ULQ2003

ULQ200XA/XD1 Seven darlington array Features ■ ■ ■ ■ ■ ■ ■ ■ Seven darlingtons per package Extended temperature range: -40 to 105°C Output current 500mA per driver (600mA peak) Output voltage 50V Integrated suppression diodes for inductive loads Outputs can be paralleled for higher current TTL/CMOS/PMOS/DTL Compatible inputs Inputs pinned opposite outputs to simplify layout General purpose, DTL, TTL, PMOS, CMOS 5V TTL, CMOS 6–15V CMOS, PMOS DIP-16 SO16 (Narrow) ULQ2001 ULQ2003 ULQ2004 Description The ULQ2001, ULQ2003 and ULQ2004 are high voltage, high current darlington arrays each containing seven open collector darlington pairs with common emitters. Each channel rated at 500mA and can withstand peak currents of 600mA. Suppression diodes are included for inductive load driving and the inputs are pinned opposite the outputs to simplify board layout. The versions interface to all common logic families. These versatile devices are useful for driving a wide range of loads including solenoids, relays DC motors, LED displays filament lamps, thermal print-heads and high power buffers. The ULQ2001A/2003A and 2004A are supplied in 16 pin plastic DIP packages with a copper leadframe to reduce thermal resistance. They are available also in small outline package (SO-16) as ULQ2003D1/2004D1. Order codes Part numbers ULQ2001A ULQ2003A ULQ2004A ULQ2003D1013TR ULQ2004D1013TR May 2007 Rev. 3 Packages DIP-16 DIP-16 DIP-16 SO16 in Tape & Reel SO16 in Tape & Reel 1/13 www.st.com 13 ULQ200XA/XD1 Contents 1 2 3 4 5 6 7 Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2/13 ULQ200XA/XD1 Diagram 1 Figure 1. Diagram Schematic diagram ULQ2001 (each driver) ULQ2003 (each driver) ULQ2004 (each driver) 3/13 Pin configuration ULQ200XA/XD1 2 Figure 2. Pin configuration Pin connections (top view) 4/13 ULQ200XA/XD1 Maximum ratings 3 Table 1. Maximum ratings Absolute maximum ratings Parameter Output voltage Input voltage (for ULQ2003A/D1 - 2004A/D1) Continuous collector current Continuous base current Operating ambient temperature range Storage temperature range Junction temperature Value 50 30 500 25 -40 to 105 -55 to 150 150 Unit V V mA mA °C °C °C Symbol Vo Vin Ic Ib TA TSTG TJ Table 2. Symbol RthJA Thermal Data Parameter Thermal resistance junction-ambient, Max. DIP-16 70 SO-16 120 Unit ° C/W 5/13 Electrical characteristics ULQ200XA/XD1 4 Table 3. Electrical characteristics Electrical characteristics (TA = -40 to 105°C for DIP16 unless otherwise specified) (TJ = 25 to 105°C for SO16 unless otherwise specified). Parameter Test conditions VCE = 50V, (Figure 3.) ICEX Output leakage current TA = 105°C, VCE= 50V (Figure 3.) TJ = 105°C for ULQ2004, VCE= 50V, VI = 1V (Figure 4.) IC = 100mA, IB = 250µA 0.9 1.1 1.3 0.93 0.35 1 50 65 2.4 2.7 3 V 5 6 7 8 1000 15 0.5 VI to 0.5VO 0.5 VI to 0.5VO VR = 50V TA = 105°C, VR = 50V IF = 350mA 1.7 0.25 0.25 25 (1) 1 (1) Symbol Min. Typ. Max. 50 100 500 1.1 1.3 1.6 1.35 0.5 1.45 Unit µA Collector-emitter saturation VCE(SAT) voltage (Figure 5.) IC = 200mA, IB= 350µA IC = 350mA, IB= 500µA for ULQ2003, VI = 3.85V V II(ON) Input current (Figure 6.) for ULQ2004, VI = 5V VI = 12V mA II(OFF) Input current (Figure 7.) TA = 105°C, IC = 500µA for ULQ2003 IC = 200mA IC = 250mA IC = 300mA for ULQ2004 IC = 125mA IC = 200mA IC = 275mA IC = 350mA for ULQ2001, VCE = 2V, IC = 350mA µA VI(ON) Input voltage (Figure 8.) hFE CI tPLH tPHL IR VF DC Forward current gain (Figure 5.) Input capacitance Turn-on delay time Turn-off delay time Clamp diode leakage current (Figure 9.) Clamp diode forward voltage (Figure 10.) pF µs µs µA 1 (1) 50 100 2 V 1. Guaranteed by design. 6/13 ULQ200XA/XD1 Test circuits 5 Figure 3. Test circuits Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. 7/13 Test circuits ULQ200XA/XD1 Figure 9. Figure 10. 8/13 ULQ200XA/XD1 Package mechanical data 6 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/13 Package mechanical data ULQ200XA/XD1 Plastic DIP-16 (0.25) MECHANICAL DATA mm. DIM. MIN. a1 B b b1 D E e e3 F I L Z 3.3 1.27 8.5 2.54 17.78 7.1 5.1 0.130 0.050 0.51 0.77 0.5 0.25 20 0.335 0.100 0.700 0.280 0.201 1.65 TYP MAX. MIN. 0.020 0.030 0.020 0.010 0.787 0.065 TYP. MAX. inch P001C 10/13 ULQ200XA/XD1 Package mechanical data mm DIM. MIN. A a1 a2 b b1 C c1 D(1) E e e3 F(1) G L M S 3.8 4.60 0.4 9.8 5.8 1.27 8.89 4.0 5.30 1.27 0.62 8 ° (max.) 0.150 0.181 0.150 0.35 0.19 0.5 45° 10 6.2 (typ.) 0.386 0.228 0.1 TYP. MAX. 1.75 0.25 1.6 0.46 0.25 0.014 0.007 0.004 MIN. inch TYP. MAX. 0.069 0.009 0.063 0.018 0.010 0.020 OUTLINE AND MECHANICAL DATA 0.394 0.244 0.050 0.350 0.157 0.208 0.050 0.024 SO16 (Narrow) (1) "D" and "F" do not include mold flash or protrusions - Mold flash or protrusions shall not exceed 0.15mm (.006inc.) 0016020 D 11/13 Revision history ULQ200XA/XD1 7 Table 4. Date Revision history Revision history Revision 2 3 Changes Order codes has been updated and document has been reformatted. Order codes has been updated. 05-Dec-2006 23-May-2007 12/13 ULQ200XA/XD1 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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