TSH93IYDT

TSH93 High-speed low power triple operational amplifier Features ■ ■ ■ ■ ■ ■ ■ ■ Low supply current: 4.5mA High-speed: 150MHz - 110V/µs Unity gain stability Low offset voltage: 4mV Low noise: 4.2nV/√ Hz Low cost Specified for 600Ω and 150Ω loads High video performance: Differential gain: 0.03% Differential phase: 0.07° Gain flatness: 6MHz, 0.1dB max. 0 10dB gain High audio performance ESD tolerance: 2kV Pin connections (top view) D SO-14 (Plastic micropackage) N.C. N.C. N.C. VCC + 1 2 3 4 5 6 7 + + + 14 Output 3 13 Inverting Input 3 12 Non-inverting Input 3 11 VCC 10 Non-inverting Input 2 9 8 Inverting Input 2 Output 2 ■ ■ Description The TSH93 is a triple low-power high-frequency op-amp, designed for high quality video signal processing. The device offers an excellent speed consumption ratio with 4.5mA per amplifier for 150MHz bandwidth. High slew rate and low noise make it also suitable for high quality audio applications. Non-inverting Input 1 Inverting Input 1 Output 1 October 2007 Rev 3 1/13 www.st.com 13 Absolute maximum ratings and operating conditions TSH93 1 Absolute maximum ratings and operating conditions Table 1. Symbol VCC Vid Vi Toper Tstg ESD Supply voltage (1) Differential input voltage Input voltage (3) (2) Absolute maximum ratings (AMR) Parameter Value 14 ±5 -0.3 to 12 -40 to +125 -65 to +150 (4) Unit V V V °C °C kV kV V Operating free-air temperature range Storage temperature range CDM: charged device model HBM: human body model(5) MM: machine model(6) 1.5 2 200 1. All voltage values, except differential voltage are with respect to network ground terminal. 2. Differential voltages are the non-inverting input terminal with respect to the inverting input terminal. 3. The magnitude of input and output voltages must never exceed VCC+ +0.3V. 4. Charged device model: all pins and the package are charged together to the specified voltage and then discharged directly to the ground through only one pin. This is done for all pins. 5. Human body model: A 100pF capacitor is charged to the specified voltage, then discharged through a 1.5kΩ resistor between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating. 6. Machine model: A 200pF capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5Ω). This is done for all couples of connected pin combinations while the other pins are floating Table 2. Symbol VCC Vic Operating conditions Parameter Supply voltage Common mode input voltage range - Value 7 to 12 VCC +2 to VCC -1 + Unit V V 2/13 TSH93 Schematic diagram 2 Schematic diagram Figure 1. Schematic diagram (one channel only) V CC+ non inverting input Internal Vref inverting input output Cc VCC- 3/13 Electrical characteristics TSH93 3 Table 3. Symbol Vio Iio Iib ICC CMR SVR Avd Electrical characteristics VCC+ = 5V, VCC- = -5V, Tamb = 25°C (unless otherwise specified) Parameter Input offset voltage Tmin ≤ Tamb ≤ Tmax Input offset current Tmin ≤ Tamb ≤ Tmax Input bias current. Tmin ≤ Tamb ≤ Tmax Supply current (per amplifier, no load) Tmin ≤ Tamb ≤ Tmax Common-mode rejection ratio Vic = -3V to +4V, Vo = 0V Tmin ≤ Tamb ≤ Tmax Supply voltage rejection ratio VCC = ±5V to ±3V Tmin ≤ Tamb ≤ Tmax Large signal voltage gain RL = 100Ω, Vo = ±2.5V Tmin ≤ Tamb ≤ Tmax High level output voltage Vid = 1V RL = 600Ω RL = 150Ω Tmin ≤ Tamb ≤ Tmax - RL = 150Ω Low level output voltage Vid = 11V RL = 600Ω RL = 150Ω Tmin ≤ Tamb ≤ Tmax - RL = 150Ω Output short circuit current - Vid = ±1V Source Sink Tmin ≤ Tamb ≤ Tmax Source Sink Gain bandwidth product , AVCL = 100, RL = 600Ω CL = 15pF, f = 7.5MHz Transition frequency Slew rate Vin = -2 to +2V, AVCL = +1, RL = 600Ω, CL = 15pF Equivalent input voltage noise Rs = 50Ω f = 1kHz , Phase margin AVM = +1 Channel separation f = 1MHz to 10MHz Gain flatness f = DC to 6MHz, AVCL = 10dB Total harmonic distortion f = 1kHz, Vo = ±2.5V, RL = 600Ω 0.01 62 20 20 15 15 90 150 90 110 4.2 35 65 0.1 MHz MHz V/μs nV/√ Hz Degrees dB dB % 80 70 60 50 57 54 3 2.5 2.4 1 5 4.5 100 75 70 Min. Typ. Max. 4 6 2 5 15 20 6 8 Unit mV μA μA mA dB dB dB VOH 3.5 3 V VOL -3.5 -2.8 -3 -2.5 -2.4 V Io 36 40 mA GBP fT SR en φm VO1/VO2 Gf THD 4/13 TSH93 Table 3. Symbol ΔG Δϕ Electrical characteristics VCC+ = 5V, VCC- = -5V, Tamb = 25°C (unless otherwise specified) (continued) Parameter Differential gain f = 3.58MHz, AVCL = +2, RL = 150Ω Differential phase f = 3.58MHz, AVCL = +2, RL = 150Ω Min. Typ. 0.03 0.07 Max. Unit % Degrees Table 4. Symbol Vio Avd ICC Vicm VOH VOL Isink Isource GBP SR φm VCC+ = ±15V, Tamb = 25°C (unless otherwise specified) Conditions Value 0 RL = 600Ω No load / ampli 3.2 5.2 -3 to 4 RL = 600Ω RL = 600Ω Vo = 0V Vo = 0V , RL = 600Ω CL = 15pF RL = 600Ω CL = 15pF , , RL = 600Ω CL = 15pF +3.6 -3.6 40 40 147 110 42 Unit mV V/mV mA V V V mA mA MHz V/μs Degrees 5/13 Electrical characteristics TSH93 Figure 2. Input offset voltage drift vs. temperature Figure 3. Static open loop voltage gain Figure 4. Large signal follower response Figure 5. Small signal follower response Figure 6. Open loop frequency response & phase shift Figure 7. Close loop frequency response 6/13 TSH93 Electrical characteristics Figure 8. Audio bandwidth frequency Figure 9. Response & phase shift (TSH93 vs. standard 15MHz audio op-amp) Gain flatness & phase shift vs. frequency Figure 10. Cross talk isolation vs. frequency (SO-14 package) Figure 11. Cross talk isolation vs. frequency (SO-14 package) 7/13 Printed circuit layout TSH93 Figure 12. Differential input impedance vs. frequency 4.5 4.0 3.5 Figure 13. Common input impedance vs. frequency 120 100 2.5 2.0 1.5 1.0 0.5 Zin-com (MW) 3.0 Zin-diff (kW) 80 60 40 20 1k 10k 100k 1M Frequency (Hz) 10M 100M 1k 10k 100k 1M Frequency (Hz) 10M 100M 4 Printed circuit layout As for any high frequency device, a few rules must be observed when designing the PCB to get the best performance from this high speed op-amp. From the most important to the least important point: ● ● ● ● ● Each power supply lead must be bypassed to ground with a 10nF ceramic capacitor very close to the device and a 10μF capacitor. To provide low inductance and low resistance common return, use a ground plane or common point return for power and signal. All leads must be wide and as short as possible especially for op-amp inputs. This is in order to decrease parasitic capacitance and inductance. Use small resistor values to decrease the time constant with parasitic capacitance. Choose component sizes as small as possible (SMD). On output, decrease capacitor load to avoid degradation in circuit stability which may cause oscillation. You can also add a serial resistor in order to minimize its influence. 8/13 TSH93 Macromodel 5 Macromodel Please consider the following remarks before using this macromodel. ● ● ● All models are a trade-off between accuracy and complexity (i.e. simulation time). Macromodels are not a substitute to breadboarding; rather, they confirm the validity of a design approach and help to select surrounding component values. A macromodel emulates the nominal performance of a typical device within specified operating conditions (temperature, supply voltage, for example). Thus the macromodel is often not as exhaustive as the datasheet, its purpose is to illustrate the main parameters of the product. Data derived from macromodels used outside of the specified conditions (VCC, temperature, for example) or even worse, outside of the device operating conditions (VCC, Vicm, for example), is not reliable in any way. This macromodel applies to: TSH93I ** Standard Linear Ics Macromodels, 1997. ** CONNECTIONS : * 1 INVERTING INPUT * 2 NON-INVERTING INPUT * 3 OUTPUT * 4 POSITIVEPOWER SUPPLY * 5 NEGATIVE POWER SUPPLY .SUBCKT TSH93 1 3 2 4 5(analog) ******************************************************** .MODEL MDTH D IS=1E-8 KF=1.809064E-15 CJO=10F * INPUT STAGE CIP 2 5 1.000000E-12 CIN 1 5 1.000000E-12 EIP 10 5 2 5 1 EIN 16 5 1 5 1 RIP 10 11 2.600000E-01 RIN 15 16 2.600000E-01 RIS 11 15 3.645298E-01 DIP 11 12 MDTH 400E-12 DIN 15 14 MDTH 400E-12 VOFP 12 13 DC 0.000000E+00 VOFN 13 14 DC 0 IPOL 13 5 1.000000E-03 CPS 11 15 2.986990E-10 DINN 17 13 MDTH 400E-12 VIN 17 5 2.000000e+00 DINR 15 18 MDTH 400E-12 VIP 4 18 1.000000E+00 FCP 4 5 VOFP 3.500000E+00 FCN 5 4 VOFN 3.500000E+00 FIBP 2 5 VOFP 1.000000E-02 FIBN 5 1 VOFN 1.000000E-02 * AMPLIFYING STAGE FIP 5 19 VOFP 2.530000E+02 FIN 5 19 VOFN 2.530000E+02 9/13 Package information RG1 19 5 3.160721E+03 RG2 19 4 3.160721E+03 CC 19 5 2.00000E-09 DOPM 19 22 MDTH 400E-12 DONM 21 19 MDTH 400E-12 HOPM 22 28 VOUT 1.504000E+03 VIPM 28 4 5.000000E+01 HONM 21 27 VOUT 1.400000E+03 VINM 5 27 5.000000E+01 *********************** RZP1 5 80 1E+06 RZP2 4 80 1E+06 GZP 5 82 19 80 2.5E-05 RZP2H 83 4 10000 RZP1H 83 82 80000 RZP2B 84 5 10000 RZP1B 82 84 80000 LZPH 4 83 3.535e-02 LZPB 84 5 3.535e-02 EOUT 26 23 82 5 1 VOUT 23 5 0 ROUT 26 3 35 COUT 3 5 30.000000E-12 DOP 19 25 MDTH 400E-12 VOP 4 25 2.361965E+00 DON 24 19 MDTH 400E-12 VON 24 5 2.361965E+00 .ENDS TSH93 6 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 10/13 TSH93 Figure 14. SO-14 package mechanical data Dimensions Ref. Min. A a1 a2 b b1 C c1 D E e e3 F G L M S 3.8 4.6 0.5 8.55 5.8 1.27 7.62 4.0 5.3 1.27 0.68 8° (max.) 0.149 0.181 0.019 8.75 6.2 0.35 0.19 0.5 45° (typ.) 0.336 0.228 0.1 Millimeters Typ. Max. 1.75 0.2 1.65 0.46 0.25 0.013 0.007 0.003 Min. Package information Inches Typ. Max. 0.068 0.007 0.064 0.018 0.010 0.019 0.344 0.244 0.050 0.300 0.157 0.208 0.050 0.026 11/13 Ordering information TSH93 7 Ordering information Table 5. Order codes Temperature range Package SO-14 -40°C, +125°C TSH93IYD TSH93IYDT(1) SO-14 (Automotive grade level) Tube or Tape & reel H93Y Packaging Tube or Tape & reel Marking H93 Part number TSH93ID TSH93IDT 1. Qualification and characterization according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC Q001 & Q 002 or equivalent are on-going. 8 Revision history Table 6. Date 31-Oct-2000 1-Aug- 2005 Document revision history Revision 1 3 First release. PPAP references inserted in the datasheet see Order Codes table on page 1. Added ESD parameters in Table 1: Absolute maximum ratings (AMR). PPAP footnote inserted in the datasheet see Table 5: Order codes on page 12. Changes 24-Oct -2007 3 12/13 TSH93 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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