TS820-600FP

TN805, TN815 TS820, TYN608 Datasheet Sensitive and standard 8 A SCRs Features A K G A • On-state rms current, IT(RMS) 8 A • Repetitive peak off-state voltage, VDRM/VRRM 600 and 800 V • Triggering gate current, IGT 0.2 to 15 mA Description TO-220AB K A G TO-220FPAB K A K A IPAK G G A A K TO-220AB A G A K Available either in sensitive (TS8) or standard (TN8 / TYN) gate triggering levels, the 8 A SCR series is suitable to fit all modes of control found in applications such as overvoltage crowbar protection, motor control circuits in power tools and kitchen aids, inrush current limiting circuits, capacitive discharge ignition and voltage regulation circuits. Available in through-hole or surface-mount packages, they provide an optimized performance in a limited space. A G Product summary DPAK Order code Voltage (x00) VDRM/VRRM 600 V 800 V Sensitivity IGT Package TS820-600B X 0.2 mA DPAK Product status link TS820-600H X 0.2 mA IPAK TN805, TN815, TS820, TYN608 TS820-600T X 0.2 mA TO-220AB TS820-600FP X 0.2 mA TO-220FPAB TN805-600B X 5 mA DPAK TN815-x00B X X 15 mA DPAK X 15 mA IPAK 15 mA TO-220AB TN815-800H TYN608RG DS2118 - Rev 9 - November 2021 For further information contact your local STMicroelectronics sales office. X www.st.com TN805, TN815, TS820, TYN608 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values) Value Symbol TN805 Parameters TN815 TYN608 Unit TS820 IT(RMS) RMS on-state current On-state rms current (180° conduction angle) TO-220FPAB, TC = 91 °C IT(AV) Average on-state current (180° conduction angle) ITSM Non repetitive surge peak on-state current I2t dl/dt IGM PG(AV) Tstg Tj VRGM TC = 110 °C tp = 8.3 ms tp = 10 ms TC = 110 °C TO-220FPAB, TC = 91 °C Tj = 25 °C 8 A 5 A 73 100 70 95 24.5 45 A tp = 10 ms Tj = 25 °C F = 60 Hz Tj = 125 °C 50 A/µs tp = 20 µs Tj = 125 °C 4 A Tj = 125 °C 1 W Storage junction temperature range -40 to +150 °C Operating junction temperature range -40 to +125 °C 5 V I2t value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns Peak gate current Average gate power dissipation Maximum peak reverse gate voltage (for TN8x5 and TYN608 only) A2s Table 2. Sensitive electrical characteristics (Tj = 25 °C, unless otherwise specified) Symbol IGT VGT VD = 12 V, RL = 140 Ω VRG IRG = 10 µA VGD VD = VDRM, RL = 3.3 kΩ, RGK = 220 Ω Tj = 125 °C TS820 Unit Max. 200 µA Max. 0.8 V Min. 8 V Min. 0.1 V IH IT = 50 mA, RGK = 1 kΩ Max. 5 mA IL IG = 1mA, RGK = 1 kΩ Max. 6 mA dV/dt VD = 65% VDRM, RGK = 220 Ω Tj = 125 °C Min. 5 V/µs VTM ITM = 16 A, tp = 380 μs Tj = 25 °C Max. 1.6 V Vt0 Threshold voltage Tj = 125 °C Max. 0.85 V Rd Dynamic resistance Tj = 125 °C Max. 46 mΩ 5 µA 1 mA IDRM IRRM DS2118 - Rev 9 Parameter VDRM = VRRM, RGK = 220 Ω Tj = 25 °C Tj = 125 °C Max. page 2/20 TN805, TN815, TS820, TYN608 Characteristics Table 3. Standard electrical characteristics (Tj = 25 °C, unless otherwise specified) Symbol IGT Parameter VD = 12 V, RL = 140 Ω VGT Tj = 125 °C TN805 TN815 TYN608 Min. 0.5 2 2 Max. 5 15 15 Unit mA Max. 1.3 V Min. 0.2 V VGD VD = VDRM, RL = 3.3 kΩ IH IT = 100 mA, gate open Max. 25 40 30 mA IL IG = 1.2 IGT Max. 30 50 70 mA 50 150 150 V/µs dV/dt VD = 67% VDRM, gate open Tj = 125 °C Min. VTM ITM = 16 A, tp = 380 μs Tj = 25 °C Max. 1.6 V Vt0 Threshold voltage Tj = 125 °C Max. 0.85 V Rd Dynamic resistance Tj = 125 °C Max. 46 mΩ 5 µA 2 mA IDRM IRRM Tj = 25 °C VDRM = VRRM Tj = 125 °C Max. Table 4. Thermal resistance (maximum values) Symbol Rth(j-c) Parameter Junction to case (DC) Junction to ambient Rth(j-a) Value Junction to ambient S(1) = 0.5 cm² IPAK / DPAK / TO-220AB 1.3 TO-220FPAB 4.6 DPAK 70 TO-220AB / TO-220FPAB 60 IPAK 100 Unit °C/W °C/W 1. S = Copper surface under tab DS2118 - Rev 9 page 3/20 TN805, TN815, TS820, TYN608 Characteristics (curves) 1.1 Characteristics curves Figure 1. Maximum average power dissipation versus average on-state current Figure 2. Average and DC on-state current versus case temperature IT(AV) (A) P(W) 8 10 7 DPAK IPAK 9 α = 180° TO-220AB D.C. 8 6 7 5 6 4 α = 180° 5 4 3 360° TO-220FPAB 3 2 2 1 α IT(AV) (A) 0 Tcase (°C) 1 0 0 1 3 2 5 4 6 0 25 50 75 100 125 Figure 3. Average and DC on-state current versus ambient Figure 4. Relative variation of thermal impedance junction temperature to case versus pulse duration 2.5 IT(AV) (A) K=[Z th(j-c) /Rth(j-c) ] 1.0 Recommendedpad layout, FR4 printed circuit board D.C. α = 180° 2.0 0.5 TO-220AB TO-220FPAB 1.5 1.0 0.2 DPAK IPAK 0.5 Tamb(°C) 0.0 0 25 50 75 tp(s) 0.1 100 125 Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration 1E-3 1E-2 1E+0 1E-1 Figure 6. Relative variation of gate trigger current and holding current versus junction temperature for TS820 IGT,IH ,IL [T j ] / IGT,IH ,IL [T j =25°C] K=[Z th(j-a) /Rth(j-a) ] 2.0 1.00 Recommended pad layout, FR4 printed circuit board 1.8 IGT 1.6 1.4 DPAK 1.2 0.10 1.0 IH & I L R GK = 1kΩ 0.8 TO-220AB / IPAK TO-220FPAB 0.6 0.4 1E-2 DS2118 - Rev 9 0.2 tp(s) 0.01 1E-1 1E+0 1E+1 1E+2 5E+2 0.0 -40 Tj(°C) -20 0 20 40 60 80 100 120 140 page 4/20 TN805, TN815, TS820, TYN608 Characteristics (curves) Figure 7. Relative variation of gate trigger current and holding current versus junction temperature Figure 8. Relative variation of holding current versus gate-cathode resistance (typical values) IH[R GK ] / IH[ RGK =1kΩ] IGT,IH,IL [ Tj ] / IGT,IH,IL [T j =25°C] 6.0 2.4 5.5 2.2 TN8 and TYNx8 IGT 2.0 Tj = 25°C TS8 5.0 1.8 4.5 1.6 4.0 3.5 1.4 1.2 3.0 IH & IL 1.0 2.5 0.8 2.0 0.6 1.5 1.0 0.4 0.5 Tj(°C) 0.2 0.0 -40 -20 0 20 40 60 80 100 120 140 Figure 9. Relative variation of dV/dt immunity versus gatecathode resistance (typical values) for TS820 dV/dt[R GK ] / dV/dt[ RGK =220Ω] RGK (kΩ) 0.0 1E-2 1E-1 1E+0 1E+1 Figure 10. Relative variation of dV/dt immunity versus gate-cathode capacitance (typical values) for TS820 dV/dt[C GK ] / dV/dt[R GK =220Ω] 15.0 10.00 VD = 0.67 x VDRM Tj = 125°C RGK = 220Ω T j = 125°C V D = 0.67 x V DRM 12.5 1.00 10.0 7.5 0.10 5.0 2.5 R GK(k Ω) 0.01 0 200 400 600 800 1000 1200 1400 1600 1800 2000 CGK(nF) 0.0 0 Figure 11. Surge peak on-state current versus number of cycles 20 40 60 80 100 120 140 160 180 200 220 Figure 12. Non-repetitive surge peak on-state current and corresponding values of I2t ITSM(A) ITSM(A), I 2t (A 2s) 100 1000 Tj initial = 25°C 90 80 tp=10ms TYN08 70 ITSM One cycle TYN08 Non repetitive Tj initial=25°C 60 dI/dt limitation TN8 / TS8 50 100 Sinusoidal pulse width tp < 10 ms TN8 / TS8 40 TYN08 30 Repetitive TC=110°C 20 I2t TN8 / TS8 10 Number ofcycles 0 1 DS2118 - Rev 9 10 100 t p(ms) 10 1000 0.01 0.10 1.00 10.00 page 5/20 TN805, TN815, TS820, TYN608 Characteristics (curves) Figure 13. On-state characteristics (maximum values) Figure 14. Thermal resistance junction to ambient versus copper surface under tab ITM(A) 50.0 100 Tj max.: Vt0 = 0.85 V Rd = 46 mΩ Rth(j-a) (°C/W) DPAK Epoxy printed circuit board, copper thickness: 35 µm 90 10.0 80 70 Tj=max 60 50 1.0 40 Tj=25°C 30 20 VTM(V) 0.1 0.0 DS2118 - Rev 9 10 SCu (cm²) 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 5 10 15 20 25 30 35 40 page 6/20 TN805, TN815, TS820, TYN608 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 DPAK package information • • Molding compouned resin is halogen free and meets UL94 flammability standard, level V0 Lead-free package leads plating A Figure 15. DPAK package outline E b4 H D D1 L2 c2 e L4 A1 b E1 c e1 A2 V2 L DS2118 - Rev 9 page 7/20 TN805, TN815, TS820, TYN608 DPAK package information Table 5. DPAK package mechanical data Dimensions Inches(1) Millimeters Ref. Min. Typ. Max. Min. Typ. Max. A 2.18 2.40 0.0858 0.0945 A1 0.90 1.10 0.0354 0.0433 A2 0.03 0.23 0.0012 0.0091 b 0.64 0.90 0.0252 0.354 b4 4.95 5.46 0.1949 0.2150 c 0.46 0.61 0.0181 0.0240 c2 0.46 0.60 0.0181 0.0236 D 5.97 6.22 0.2350 0.2449 D1 4.95 5.60 0.1949 0.2205 E 6.35 6.73 0.2500 0.2650 E1 4.32 5.50 0.1701 0.2165 e 2.286 0.0900 e1 4.40 4.70 0.1732 0.1850 H 9.35 10.40 0.3681 0.4094 L 1.00 1.78 0.0394 0.0701 L2 1.27 0.0500 L4 0.60 1.02 0.0236 0.0402 V2(2) -8° +8° -8° +8° 1. Dimensions in inches are given for reference only 2. Degree Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. Figure 16. DPAK recommended footprint (dimensions are in mm) 12.7 6.7 3.0 3.0 4.572 6.7 B The device must be positioned within DS2118 - Rev 9 A 1.6 0.05 A B page 8/20 TN805, TN815, TS820, TYN608 IPAK package information 2.2 IPAK package information • • Molding compouned resin is halogen free and meets UL94 flammability standard, level V0 Lead-free package leads plating Figure 17. IPAK package outline E b4 A c2 V1 L2 1.20 ±0.010 Top E-MARK D L1 A1 e b2 b e1 DS2118 - Rev 9 H L c page 9/20 TN805, TN815, TS820, TYN608 IPAK package information Table 6. IPAK package mechanical data Dimensions MillimetersInches (for reference only) Ref. Min. Typ. Min. 0.086 A 2.20 2.40 A1 0.90 1.10 b 0.64 0.90 b2 b4 5.20 5.43 c 0.45 0.60 c2 0.46 0.60 D 6 6.20 E 6.40 6.70 e1 Typ. 0.035 0.025 0.035 0.037 0.252 2.28 4.40 H Max. 0.094 0.95 e 0.263 0.090 4.60 0.173 16.10 0.181 0.634 L 9 9.60 0.354 0.377 L1 0.8 1.20 0.031 0.047 L2 V1 DS2118 - Rev 9 Max. 0.80 10° 1.25 0.031 0.049 10° page 10/20 TN805, TN815, TS820, TYN608 TO-220AB package information 2.3 TO-220AB package information • • • • • Molding compouned resin is halogen free and meets UL94 flammability standard, level V0 Lead-free package leads plating Cooling method: by conduction (C) Recommended torque value: 0.55 N·m Maximum torque value: 0.70 N·m Figure 18. TO-220AB package outline DS2118 - Rev 9 page 11/20 TN805, TN815, TS820, TYN608 TO-220AB package information Table 7. TO-220AB package mechanical data Dimensions Millimeters Ref. Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.240 0.035 b1 1.14 1.55 0.045 0.061 c 0.48 0.70 0.019 0.028 D 15.25 15.75 0.600 D1 DS2118 - Rev 9 Inches (for reference only) 1.27 typ. 0.620 0.050 typ. E 10.00 10.40 0.394 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.260 J1 2.40 2.72 0.094 0.107 L 13.00 14.00 0.512 0.551 L1 3.50 3.93 0.138 0.155 L20 16.40 typ. 0.646 typ. L30 28.90 typ. 1.138 typ. θP 3.75 3.85 0.148 0.152 Q 2.65 2.95 0.104 0.116 page 12/20 TN805, TN815, TS820, TYN608 TO-220AB package information 2.4 TO-220AB package information • • • Molding compound resin is halogen free and meets UL94 flammability standard, level V0 Lead-free plating package leads Recommended torque: 0.4 to 0.6 N·m Figure 19. TO-220AB package outline DS2118 - Rev 9 page 13/20 TN805, TN815, TS820, TYN608 TO-220AB package information Table 8. TO-220AB package mechanical data Dimensions Min. A Inches(1) Millimeters Ref. Typ. 15.20 a1 Max. Min. 15.90 0.5984 3.75 Typ. Max. 0.6260 0.1476 a2 13.00 14.00 0.5118 0.5512 B 10.00 10.40 0.3937 0.4094 b1 0.61 0.88 0.0240 0.0346 b2 1.23 1.32 0.0484 0.0520 C 4.40 4.60 0.1732 0.1811 c1 0.49 0.70 0.0193 0.0276 c2 2.40 2.72 0.0945 0.1071 e 2.40 2.70 0.0945 0.1063 F 6.20 6.60 0.2441 0.2598 I 3.73 3.88 0.1469 0.1528 L 2.65 2.95 0.1043 0.1161 I2 1.14 1.70 0.0449 0.0669 I3 1.14 1.70 0.0449 0.0669 I4 15.80 16.80 0.6220 M 16.40 2.6 0.6457 0.6614 0.1024 1. Inch dimensions are for reference only. DS2118 - Rev 9 page 14/20 TN805, TN815, TS820, TYN608 TO-220FPAB package information 2.5 TO-220FPAB package information • • Epoxy meets UL94, V0 Recommended torque: 0.4 to 0.6 N·m Figure 20. TO-220FPAB package outline DS2118 - Rev 9 page 15/20 TN805, TN815, TS820, TYN608 TO-220FPAB package information Table 9. TO-220FPAB package mechanical data Dimensions Millimeters Ref. Min. Max. Min. Max. A 4.40 4.60 0.1739 0.1818 B 2.5 2.7 0.0988 0.1067 D 2.50 2.75 0.0988 0.1087 E 0.45 0.70 0.0178 0.0277 F 0.75 1.0 0.0296 0.0395 F1 1.15 1.70 0.0455 0.0672 F2 1.15 1.70 0.0455 0.0672 G 4.95 5.20 0.1957 0.2055 G1 2.40 2.70 0.0949 0.1067 H 10.00 10.40 0.3953 0.4111 L2 DS2118 - Rev 9 Inches 16.00 typ. 0.6324 typ. L3 28.60 30.60 1.1304 1.2095 L4 9.80 10.6 0.3874 0.4190 L5 2.90 3.60 0.1146 0.1423 L6 15.90 16.40 0.6285 0.6482 L7 9.00 9.30 0.3557 0.3676 Dia 3.0 3.20 0.1186 0.1265 page 16/20 TN805, TN815, TS820, TYN608 Ordering information 3 Ordering information Figure 21. TN8 series TN 8 05 - 600 B -TR Standard SCR series Current 8=8A Sensitivity 05 = 5 mA 15 = 15 mA Voltage 600 = 600 V 800 = 800 V Package B = DPAK H = IPAK Packing mode Blank = Tube -TR = Tape and reel Figure 22. TS8 series TS 8 20 - 600 B (-TR) Sensitive SCR series Current 8=8A Sensitivity 20 = 200 µA Voltage 600 = 600 V Package B = DPAK H = IPAK T = TO-220AB FP = TO220FPAB Packing mode Blank = Tube -TR = Tape and reel Figure 23. TYNx08 series TYN 6 08 RG Standard SCR series Voltage 6 = 600 V Current 8=8A Packing mode RG = Tube DS2118 - Rev 9 page 17/20 TN805, TN815, TS820, TYN608 Ordering information Table 10. Ordering information DS2118 - Rev 9 Order code Marking Package Weight Base qty Delivery mode TN805-600B-TR TN805600 DPAK 0.3 g 2500 Tape and reel TN815-600B-TR TN815600 DPAK 0.3 g 2500 Tape and reel TN815-800B-TR TN815800 DPAK 0.3 g 2500 Tape and reel TN815-800H TN815800 IPAK 0.4 g 75 Tube TS820-600B TS820600 DPAK 0.3 g 75 Tube TS820-600B-TR TS820600 DPAK 0.3 g 2500 Tape and reel TS820-600H TS820600 IPAK 0.4 g 75 Tube TS820-600T TS820600T TO-220AB 2.3 g 50 Tube TS820-600FP TS820600 TO-220FPAB 2.0 g 50 Tube TYN608RG TYN608 TO-220AB 2.3 g 50 Tube page 18/20 TN805, TN815, TS820, TYN608 Revision history Table 11. Document revision history DS2118 - Rev 9 Date Revision Changes Apr-2002 4A 13-Feb-2006 5 TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. 22-Jan-2010 6 Alpha definition updated in Figure 1. Thermal resistance, junction to case, updated in Table 5. 10-Oct-2011 7 Added TO-220FPAB package. Removed 700 V and 1000 V products. 14-May-2014 8 Updated DPAK and IPAK package information and reformatted to current standard. 03-Nov-2021 9 Added TN815-800H product information. Minor text changes. Last update. page 19/20 TN805, TN815, TS820, TYN608 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved DS2118 - Rev 9 page 20/20