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TS971ILT

TS971ILT

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOT23-5

  • 描述:

    IC OPAMP GP 12MHZ RRO SOT23-5

  • 数据手册
  • 价格&库存
TS971ILT 数据手册
TS971, TS972, TS974 Output rail-to-rail very low noise operational amplifier Datasheet - production data Features Rail-to-rail output voltage swing ±2.4 V at VCC = ±2.5 V Very low noise level: 4 nV/√Hz Ultra low distortion: 0.003 % High dynamic features: 12 MHz, 4 V/µs Operating range: 2.7 to 10 V ESD protection (2 kV) Latch-up immunity (class A) Applications Portable devices (CD players, PDAs) Portable communication (cell phones, pagers) Instrumentation and sensing technology Professional audio circuits Description The TS97x family of operational amplifiers operate with voltages as low as ±1.35 V and feature output rail-to-rail signal swing. The TS97x devices are particularly well suited for portable and battery-supplied equipment. Very low noise and low distortion characteristics make them ideal for audio pre-amplification. The TS97x devices are available in a variety of packages to suit all types of applications. For applications where space saving is critical, the SOT23-5 package (2.8 x 2.9 mm) or the DFN8 package (3 x 3 mm) simplify the board design because they can be placed anywhere on it. June 2016 DocID6031 Rev 11 This is information on a product in full production. 1/18 www.st.com Contents TS971, TS972, TS974 Contents 1 Package pin connections................................................................ 3 2 Absolute maximum ratings and operating conditions ................. 4 3 4 Electrical characteristics ................................................................ 6 Electrical characteristic curves ...................................................... 7 5 Package information ....................................................................... 9 5.1 SOT23-5 package information ........................................................ 10 5.2 SO8 package information ................................................................ 11 5.3 TSSOP8 package information ......................................................... 12 5.4 DFN8 3x3 exposed pad package information ................................. 13 5.5 SO14 package information .............................................................. 14 5.6 TSSOP14 package information ....................................................... 15 6 Ordering information..................................................................... 16 7 Revision history ............................................................................ 17 2/18 DocID6031 Rev 11 TS971, TS972, TS974 1 Package pin connections Package pin connections Figure 1: Package pin connections 1. The exposed pad of the DFN8 3x3 can be connected to VCC or left floating DocID6031 Rev 11 3/18 Absolute maximum ratings and operating conditions 2 TS971, TS972, TS974 Absolute maximum ratings and operating conditions Table 1: Absolute maximum ratings (AMR) Symbol VCC Parameter Supply voltage (1) (2) ±1 (3) Vin Input voltage Tstg Storage temperature range Tj Rthjc -65 to 150 Thermal resistance junction-to-ambient (4) Thermal resistance junction-to-case (4) HBM: human body model ESD MM: machine model V VDD - 0.3 to VCC + 0.3 Maximum junction temperature Rthja Unit 12 Differential input voltage Vid Value 150 SOT23-5 250 SO8 125 TSSOP8 120 DFN8 3x3 40 SO14 105 TSSOP14 100 SOT23-5 81 SO8 40 TSSOP8 37 DFN8 3x3 5.2 SO14 31 TSSOP14 32 (5) (6) CDM: charged device model (7) (8) Lead temperature (soldering, 10 sec.) °C °C/W 2 kV 200 V 1.5 kV 260 °C Notes: (1)All voltage values, except the differential voltage are with respect to the network ground terminal. (2)The differential voltage is the non-inverting input terminal with respect to the inverting input terminal. (3)The magnitude of input and output voltages must never exceed VCC + 0.3 V. (4) Short-circuits can cause excessive heating and destructive dissipation. Values are typical. (5)Human body model: a 100 pF capacitor is charged to the specified voltage, then discharged through a 1.5kΩ resistor between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating. (6)Machine model: a 200 pF capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of connected pin combinations while the other pins are floating. (7) No value specified for CDM on SOT23-5 package. (8)Charged device model: all pins and package are charged together to the specified voltage and then discharged directly to ground through only one pin. This is done for all pins. 4/18 DocID6031 Rev 11 TS971, TS972, TS974 Absolute maximum ratings and operating conditions Table 2: Operating conditions Symbol Parameter VCC Supply voltage Vicm Common mode input voltage range Toper Operating free air temperature range Value 2.7 to 10 DocID6031 Rev 11 VDD + 1.15 to VCC - 1.15 -40 to 125 Unit V °C 5/18 Electrical characteristics 3 TS971, TS972, TS974 Electrical characteristics Table 3: Electrical characteristics at VCC = 2.5 V, VDD = -2.5 V, Tamb = 25 °C (unless otherwise specified) Symbol Vio ΔVio/ΔT Parameter Input offset voltage Conditions Min. Typ. Max. 1 5 Tmin ≤ Tamb ≤ Tmax 7 Input offset voltage drift Vicm = 0 V, Vo = 0 V 5 Iio Input offset current Vicm = 0 V, Vo = 0 V 10 Iib Input bias current Vicm = 0 V, Vo = 0 V 200 750 Tmin ≤ Tamb ≤ Tmax 200 1000 Vicm Common mode input voltage range CMR Common mode rejection ratio Vicm = ±1.35 V 60 85 SVR Supply voltage rejection ratio VCC = ±2 V to ±3 V 60 70 70 80 -1.35 Large signal voltage gain VOH High-level output voltage VOL Low-level output voltage -2.4 Output source current 1.5 Isink Output sink current 100 ICC Supply current per amplifier Unity gain, no load Gain bandwidth product f = 100 kHz, RL = 2 kΩ, CL = 100 pF 8.5 AV = 1, Vin = ±1 V 2.8 Isource GBP SR Slew rate ∅m Phase margin at unit gain Gm Gain margin RL = 2 kΩ RL = 2 kΩ, CL = 100 pF en Equivalent input noise voltage f = 100 kHz in Equivalent input noise current f = 1 kHz Total harmonic distortion f = 1 kHz, AV = -1, RL = 10 kΩ THD 6/18 DocID6031 Rev 11 2 150 12 nA V dB 2.4 2 mV µV/°C 1.35 Avd Unit -2 V mA 2.8 MHz 4 V/µs 60 Degrees 10 dB 4 nV/√Hz 250 fA/√Hz 0.003 % TS971, TS972, TS974 4 Electrical characteristic curves Electrical characteristic curves Figure 2: Input offset voltage distribution Figure 3: Voltage gain and phase vs. frequency VCC = 5 V Figure 4: Voltage gain and phase vs. frequency VCC = 2.7 V Figure 5: THS vs. Vout, VCC = 5 V Figure 6: THD vs. Vout, VCC = 2.7 V Figure 7: THD vs. frequency DocID6031 Rev 11 7/18 Electrical characteristic curves TS971, TS972, TS974 Figure 8: Noise voltage vs. frequency Figure 9: Gain bandwidth product vs. Iout Figure 10: Phase margin vs. Iout Figure 11: Phase margin vs. VCC RL = 10 kΩ, CL = 30 pF Figure 12: Phase margin vs. VCC CL = 30, 130, and 250 pF Figure 13: Gain margin vs. VCC 8/18 DocID6031 Rev 11 TS971, TS972, TS974 5 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DocID6031 Rev 11 9/18 Package information 5.1 TS971, TS972, TS974 SOT23-5 package information Figure 14: SOT23-5 package outline Table 4: SOT23-5 mechanical data Dimensions Ref. A Millimeters Min. Typ. Max. Min. Typ. Max. 0.90 1.20 1.45 0.035 0.047 0.057 A1 10/18 Inches 0.15 0.006 A2 0.90 1.05 1.30 0.035 0.041 0.051 B 0.35 0.40 0.50 0.014 0.016 0.020 C 0.09 0.15 0.20 0.004 0.006 0.008 D 2.80 2.90 3.00 0.110 0.114 0.118 D1 1.90 0.075 e 0.95 0.037 E 2.60 2.80 3.00 0.102 0.110 0.118 F 1.50 1.60 1.75 0.059 0.063 0.069 L 0.10 0.35 0.60 0.004 0.014 0.024 K 0 degrees 10 degrees 0 degrees DocID6031 Rev 11 10 degrees TS971, TS972, TS974 5.2 Package information SO8 package information Figure 15: SO8 package outline Table 5: SO8 mechanical data Dimensions Ref. Millimeters Min. Typ. A Inches Max. Min. Typ. 1.75 0.069 A1 0.10 A2 1.25 b 0.28 0.48 0.011 0.019 c 0.17 0.23 0.007 0.010 D 4.80 4.90 5.00 0.189 0.193 0.197 E 5.80 6.00 6.20 0.228 0.236 0.244 E1 3.80 3.90 4.00 0.150 0.154 0.157 e 0.25 Max 0.004 0.010 0.049 1.27 0.050 h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 L1 k ccc 1.04 1° 0.040 8° 0.10 DocID6031 Rev 11 1° 8° 0.004 11/18 Package information 5.3 TS971, TS972, TS974 TSSOP8 package information Figure 16: TSSOP8 package outline Table 6: TSSOP8 mechanical data Dimensions Ref. Millimeters Min. Typ. A Max. Min. Typ. 1.2 A1 0.05 A2 0.80 b 0.19 c 0.09 D 2.90 E E1 Max. 0.047 0.15 0.002 1.05 0.031 0.30 0.007 0.012 0.20 0.004 0.008 3.00 3.10 0.114 0.118 0.122 6.20 6.40 6.60 0.244 0.252 0.260 4.30 4.40 4.50 0.169 0.173 0.177 e 12/18 Inches 1.00 0.65 k 0° L 0.45 0.60 0.006 0.039 0.041 0.0256 8° 0° 0.75 0.018 8° 0.024 L1 1 0.039 aaa 0.1 0.004 DocID6031 Rev 11 0.030 TS971, TS972, TS974 5.4 Package information DFN8 3x3 exposed pad package information Figure 17: DFN8 3x3 package outline Table 7: DFN8 3x3 mechanical data Dimensions Symbol A Millimeters Min. Typ. Max. Min. Typ. Max. 0.80 0.90 1.00 0.031 0.035 0.039 0.0008 0.0019 0.025 0.031 A1 A2 Inches 0.02 0.55 A3 0.65 0.80 0.021 0.20 0.008 b 0.18 0.25 0.30 0.007 0.010 0.012 D 2.85 3.00 3.15 0.112 0.118 0.124 D2 2.20 2.70 0.087 E 2.85 3.15 0.112 E2 1.40 1.75 0.055 e L ddd 3.00 0.50 0.30 0.40 0.106 0.118 0.124 0.069 0.020 0.50 0.08 DocID6031 Rev 11 0.012 0.016 0.020 0.003 13/18 Package information 5.5 TS971, TS972, TS974 SO14 package information Figure 18: SO14 package outline Table 8: SO14 mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Max. A 1.35 1.75 0.05 0.068 A1 0.10 0.25 0.004 0.009 A2 1.10 1.65 0.04 0.06 B 0.33 0.51 0.01 0.02 C 0.19 0.25 0.007 0.009 D 8.55 8.75 0.33 0.34 E 3.80 4.0 0.15 0.15 e 1.27 0.05 H 5.80 6.20 0.22 0.24 h 0.25 0.50 0.009 0.02 L 0.40 1.27 0.015 0.05 k ddd 14/18 Typ. 8° (max) 0.10 DocID6031 Rev 11 0.004 TS971, TS972, TS974 5.6 Package information TSSOP14 package information Figure 19: TSSOP14 package outline aaa Table 9: TSSOP14 mechanical data Dimensions Ref. Millimeters Min. Typ. A 0.05 A2 0.80 b c D 4.90 E E1 Typ. Max. 0.047 0.002 0.004 0.006 1.05 0.031 0.039 0.041 0.19 0.30 0.007 0.012 0.09 0.20 0.004 0.0089 5.00 5.10 0.193 0.197 0.201 6.20 6.40 6.60 0.244 0.252 0.260 4.30 4.40 4.50 0.169 0.173 0.176 1.00 0.65 0.45 L1 k Min. 0.15 e aaa Max. 1.20 A1 L Inches 0.60 0.0256 0.75 0.018 1.00 0° 0.024 0.030 0.039 8° 0.10 DocID6031 Rev 11 0° 8° 0.004 15/18 Ordering information 6 TS971, TS972, TS974 Ordering information Table 10: Order codes Order code Temperature range Package Packaging Marking TS971IDT SΟ8 971I TS971ILT SOT23-5 K120 SOT23-5 (automotive grade level) K121 TS971IYLT (1) TS972IDT SO8 TS972IPT TSSOP8 TS972IQT TS972IYDT (1) TS972IYPT (1) TS972IYQT (1) -40 °C, 125 °C DFN8 3x3 SO8 (automotive grade level) Tape and reel 972IY TSSOP8 (automotive grade level) 972IY DFN8 3x3 (automotive grade level) 972Y TS974IDT SO14 TS974IPT TSSOP14 TS974IYPT (1) 972I TSSOP14 (automotive grade level) 974I 974IY Notes: (1)Qualified and characterized according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC Q001 and Q 002 or equivalent. 16/18 DocID6031 Rev 11 TS971, TS972, TS974 7 Revision history Revision history Table 11: Document revision history Date Revision 15-Nov- 2002 1 First release. 9-May- 2005 2 Modifications on AMR table (explanation of Vid and Vi limits) 31-Aug-2005 3 PPAP references inserted in the datasheet, see Table 1 on page 2. 9-Dec-2005 4 Thermal resistance junction to case data added in Table 1. on page 3 Missing PPAP references inserted in the datasheet, see Table 10: Order codes. 3-Oct-2007 5 Added Rthja and Rthjc values for DIP8 and DIP14 packages in Table 1. ESD footnotes updated in Table 1: Absolute maximum ratings (AMR). Description section updated on cover page. Markings for automotive grade parts corrected in Table 10: Order codes. 20-Dec-2007 6 Reformatted package information in Section 3: Package information. Footnotes for automotive grade parts corrected in Table 10: Order codes. 06-May-2010 7 Updated package information (drawings and data) in Chapter 3. Removed DIP package order codes from Chapter 4: Ordering information. 19-Sep-2012 8 Updated “Pin connection” figure on page 1 (removed part numbers). Removed TS971ID, TS971IYD, TS972ID, TS972IYD, TS974ID and TS974IYD order code from Table 10. Qualified status of TS971IYLT and TS974IYPT order code in Table 10. Minor corrections throughout document. 19-Jul-2013 9 Added footnote regarding NC to the DFN8 3x3 pinout Table 10: Order codes: removed order code TS971IYDT; added automotive qualification to order code TS972IYPT. 07-Mar-2014 10 Table 3: Electrical characteristics at VCC = +2.5 V, VDD = -2.5 V, Tamb = 25 °C (unless otherwise specified): added parameter “equivalent input noise current” 24-Jun-2016 11 Changes Added package silhouettes to cover page Removed pinouts to Section 1: "Package pin connections" Updated document layout Table 5: updated “k” parameter in Millimeters, Min. column. Table 6: moved “aaa” parameter to Typ. column instead of Max. column. Table 7: removed "0.5" from A1, Millimeters, Max column. Table 10: "Order codes": removed obsolete order code TS974IYDT, added order code TS972IYQT, removed “tube” packaging. DocID6031 Rev 11 17/18 TS971, TS972, TS974 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 18/18 DocID6031 Rev 11
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