VIPER012BHSTR

VIPer01B Energy saving off-line high voltage converter Datasheet - production data Applications  Low power SMPS for home appliances, building and home control, small industrial, consumers, lighting, motion control  Low power adapters SSOP10 Description Features  800 V avalanche-rugged power MOSFET allowing ultra wide VAC input range to be covered  Embedded HV startup and sense-FET  Current mode PWM controller  Drain current limit protection (OCP)  Wide supply voltage range: 4.5 V to 30 V  Self-supply option allows the auxiliary winding or bias components to be removed  Minimized system input power consumption: – Less than 10 mW at 230 VAC in no-load condition – Less than 400 mW at 230 VAC with 250 mW load The device is a high voltage converter smartly integrating an 800 V avalanche-rugged power MOSFET with PWM current mode control. The power MOSFET with 800 V breakdown voltage allows the extended input voltage range to be applied, as well as the size of the DRAIN snubber circuit to be reduced. This IC meets the most stringent energy-saving standards as it has very low consumption and operates in pulse frequency modulation under light load. The design of flyback, buck and buck boost converters is supported. The integrated HV startup, senseFET, error amplifier and oscillator with jitter allow a complete application to be designed with the minimum number of components. Figure 1. Basic application schematic  Jittered switching frequency reduces the EMI filter cost: – 60 kHz ± 7% (type L) – 120 kHz ± 7% (type H)  Embedded E/A with 1.2 V reference  Protections with automatic restart: overload/short-circuit (OLP), line or output OVP, VCC clamp  Pulse-skip protection to prevent flux-runaway  Embedded thermal shutdown  Built-in soft-start for improved system reliability April 2018 This is information on a product in full production. DocID031727 Rev 1 1/37 www.st.com Contents VIPer01B Contents 1 Pin setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Electrical and thermal ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 Typical electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4 General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5 6 4.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.2 Typical power capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.3 Primary MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.4 High voltage startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.5 Soft-start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.6 Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.7 Pulse-skipping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.8 Direct feedback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4.9 Secondary feedback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4.10 Pulse frequency modulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4.11 Overload protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4.12 VCC clamp protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.13 Disable function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4.14 Thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 5.1 Typical schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 5.2 Energy saving performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.3 Layout guidelines and design recommendations . . . . . . . . . . . . . . . . . . . 32 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 6.1 2/37 SSOP10 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 DocID031727 Rev 1 VIPer01B Contents 7 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 DocID031727 Rev 1 3/37 37 List of tables VIPer01B List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. 4/37 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Avalanche characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Supply section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Controller section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Typical power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Power supply efficiency, VOUT = 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 SSOP10 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Order code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 DocID031727 Rev 1 VIPer01B List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. Basic application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 RthJA/(RthJA at A = 100 mm²) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 IDLIM vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 FOSC vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 VHV_START vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 VFB_REF vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Quiescent current Iq vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Operating current ICC vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 ICH1 vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 ICH1 vs. VDRAIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 ICH2 vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 ICH2 vs. VDRAIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 ICH3 vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 ICH3 vs. VDRAIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 GM vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 ICOMP vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 RDS(on) vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Static drain-source on-resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 VBVDSS vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Output characteristic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 SOA SSOP10 package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Maximum avalanche energy vs. TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 IC supply modes: self-supply and external supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Power-ON and power-OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Soft startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Pulse-skipping during startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Short-circuit condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Connection for input overvoltage protection (isolated or non-isolated topologies) . . . . . . . 25 Connection for output overvoltage protection (non-isolated topologies). . . . . . . . . . . . . . . 26 Thermal shutdown timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Flyback converter (non-isolated) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Flyback converter with line OVP (non-isolated) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Flyback converter (isolated) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Primary side regulation isolated flyback converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Buck converter (positive output) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Buck-boost converter (negative output) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 PIN versus VIN in no-load, VOUT = 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 PIN versus VIN in light load, VOUT = 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Recommended routing for flyback converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Recommended routing for buck converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 SSOP10 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 SSOP10 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 DocID031727 Rev 1 5/37 37 Pin setting 1 VIPer01B Pin setting Figure 2. Connection diagram Table 1. Pin description SSOP10 Name Function 1 GND Ground and MOSFET source. Connection of source of the internal MOSFET and the return of the bias current of the device. All groundings of bias components must be tied to a trace going to this pin and kept separate from the pulsed current return. VCC Controller supply. An external storage capacitor has to be connected across this pin and GND. The pin, internally connected to the high voltage current source, provides the VCC capacitor charging current at startup and during steady-state operation, if the self-supply mode is selected. A small bypass capacitor (0.1 F typ.) in parallel, placed as close as possible to the IC, is also recommended, for noise filtering purpose. DIS Disable. If its voltage exceeds the internal threshold VDIS_th (1.2 V typ.) for more than tDEB time (1 ms, typ.), the PWM is disabled in auto-restart mode. An input overvoltage protection can be built by connecting a voltage divider between DIS pin and the rectified mains. In case of non-isolated topologies, with the same principle an output overvoltage protection can be implemented. If the disable function is not required, DIS pin must be soldered to GND, which excludes the function. FB Direct feedback. It is the inverting input of the internal transconductance E/A, which is internally referenced to 1.2 V with respect to GND. In case of non- isolated converter, the output voltage information is directly fed into the pin through a voltage divider. In case of primary regulation, the FB voltage divider is connected to the VCC. The E/A is disabled soldering FB to GND. 2 3 4 5 6 to 10 6/37 COMP Compensation. It is the output of the internal E/A. A compensation network is placed between this pin and GND to achieve stability and good dynamic performance of the control loop. In case of secondary feedback, the internal E/A must be disabled and the COMP directly driven by the optocoupler to control the DRAIN peak current setpoint. DRAIN MOSFET drain. The internal high voltage current source sinks current from this pin to charge the VCC capacitor at startup and during steady-state operation. These pins are mechanically connected to the internal metal PAD of the MOSFET in order to facilitate heat dissipation. On the PCB, copper area must be placed under these pins in order to decrease the total junction-to-ambient thermal resistance thus facilitating the power dissipation. DocID031727 Rev 1 VIPer01B 2 Electrical and thermal ratings Electrical and thermal ratings Table 2. Absolute maximum ratings Symbol VDS Parameter(1), (2) Min. Max. Unit 6 to 10 Drain-to-source (ground) voltage -0.3 800 V - 2 A -0.3 Internally limited V 45(3) mA V Pin Pulsed drain current (pulse-width limited by SOA) IDRAIN 6 to 10 VCC 2 VCC voltage ICC 2 VCC internal Zener current (pulsed) VDIS 3 DIS voltage -0.3 4.25(4) VFB 4 FB voltage -0.3 4.25(4) V -0.3 5.25(4) V 1(5) W VCOMP 5 COMP voltage PTOT - Power dissipation at Tamb < 50 °C TJ - Junction temperature operating range -40 150 °C TSTG - Storage temperature -55 150 °C 1. Stresses beyond those listed absolute maximum ratings may cause permanent damage to the device. 2. Exposure to absolute-maximum-rated conditions for extended periods may affect the device reliability. 3. Pulse-width limited by maximum power dissipation, PTOT. 4. The AMR value is intended when VCC  5 V, otherwise the value VCC + 0.3 V has to be considered. 5. When mounted on a standard single side FR4 board with 100 mm² (0.1552 inch) of Cu (35 m thick). Table 3. Thermal data Max. value Symbol Parameter Unit SSOP10 RthJP RthJA(1) Thermal resistance junction-pin 35 Thermal resistance junction-ambient (dissipated power 1 W) 145 Thermal resistance junction-ambient (dissipated power 1 W)(2) 90 °C/W 1. Derived by characterization. 2. When mounted on a standard single side FR4 board with 100 mm² (0.155² inch) of Cu (35 µm thick). DocID031727 Rev 1 7/37 37 Electrical and thermal ratings VIPer01B Figure 3. RthJA/(RthJA at A = 100 mm²) Table 4. Avalanche characteristics Symbol Parameter Test conditions Repetitive and non-repetitive Pulse-width limited by TJmax IAR Avalanche current EAS L = 1 mH IAS = 0.8 A Single pulse avalanche V DS = 50 V energy(1) RG = 47  Starting TJ = 25 °C 1. Parameter derived by characterization. 8/37 DocID031727 Rev 1 Min. Typ. Max. Unit - - 0.8 A - - 1 mJ VIPer01B Electrical and thermal ratings Electrical characteristics Tj = -40 to 125 °C, VCC = 9 V (unless otherwise specified). Table 5. Power section Symbol VBVDSS IDSS IOFF RDS(on) COSS EQ Parameter Test conditions Min. Typ. Max. Unit Breakdown voltage IDRAIN = 1 mA VCOMP = GND TJ = 25 °C 800 - - Drain-source leakage current VDS = 400 V VCOMP = GND TJ = 25 °C - - 1 OFF-state drain current VDRAIN = max.rating VCOMP = GND TJ = 25 °C - - 45 IDRAIN = 360 mA TJ = 25 °C - - 30 IDRAIN = 360 mA TJ = 125 °C - - 60 VGS = 0 VDS = 0 to 640 V TJ = 25 °C - 10 - pF Static drain-source ON-resistance Equivalent output capacitance V µA  Table 6. Supply section Symbol Parameter Test conditions Min. Typ. Max. Unit 800 - - V - - 18 V M High voltage start-up current source VBVDSS_SU Breakdown voltage of start-up MOSFET TJ = 25 °C VHV_START Drain-source start-up voltage - RG Start-up resistor VFB > VFB_REF VDRAIN = 400 V VDRAIN = 600 V 22 30 38 ICH1 VCC charging current at startup VDRAIN = 100 V VCC = 0 V 1.4 1.9 2.4 ICH2 VCC charging current at startup VFB > VFB_REF VDRAIN = 100 V VCC = 6 V 3.5 4.5 5.5 Max. VCC charging current in self-supply VFFB > VFB_REF VDRAIN = 100 V VCC = 6 V 7.6 8.8 10 Operating voltage range VGND = 0 V 4.5 - 30 V Clamp voltage ICC = Iclamp_max 30 32.5 35 V ICH3 (1) mA IC supply and consumptions VCC VCCclamp DocID031727 Rev 1 9/37 37 Electrical and thermal ratings VIPer01B Table 6. Supply section (continued) Symbol Parameter Test conditions Min. Typ. Max. Unit - 30 - mA Iclamp max Clamp shutdown current (2) tclamp max Clamp time before shutdown - 325 500 675 µs VCCon VCC start-up threshold VFB = 1.2 V VDRAIN = 400 V 7.5 8 8.5 V VCSon HV current source turn-on threshold VCC falling 4 4.25 4.5 V VCCoff UVLO VFB = 1.2 V VDRAIN = 400 V 3.75 4 4.25 V Quiescent current Not switching VFB > VFB_REF - 0.3 0.45 A VDS = 150 V VCOMP = 1.2 V FOSC = 60 kHz - 0.85 1.25 VDS = 150 V VCOMP = 1.2 V FOSC= 120 kHz - Iq ICC Operating supply current, switching mA 1 1.5 1. Current supplied during the main MOSFET OFF time only. 2. Parameter assured by design and characterization. Table 7. Controller section Symbol Parameter Test conditions Min. Typ. Max. Unit E/A VFB_REF Reference voltage - 1.175 1.2 1.225 V VFB_DIS E/A disable voltage - 150 180 210 mV Pull-up current - 0.9 1 1.1 µA Transconductance VCOMP = 1.5 V VFB > VFB_REF 350 500 650 µA/V ICOMP1 Max. source current VCOMP = 1.5 V VFB = 0.5 V 65 100 135 µA ICOMP2 Max. sink current VFB = 2 V VCOMP = 1.5 V 70 105 140 µA Dynamic resistance VCOMP = 2.7 V VFB = GND 50 58 66 k VCOMPH Current limitation threshold - - 3 - V VCOMPL PFM threshold - - 0.8 - V IFB PULL UP GM RCOMP(DYN) 10/37 DocID031727 Rev 1 VIPer01B Electrical and thermal ratings Table 7. Controller section (continued) Symbol Parameter Test conditions Min. Typ. Max. Unit TJ = 25 °C VIPer012BHS 228 240 252 TJ = 25 °C VIPer013BLS 342 360 378 0.9 ·I2f I2f 1.1 ·I2f TJ = 25 °C VCOMP = VCOMPL(1) VIPer012BHS 45 65 85 TJ = 25 °C VCOMP = VCOMPL(1) VIPer013BLS 60 80 100 1.15 1.2 1.25 V Debounce time before DIS protection tripping 0.65 1 1.35 ms Restart time after DIS protection tripping - 325 500 675 ms Overload delay time - 45 50 55 ms VIPer013BLS FOSC = FOSC MIN 180 200 220 VIPer012BHS FOSC = FOSC MIN 360 400 440 5 8 11 ms OLP and timing IDLIM I2f IDLIM_PFM VDISth tDIS tDIS_RESTART tOVL tOVL_MAX Drain current limitation IDLIM_TYP2X FOSC_TYP Power coefficient rain current limitation at light load VCC = 9 V VCOMP = 1 V VFB = VFB_REF Disable threshold voltage Max. overload delay time mA A2·kHz mA ms Soft-start time - tON_MIN Minimum turn-on time VCC = 9 V VCOMP = 1 V VFB = VFB_REF 250 - 360 ns tRESTART Restart time after fault - 0.65 1 1.35 s TJ = 25 °C VIPer013BLS 54 60 66 TJ = 25 °C VIPer012BHS 108 120 132 Minimum switching frequency TJ = 25 °C (2) 13.5 15 16.5 kHz Modulation depth (3) - ±7 FOSC - % tSS Oscillator FOSC FOSC_MIN FD Switching frequency DocID031727 Rev 1 kHz 11/37 37 Electrical and thermal ratings VIPer01B Table 7. Controller section (continued) Symbol FM DMAX Parameter Min. Typ. Max. Unit Modulation frequency (3) Test conditions - 260 - Hz Max. duty cycle (3) 70 - 80 % (3) 150 160 - °C Thermal shutdown TSD Thermal shutdown temperature 1. See Section 4.10: Pulse frequency modulation on page 23. 2. See Section 4.7: Pulse-skipping on page 21. 3. Parameter assured by design and characterization. 12/37 DocID031727 Rev 1 VIPer01B 3 Typical electrical characteristics Typical electrical characteristics Figure 4. IDLIM vs. TJ Figure 5. FOSC vs. TJ Figure 6. VHV_START vs. TJ Figure 7. VFB_REF vs. TJ Figure 8. Quiescent current Iq vs. TJ Figure 9. Operating current ICC vs. TJ DocID031727 Rev 1 13/37 37 Typical electrical characteristics 14/37 VIPer01B Figure 10. ICH1 vs. TJ Figure 11. ICH1 vs. VDRAIN Figure 12. ICH2 vs. TJ Figure 13. ICH2 vs. VDRAIN Figure 14. ICH3 vs. TJ Figure 15. ICH3 vs. VDRAIN DocID031727 Rev 1 VIPer01B Typical electrical characteristics Figure 16. GM vs. TJ Figure 17. ICOMP vs. TJ Figure 18. RDS(on) vs. TJ Figure 19. Static drain-source on-resistance Figure 20. VBVDSS vs. TJ Figure 21. Output characteristic DocID031727 Rev 1 15/37 37 Typical electrical characteristics VIPer01B Figure 22. SOA SSOP10 package Figure 23. Maximum avalanche energy vs. TJ 
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16/37 DocID031727 Rev 1 VIPer01B General description 4 General description 4.1 Block diagram Figure 24. Block diagram 4.2 Typical power capability Table 8. Typical power Vin: 230 VAC Vin: 85-265 VAC Adapter(1) Open frame(2) Adapter(1) Open frame(2) 7W 8W 4W 4.5 W 1. Typical continuous power in non-ventilated enclosed adapter measured at 50 °C ambient. 2. Maximum practical continuous power in an open frame design at 50 °C ambient, with adequate heat-sinking. DocID031727 Rev 1 17/37 37 General description 4.3 VIPer01B Primary MOSFET The primary switch is implemented with an avalanche-rugged N-channel MOSFET with minimum breakdown voltage 800 V, VBVDSS, and maximum on-resistance of 30 , RDS(on). The sense-FET is embedded and it allows a virtually lossless current sensing. The MOSFET is embedded and it allows the HV voltage start-up operation. The MOSFET gate driver controls the gate current during both turn-on and turn-off in order to minimize EMI. Under UVLO conditions the embedded pull-down circuit holds the gate low in order to ensure that the MOSFET cannot be turned on accidentally. 4.4 High voltage startup The embedded high voltage startup includes both the 800 V start-up FET, whose gate is biased through the resistor RG, and the switchable HV current source, delivering the current IHV. The major portion of IHV, (ICH), charges the capacitor connected to VCC. A minor portion is sunk by the controller block. At startup, as the voltage across the DRAIN pin exceeds the VHV_START threshold, the HV current source is turned on, charging linearly the CS capacitor. At the very beginning of the startup, when Cs is fully discharged, the charging current is low, ICH1, in order to avoid IC damaging in case VCC is accidentally shorted to GND. As VCC exceeds 1 V, ICH is increased to ICH2 in order to speed up the charging of CS. As VCC reaches the start-up threshold VCCon (8 V typ.) the chip starts operating, the primary MOSFET is enabled to switch, the HV current source is disabled and the device is powered by the energy stored in the CS capacitor. In steady-state the IC supports two different kind of supplies: self-supply and external supply, as shown in Figure 25. Figure 25. IC supply modes: self-supply and external supply &YUFSOBM TVQQMZ 4FMG TVQQMZ 7"VY 7 065 7$$ *$) 7$$ *$) 7$$ *$) $4 $4 GSPN
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PVUQVU $4 GSPN BVYJMJBSZ XJOEJOH (*1%.5 In self-supply only one capacitor CS is connected to the VCC and the device is supplied by the energy stored in CS. After the IC startup, due to its internal consumption, the VCC decays to VCCson (4.25 V, typ.) and the HV current source is turned on delivering the current ICH3 until VCC is recharged to VCCon. The HV current source is reactivated when VCC decays to VCCson again. The ICH3 is supplied during the switching OFF time only. In external 18/37 DocID031727 Rev 1 VIPer01B General description supply the HV current source is always kept off by maintaining the VCC above VCSon. This can be obtained through a transformer auxiliary winding or a connection from the output, the latter in case of non-isolated topology only. In this case the residual consumption is given by the power dissipated on RG, calculated as follows: Equation 1 2 V INDC P = ------------------RG At the nominal input voltage, 230 VAC, the typical consumption (RG = 30 M) is 3.5 mW and the worst-case consumption (RG = 22 M) is 4.8 mW. When the IC is disconnected from the mains, or there is a mains interruption, for some time the converter keeps on working, powered by the energy stored in the input bulk capacitor. When it is discharged below a critical value, the converter is no longer able to keep the output voltage regulated. During the power down, when the DRAIN voltage becomes too low, the HV current source (IHV) remains off and the IC is stopped as soon as the VCC drops below the UVLO threshold, VCCoff. Figure 26. Power-ON and power-OFF DocID031727 Rev 1 19/37 37 General description 4.5 VIPer01B Soft-start The internal soft-start function of the device progressively increases the cycle-by-cycle current limitation set point from zero up to IDLIM in 8 steps. The soft-start time, tSS, is internally set at 8 ms. This function is activated at any attempt of converter startup and at any restart after a fault event. The feature protects the system at the startup when the output load occurs like a short-circuit and the converter works at its maximum drain current limitation. Figure 27. Soft startup 4.6 Oscillator The IC embeds a fixed frequency oscillator with jittering feature. The switching frequency is modulated by approximately ± 7% kHz FOSC at 260 Hz rate. The purpose of the jittering is to get a spread-spectrum action that distributes the energy of each harmonic of the switching frequency over a number of frequency bands, having the same energy on the whole but smaller amplitudes. This helps to reduce the conducted emissions, especially when measured with the average detection method or, which is the same, to pass the EMI tests with an input filter of smaller size than that needed in absence of jittering feature. Two options with different switching frequencies, FOSC, are available: 60 (L type) and 120 kHz (H type). 20/37 DocID031727 Rev 1 VIPer01B 4.7 General description Pulse-skipping The IC embeds a pulse-skip circuit that operates in the following ways:  Each time the DRAIN peak current exceeds IDLIM level within tON_MIN, the switching cycle is skipped. The cycles can be skipped until the minimum switching frequency is reached, FOSC_MIN (15 kHz).  Each time the DRAIN peak current does not exceed IDLIM within tON_MIN, a switching cycle is restored. The cycles can be restored until the nominal switching frequency is reached, FOSC (60 or 120 kHz). If the converter is operated at FOSC_MIN, the IC is turned off after the time tOVL_MAX (200 ms or 400 ms typ., depending on FOSC) and then automatically restarted with soft-start phase, after the time tRESTART (1 s, typ.). The protection is intended to avoid the so called “flux-runaway” condition often present at converter startup and due to the fact that the primary MOSFET, which is turned on by the internal oscillator, cannot be turned off before than the minimum on-time. During the on-time, the inductor is charged by the input voltage and if it cannot be discharged by the same amount during the off-time, in every switching cycle there is an increase of the average inductor current, that can reach dangerously high values until the output capacitor is not charged enough to ensure the inductor discharge rate needed for the volt-second balance. This condition may happen at converter startup, because of the low output voltage. In Figure 28 the effect of pulse-skipping feature on the DRAIN peak current shape is shown (solid line), compared with the DRAIN peak current shape when pulse-skipping feature is not implemented (dashed line). Providing more time for cycle-by-cycle inductor discharge when needed, this feature is effective by keeping low the maximum DRAIN peak current avoiding the flux-runaway condition. DocID031727 Rev 1 21/37 37 General description VIPer01B Figure 28. Pulse-skipping during startup 4.8 Direct feedback The IC embeds a transconductance type error amplifier (E/A) whose inverting input, ground reference and output are FB and COMP, respectively. The internal reference voltage of the E/A is VFB_REF (1.2 V typical value referred to GND). In non-isolated topologies this tightly regulates positive output voltages through a simple voltage divider applied to the output voltage terminal, FB and GND. The E/A output is scaled down and fed into the PWM comparator, where it is compared to the voltage across the sense resistor in series to the sense-FET, thus setting the cycle-bycycle drain current limitation. An R-C network connected on the output of the E/A (COMP) is usually used to stabilize the overall control loop. The FB is provided with an internal pull-up to prevent a wrong IC behavior when the pin is accidentally left floating. The E/A is disabled if the FB voltage is lower than VFB_DIS (200 mV, typ.). 22/37 DocID031727 Rev 1 VIPer01B 4.9 General description Secondary feedback When a secondary feedback is required, the internal E/A has to be disabled shorting FB to GND (VFB < VFB_DIS). With this setting, COMP is internally connected to a pre-regulated voltage through the pull-up resistor RCOMP(DYN), (60 k, typ.) and the voltage across COMP is set by the current sunk. This allows the output voltage value to be set through an external error amplifier (TL431 or similar) placed on the secondary side, whose error signal is used to set the DRAIN peak current setpoint corresponding to the output power demand. If isolation is required, the error signal must be transferred through an optocoupler, with the phototransistor collector connected across COMP and GND. 4.10 Pulse frequency modulation If the output load is decreased, the feedback loop reacts lowering the VCOMP voltage, which reduces the DRAIN peak current setpoint, down to the minimum value of IDLIM_PFM when the VCOMPL threshold is reached. If the load is furtherly decreased, the DRAIN peak current value is maintained at IDLIM_PFM and some PWM cycles are skipped. This kind of operation is referred to as “pulse frequency modulation” (PFM), the number of the skipped cycles depends on the balance between the output power demand and the power transferred from the input. The result is an equivalent switching frequency which can go down to some hundreds Hz, thus reducing all the frequency-related losses. This kind of operation, together with the extremely low IC quiescent current, allows very low input power consumption in no-load and light load, while the low DRAIN peak current value, IDLIM_PFM, prevents any audible noise which could arise from low switching frequency values. When the load is increased, VCOMP increases and PFM is exited. VCOMP reaches its maximum at VCOMPH and corresponding to that value, the DRAIN current limitation (IDLIM) is reached. 4.11 Overload protection To manage the overload condition, the IC embeds the following main blocks: the OCP comparator to turn off the power MOSFET when the drain current reaches its limit (IDLIM) , the up and down OCP counter to define the turn-off delay time in case of continuous overload (tOVL = 50 ms typ.) and the timer to define the restart time after protection tripping (tRESTART = 1 s typ.). In case of short-circuit or overload, the control level on the inverting input of the PWM comparator is greater than the reference level fed into the inverting input of the OCP comparator. As a result, the cycle-by-cycle turn-off of the power switch is triggered by the OCP comparator instead of PWM comparator. Every cycle where this condition is met, the OCP counter is incremented and if the fault condition lasts longer than tOVL (corresponding to the counter end-of-count), the protection is tripped, the PWM is disabled for tRESTART, then it resumes switching with soft-start and, if the fault is still present, it is disabled again after tOVL. The OLP management prevents IC from operating indefinitely at IDLIM and the low repetition rate of the restart attempts of the converter avoids IC overheating in case of repeated fault events. DocID031727 Rev 1 23/37 37 General description VIPer01B After the fault removal, the IC resumes working normally. If the fault is removed earlier than the protection tripping (before tOVL), the tOVL-counter is decremented on a cycle-by-cycle basis down to zero and the protection is not tripped. If the fault is removed during tRESTART, the IC waits for the tRESTART period has elapsed before resuming switching. In fault condition the VCC ranges between VCSon and VCCon levels, due to the periodical activation of the HV current source recharging the VCC capacitor. Figure 29. Short-circuit condition 4.12 VCC clamp protection This protection can occur when the IC is supplied by auxiliary winding or diode from the output voltage, when an output overvoltage produces an increase of VCC. If VCC reaches the clamp level VCCclamp (30 V, min. referred to GND) the current injected into the pin is monitored and if it exceeds the internal threshold Iclamp_max (30 mA, typ.) for more than tclamp_max (500 µs, typ.), the PWM is disabled for tRESTART (1 s, typ.) and then activated again in soft-start phase. The protection is disabled during the soft-start time. 24/37 DocID031727 Rev 1 VIPer01B 4.13 General description Disable function When the voltage across the pin is externally pulled above VDIS_th (1.2 V typ.) for more than tDEB (for instance by a voltage divider connected to some higher voltages), the PWM is disabled. If the voltage divider on the DIS pin is connected to the rectified mains, as shown in Figure 30, an input overvoltage protection can be built. Figure 30. Connection for input overvoltage protection (isolated or non-isolated topologies) In case of non-isolated topologies, by following the same principle an output overvoltage protection can be built, as shown in Figure 31. DocID031727 Rev 1 25/37 37 General description VIPer01B Figure 31. Connection for output overvoltage protection (non-isolated topologies)
If VOVP is the desired input/output overvoltage threshold, the resistors RH and RL of the voltage divider are to be selected according to the following formula: Equation 2 RH = (VOVP/VDIS_th - 1) · RL The power dissipation associated to the DIS network is: Equation 3  V IN – V DIS  2 V DIS 2 P DIS  V IN  = P RH + P RL = -------------------------------- + -------------RL RH in case of connection for the input overvoltage detection and Equation 4  V OUT – V DIS  2 V DIS 2 P DIS  V OUT  = P RH + P RL = -------------------------------------- + -------------RH RL in case of connection for the output overvoltage detection. 26/37 DocID031727 Rev 1 VIPer01B 4.14 General description Thermal shutdown If the junction temperature becomes higher than the internal threshold TSD (160 °C, typ.), the PWM is disabled. After tRESTART time, three switching cycles are performed, during which the temperature sensor embedded in the power MOSFET section is checked. If a junction temperature above TSD is still measured, the PWM is maintained disabled for tRESTART time, otherwise it resumes switching with soft-start phase. During tRESTART VCC is maintained between VCSon and VCCon levels by the HV current source periodical activation. Such a behavior is summarized in Figure 32. Figure 32. Thermal shutdown timing diagram DocID031727 Rev 1 27/37 37 Application information VIPer01B 5 Application information 5.1 Typical schematics Figure 33. Flyback converter (non-isolated) Figure 34. Flyback converter with line OVP (non-isolated)
28/37 DocID031727 Rev 1 VIPer01B Application information Figure 35. Flyback converter (isolated) Figure 36. Primary side regulation isolated flyback converter DocID031727 Rev 1 29/37 37 Application information VIPer01B Figure 37. Buck converter (positive output)
Figure 38. Buck-boost converter (negative output)
30/37 DocID031727 Rev 1 VIPer01B 5.2 Application information Energy saving performance The device allows designing applications to be compliant with the most stringent energy saving regulations. In order to show the typical performance is achievable, the active mode average efficiency and the efficiency at 10% of the rated output power of a single output flyback converter have been measured and are reported in Table 9. In addition, no-load and light load consumptions are shown in Figure 39 and Figure 40. Table 9. Power supply efficiency, VOUT = 5 V VIN 10% output load efficiency [%] Active mode average efficiency [%] Pin at no-load [mW] 115 VAC 72.2 74.6 4.5 230 VAC 65.1 75.1 8.6 Figure 39. PIN versus VIN in no-load, VOUT = 5 V Figure 40. PIN versus VIN in light load, VOUT = 5 V DocID031727 Rev 1 31/37 37 Application information 5.3 VIPer01B Layout guidelines and design recommendations A proper printed circuit board layout ensures the correct operation of any switch-mode converter and this is true for the VIPer as well. The main reasons to have a proper PCB layout are:  Providing clean signals to the IC, ensuring good immunity against external and switching noises.  Reducing the electromagnetic interferences, both radiated and conducted, to pass the EMC tests more easily. If the VIPer is used to design a SMPS, the following basic rules should be considered: 32/37  Separating signal from power tracks. Generally, traces carrying signal currents should run far from others carrying pulsed currents or with fast swinging voltages. Signal ground traces should be connected to the IC signal ground, GND, using a single “star point”, placed close to the IC. Power ground traces should be connected to the IC power ground, GND. The compensation network should be connected to the COMP, maintaining the trace to GND as short as possible. In case of two-layer PCB, it is a good practice to route signal traces on one PCB side and power traces on the other side.  Filtering sensitive pins. Some crucial points of the circuit need or may need filtering. A small high-frequency bypass capacitor to GND might be useful to get a clean bias voltage for the signal part of the IC and protect the IC itself during EFT/ESD tests. A low ESL ceramic capacitor (a few hundreds pF up to 0.1 F) should be connected across VCC and GND, placed as close as possible to the IC. With flyback topologies, when the auxiliary winding is used, it is suggested to connect the VCC capacitor on the auxiliary return and then to the main GND using a single track.  Keeping power loops as confined as possible. The area circumscribed by current loops where high pulsed current flow should be minimized to reduce its parasitic selfinductance and the radiated electromagnetic field. As a consequence, the electromagnetic interferences produced by the power supply during the switching are highly reduced. In a flyback converter the most critical loops are: the one including the input bulk capacitor, the power switch, the power transformer, the one including the snubber, the one including the secondary winding, the output rectifier and the output capacitor. In a buck converter the most critical loop is the one including the input bulk capacitor, the power switch, the power inductor, the output capacitor and the freewheeling diode.  Reducing line lengths. Any wire acts as an antenna. With the very short rise times exhibited by EFT pulses, any antenna can receive high voltage spikes. By reducing line lengths, the level of received radiated energy is reduced, and the resulting spikes from electrostatic discharges are lower. This also keeps both resistive and inductive effects to a minimum. In particular, all traces carrying high currents, especially if pulsed (tracks of the power loops) should be as short and wide as possible.  Optimizing track routing. As levels of pickup from static discharges are likely greater near the edges of the board, it is wise to keep any sensitive lines away from these areas. Input and output lines often need to reach the PCB edge at some stage, but they can be routed away from the edge as soon as possible where applicable. Since vias are to be considered inductive elements, it is recommended to minimize their number in the signal path and avoid them in the power path.  Improving thermal dissipation. An adequate copper area has to be provided under the DRAIN pins as heatsink, while it is not recommended to place large copper areas on the GND. DocID031727 Rev 1 VIPer01B Application information Figure 41. Recommended routing for flyback converter Figure 42. Recommended routing for buck converter
DocID031727 Rev 1 33/37 37 Package information 6 VIPer01B Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 6.1 SSOP10 package information Figure 43. SSOP10 package outline 34/37 DocID031727 Rev 1 VIPer01B Package information Table 10. SSOP10 package mechanical data Dimensions (mm) Symbol Min. Typ. Max. A - - 1.75 A1 0.10 - 0.25 A2 1.25 - b 0.31 - 0.51 c 0.17 - 0.25 D 4.80 4.90 5 E 5.80 6 6.20 E1 3.80 3.90 4 e - 1 - h 0.25 - 0.50 L 0.40 - 0.90 K 0° - 8° Figure 44. SSOP10 recommended footprint DocID031727 Rev 1 35/37 37 Ordering information 7 VIPer01B Ordering information Table 11. Order code 8 Order code IDLIM (OCP) FOSC ± jitter VIPer013BLSTR 360 mA 60 kHz ± 7% VIPer012BHSTR 240 mA 120 kHz ± 7% Package SSOP10 (tape and reel) Revision history Table 12. Document revision history 36/37 Date Revision 04-Apr-2018 1 Changes Initial release. DocID031727 Rev 1 VIPer01B IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DocID031727 Rev 1 37/37 37