TSV731ICT

TSV731, TSV732, TSV734 High accuracy (200 μV) micropower 60 μA, 900 kHz 5 V CMOS operational amplifiers Datasheet - preliminary data Benefits Single (TSV731) • Higher accuracy without calibration • Energy saving • Guaranteed operation on low-voltage battery SC70-5 Related products • See the TSV71 series (150 kHz for 14 μA) for more power savings Dual (TSV732) Applications • Battery powered applications DFN8 2x2 MiniSO-8 • Portable devices • Signal conditioning Quad (TSV734) • Active filtering • Medical instrumentation Description QFN16 3x3 The TSV73x series of single, dual, and quad operational amplifiers offer low-voltage operation, rail-to-rail input and output, and excellent accuracy (Vio lower than 200 μV at 25 ° C). TSSOP14 These devices benefit from STMicroelectronics® 5 V CMOS technology and offer an excellent speed/power consumption ratio (900 kHz typical gain bandwidth) while consuming 60 μA typical at 5 V. The TSV73x series also feature an ultra-low input bias current. Features • Low offset voltage: 200 µV max. • Low power consumption: 60 µA at 5 V • Low supply voltage: 1.5 V to 5.5 V The single version (TSV731), the dual version (TSV732), and the quad version (TSV734) are housed in the smallest industrial packages. • Gain bandwidth product: 900 kHz typ. • Low input bias current: 1 pA typ. These characteristics make the TSV73x family ideal for sensor interfaces, battery-powered and portable applications, and active filtering. • Rail-to-rail input and output • EMI hardened operational amplifiers • High tolerance to ESD: 4 kV HBM • Extended temperature range: -40 to +125 °C March 2013 DocID023708 Rev 2 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. 1/29 www.st.com 29 Contents TSV731, TSV732, TSV734 Contents 1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 4 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5 4.1 Operating voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.2 Rail-to-rail input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.3 Rail-to-rail output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.4 Input offset voltage drift over temperature . . . . . . . . . . . . . . . . . . . . . . . . 16 4.5 Long-term input offset voltage drift . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.6 Initialization time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.7 PCB layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.8 Macromodel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.1 SC70-5 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.2 DFN8 2x2 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.3 MiniSO-8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.4 QFN16 3x3 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.5 TSSOP14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 2/29 DocID023708 Rev 2 TSV731, TSV732, TSV734 Pin connections Figure 1. Pin connections (top view) Single  9&& ,1   9&&   ,1   287 SC70-5 (TSV731) Dual 287   9&& 287 9&& ,1   287 ,1 287 ,1   ,1 ,1 ,1 9&&   ,1 9&& ,1 DFN8 2x2 (TSV732) MiniSO-8 (TSV732)  1&  ,1  287 287 ,1    1&     ,1 9&&  287  287 ,1 ,1 Quad ,1 1 Pin connections  ,1  9&&  1&  ,1 QFN16 3x3 (TSV734) TSSOP14 (TSV734) 1. The exposed pads of the QFN16 3x3 can be connected to VCC- or left floating. DocID023708 Rev 2 3/29 Absolute maximum ratings and operating conditions 2 TSV731, TSV732, TSV734 Absolute maximum ratings and operating conditions Table 1. Absolute maximum ratings (AMR) Symbol VCC Vid Vin Iin Tstg Rthja Rthjc Tj Parameter Supply voltage (2) ±VCC V (3) VCC- - 0.2 to VCC++ 0.2 (4) 10 mA -65 to +150 °C Input voltage Storage temperature Thermal resistance junction-to-ambient SC70-5 DFN8 2x2 MiniSO8 QFN16 3x3 TSSOP14 (5)(6) 205 120 190 45 100 °C/W Thermal resistance junction-to-case DFN8 2x2 33 Maximum junction temperature 150 °C 4 kV HBM: human body ESD Unit 6 Differential input voltage Input current Value (1) model(7) MM: machine model for TSV731(8) 150 MM: machine model for TSV732(8) 200 MM: machine model for TSV734(8) CDM: charged device model except V 300 MiniSO8(9) 1.5 (9) 1.3 CDM: charged device model for MiniSO8 Latchup immunity 200 kV mA 1. All voltage values, except the differential voltage are with respect to the network ground terminal. 2. The differential voltage is a non-inverting input terminal with respect to the inverting input terminal. The TSV732 and TSV734 devices include an internal differential voltage limiter that clamps internal differential voltage at 0.5 V. 3. VCC - Vin must not exceed 6 V, Vin must not exceed 6 V. 4. Input current must be limited by a resistor in series with the inputs. 5. Short-circuits can cause excessive heating and destructive dissipation. 6. Rth are typical values. 7. Human body model: 100 pF discharged through a 1.5 kΩ resistor between two pins of the device, done for all couples of pin combinations with other pins floating. 8. Machine model: a 200 pF cap is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5 Ω), done for all couples of pin combinations with other pins floating. 9. Charged device model: all pins plus package are charged together to the specified voltage and then discharged directly to ground. 4/29 DocID023708 Rev 2 TSV731, TSV732, TSV734 Absolute maximum ratings and operating conditions Table 2. Operating conditions Symbol Parameter VCC Supply voltage Vicm Common mode input voltage range Toper Operating free air temperature range Value 1.5 to 5.5 DocID023708 Rev 2 VCC- - 0.1 to VCC+ + 0.1 -40 to +125 Unit V °C 5/29 Electrical characteristics 3 TSV731, TSV732, TSV734 Electrical characteristics Table 3. Electrical characteristics at VCC+ = 1.8 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) Symbol Parameter Conditions Min. Typ. Max. Unit DC performance Vio ΔVio/ΔT Iio Iib Input offset voltage (Vicm = 0 V) T = 25 °C 200 -40 °C < T< 85 °C 500 -40 °C < T< 125 °C 650 (1) Input offset voltage drift -40 °C < T< 125 °C Input offset current (Vout = VCC/2) T = 25 °C 1 10(2) -40 °C < T< 125 °C 1 300(2) T = 25 °C 1 10(2) -40 °C < T< 125 °C 1 300(2) Input bias current (Vout = VCC/2) 4.5 Common mode rejection ratio 20 log (ΔVicm/ΔVio) Vicm = 0 V to VCC, Vout = VCC/2, RL > 1 MΩ T = 25 °C 72 -40 °C < T< 125 °C 66 Avd Large signal voltage gain Vout = 0.5 V to (VCC - 0.5 V) T = 25 °C 105 -40 °C < T< 125 °C 90 VOH High level output voltage (VOH = VCC - Vout) T = 25 °C 75 -40 °C < T< 125 °C 80 T = 25 °C 40 -40 °C < T< 125 °C 60 CMR VOL Low level output voltage Isink (Vout = VCC) Iout Isource (Vout = 0 V) ICC 6/29 Supply current (per channel, Vout = VCC/2, RL > 1 MΩ) T = 25 °C 6 -40 °C < T< 125 °C 4 T = 25 °C 5 -40 °C < T< 125 °C 3 T = 25 °C -40 °C < T< 125 °C DocID023708 Rev 2 μV μV/°C pA 90 dB mV 12 mA 7 58 70 85 µA TSV731, TSV732, TSV734 Electrical characteristics Table 3. Electrical characteristics at VCC+ = 1.8 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) (continued) Symbol Parameter Conditions Min. Typ. 700 850 Max. Unit AC performance GBP Gain bandwidth product Fu Unity gain frequency Φm Phase margin Gm Gain margin SR Slew rate(3) en Equivalent input noise voltage tinit Initialization time(4) RL = 10 kΩ, CL = 100 pF RL = 10 kΩ, CL = 100 pF, Vout = 0.5 V to VCC - 0.5 V kHz 650 45 Degrees 12 dB 0.35 V/μs f = 1 kHz 35 f = 10 kHz 32 nV -----------Hz T = 25 °C 5 -40 °C < T< 125 °C 60 ms 1. See Section 4.4: Input offset voltage drift over temperature. 2. Guaranteed by characterization. 3. Slew rate value is calculated as the average between positive and negative slew rates. 4. Initialization time is defined as the delay after power-up to guarantee operation within specified performances. Guaranteed by design. See Section 4.6: Initialization time. DocID023708 Rev 2 7/29 Electrical characteristics TSV731, TSV732, TSV734 Table 4. Electrical characteristics at VCC+ = 3.3 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) Symbol Parameter Conditions Min. Typ. Max. Unit DC performance Vio Input offset voltage T = 25 °C 200 -40 °C < T< 85 °C 500 -40 °C < T< 125 °C ΔVio/ΔT ΔVio 650 (1) Input offset voltage drift -40 °C < T< 125 °C Long-term input offset voltage drift T = 25 °C(2) 4.5 month (3) Input offset current (Vout = VCC/2) T = 25 °C 1 10 -40 °C < T< 125 °C 1 300(3) Iib Input bias current (Vout = VCC/2) T = 25 °C 1 10(3) -40 °C < T< 125 °C 1 300(3) CMR 83 76 dB Large signal voltage gain Vout = 0.5 V to (VCC - 0.5 V) T = 25 °C 105 -40 °C < T< 125 °C 90 VOH High level output voltage (VOH = VCC - Vout) T = 25 °C 75 -40 °C < T< 125 °C 80 T = 25 °C 40 -40 °C < T< 125 °C 60 Low level output voltage Isink (Vout = VCC) Iout Isource (Vout = 0 V) ICC 8/29 Supply current (per channel, Vout = VCC/2, RL > 1 MΩ) T = 25 °C 25 -40 °C < T< 125 °C 15 T = 25 °C 20 -40 °C < T< 125 °C 15 T = 25 °C -40 °C < T< 125 °C DocID023708 Rev 2 pA 100 Avd VOL μV/°C μV --------------------------- 0.3 Iio T = 25 °C Common mode rejection ratio 20 log (ΔVicm/ΔVio) Vicm = 0 V to VCC, Vout = VCC/2, -40 °C < T< 125 °C RL > 1 MΩ μV mV 40 mA 28 59 70 85 µA TSV731, TSV732, TSV734 Electrical characteristics Table 4. Electrical characteristics at VCC+ = 3.3 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) (continued) Symbol Parameter Conditions Min. Typ. 700 850 Max. Unit AC performance GBP Gain bandwidth product Fu Unity gain frequency Φm Phase margin Gm Gain margin SR Slew rate(4) en Equivalent input noise voltage tinit Initialization time(5) RL = 10 kΩ, CL = 100 pF RL = 10 kΩ, CL = 100 pF, Vout = 0.5 V to VCC - 0.5 V kHz 650 45 Degrees 15 dB 0.35 V/μs f = 1 kHz 35 f = 10 kHz 32 nV -----------Hz T = 25 °C 5 -40 °C < T< 125 °C 50 ms 1. See Section 4.4: Input offset voltage drift over temperature. 2. Typical value is based on the Vio drift observed after 1000h at 125 °C extrapolated to 25 °C using the Arrhenius law and assuming an activation energy of 0.7 eV. The operational amplifier is aged in follower mode configuration. See Section 4.5: Long-term input offset voltage drift. 3. Guaranteed by characterization. 4. Slew rate value is calculated as the average between positive and negative slew rates. 5. Initialization time is defined as the delay after power-up which guarantees operation within specified performances. Guaranteed by design. See Section 4.6: Initialization time. DocID023708 Rev 2 9/29 Electrical characteristics TSV731, TSV732, TSV734 Table 5. Electrical characteristics at VCC+ = 5 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) Symbol Parameter Conditions Min. Typ. Max. Unit DC performance Vio Input offset voltage T = 25 °C 200 -40 °C < T< 85 °C 500 -40 °C < T< 125 °C ΔVio/ΔT ΔVio 650 (1) Input offset voltage drift -40 °C < T< 125 °C Long-term input offset voltage drift T = 25 °C(2) 4.5 month (3) Input offset current (Vout = VCC/2) T = 25 °C 1 10 -40 °C < T< 125 °C 1 300(3) Iib Input bias current (Vout = VCC/2) T = 25 °C 1 10(3) -40 °C < T< 125 °C 1 300(3) T = 25 °C 80 CMR Common mode rejection ratio 20 log (ΔVicm/ΔVio) Vicm = 0 V to VCC, Vout = VCC/2, RL > 1 MΩ -40 °C < T< 125 °C 78 Supply voltage rejection ratio T = 25 °C 20 log (ΔVCC/ΔVio) VCC = 1.5 to 5.5 V, Vic = 0 V -40 °C < T< 125 °C 76 SVR Avd Large signal voltage gain Vout = 0.5 V to (VCC - 0.5 V) VOH VOL RL = 10 kΩ, T = 25 °C 105 RL = 10 kΩ, -40 °C < T< 125 °C 90 dB VRF = 100 mVRFpeak, f = 900 MHz 51(4) EMIRR = 20 log (VRFpeak/ΔVio) VRF = 100 mVRFpeak, f = 1800 MHz 61(4) VRF = 100 mVRFpeak, f = 2400 MHz 66(4) Iout Isource (Vout = 0 V) 10/29 74 EMI rejection ratio Isink (Vout = VCC) ICC 90 41(4) Low level output voltage Supply current (per channel, Vout = VCC/2, RL > 1 MΩ) T = 25 °C 75 -40 °C < T< 125 °C 80 T = 25 °C 40 -40 °C < T< 125 °C 60 T = 25 °C 40 -40 °C < T< 125 °C 25 T = 25 °C 40 -40 °C < T< 125 °C 25 T = 25 °C -40 °C < T< 125 °C DocID023708 Rev 2 pA 94 VRF = 100 mVRFpeak, f = 400 MHz High level output voltage (VOH = VCC - Vout) μV/°C μV --------------------------- 0.7 Iio EMIRR μV mV 68 mA 52 60 70 85 µA TSV731, TSV732, TSV734 Electrical characteristics Table 5. Electrical characteristics at VCC+ = 5 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) (continued) Symbol Parameter Conditions Min. Typ. 700 900 Max. Unit AC performance GBP Gain bandwidth product Fu Unity gain frequency Φm Phase margin Gm Gain margin SR Slew rate(5) ∫ en Low-frequency peak-to-peak Bandwidth: f = 0.1 to 10 Hz input noise en THD+N tinit Equivalent input noise voltage Total harmonic distortion + noise Initialization time(6) RL = 10 kΩ, CL = 100 pF RL = 10 kΩ, CL = 100 pF, Vout = 0.5 V to VCC - 0.5 V 48 Degrees 15 dB 0.35 V/μs 7 µVpp f = 1 kHz 35 f = 10 kHz 32 fin = 1 kHz, ACL = 1, RL = 100 kΩ, Vicm = (VCC - 1 V)/2, BW = 22 kHz, Vout = 0.5 Vpp kHz 700 nV -----------Hz 0.002 % T = 25 °C 5 -40 °C < T< 125 °C 50 ms 1. See Section 4.4: Input offset voltage drift over temperature. 2. Typical value is based on the Vio drift observed after 1000h at 125 °C extrapolated to 25 °C using the Arrhenius law and assuming an activation energy of 0.7 eV. The operational amplifier is aged in follower mode configuration. See Section 4.5: Long-term input offset voltage drift. 3. Guaranteed by characterization. 4. Tested on SC70-5 package. 5. Slew rate value is calculated as the average between positive and negative slew rates. 6. Initialization time is defined as the delay after power-up to guarantee operation within specified performances. Guaranteed by design. See Section 4.6: Initialization time. DocID023708 Rev 2 11/29 Electrical characteristics TSV731, TSV732, TSV734 Figure 2. Supply current vs. supply voltage at Vicm = VCC/2 Figure 3. Input offset voltage distribution at VCC = 5 V, Vicm = VCC/2  70  60  3RSXODWLRQ Supply current (µA) 80 50 T = 125 ˚C 40 T = -40 ˚C T = 25 ˚C 30 20 10 2.0 2.5   3.0 3.5 4.0 4.5 Supply voltage (V) 5.0   5.5           ,QSXWRIIVHWYROWDJH—9 Figure 4. Input offset voltage distribution at VCC = 3.3 V, Vicm = VCC/2 Figure 5. Input offset voltage temperature coefficient distribution    9&& 9 9LFP 9 7 ƒ& 9&& 9 9LFP 9 7 ƒ&  3RSXODWLRQ  3RSXODWLRQ   Vicm = VCC/2 0 1.5 9&& 9 9LFP 9 7 ƒ&                          ,QSXWRIIVHWYROWDJH—9        9LR Figure 6. Input offset voltage vs. input common mode voltage Figure 7. Input offset voltage vs. temperature   7 ƒ& 7 ƒ&  7 ƒ&      9&& 9 0D[LPXP9LR      9&& 9              ,QSXWFRPPRQPRGHYROWDJH9 12/29 ,QSXWRIIVHWYROWDJH—9 ,QSXWRIIVHWYROWDJHP9   DocID023708 Rev 2       7HPSHUDWXUHƒ&   TSV731, TSV732, TSV734 Electrical characteristics Figure 8. Output current vs. output voltage at VCC = 1.5 V Figure 9. Output current vs. output voltage at VCC = 5 V  6LQN  9  9 LG  9  9 LG   6LQN 2XWSXWFXUUHQWP$ 9&& 9   7 ƒ& 7 ƒ& 7 ƒ&          7 ƒ&  7 ƒ&     6RXUFH 9LG 9   Figure 10. Output current vs. supply voltage      *DLQ 7 ƒ&   7 ƒ& 7 ƒ&     *DLQG%  9LFP 9&&       7 ƒ& 3KDVH  7 ƒ&      N  Figure 12. Bode diagram at VCC = 5 V Figure 13. Closed-loop gain diagram vs. capacitive load   *DLQ   7 ƒ& 3KDVH     N   9&& 9 9LFP 9 &O S) *DLQ  7 ƒ& N 0 *DLQG% 7 ƒ& 3KDVHƒ   0 )UHTXHQF\+] 6XSSO\YROWDJH9   7 ƒ&   N   9&& 9 9LFP 9  &O S) *DLQ  7 ƒ& 6RXUFH 9LG 9  7 ƒ&      7 ƒ& 6LQN  9  9 LG 2XWSXWFXUUHQWP$  Figure 11. Bode diagram at VCC = 1.5 V   *DLQG%  2XWSXWYROWDJH9 2XWSXWYROWDJH9  9&& 9 7 ƒ&   6RXUFH 9LG 9   3KDVHƒ 2XWSXWFXUUHQWP$  )ROORZHUFRQILJXUDWLRQ  9&& 9 9LFP 9 &O S) &O S)  7 ƒ&       N )UHTXHQF\+] DocID023708 Rev 2 &O S) N N 0 )UHTXHQF\+] 0 13/29 Electrical characteristics TSV731, TSV732, TSV734 Figure 14. Positive slew rate Figure 15. Negative slew rate      7 ƒ& 2XWSXWYROWDJH9 2XWSXWYROWDJH9    7 ƒ&   7 ƒ&   9&& 9 9LFP 9FF &O S)     7LPH—V   7 ƒ&     Figure 16. Slew rate vs. supply voltage   7LPH—V  7 ƒ& 7 ƒ&  7 ƒ& 9&& 9 9LFP 9&& 7 ƒ& 6OHZUDWH9—V   7 ƒ&  &O S) 9LFP 9&& 9ORDG 9&&   7 ƒ&    7 ƒ&          6XSSO\YROWDJH9     Figure 18. 0.1 Hz to 10 Hz noise   )UHTXHQF\+]  Figure 19. THD+N vs. frequency   9&& 9 %: N+] 9LQ 9SS *DLQ  9LFP 9&& 7 ƒ& 9&& 9  9LFP 9 7 ƒ&  7+'1 ,QSXWYROWDJHQRLVH—9  Figure 17. Noise vs. frequency   7 ƒ&     9&& 9 9LFP 9&& &O S) 5O N 7 ƒ&       14/29    7LPHV   (   )UHTXHQF\+] DocID023708 Rev 2  TSV731, TSV732, TSV734 Electrical characteristics Figure 20. THD+N vs. output voltage Figure 21. Output impedance vs. frequency in closed-loop configuration   2XWSXWLPSHGDQFH 7+'1  ( 9&& 9 *DLQ  I N+] %: N+] 9LFP 9&& 7 ƒ& (   9&& 9 9LFP 9  *DLQ  9RVF P9506 7 ƒ&        2XWSXWYROWDJH9SS DocID023708 Rev 2 N N N 0 0 )UHTXHQF\+] 15/29 Application information TSV731, TSV732, TSV734 4 Application information 4.1 Operating voltages The TSV73x series of devices can operate from 1.5 V to 5.5 V. The parameters are fully specified for 1.8 V, 3.3 V, and 5 V power supplies. However, they are very stable in the full VCC range and several characterization curves show TSV73x device characteristics at 1.5 V. In addition, the main specifications are guaranteed in the extended temperature range from -40 °C to +125 °C. 4.2 Rail-to-rail input The TSV731, TSV732, and TSV734 devices have a rail-to-rail input, and the input common mode range is extended from VCC-- 0.1 V to VCC+ + 0.1 V. 4.3 Rail-to-rail output The output levels of the TSV73x operational amplifiers can go close to the rails: to a maximum of 40 mV below the upper rail and to a maximum of 75 mV above the lower rail when a 10 kΩ resistive load is connected to VCC/2. 4.4 Input offset voltage drift over temperature The maximum input voltage drift over the temperature variation is defined as the offset variation related to offset value measured at 25 °C. The operational amplifier is one of the main circuits of the signal conditioning chain, and the amplifier input offset is a major contributor to the chain accuracy. The signal chain accuracy at 25 °C can be compensated during production at application level. The maximum input voltage drift over temperature enables the system designer to anticipate the effect of temperature variations. The maximum input voltage drift over temperature is computed using Equation 1. Equation 1 ΔV io V io ( T ) – V io ( 25° C ) ------------ = max -------------------------------------------------ΔT T – 25° C with T = -40 °C and 125 °C. The datasheet maximum value is guaranteed by a measurement on a representative sample size ensuring a Cpk (process capability index) greater than 1.33. 16/29 DocID023708 Rev 2 TSV731, TSV732, TSV734 4.5 Application information Long-term input offset voltage drift To evaluate product reliability, two types of stress acceleration are used: • Voltage acceleration, by changing the applied voltage • Temperature acceleration, by changing the die temperature (below the maximum junction temperature allowed by the technology) with the ambient temperature. The voltage acceleration has been defined based on JEDEC results, and is defined using Equation 2. Equation 2 A FV = e β ⋅ ( VS – VU ) Where: AFV is the voltage acceleration factor β is the voltage acceleration constant in 1/V, constant technology parameter (β = 1) VS is the stress voltage used for the accelerated test VU is the voltage used for the application The temperature acceleration is driven by the Arrhenius model, and is defined in Equation 3. Equation 3 A FT = e Ea ⎛ 1 1 ------ ⋅ ------ – ------⎞ ⎝ T U T S⎠ k Where: AFT is the temperature acceleration factor Ea is the activation energy of the technology based on the failure rate k is the Boltzmann constant (8.6173 x 10-5 eV.K-1) TU is the temperature of the die when VU is used (K) TS is the temperature of the die under temperature stress (K) The final acceleration factor, AF, is the multiplication of the voltage acceleration factor and the temperature acceleration factor (Equation 4). Equation 4 A F = A FT × A FV AF is calculated using the temperature and voltage defined in the mission profile of the product. The AF value can then be used in Equation 5 to calculate the number of months of use equivalent to 1000 hours of reliable stress duration. DocID023708 Rev 2 17/29 Application information TSV731, TSV732, TSV734 Equation 5 Months = A F × 1000 h × 12 months ⁄ ( 24 h × 365.25 days ) To evaluate the op-amp reliability, a follower stress condition is used where VCC is defined as a function of the maximum operating voltage and the absolute maximum rating (as recommended by JEDEC rules). The Vio drift (in µV) of the product after 1000 h of stress is tracked with parameters at different measurement conditions (see Equation 6). Equation 6 V CC = maxV op with V icm = V CC ⁄ 2 The long term drift parameter (ΔVio), estimating the reliability performance of the product, is obtained using the ratio of the Vio (input offset voltage value) drift over the square root of the calculated number of months (Equation 7). Equation 7 V io drift ΔV io = -----------------------------( months ) where Vio drift is the measured drift value in the specified test conditions after 1000 h stress duration. 18/29 DocID023708 Rev 2 TSV731, TSV732, TSV734 4.6 Application information Initialization time The TSV73x series of devices use a proprietary trimming topology that is initiated at each device power-up and allows excellent Vio performance to be achieved. The initialization time is defined as the delay after power-up which guarantees operation within specified performances. During this period, the current consumption (ICC) and the input offset voltage (Vio) can be different to the typical ones. Figure 22. Initialization phase   ,QLWLDOL]DWLRQWLPH   9&& 3KDVH 3KDVH   9&& 9 9LFP 9 7 ƒ&  7\SLFDO,&&   9&&9  ,&&P$          7LPHPV The initialization time is VCC and temperature dependent. Table 6 sums up the measurement results for different supply voltages and for temperatures varying from -40 °C to 125 °C. Table 6. Initialization time measurement results Temperature: -40 °C VCC (V) 4.7 Temperature: 25 °C Temperature: 125 °C Tinit (ms) ICC phase 1 (mA) Tinit (ms) ICC phase 1 (mA) Tinit (ms) ICC phase 1 (mA) 1.8 37 0.33 3.2 0.40 0.35 0.46 3.3 2.9 1.4 0.95 1.3 0.34 1.2 5 2.4 3.2 0.85 2.4 0.31 2.9 PCB layouts For correct operation, it is advised to add a 10 nF decoupling capacitors as close as possible to the power supply pins. DocID023708 Rev 2 19/29 Application information 4.8 TSV731, TSV732, TSV734 Macromodel Accurate macromodels of the TSV73x devices are available on the STMicroelectronics’ website at www.st.com. These model are a trade-off between accuracy and complexity (that is, time simulation) of the TSV73x operational amplifiers. They emulate the nominal performance of a typical device within the specified operating conditions mentioned in the datasheet. They also help to validate a design approach and to select the right operational amplifier, but they do not replace on-board measurements. 20/29 DocID023708 Rev 2 TSV731, TSV732, TSV734 5 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DocID023708 Rev 2 21/29 Package information 5.1 TSV731, TSV732, TSV734 SC70-5 package information Figure 23. SC70-5 package mechanical drawing SIDE VIEW DIMENSIONS IN MM GAUGE PLANE COPLANAR LEADS SEATING PLANE TOP VIEW Table 7. SC70-5 package mechanical data Dimensions Symbol Millimeters Min. 22/29 Typ. Inches Max. Min. 0.032 A 0.80 1.10 A1 0 0.10 A2 0.80 b 0.90 Typ. Max. 0.043 0.004 1.00 0.032 0.035 0.15 0.30 0.006 0.012 c 0.10 0.22 0.004 0.009 D 1.80 2.00 2.20 0.071 0.079 0.087 E 1.80 2.10 2.40 0.071 0.083 0.094 E1 1.15 1.25 1.35 0.045 0.049 0.053 e 0.65 0.025 e1 1.30 0.051 L 0.26 < 0° 0.36 0.46 0.010 8° 0° DocID023708 Rev 2 0.014 0.039 0.018 8° TSV731, TSV732, TSV734 DFN8 2x2 package information Figure 24. DFN8 2x2 package mechanical drawing ' $ %  & [ ( 3,1,1'(;$5($  & [ 7239,(: $  & $ & 6($7,1* 3/$1( 6,'(9,(:  & H ESOFV 3,1,1'(;$5($    & $ % 3LQ,' / 5.2 Package information   %277209,(: *$06&% Table 8. DFN8 2x2 package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D 2.00 0.079 E 2.00 0.079 e 0.50 0.020 L N 0.045 0.55 0.65 8 DocID023708 Rev 2 0.018 0.022 0.026 8 23/29 Package information 5.3 TSV731, TSV732, TSV734 MiniSO-8 package information Figure 25. MiniSO-8 package mechanical drawing Table 9. MiniSO-8 package mechanical data Dimensions Ref. Millimeters Min. Typ. A Max. Min. Typ. 1.1 A1 0 A2 0.75 b Max. 0.043 0.15 0 0.95 0.030 0.22 0.40 0.009 0.016 c 0.08 0.23 0.003 0.009 D 2.80 3.00 3.20 0.11 0.118 0.126 E 4.65 4.90 5.15 0.183 0.193 0.203 E1 2.80 3.00 3.10 0.11 0.118 0.122 e L 0.85 0.65 0.40 0.60 0.006 0.033 0.80 0.016 0.024 0.95 0.037 L2 0.25 0.010 ccc 0° 0.037 0.026 L1 k 24/29 Inches 8° 0.10 DocID023708 Rev 2 0° 0.031 8° 0.004 TSV731, TSV732, TSV734 5.4 Package information QFN16 3x3 package information Figure 26. QFN16 3x3 package mechanical drawing 4)1B[B9BB& DocID023708 Rev 2 25/29 Package information TSV731, TSV732, TSV734 Table 10. QFN16 3x3 mm package mechanical data (pitch 0.5 mm) Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.80 0.90 1.00 0.031 0.035 0.039 A1 0 0.05 0 A3 0.20 b 0.18 D 2.90 D2 1.50 E 2.90 E2 1.50 e L 3.00 3.00 0.008 0.30 0.007 3.10 0.114 1.80 0.059 3.10 0.114 1.80 0.059 0.50 0.30 0.002 0.012 0.118 0.071 0.118 0.122 0.071 0.020 0.50 0.012 Figure 27. QFN16 3x3 footprint recommendation 4)1B[B9BIRRWSULQWBB& 26/29 0.122 DocID023708 Rev 2 0.020 TSV731, TSV732, TSV734 5.5 Package information TSSOP14 package information Figure 28. TSSOP14 package mechanical drawing Table 11. TSSOP14 package mechanical data Dimensions Ref. Millimeters Min. Typ. A Inches Max. Min. Typ. 1.20 A1 0.05 A2 0.80 b Max. 0.047 0.15 0.002 0.004 0.006 1.05 0.031 0.039 0.041 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.0089 D 4.90 5.00 5.10 0.193 0.197 0.201 E 6.20 6.40 6.60 0.244 0.252 0.260 E1 4.30 4.40 4.50 0.169 0.173 0.176 e L 0.65 0.45 L1 k aaa 1.00 0.60 0.0256 0.75 0.018 1.00 0° 0.024 0.030 0.039 8° 0.10 DocID023708 Rev 2 0° 8° 0.004 27/29 Ordering information 6 TSV731, TSV732, TSV734 Ordering information Table 12. Order codes Order code Temperature range TSV731ICT TSV732IQ2T TSV732IST -40° C to +125° C TSV734IQ4T TSV734IPT 7 Package Packaging Marking SC70-5 K1X DFN8 2x2 K1X MiniSO8 Tape and reel V732 QFN16 3x3 K1X TSSOP14 TSV734IP Revision history Table 13. Document revision history Date Revision 24-Sep-2012 1 Initial internal release 2 Initial public release. Datasheet updated for two new products: TSV732 and TSV734. Four new packages added: DFN8 2x2, MiniSO-8, QFN16 3x3, and TSSOP14. Updated Table 3, Table 4, and Table 5. Section 4: Application information: re-written 26-Mar-2013 28/29 Changes DocID023708 Rev 2 TSV731, TSV732, TSV734 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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