 28 4 DC 50 HONM 21 27 VOUT 1222 VINM 5 27 DC 50 VOUT 3 23 DC 0 ***VOH, VOL DEFINITIONS DOP 19 25 MDTH 400E-12 VOP 4 25 2.5 DON 24 19 MDTH 400E-12 VON 24 5 0.92 ***OUTPUT RESISTOR ROUT 23 20 10 .ENDS 9/14 Package information 5 TS274 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5.1 DIP14 package information Figure 15. DIP14 package mechanical drawing Table 5. DIP14 package mechanical data Millimeters Inches Ref. Min. a1 0.51 B 1.39 Typ. Min. Typ. Max. 0.020 1.65 0.055 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 15.24 0.600 F 7.1 0.280 I 5.1 0.201 L Z 10/14 Max. 3.3 1.27 0.130 2.54 0.050 0.100 TS274 5.2 Package information SO-14 package information Figure 16. SO-14 package mechanical drawing Table 6. SO-14 package mechanical data Dimensions Ref. Millimeters Min. Typ. A a1 Inches Max. Min. Typ. 1.75 0.1 0.2 a2 Max. 0.068 0.003 0.007 1.65 0.064 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 0.019 c1 45° (typ.) D 8.55 8.75 0.336 0.344 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 7.62 0.300 F 3.8 4.0 0.149 0.157 G 4.6 5.3 0.181 0.208 L 0.5 1.27 0.019 0.050 M S 0.68 0.026 8° (max.) 11/14 Package information 5.3 TS274 TSSOP14 package information Figure 17. TSSOP14 package mechanical drawing A A2 A1 e b K L c E D E1 PIN 1 IDENTIFICATION 1 Figure 18. TSSOP14 package mechanical data Dimensions Ref. Millimeters Min. Typ. A Max. Min. Typ. 1.2 A1 0.05 A2 0.8 b Max. 0.047 0.15 0.002 0.004 0.006 1.05 0.031 0.039 0.041 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.0089 D 4.9 5 5.1 0.193 0.197 0.201 E 6.2 6.4 6.6 0.244 0.252 0.260 E1 4.3 4.4 4.48 0.169 0.173 0.176 e 12/14 Inches 1 0.65 BSC K 0° L1 0.45 0.60 0.0256 BSC 8° 0° 0.75 0.018 8° 0.024 0.030 TS274 6 Ordering information Ordering information Table 7. Order codes Order code Temperature range Package Packing SO-14 Tube or Tape & reel TS274CD TS274CDT 274C TS274ACD TS274ACDT 274AC 0°C, +70°C TS274CN TS274ACN TS274CN DIP14 Tube TS274ACN 274C TS274CPT TS274ACPT TSSOP14 Tape & reel 274AC TS274ID TS274IDT 274I SO-14 TS274AID TS274AIDT Tube or Tape & reel 274AI -40°C, +125°C TS274IN TS274AIN TS274IN DIP14 Tube TS274AIN 274I TS274IPT TS274AIPT 7 Marking TSSOP14 Tape & reel 274AI Revision history Table 8. Document revision history Date Revision Changes 19-Nov-2001 1 Initial release. 07-Apr-2006 2 ESD protection inserted in Table 2. on page 2. Thermal resistance junction to case information added see Table 2. on page 2. Macromodel insertion in Section 4 on page 8. 01-Feb-2008 3 Added information on enhanced related families of devices on cover page. Removed TS274B version in AMR table and in order codes table. 13/14 TS274 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 14/14
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