TYN612TRG

® TN12, TS12 and TYNx12 Series 12A SCRS A SENSITIVE & STANDARD Table 1: Main Features Symbol IT(RMS) VDRM/VRRM IGT Value 12 600 to 1000 0.2 to 15 Unit A V mA A G K A DESCRIPTION Available either in sensitive (TS12) or standard (TN12 / TYN) gate triggering levels, the 12A SCR series is suitable to fit all modes of control, found in applications such as overvoltage crowbar protection, motor control circuits in power tools and kitchen aids, inrush current limiting circuits, capacitive discharge ignition and voltage regulation circuits... Available in through-hole or surface-mount packages, they provide an optimized performance in a limited space area. KA G KA G DPAK (TN12-B / TS12-B) A D2PAK (TN12-G) A K A K G A G IPAK (TN12-H / TS12-H) TO-220AB (TYNx12RG) Table 2: Order Codes Part Numbers TN1215-x00B TN1215-x00B-TR TN1215-x00G TN1215-x00G-TR TN1215-x00H TS1220-x00B TS1220-x00B-TR TS1220-x00H TYNx12RG TYNx12TRG Marking TN1215x00 TN1215x00 TN1215x00G TN1215x00G TN1215x00 TS1220x00 TS1220x00 TS1220x00 TYNx12 TYNx12T October 2005 REV. 5 1/11 TN12, TS12 and TYNx12 Series Table 3: Absolute Ratings (limiting values) Value Symbol Parameter TN12-G TYN12 Tc = 105°C Tc = 105°C Tj = 25°C Tj = 25°C Tj = 125°C Tj = 125°C Tj = 125°C 145 140 98 50 4 1 - 40 to + 150 - 40 to + 125 5 TN12-B/H TS12-B/H 12 8 115 110 60 A A2S A/µs A W °C V Unit IT(RMS) IT(AV) ITSM I ²t dI/dt IGM PG(AV) Tstg Tj VRGM RMS on-state current (180° conduction angle) Average on-state current (180° conduction angle) Non repetitive surge peak onstate current I²t Value for fusing tp = 8.3 ms tp = 10 ms tp = 10 ms A A Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 60 Hz Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range tp = 20 µs Maximum peak reverse gate voltage (for TN12 & TYN12 only) Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified) ■ SENSITIVE Test Conditions VD = 12 V VD = VDRM IRG = 10 µA IT = 50 mA IG = 1 mA RGK = 1 kΩ RGK = 1 kΩ RGK = 220 Ω Tj = 125°C Tj = 25°C Tj = 125°C Tj = 125°C Tj = 25°C Tj = 125°C RL = 140 Ω RL = 3.3 kΩ RGK = 1 kΩ Tj = 125°C MAX. MAX. MIN. MIN. MAX. MAX. MIN. MAX. MAX. MAX. MAX. 2 mA TS1220 200 0.8 0.1 8 5 6 5 1.6 0.85 30 5 Unit µA V V V mA mA V/µs V V mΩ µA Symbol IGT VGT VGD VRG IH IL dV/dt VTM Vt0 Rd IDRM IRRM VD = 65 % VDRM ITM = 24 A tp = 380 µs Threshold voltage Dynamic resistance VDRM = VRRM RGK = 220 Ω 2/11 TN12, TS12 and TYNx12 Series ■ STANDARD Test Conditions MIN. VD = 12 V VD = VDRM IT = 500 mA IG = 1.2 IGT VD = 67 % VDRM ITM = 24 A Threshold voltage Dynamic resistance VDRM = VRRM Gate open Tj =125°C Tj = 25°C Tj = 125°C Tj = 125°C Tj = 25°C Tj = 125°C tp = 380 µs RL = 33 Ω RL = 3.3 kΩ Gate open Tj = 125°C MAX. MAX. MIN. MAX. MAX. MIN. MAX. MAX. MAX. MAX. 40 80 200 1.6 0.85 30 5 2 30 60 TN1215 B/H 2 15 1.3 0.2 15 30 40 30 60 200 G 0.5 5 TYN x12T x12 2 15 Unit mA V V mA mA V/µs V V mΩ µA mA Symbol IGT VGT VGD IH IL dV/dt VTM Vt0 Rd IDRM IRRM Table 6: Thermal resistance Symbol Rth(j-c) Junction to case (DC) S = 0.5 cm² Rth(j-a) Junction to ambient (DC) S = 1 cm² DPAK D2PAK IPAK TO-220AB S = Copper surface under tab. Parameter Value 1.3 70 45 100 60 Unit °C/W °C/W Figure 1: Maximum average power dissipation versus average on-state current P(W) 12 11 10 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 360° α = 180° Figure 2: Average and D.C. on-state current versus case temperature IT(AV)(A) 14 D.C. 12 10 α = 180° 8 6 4 2 IT(AV)(A) α 8 9 Tcase(°C) 0 0 25 50 75 100 125 3/11 TN12, TS12 and TYNx12 Series Figure 3: Average and D.C. on-state current versus ambient temperature (device mounted on FR4 with recommended pad layout) (DPAK) IT(AV)(A) 3.0 2.5 D.C. Figure 4: Relative variation of thermal impedance junction to case versus pulse duration K=[Zth(j-c)/Rth(j-c)] 1.0 2.0 1.5 α = 180° D2PAK 0.5 1.0 0.5 DPAK 0.2 Tamb(°C) 0.0 0 25 50 75 100 125 tp(s) 0.1 1E-3 1E-2 1E-1 1E+0 Figure 5: Relative variation of thermal impedance junction to ambient versus pulse duration (recommended pad layout, FR4 PC board for DPAK) K=[Zth(j-a)/Rth(j-a)] 1.00 Figure 6: Relative variation of gate trigger current and holding current versus junction temperature for TS8 series IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 2.0 1.8 1.6 DPAK IGT 1.4 D2PAK 1.2 TO-220AB / IPAK 0.10 1.0 0.8 0.6 0.4 IH & IL RGK = 1kΩ tp(s) 0.01 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 0.2 0.0 -40 -20 0 20 Tj(°C) 40 60 80 100 120 140 Figure 7: Relative variation of gate trigger current and holding current versus junction temperature for TN8 & TYN08 series IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 0 20 40 60 80 100 120 140 IH & IL IGT Figure 8: Relative variation of holding current versus gate-cathode resistance (typical values) for TS8 series IH[RGK] / IH[RGK=1kΩ] 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 Tj = 25°C Tj(°C) 0.5 0.0 1E-2 1E-1 RGK(kΩ) 1E+0 1E+1 4/11 TN12, TS12 and TYNx12 Series Figure 9: Relative variation of dV/dt immunity versus gate-cathode resistance (typical values) for TS8 series dV/dt[RGK] / dV/dt[RGK=220Ω] 10.0 Tj = 125°C VD = 0.67 x VDRM Figure 10: Relative variation of dV/dt immunity versus gate-cathode capacitance (typical values) for TS8 series dV/dt[CGK] / dV/dt[RGK=220Ω] 4.0 3.5 3.0 2.5 VD = 0.67 x VDRM Tj = 125°C RGK = 220Ω 1.0 2.0 1.5 1.0 RGK(kΩ) 0.1 0 200 400 600 800 1000 1200 0.5 0.0 0 25 50 CGK(nF) 75 100 125 150 Figure 11: Surge peak on-state current versus number of cycles Figure 12: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding values of I²t ITSM(A), I2t (A2s) 2000 Tj initial = 25°C ITSM(A) 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 1 1000 TN12 / TYN12 Non repetitive Tj initial=25°C TS12 tp=10ms One cycle ITSM TN12 / TYN12 TS12 dI/dt limitation 100 I2t TN12 / TYN12 TS12 Repetitive TC=105°C Number of cycles 10 tp(ms) 0.01 0.10 1.00 10.00 10 100 1000 Figure 13: On-state characteristics (maximum values) Figure 14: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board FR4, copper thickness: 35µm) (DPAK and D2PAK) Rth(j-a)(°C/W) 100 ITM(A) 200 100 Tj max.: Vt0=0.85V Rd=30mΩ 80 60 Tj=max DPAK 10 Tj=25°C 40 D2PAK 20 VTM(V) 1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 0 2 4 6 8 S(cm²) 10 12 14 16 18 20 5/11 TN12, TS12 and TYNx12 Series Figure 15: Ordering Information Scheme (TN8 series) TN 12 15 - 600 B (-TR) Standard SCR series Current 12 = 12A Sensitivity 15 = 15mA Voltage 600 = 600V 800 = 800V 1000 = 1000V Package B = DPAK G = D2PAK H = IPAK Packing mode Blanck = Tube -TR = Tape & Reel (DPAK and D2PAK) Figure 16: Ordering Information Scheme (TS8 series) TS 12 20 - 600 B (-TR) Sensitive SCR series Current 12 = 12A Sensitivity 20 = 200µA Voltage 600 = 600V 700 = 700V Package B = DPAK H = IPAK Packing mode Blanck = Tube -TR = Tape & Reel Figure 17: Ordering Information Scheme (TYN08 series) TYN Standard SCR series Voltage 6 = 600V 8 = 800V 10 = 100V Current 12 = 12A Sensitivity Blanck = 30mA T = 15mA Packing mode RG = Tube 6 12 T RG 6/11 TN12, TS12 and TYNx12 Series Table 7: Product Selector Part Numbers TN1215-xxxB TN1215-xxxG TN1215-xxxH TS1220-xxxB TS1220-xxxH TYNx12 TYNx12T Voltage (xxx) 600 V X X X X X X X X X X X X X 700 V 800 V X X X X 1000 V Sensitivity 15 mA 15 mA 15 mA 0.2 mA 0.2 mA 15 mA 5 mA Package DPAK D2PAK IPAK DPAK IPAK TO-220AB TO-220AB Figure 18: DPAK Package Mechanical Data REF. E B2 C2 L2 A D H L4 B G A1 C R R A2 0.60 MIN. V2 A A1 A2 B B2 C C2 D E G H L2 L4 V2 DIMENSIONS Millimeters Inches Min. Max Min. Max. 2.20 2.40 0.086 0.094 0.90 1.10 0.035 0.043 0.03 0.23 0.001 0.009 0.64 0.90 0.025 0.035 5.20 5.40 0.204 0.212 0.45 0.60 0.017 0.023 0.48 0.60 0.018 0.023 6.00 6.20 0.236 0.244 6.40 6.60 0.251 0.259 4.40 4.60 0.173 0.181 9.35 10.10 0.368 0.397 0.80 typ. 0.031 typ. 0.60 1.00 0.023 0.039 0° 8° 0° 8° Figure 19: DPAK Foot Print Dimensions (in millimeters) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 7/11 TN12, TS12 and TYNx12 Series Figure 20: D2PAK Package Mechanical Data DIMENSIONS REF. Millimeters Inches Min. Typ. Max. Min. Typ. A 4.30 4.60 0.169 A1 2.49 2.69 0.098 A2 0.03 0.23 0.001 B 0.70 0.93 0.027 B2 1.25 1.40 0.048 0.055 C 0.45 0.60 0.017 C2 1.21 1.36 0.047 D 8.95 9.35 0.352 E 10.00 10.28 0.393 G 4.88 5.28 0.192 L 15.00 15.85 0.590 L2 1.27 1.40 0.050 L3 1.40 1.75 0.055 R 0.40 0.016 V2 0° 8° 0° A E L2 C2 D L L3 A1 B2 B G A2 2mm min. FLAT ZONE R Max. 0.181 0.106 0.009 0.037 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 8° C V2 Figure 21: D2PAK Foot Print Dimensions (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 8/11 TN12, TS12 and TYNx12 Series Figure 22: IPAK Package Mechanical Data REF. A A1 A3 B B2 B3 B5 C C2 D E e G H L L1 L2 V1 DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 2.20 2.40 0.086 0.90 1.10 0.035 0.70 1.30 0.027 0.64 0.90 0.025 5.20 5.40 0.204 0.95 0.30 0.035 0.45 0.60 0.017 0.48 0.60 0.019 6 6.20 0.236 6.40 6.60 0.252 2.28 0.090 4.40 4.60 0.173 16.10 0.634 9 9.40 0.354 0.8 1.20 0.031 0.80 1 0.031 10° 10° A E B2 L2 C2 Max. 0.094 0.043 0.051 0.035 0.212 0.037 0.023 0.023 0.244 0.260 0.181 0.370 0.047 0.039 D H L L1 B3 B V1 A1 e G B5 C A3 Figure 23: TO-220AB Package Mechanical Data DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 15.20 15.90 0.598 3.75 0.147 13.00 14.00 0.511 10.00 10.40 0.393 0.61 0.88 0.024 1.23 1.32 0.048 4.40 4.60 0.173 0.49 0.70 0.019 2.40 2.72 0.094 2.40 2.70 0.094 6.20 6.60 0.244 3.75 3.85 0.147 15.80 16.40 16.80 0.622 0.646 2.65 2.95 0.104 1.14 1.70 0.044 1.14 1.70 0.044 2.60 0.102 REF. B ØI L F A I4 l3 a1 l2 c2 b2 C a2 M b1 e c1 A a1 a2 B b1 b2 C c1 c2 e F ØI I4 L l2 l3 M Max. 0.625 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.661 0.116 0.066 0.066 9/11 TN12, TS12 and TYNx12 Series In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 8: Ordering Information Ordering type TN1215-x00B TN1215-x00B-TR TN1215-x00G TN1215-x00G-TR TN1215-x00H TS1220-x00B TS1220-x00B-TR TS1220-x00H TYNx12RG TYNx12TRG Note: x = voltage Marking TN1215x00 TN1215x00 TN1215x00G TN1215x00G TN1215x00 TS1220x00 TS1220x00 TS1220x00 TYNx12 TYNx12T Package DPAK DPAK D2PAK D2PAK IPAK DPAK DPAK IPAK TO-220AB TO-220AB Weight 0.3 g 0.3 g 1.5 g 1.5 g 0.3 g 0.3 g 0.3 g 0.3 g 2.3 g 2.3 g Base qty 75 2500 50 1000 75 75 2500 75 50 50 Delivery mode Tube Tape & reel Tube Tape & reel Tube Tube Tape & reel Tube Tube Tube Table 9: Revision History Date Sep-2000 25-Mar-2005 14-Oct-2005 Revision 3 4 5 Last update. TO-220AB delivery mode changed from bulk to tube. Changed sensitivity values in Table 7 for TYNx12 (30 to 15 mA) and TYNx12T ( 15 to 5 mA). Added ECOPACK statement Description of Changes 10/11 TN12, TS12 and TYNx12 Series Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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