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TSL1018IF

TSL1018IF

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TQFP48_EP

  • 描述:

    IC BUFFER 18+1CH TFT-LCD 48-TQFP

  • 数据手册
  • 价格&库存
TSL1018IF 数据手册
TSL1018 18 + 1 channel buffer for TFT-LCD panels Features ■ Wide supply voltage: 5.5V to 16.8V ■ Low operating current: 8mA typical at 25°C ■ Bandwidth at -3dB: 3.5MHz ■ High output current COM amplifier: ±150mA ■ Industrial temperature range: -40°C to +95°C ■ Small package: TQFP48 ePad QFP48 P48 ePad 7 x 7mm TQFP48 Pin connections nnections (top (t view) Application COMi VSS VDD VSS TFT liquid crystal display (LCD) VDD CO COMo ■ ) s ( t c u d o r P e t e l o s b -O 4 46 45 44 43 42 41 40 39 38 37 48 47 Description The TSL1018 is composed of 18 + 1 channel ence nc buffers which are used to buffer the reference lm m transistor transis voltage for gamma correction in thin film D). (TFT) liquid crystal displays (LCD). 2 e to deliver high output One "COM" amplifier is able 50mA. mA. Amplifie Ampli current value, up to ±150mA. Amplifiers A and B gle supply in inpu feature positive single inputs for common hus s can be u use mode voltage, thus used for highest ages. The amp gamma voltages. amplifiers C to R inclusive, amplifier amp and the COM amplifier, feature negative single plyy inputs and an are dedicated to the lowest supply gamma mma voltage volt voltages. 6 M 33 L K 32 J 31 I 7 30 VSS H VDD 8 29 VDD G F 9 28 E 10 27 D C 11 26 B 12 14 15 16 17 18 19 20 VDD Rev 2 25 A 13 The TSL1018 TS TSL is fully characterized and gu guara guaranteed over a wide industrial temperature range (-40 to +95°C). July 2008 34 N 5 VSS 35 O 4 so Ob P 21 22 23 24 VSS Pr ) s t( 36 Q 3 uc od e t e l R 1 1/15 www.st.com 15 Absolute maximum ratings and operating conditions 1 TSL1018 Absolute maximum ratings and operating conditions Table 1. Absolute maximum ratings Symbol Parameter VDD Supply voltage VIN Input voltage IOUT Output current (A to R buffers) Output current (COM buffer) Value Unit 18 V VSS -0.5V to VDD +0.5V V 40 150 mA Thermal resistance junction to ambient for TQFP48 ePad not thermally connected to PCB ePad thermally connected to PCB ) s ( t c du 85 36 °C/W °C Power dissipation(1) for TQFP48 ePad ePad not thermally connected to PCB ePad thermally connected to PCB 1470 3470 mW TLEAD Lead temperature (soldering 10 seconds) 260 °C TSTG Storage temperature -65 to +150 °C TJ Junction temperature 150 °C RTHJA PD Human body model (HBM)(2) (MM)(3) Machine model ESD o r P e t e l o s b -O Charged device model odel del (CDM) ) s t( 2000 200 (4) V 1500 1. PD is calculated with Tambb = 25°C, TJ = 150 150°C and RTHJA . 2. Human body model: a 100pF capacitor capacit capa is charged to the specified voltage, then discharged through a 1.5kΩ resistor between etween en two pins of o the device. This is done for all couples of connected pin combinations while the other er pins are floating. floa floating c u d 3. Machine e model: odel: a 200pF 200 capacitor is charged to the specified voltage, then discharged directly between device with no external series resistor (internal resistor < 5Ω). This is done for all couples of two pins of the dev onnected nnected pin combinations com c connected while the other pins are floating. o r P 4. Charged Charge device dev model: all pins and package are charged together to the specified voltage and then discha discharge discharged directly to the ground through only one pin. e t e ol Tab 2. Table bs O Symbol Parameter Value Unit VCC Supply voltage (VDD - VSS) 5.5 to 16.8 V Tamb Ambient temperature -40 to +95 °C VIN 2/15 Operating conditions Input voltages for buffers A & B VSS + 1.5V to VDD Input voltages for buffers C to R & COM VSS to VDD - 1.5V V TSL1018 2 Typical application schematics Typical application schematics Figure 1. Typical application schematic for the TSL1018 Vcc 8 16 29 41 43 + Cs VDD R1 10uF 20 A 19 Gamma 17 R2 21 Gnd B 17 Gamma 16 R3 22 R4 R5 24 R6 25 R7 26 R8 27 R9 28 R10 31 R11 32 R12 ) s t( c u d o r P e t e l o R13 R 15 ) s ( t c u d o r P e t e l o s b -O 23 33 34 C D E F G H 14 13 12 11 10 9 I 6 J K 5 4 L M 3 Gamma 15 Gamma 14 Gamma 13 Gamma 12 Gamma ma 11 To colunm driver Gamma 10 Gamma 9 Gamma 8 Gamma 7 Gamma 6 Gamma 5 R14 35 N 2 Gamma 4 R15 36 O 1 Gamma 3 R16 37 P 48 Gamma 2 R17 38 Q 47 Gamma 1 R18 39 R 46 Gamma 0 R19 s b O Gnd Com Ref. Voltage 40 COM 45 VCOM VSS 7 18 30 42 44 TSL1018 Gnd Note that: ● Amplifiers A & B have their input voltages in the range VSS+1.5V to VDD. This is why they must be used for high level gamma correction voltages. ● Amplifiers C to R have their input voltages in the rangeVSS to VDD-1.5V. This is why they must be used for medium-to-low level gamma correction voltages. ● Amplifier COM has its input voltage range from VSS toVDD-1.5V. 3/15 Electrical characteristics TSL1018 3 Electrical characteristics Table 3. Electrical characteristics for Tamb = 25°C , VDD = +5V, VSS = -5V, RL = 10kΩ, CL = 10pF (unless otherwise specified) Symbol Parameter Test conditions VIO Input offset voltage VICM = 0V ΔVIO Input offset voltage drift -40°C < Tamb < +85°C IIB Input bias current VICM = 0V, buffers A & B VICM = 0V, buffers C to R & COM RIN Input impedance CIN Input capacitance VOL Output voltage low IOUT = -5mA Buffers C to P Buffers Q, R & COM VOH Output voltage high IOUT = 5mA for buffers A & B IOUT Output current Power supply rejection ratio VCC= 6.5 to 15.5V 5V ICC Supply current No load SR Slew rate (rising & falling edge) 4 -4V < VOUT UT < +4V 20% to 8 80% Settling time Settling tto 0.1%, VOUT=2V step BW Bandwidth at -3dB Gm Cs ts ) s t( c u d o r eP s b O Unit 12 mV μV/°C nA ) s ( t c u d o r P 1 G GΩ Ω 1.35 pF -4.85 85 -4.92 4.82 -4.80 -4 -4.85 4 4.8 4.87 V V ±40 mA ±150 80 100 8 dB 11 mA 1.1 V/μs 5 μs RL=10kΩ, CL=10pF 3.5 MHz Phase margin in RL=10kΩ, CL=10pF 60 degrees Channel nel separation f=1MHz 75 dB t e l o Note: Max. 140 70 COM buffer PSRR Typ. 5 e t e l o s b -O (A to R buffers) 4/15 Min. Limits are 100% production tested at 25°C. Behavior at the temperature range limits is guaran gua guaranteed through correlation and by design. TSL1018 Figure 2. Electrical characteristics Supply current vs. supply voltage for various temperatures Figure 3. 1.0 Output offset voltage (mV) Current consumption (mA) 12 Output offset voltage (eq. VIO) vs. temperature T AM B = -40°C 10 T AM B = + 25°C 8 V C C = 5.5V , 10V , 16.8V 0.5 0.0 -0.5 T AM B =+ 95°C 6 6 8 10 12 14 16 P ow er supply voltage (V ) Figure 4. 60 ) s t( c u d o r P e t e l o s Ob 40 Figure 5. 20 80 -20 0 20 0 40 60 80 60 40 20 0 -40 80 -20 Outp Output current cu capability vs. temp tem temperature Figure 7. 80 150 60 100 50 V C C =5.5V V CC =10V V CC =16.8V -50 40 60 80 Output current capability vs. temperature 20 0 V C C = 10V , 16.8V V C C =5.5V -20 -40 Buffers A & B -60 -200 -40 -80 -40 0 20 40 -150 -20 0 Am bient Tem perature (°C ) Output current (mA) Output current (mA) 60 Buffers C to C O M V C C = 5.5V, 10V , 16.8V 100 200 -100 ) s ( ct 40 Input current urrent (IIB) vs vs. temperature Am bient Tem perature pe (°C ) 0 20 120 Buffers A & B V C C =5.5V, 10V, 16.8V 80 Figure 6. 0 u d o r P e t e l o s b -O Input current (IIB) vs. temperature 100 0 -40 -20 Am bient Tem perature re (°C (° ) 120 Input bias current (nA) -1.0 -40 18 Input bias s current curre (nA) 4 20 40 60 Am bient Tem perature (°C) 80 B uffers C to R -20 0 20 40 60 80 A m bient Tem perature (°C ) 5/15 Electrical characteristics Figure 8. TSL1018 Output current capability vs. temperature Figure 9. High level voltage drop vs. temperature 200 High level voltage drop (mV) Output current (mA) 200 100 0 V CC =10V, 16.8V V CC =5.5V -100 Buffer COM V C C =16.8V 150 100 V CC =10V V C C = 5.5V 50 Buffers A & B Iout= 5m A ) s ( ct -200 -40 -20 0 20 40 60 0 -40 80 Ambient Temperature (°C) 0 60 80 u d o r P e t e l o s b -O V CC = 5.5V 160 120 ) s t( c u d o r P e let 80 0 -40 V CC = 10V, 16.8V Low level voltage age drop dro (mV) 120 40 Buffers Q & R Iout = 5m A -20 0 20 40 60 80 V CC = 5.5V 100 80 60 V CC = 10V, 16.8V 40 Buffer CO M Iout = 5m A 20 0 -40 100 -20 0 Figure ure 12. Vo Voltage Voltag output high (VOH) vs. ou output current - buffers A & B o s Ob 20 40 60 80 100 Tem perature (°C) Tem em perature (°C) Figure 13. Voltage output high (VOH) vs. output current - buffers A & B 10.0 High level output voltage (V) 5.5 High level output voltage (V) 40 Figure 11. Low level vel voltage dr drop vs. mperature atur temperature 200 T AM B =-40°C 5.0 4.5 T AM B =+25°C 4.0 9.8 T AM B =-40°C T AM B =+25°C 9.6 9.4 T AM B =+95°C 9.2 B uffers A & B V CC = 5.5V Buffers A & B V CC = 10V T AM B =+95°C 3.5 9.0 0 5 10 15 20 O utput current (m A) 6/15 20 Am bient Tem perature re (°C ) Figure 10. Low level voltage drop vs. temperature Low level voltage drop (mV) -20 25 30 0 5 10 15 20 O utput current (m A) 25 30 TSL1018 Electrical characteristics Figure 14. Voltage output high (VOH) vs. output current - buffers A & B Figure 15. Voltage output low (VOL) vs. output current - buffers C to P 1.2 Low level output voltage (V) High level output voltage (V) 16.8 T AM B =-40°C 16.6 T AMB =+25°C 16.4 T AMB =+95°C 16.2 16.0 5 10 0.8 T AM B =+25°C 0.6 0.4 T AM B =-40°C 0.2 Buffers A & B V CC = 16.8V 0 Buffers C to P V CC = 5.5V T A M B =+95°C 1.0 15 20 25 Output current (m A) 0.0 -30 30 -25 -20 -15 ) s ( ct -10 O utput current (m A A) -5 0 u d o r P e t e l o s b -O Figure 16. Voltage output low (VOL) vs. output Figure 17. Voltage e output low lo (VOL) vs. output rentt - buffers buffe C to P current - buffers C to P current 1.2 Buffers C to P V C C = 10V T A M B =+95°C 1.0 0.8 T A M B = +25°C 0.6 ) s t( c u d o r P e t e l o s Ob 0.4 Low level output ut voltage volta (V) Low level output voltage (V) 1.2 T A M B =-40°C 0.2 0.0 -30 -25 -20 0 -15 -10 -5 Buffers C to P V CC = 16.8V 1.0 T A M B =+95°C 0.8 T A M B =+25°C 0.6 0.4 T A M B =-40°C 0.2 0.0 -30 0 -25 O utput utp current (m A) -20 -15 -10 -5 0 O utput current (m A) Figure ure 18. Voltage Vo Voltag output low (VOL) vs. output Figure 19. Voltage output low (VOL) vs. output cu current - buffer Q, R & COM current - buffer Q, R & COM 2.0 B uffers Q , R & C O M V CC = 5.5V 1.2 Low level output voltage (V) Low level output voltage (V) 1.6 T AM B =+95°C T AM B =+25°C 0.8 0.4 T AM B =+95°C Buffers Q , R & C O M V CC = 10V 1.5 T AM B =+25°C 1.0 0.5 T AM B =-40°C T AM B =-40°C 0.0 -50 -40 -30 -20 O utput current (m A) -10 0 0.0 -100 -80 -60 -40 -20 0 O utput current (m A) 7/15 Electrical characteristics TSL1018 Figure 20. Voltage output low (VOL) vs. output Figure 21. Positive slew rate vs. temperature current - buffer Q, R & COM 2.0 Buffers Q , R & CO M V CC = 16.8V Positive Slew Rate (V/μs) Low level output voltage (V) 2.0 T AM B =+95°C 1.5 T AM B =+25°C 1.0 0.5 1.5 V C C = 16.8 V V C C = 10V 1.0 V C C = 5.5V 0.5 T AM B =-40°C ) s ( ct B u ffers A & B -80 -60 -40 -20 0.0 -4 0 0 0 20 40 2.0 80 Figure 23. Positive ve e slew rat rate vs vs. temperature 2.0 V C C = 16.8V 1.5 1.0 V C C = 10V V C C = 5.5 V 0.5 ) s t( c u d o r P V C C = 10V 1.5 V C C = 16.8V 1.0 V C C = 5.5 V 0.5 B uffer C O M B uffers C to R 0.0 -40 60 u d o r P e t e l o s b -O Figure 22. Positive slew rate vs. temperature Positive Slew rate (V/μs) -20 A m bient Tem peratu re (°C ) Output current (m A) Positive Slew Rate Ra (V/μs) 0.0 -100 -2 0 0 20 40 60 0.0 -40 80 -20 A m bient ient Tem p erature e (°C ) e t e l o s b O 0 20 40 60 80 A m bien t tem perature (°C ) Figure 24.. Nega Negative slew rate vs. temperature Figure 25. Negative slew rate vs. temperature 1.5 2.0 Negative Slew Rate (V/μs) Negative Slew Rate (V/μs) s) 0 2.0 V C C =16.8V V C C =10V 1.0 V C C = 5.5V 0.5 1.5 1.0 V C C =5.5V 0.5 B uffers A & B 0.0 -40 -20 0 20 40 60 A m b ien t T em perature (°C ) 8/15 V C C =16.8V V C C =10V 80 B uffers C to R 0.0 -40 -20 0 20 40 60 A m bient Tem peratu re (°C ) 80 TSL1018 Electrical characteristics Figure 26. Negative slew rate vs. temperature Figure 27. Large signal response buffers A & B 4 3 1.5 V C C =16.8V V C C =10V 2 Vout (V) Negative Slew Rate (V/μs) 2.0 1.0 Buffers A & B V CC =10V T AMB =+25°C Z L=10k Ω //16pF 1 0 -1 V C C =5.5V 0.5 -2 ) s ( ct -3 B uffer C O M 0.0 -40 -4 -20 0 20 40 60 0 1 Figure 28. Large signal response buffers A & B 3 4 5 6 5 6 5 6 u d o r P e t e l o s b -O Figure 29. Large signal resp respon response fers C to R buffers 4 4 3 Buffers A & B V CC =10V T AMB =+25°C Z L=10k Ω //16pF 2 1 0 ) s t( c u d o r P e t e l o s Ob -1 2 Vout (V) 3 0 -2 -2 -3 -3 -1 0 1 2 3 4 5 Buffers C to R V CC =10V T AMB =+25°C Z L=10k Ω //16pF 1 -1 -4 -4 6 -1 0 1 Time i (μs) 3 Buffers C to R V CC=10V T AMB=+25°C ZL=10k Ω //16pF Vout (V) 2 0 1 0 -1 -1 -2 -2 -3 -3 -4 -1 0 1 2 3 Time (μs) 4 5 4 4 3 1 3 Figure 31. Large signal response buffer COM 4 2 2 Time (μs) Figure ure 30. Large La signal response bu buffers C to R Vout (V) 2 Time (μs) A m bient Tem perature (°C ) Vout (V) -1 80 6 -4 -1 Buffer COM VCC=10V T AMB=+25°C ZL=10kΩ //16pF 0 1 2 3 4 Time (μs) 9/15 Electrical characteristics TSL1018 Figure 32. Large signal response buffer COM Figure 33. Small signal response buffers A & B 0.15 4 3 1 Buffers A & B V CC =10V T AMB=+25°C Z L=10k Ω //16pF V e=100mV pp 0.05 Vout (V) Vout (V) 0.10 Buffer COM V CC =10V T AMB =+25°C Z L=10k Ω //16pF 2 0 -1 0.00 -0.05 -2 -0.10 -3 0 1 2 3 4 5 6 0 7 1 2 Time (μs) Time (μs) Figure 34. Small signal response buffers C to R 3 u d o r P e t e l o s b -O Figure 35. Small signal response resp respon buffer fer COM 0.15 0.15 0.10 0.10 Buffers C to R V CC=10V T AMB=+25°C Z L=10k Ω //16pF V e=100mV pp 0.05 0.00 ) s t( c u d o r P e t e l o s Ob 0.00 -0.05 -0.05 -0.10 -0.10 -0.15 0 1 Buffer COM V CC=10V T AMB=+25°C Z L=10k Ω //16pF V e=100mV pp 0.05 Vout (V) -1 Vout (V) ) s ( ct -0.15 -4 2 -0.15 3 0 1 Time (μs) T 2 3 Time (μs) Figure ure 36. Output Ou Outpu voltage response to current Figure 37. Output voltage response to current tra transient - buffers A & B transient - buffers A & B 2.0 Buffers A & B V CC =10V T AMB=+25°C Δ I=0mA to 30mA 1.5 1.0 0.0 Vout (V) Vout (V) 0.5 0.5 -0.5 Buffers A & B V CC=10V T AMB=+25°C Δ I=30mA to 0mA -1.0 0.0 -0.5 -1 0 1 Time (μs) 10/15 2 3 -1.5 -1 0 1 Time (μs) 2 3 TSL1018 Figure 38. Electrical characteristics Output voltage response to current Figure 39. Output voltage response to current transient - buffers C to R transient - buffers C to R 0.5 2.0 Buffers C to R V CC=10V T AMB=+25°C Δ I=0mA to 30mA 1.0 0.0 Vout (V) Vout (V) 1.5 0.5 -0.5 Buffers C to R V CC =10V T AMB=+25°C Δ I=30mA to 0mA mA -1.0 0.0 -1.5 -1 -0.5 -1 0 1 2 3 0 ) s ( ct 1 2 Time (μs) Time (μs) 3 u d o r P e t e l o s b -O Figure 40. Output voltage response to current Figure 41. Output voltage respo response re to current sient nt - buf buffer COM transient - buffer COM transient 1 Buffer COM V CC =10V T AMB =+25°C Δ I=0mA to 100mA 4 Vout (V) 3 2 ) s t( c u d o r P e t e l o s Ob 0 -1 Vout (V) 5 -2 1 -3 0 -4 -1 0 2 4 6 Buffer COM V CC =10V T AMB =+25°C Δ I=100mA to 0m A -5 8 0 2 Time (μs) Ti Ou Outp Output voltage response to current tra transient - buffer COM 1 6 0 5 -1 4 -2 -3 Buffer COM V CC =10V T AMB=+25°C Δ I=100mA to -100mA -4 -5 0 5 10 Time (μs) 15 20 8 Buffer COM V CC =10V T AMB =+25°C Δ I=-100mA to +100mA 3 2 1 0 -6 -5 6 Figure 43. Output voltage response to current transient - buffer COM Vout (V) Vout (V) Figure ure 42. 4 Time (μs) 25 -1 -5 0 5 10 15 20 25 30 Time (μs) 11/15 Package information 4 TSL1018 Package information In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. Table 4. TQFP48 ePad package mechanical data Dimensions Ref. Min. Typ. A 0.05 A2 0.95 1.00 b 0.17 0.22 c 0.09 D 8.80 9.00 D1 6.80 7.00 ) s t( c u d o r P e let 2.00 D3 so Ob Max. Min. Typ. Max. M 0.047 0.15 0.002 02 0.006 1.05 0.037 0.039 0.041 0.27 0.007 0.0 0.009 0.011 0.20 .20 0.004 9.20 0.346 0.354 0.362 7.20 7 0.268 0.276 0.283 0.008 0.079 5.50 5.5 0.217 E 8.80 9.00 9.20 0.346 0.354 0.362 E1 6.80 6. 7.00 7.20 0.268 0.276 0.283 E2 2.00 0.079 E3 5.50 0.217 e 0.50 0.020 L 0.45 L1 k ccc 12/15 Inches 1.20 A1 D2 ) s ( t c u d o r P e t e l o s b -O Millimeters 0.60 0.75 0.018 1.00 0° 3.5° 0.024 0.030 0.039 7° 0.08 0° 3.5° 7° 0.003 TSL1018 Package information Figure 44. TQFP48 ePad package drawing O o s b ) s t( c u d o r P e let ) s ( t c u d o r P e t e l o s b -O 13/15 Ordering information 5 TSL1018 Ordering information Table 5. Order codes Part number Temperature range Package -40°C to +95°C TQFP48 ePad Packing TSL1018IF Tray SL1018I TSL1018IFT 6 Tape & reel Revision history Revision Changes 22-Mar-2007 1 Initial release. 15-Jul-2008 2 imum values in Table 3. Modified ICC typical and maximum ure 2 to Fig Figure 4 Updated all curves (Figure 43). d device evice model mod value v Added ESD charged in Table 1. t e l o s b s ( t c u d o r P e t e l o s b O ) s ( ct u d o r P e Date O ) 14/15 Marking TSL1018 ) s ( t c u d o r P e t e l o s b -O Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries reserve the ubsidiaries (“ST”) (“ right to make changes, corrections, modifications or improvements, to this document, and the products and services herein at any vices described des time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and herein, and ST assumes no nd services described d liability whatsoever relating to the choice, selection or use of the ST products and services ces described describ herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rty rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed d a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered d as a warranty warrant covering the use in any manner whatsoever of such third party products or services or any intellectual property contained ed therein. ) s t( c u d o r P e t e l o s Ob UNLESS OTHERWISE SET FORTH IN ST’S TERMS CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED S AND C WARRANTY WITH RESPECT TO THE USE AND/OR S SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS ESS FOR A P OF ANY JURISDICTION), OR INFRINGEMENT ENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT D IN WRIT RECOMMENDED, AUTHORIZED WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING D OR WARR APPLICATIONS, NOR IN PRODUCTS OR O SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY ROPERTY OR O ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. US Resale off ST products produ with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any g liability iability of ST. ST ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 15/15
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