VL53L3CX
Datasheet
Time-of-Flight ranging sensor with multi target detection
Features
•
•
•
•
Fully integrated miniature module
–
Emitter: 940 nm invisible laser (VCSEL) and its analog driver
–
Low-power microcontroller running advanced digital firmware
–
Size: 4.4 x 2.4 x 1 mm
Fast, accurate distance ranging
–
Histogram based technology
–
Up to 300 cm+ detection with full field of view (FoV)
–
Immune to cover glass cross-talk and fingerprint smudge at long distance
with patented algorithms (direct ToF)
–
Dynamic fingerprint smudge compensation
–
Short distance, high accuracy linearity
–
Multi target detection and distance measurement
Typical full FoV: 25°
Easy integration
–
Reflowable component
–
Part-to-part or generic shape crosstalk calibration available
–
Single power supply
–
Works with many types of cover glass materials
–
I²C interface (up to 1 MHz)
–
Xshutdown (reset) and interrupt GPIO to optimize ranging operation
–
C and Linux® full set of software drivers for turnkey ranging
Application
•
•
•
•
•
•
Service robots and vacuum cleaners (wall following and fast obstacle detection)
Sanitary (robust user detection whatever the target reflectance)
Smart buildings and smart lighting (user detection to wake up devices)
IoT (user and object detection)
Laser assisted autofocus (AF): enhances the camera AF system speed and
robustness, especially in difficult scenes (low light and low contrast); ideal
companion for phase-detection autofocus (PDAF) sensors.
Video focus tracking assistance
DS13204 - Rev 5 - March 2022
For further information contact your local STMicroelectronics sales office.
www.st.com
VL53L3CX
Description
The VL53L3CX is the latest Time-of-Flight (ToF) product from STMicroelectronics
and embeds ST’s third generation FlightSense patented technology. It combines
a high performance proximity and ranging sensor, with multi target distance
measurements and automatic smudge correction. The miniature reflowable package
integrates a single photon avalanche diode (SPAD) array and physical infrared filters
to achieve the best ranging performance in various ambient lighting conditions, with a
wide range of cover glass windows.
The VL53L3CX combines the benefits of a high-performance proximity sensor, with
excellent short distance linearity, together with ranging capability up to 3 m.
With patented algorithms and ingenious module construction, the VL53L3CX is
also able to detect different objects within the FoV with depth understanding. The
ST histogram algorithms allow cover glass crosstalk immunity beyond 80 cm, and
dynamic smudge compensation.
DS13204 - Rev 5
page 2/35
VL53L3CX
Product overview
1
Product overview
1.1
Technical specification
Table 1. Technical specification
Feature
Detail
Package
Optical LGA12
Size
4.4 x 2.4 x 1 mm
Operating voltage
2.6 to 3.5 V
Operating temperature
-20 to 85°C
Infrared emitter
940 nm
Up to 1 MHz (Fast mode plus) serial bus
I2C
1.2
Address: 0x52
System block diagram
Figure 1. VL53L3CX block diagram
VL53L3CX module
VL53L3CX silicon
GND
SDA
Single Photon
Avalanche Diode (SPAD)
Detection array
Non Volatile
Memory
SCL
ROM
RAM
AVDD
XSHUT
GPIO1
Microcontroller
Advanced
Ranging Core
VCSEL Driver
AVSSVCSEL
IR+
IR-
AVDDVCSEL
940nm
DS13204 - Rev 5
page 3/35
VL53L3CX
Device pinout
1.3
Device pinout
The figure below shows the pinout of the device.
Figure 2. Device pinout (bottom view)
GND3
GPIO1
7
DNC
6
5
XSHUT
8
4
GND2
SDA
9
3
GND
SCL
10
2
AVSSVCSEL
AVDD
11
1
AVDDVCSEL
12
GND4
Table 2. Device pin description
Pin number
Signal name
Signal type
Signal description
1
AVDDVCSEL
Supply
VCSEL supply, to be connected to main supply
2
AVSSVCSEL
3
GND
4
GND2
5
XSHUT
Digital input
Xshutdown pin, active low
6
GND3
Ground
To be connected to main ground
VCSEL ground, to be connected to main ground
Ground
To be connected to main ground
To be connected to main ground
7
GPIO1
Digital output
Interrupt output. Open drain output
8
DNC
Digital input
Do not connect, must be left floating
9
SDA
Digital input/output
I2C serial data
10
SCL
Digital input
I2C serial clock input
11
AVDD
Supply
Supply, to be connected to main supply
12
GND4
Ground
To be connected to main ground
Note:
AVSSVCSEL and GND are ground pins and can be connected together in the application schematics.
Note:
GND2, GND3, and GND4 are standard pins that are forced to the ground domain in the application schematics
to avoid possible instabilities if set to other states.
DS13204 - Rev 5
page 4/35
VL53L3CX
Application schematic
1.4
Application schematic
The figure below shows the application schematic of the device.
Figure 3. VL53L3CX schematic
IOVDD
AVDD
5
7
HOST
9
Rserial
10
Rserial
8
Recommended for
hardware interrupt
XSHUT AVDDVCSEL
GPIO1
AVDD
SDA
AVSSVCSEL
SCL
GND
DNC
GND2
GND3
VL53L3CX
GND4
1
11
2
3
100nF
4.7µF
Caps as close as possible
to VL53L3CX
4
6
12
Note:
Capacitors on the external supply AVDD should be placed as close as possible to the AVDDVCSEL and
AVSSVCSEL module pins.
Note:
External pull-up resistor values can be found in I2C-bus specification. Pull-ups are typically fitted only once per
bus, near the host. For suggested values see tables below.
Note:
XSHUT pin must always be driven to avoid leakage current. A pull-up is needed if the host state is not known.
XSHUT is needed to use hardware standby mode (no I²C communication).
Note:
XSHUT and GPIO1 pull-up recommended values are 10 kOhms. GPIO1 should be left unconnected if not used.
The tables below show recommended values for pull-up and series resistors for an AVDD of 1.8 V to 2.8 V in I²C
fast mode (up to 400 kHz) and fast mode plus (up to 1 MHz).
Table 3. Suggested pull-up and series resistors for I²C fast mode
I²C load capacitance (CL)
Pull-up resistor (Ohms)
Series resistor (Ohms)
CL ≤ 90 pF
3.6 k
0
90 pF < CL ≤ 140 pF
2.4 k
0
140 pF < CL ≤ 270 pF
1.2 k
0
270 pF < CL ≤ 400 pF
0.8 k
0
Table 4. Suggested pull-up and series resistors for I²C fast mode plus
Note:
DS13204 - Rev 5
I²C load capacitance (CL)
Pull up resistor (Ohms)
Series resistor (Ohms)
CL ≤ 90 pF
1.5 k
100
90 pF < CL ≤ 140 pF
1k
50
140 pF < CL ≤ 270 pF
0.5 k
50
270 pF < CL ≤ 400 pF
0.3 k
50
For each bus line, CL is measured in the application PCB by the customer.
page 5/35
VL53L3CX
Functional description
2
Functional description
2.1
System functional description
The figure below shows the system level functional description. The host customer application controls the device
using an application programming interface (API). The API implementation is delivered to the customer as a driver
(bare C code, or Linux driver).
The driver shares with the customer application a set of high-level functions that allow control of the device
firmware like initialization, ranging start/stop, setting the system accuracy.
The driver is a turnkey solution consisting of a set of “C” functions. This enables fast development of end-user
applications without the complication of direct multiple register access. The driver is structured so that it can be
compiled on any kind of platform, through a well abstracted platform layer. The driver package allows the user to
take full advantage of the device capabilities.
A detailed description of the driver is available in the device driver user manual.
The device firmware fully manages the hardware register accesses.
Section 2.2 State machine description details the firmware state machine.
Figure 4. VL53L3CX system functional description
HOST
Customer
Application
DS13204 - Rev 5
VL53L3CX
VL53L3CX
API/Driver
Firmware
Hardware
I2C
page 6/35
VL53L3CX
State machine description
2.2
State machine description
The figure below shows the device state machine.
Figure 5. Device state machine
Power Off
Host applies AVDD
Host removes AVDD
HW Standby
Host raises XSHUT
Host lowers XSHUT
Initial Boot
Automatic move
SW Standby
Host initiates START
Self-Calibration
Automatic move
Host initiates STOP
Continuous
Ranging
Next range starts
automatically after Host
has cleared the interrupt
Host clears interrupt
2.3
Customer manufacturing calibration flow
Up to three calibrations are needed to guarantee the best sensor performances. Offset and RefSpad calibration
are needed in all applications. If a cover glass is used, the crosstalk calibration is needed also.
“Generic shape” crosstalk calibration is also available. In this case, part-to-part calibration is not needed and a
standard set of calibration values is loaded.
The detailed procedure is provided in the device driver user manual.
2.4
Device programming and control
The VL53L3CX physical control interface is I²C, described in Section 3 Control interface.
A software layer (driver) is provided to control the device. This avoids complex I²C register operations with turnkey
functions to start, stop, and read the ranging values.
The driver structure and functions are described in the device driver user manual.
DS13204 - Rev 5
page 7/35
VL53L3CX
Ranging mode description
2.5
Ranging mode description
The VL53L3CX dedicated operating mode (called “preset”) is “ranging mode”. In this mode, the software driver
proposes turnkey to allow fast and easy ranging in all customer applications:
Ranging mode is the configuration to get the best of the VL53L3CX functionalities.
•
Ranging mode is natively immune to cover glass crosstalk and smudge beyond 80 cm. With patented
algorithms (direct ToF), a temporal filtering is possible to distinguish crosstalk from the object signal over
long distances > 80 cm. A best-in-class ranging performance of 300 cm with the cover glass in place is now
possible, and can be reached with any computation unlike other sensors on the market.
•
Ranging mode can detect several objects concurrently within the FoV. Up to four ranges can be output
simultaneously by the software driver, to indicate an object's range. Check the latest software driver manual
for further details.
•
Ranging operation is performed by default at 30 Hz once the driver function is called (typical ranging
operation lasts 33 ms). It includes internal housekeeping, ranging and post-processing.
Note:
Ranging mode requires a handshake between the host and the VL53L3CX, at each ranging operation. This
handshake is mandatory to ensure the right result is read by the host to continue the ranging operation.
Refer to Section 2.10 Handshake management.
2.6
Digital processing
Digital processing is the final operation of the ranging sequence that computes, validates or rejects a ranging
measurement. Part of this processing is performed by the VL53L3CX internal firmware and completed on the host
processor running the software driver.
At the end of digital processing, the ranging distance is computed by the VL53L3CX itself. If the distance cannot
be measured (no target or weak signal), a corresponding status error code is generated and can be read by the
host.
A full description of the status errors is provided inside the device driver user manual.
2.7
Reading the results
The VL53L3CX software driver provides turnkey functions to read output results after the measurement:
•
Signal rate per object detected
•
Ranging distance per object detected
•
Min. and max. distances where object is located
A full description is provided inside the device driver user manual.
DS13204 - Rev 5
page 8/35
VL53L3CX
Power sequence
2.8
Power sequence
2.8.1
Power up and boot sequence
There are two options available for device power up/boot.
Option 1: The XSHUT pin is connected and controlled from the host.
This option optimizes power consumption as the device can be completely powered off when not used, and then
woken up through the host GPIO (using the XSHUT pin).
HW standby mode is defined as the period when AVDD is present and XSHUT is low.
Figure 6. Power up and boot sequence
Option 2: The XSHUT pin is not controlled by the host, it is tied to AVDD through the pull-up resistor.
When the XSHUT pin is not controlled, the power-up sequence is presented in the figure below. In this case, the
device goes automatically to SW STANDBY after FW BOOT, without entering HW STANDBY.
Figure 7. Power up and boot sequence with XSHUT not controlled
Note:
In both cases, tBOOT is 1.2 ms max.
Note:
In both cases, XSHUT has to be raised only when AVDD is tied on.
Note:
The VL53L3CX must only exit reset when there is no existing I²C transaction taking place on the bus. That is, do
not raise the XSHUT when there is an existing I²C command in progress, wait until the current I²C command has
completed.
DS13204 - Rev 5
page 9/35
VL53L3CX
Ranging sequence
2.9
Ranging sequence
Figure 8. Ranging sequence
2.10
Handshake management
Once a ranging measurement is available, an interrupt is generated. This is communicated to the host as a
physical signal on the GPIO1 pin, which is driven low, and the output of a driver function. The former operating
method is called “hardware interrupt”, and the latter is referred as “polling mode”.
Once the host reads the result, the interrupt is cleared by the driver and the ranging sequence can repeat. If the
interrupt is not cleared, the ranging operation inside the VL53L3CX is on hold. The interrupt behavior allows a
good synchronization between the VL53L3CX and the host, avoids losing results if the host is not available to
acquire or process the data.
It is strongly recommended to use the hardware interrupt pin to manage this handshake.
For more details, refer to the device driver user manual.
DS13204 - Rev 5
page 10/35
VL53L3CX
Control interface
3
Control interface
This section describes the control interface. The I²C interface uses two signals: serial data line (SDA) and serial
clock line (SCL). Each device connected to the bus uses a unique address and a simple master/slave relationship
exists.
Both SDA and SCL lines are connected to a positive supply voltage using pull-up resistors located on the host.
Lines are only actively driven low. A high condition occurs when lines are floating and the pull-up resistors pull
lines up. When no data is transmitted, both lines are high.
Clock signal (SCL) generation is performed by the master device. The master device initiates data transfer. The
I²C bus on the product device has a maximum speed of 1 Mbits/s and uses a default device address of 0x52.
Figure 9. Data transfer protocol
Acknowledge
Start condition
SDA
MSB
SCL
S
LSB
1
2
3
4
5
8
7
6
Address or data byte
Ac/Am
P
Stop condition
Information is packed in 8-bit packets (bytes) always followed by an acknowledge bit, Ac for VL53L3CX
acknowledge and Am for master acknowledge (host bus master). The internal data is produced by sampling
SDA at a rising edge of SCL. The external data must be stable during the high period of SCL. The exceptions to
this are start (S) or stop (P) conditions when SDA falls or rises respectively, while SCL is high.
A message contains a series of bytes preceded by a start condition and followed by either a stop or repeated
start (another start condition but without a preceding stop condition) followed by another message. The first byte
contains the device address (0x52) and also specifies the data direction. If the least significant bit is low (that
is, 0x52) the message is a master-write-to-the-slave. If the LSB is set (that is, 0x53) then the message is a
master-read-from-the-slave.
Figure 10. VL53L3CX I²C device address: 0x52
LSBit
MSBit
0
1
0
1
0
0
1
R/W
All serial interface communications with the Time-of-Flight sensor must begin with a start condition. The
VL53L3CX module acknowledges the receipt of a valid address by driving the SDA wire low. The state of
the read/write bit (LSB of the address byte) is stored and the next byte of data, sampled from SDA, can be
interpreted. During a write sequence, the second byte received provides a 16-bit index, which points to one of the
internal 8-bit registers.
DS13204 - Rev 5
page 11/35
VL53L3CX
Control interface
Figure 11. VL53L3CX data format (write)
Start
S
VL53L3CX acknowledges
valid address
ADDRESS[7:0]
As
Acknowledge from VL53L3CX
As
INDEX[15:8]
INDEX[7:0]
As
DATA[7:0]
0x52 (write)
As P
Stop
As data are received by the slave, they are written bit by bit to a serial/parallel register. After each data byte is
received by the slave, an acknowledge is generated. The data are then stored in the internal register addressed
by the current index.
During a read message, the contents of the register addressed by the current index is read out in the byte
following the device address byte. The contents of this register are parallel loaded into the serial/parallel register,
and clocked out of the device by the falling edge of SCL.
Figure 12. VL53L3CX data format (read)
0x52 (write)
S
ADDRESS[7:0]
INDEX[15:8]
As
INDEX[7:0]
As
As P
0x53 (read)
S
ADDRESS[7:0]
As
DATA[7:0]
Am P
At the end of each byte, in both read and write message sequences, an acknowledge is issued by the receiving
device (that is, the VL53L3CX device for a write and the host for a read).
A message can only be terminated by the bus master, either by issuing a stop condition or by a negative
acknowledge (that is, not pulling the SDA line low) after reading a complete byte during a read operation.
The interface also supports auto-increment indexing. After the first data byte is transferred, the index is
automatically incremented by 1. The master can therefore send data bytes continuously to the slave until the
slave fails to provide an acknowledge, or the master terminates the write communication with a stop condition.
If the auto-increment feature is used the master does not have to send address indexes to accompany the data
bytes.
Figure 13. VL53L3CX data format (sequential write)
0x52 (write)
S
ADDRESS[7:0]
DATA[7:0]
DS13204 - Rev 5
INDEX[15:8]
As
As
DATA[7:0]
INDEX[7:0]
As
As
DATA[7:0]
As P
As P
page 12/35
VL53L3CX
I²C interface - timing characteristics
Figure 14. VL53L3CX data format (sequential read)
0x52 (write)
ADDRESS[7:0]
S
INDEX[15:8]
As
INDEX[7:0]
As
As P
0x53 (read)
S
ADDRESS[7:0]
DATA[7:0]
3.1
DATA[7:0]
As
Am
DATA[7:0]
Am
Am
DATA[7:0]
DATA[7:0]
Am
Am P
I²C interface - timing characteristics
Timing characteristics are shown in the tables below. Refer to the figure below for an explanation of the
parameters used.
Timings are given for all PVT conditions.
Table 5. I²C interface - timing characteristics for fast mode plus (1 MHz)
DS13204 - Rev 5
Symbol
Parameter
Minimum
FI2C
Operating frequency
tLOW
Typical
Maximum
Unit
0
1000
kHz
Clock pulse width low
0.5
—
tHIGH
Clock pulse width high
0.26
—
tSP
Pulse width of spikes that are suppressed by the input filter
—
50
tBUF
Bus free time between transmissions
0.5
—
tHD.STA
Start hold time
0.26
—
tSU.STA
Start setup time
0.26
—
tHD.DAT
Data in hold time
0
0.9
tSU.DAT
Data in setup time
50
—
tR
SCL/SDA rise time
—
120
tF
SCL/SDA fall time
—
120
tSU.STO
Stop setup time
0.26
—
Ci/o
Input/output capacitance (SDA)
—
10
Cin
Input capacitance (SCL)
—
4
CL
Load capacitance
—
—
140
µs
ns
µs
ns
µs
pF
550
page 13/35
VL53L3CX
I²C interface - timing characteristics
Table 6. I²C interface - timing characteristics for fast mode (400 kHz)
Symbol
Parameter
Minimum
FI2C
Operating frequency
tLOW
Typical
Maximum
Unit
0
400
kHz
Clock pulse width low
1.3
—
tHIGH
Clock pulse width high
0.6
—
tSP
Pulse width of spikes that are suppressed by the input filter
—
50
tBUF
Bus free time between transmissions
1.3
—
tHD.STA
Start hold time
0.26
—
tSU.STA
Start setup time
0.26
—
tHD.DAT
Data in hold time
0
0.9
tSU.DAT
Data in setup time
50
—
tR
SCL/SDA rise time
—
300
tF
SCL/SDA fall time
—
300
tSU.STO
Stop setup time
0.6
—
Ci/o
Input/output capacitance (SDA)
—
10
Cin
Input capacitance (SCL)
—
4
CL
Load capacitance
—
—
125
µs
ns
µs
ns
µs
pF
400
Figure 15. I²C timing characteristics
stop
start
start
...
SDA
tBUF
SCL
tLOW
tR
VIL
tHD.STA
...
VIL
tHD.STA
tHD.DAT
IL
DS13204 - Rev 5
VIH
tF
VIH
stop
tHIGH
tSU.DAT
tSU.STA
tSU.STO
or VIH.
page 14/35
VL53L3CX
I²C interface - reference registers
3.2
I²C interface - reference registers
The registers shown in the table below can be used to validate the user I²C interface.
Table 7. Reference registers
Note:
Register name
Index
Value
Model_ID
0x010F
0xEA
Module_Type
0x0110
0xAA
The I²C read/writes can be 8, 16 or 32-bit. Multi-byte reads/writes are always addressed in ascending order with
MSB first as shown in the table below. The customer must use the device software driver for easy and efficient
ranging operations to match performance and accuracy criteria. Hence full register details are not exposed. The
customer should refer to the device user manual.
Table 8. 32-bit register example
DS13204 - Rev 5
Register address
Byte
Address
MSB
Address + 1
..
Address + 2
..
Address + 3
LSB
page 15/35
VL53L3CX
Electrical characteristics
4
Electrical characteristics
4.1
Absolute maximum ratings
Table 9. Absolute maximum ratings
Parameter
Min.
Typ.
Max.
AVDD
-0.5
—
3.6
SCL, SDA, XSHUT,
and GPIO1
-0.5
—
3.6
Unit
V
Caution:
Stresses above those listed as "Absolute maximum ratings" may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at these or any other conditions above those
indicated in the operational sections of the specification is not implied. Exposure to maximum rating conditions
for extended periods may effect device reliability.
4.2
Recommended operating conditions
Table 10. Recommended operating conditions
There are no power supply sequencing requirements. The I/Os may be high, low or floating when AVDD is applied. The I/Os are
internally failsafe with no diode connecting them to AVDD
Parameter
Min.
Typ.
Max.
Voltage (AVDD)
2.6
2.8
3.5
Standard mode
1.6
1.8
1.9
2V8 mode (2)
2.6
2.8
3.5
Ambient operating temperature range without damage (3)
-20
IO (IOVDD) (1)
Unit
V
85
°C
1. XSHUT should be high level only when AVDD is on.
2. SDA, SCL, XSHUT and GPIO1 high levels have to be equal to AVDD in 2V8 mode.
3. Performances described are given at 23°C ambient temperature.
4.3
Electrostatic discharge
The device is compliant with electrostatic discharge (ESD) values presented in the table below.
Table 11. ESD performances
DS13204 - Rev 5
Parameter
Specification
Condition
Human body model
JS-001-2012
± 2 kV, 1500 Ohms, 100 pF
Charged device model
JESD22-C101
± 500 V
page 16/35
VL53L3CX
Current consumption
4.4
Current consumption
Table 12. Power consumption at ambient temperature
All current consumption values include silicon process variations. Temperature and voltage are nominal conditions (23°C and
2v8). All values include AVDD and AVDDVCSEL.
Parameter
Min.
Typ.
Max.
HW STANDBY
3
5
7
SW STANDBY (2V8 mode) (1)
4
6
9
16
18
Active ranging average consumption (including VCSEL) (2) (3)
Unit
µA
mA
1. In standard mode (1v8), pullups have to be modified, then SW STANDBY consumption is increased by 0.6 µA.
2. Active ranging is an average value, measured using default driver settings. Ranging mode is with default settings.
3. Peak current (including VCSEL) can reach 40 mA.
4.5
Digital input and output
Symbol
Parameter
Min.
Typ.
Max.
Unit
Interrupt pin (GPIO1)
VIL
Low level input voltage
—
0.3 IOVDD
VIH
High level input voltage
0.7 IOVDD
—
VOL
Low level output voltage (IOUT = 4 mA)
—
VOH
High level output voltage (IOUT = 4 mA)
IOVDD-0.4
—
FGPIO
Operating frequency (CLOAD = 20 pF)
0
108
—
0.4
V
MHz
I2C interface (SDA/SCL)
VIL
Low level input voltage
-0.5
0.6
VIH
High level input voltage
1.12
IOVDD+0.5
VOL
Low level output voltage (IOUT = 4 mA)
—
Leakage current (1)
—
10
(2)
—
0.15
IIL/IH
Leakage current
—
V
0.4
µA
1. AVDD = 0 V
2. AVDD = 2.85 V; I/O voltage = 1.8 V
DS13204 - Rev 5
page 17/35
VL53L3CX
Ranging performances
5
Ranging performances
5.1
Measurement conditions
In all measurement tables of the document, it is considered that:
1.
The full FoV is covered (typically 25° is covered).
2.
Charts used as targets are: grey (17% reflectance, N4.74 Munsell) and white (88% reflectance N9.5
Munsell).
3.
Nominal voltage (2.8 V) and temperature (23°C)
4.
The device is controlled through the driver using the default settings (refer to the user manual for driver
settings description).
5.
Indoor (no IR) means there is no contribution of light in the band 940 nm ± 30 nm. Outdoor overcast
conditions means an illumination level of 0.7 W/m² back on the sensor, in the band 940 nm ± 30 nm.
6.
No coverglass is present.
7.
Typical samples used.
5.2
Minimum ranging distance
A target can be detected down to 10 mm.
5.3
Maximum ranging distance
The table below shows the ranging specification for the typical device bare module, without cover glass, at room
temperature (23°C), with nominal voltage (2.8 V), and full FoV covered.
Table 13. Maximum ranging capabilities with 30 ms timing budget
Target reflectance level,
full FoV (reflectance %)
White target (88%)
Light gray target (54%)
Gray target (17%)
Note:
DS13204 - Rev 5
Indoor (detection rate %)
Outdoor overcast (detection rate %)
Typical: 310 cm @ 94% min.
Typical: 100 cm @ 94% min.
Minimum: 310 cm @ 50% min.
Minimum: 110 cm @ 50% min.
Typical: 290 cm @ 94% min.
Typical: 70 cm @ 94% min.
Minimum: 290 cm @ 50% min.
Minimum: 90 cm @ 50% min.
Typical: 170 cm @ 94% min.
Typical: 70 cm @ 94% min.
Minimum: 200 cm@ 50% min.
Minimum: 90 cm @ 50% min.
In the table above:
•
"Indoor" corresponds to no infrared
•
"Outdoor overcast" corresponds to a parasitic noise of 10 kcps/SPAD for the device module. For reference,
this corresponds to a 1.2 W/m2 at 940 nm and is equivalent to 5 kLux daylight while ranging on a grey 17%
chart at 40 cm.
•
Detection rate is the worst case percentage of measurements that return a valid measurement.
•
The ranging distances reported are the ones reported by the driver by the parameter called RangeMilliMeter.
page 18/35
VL53L3CX
Ranging accuracy
5.4
Ranging accuracy
Ranging accuracy is defined as follows:
RangingAccuracy =
RangeMilliMeter − TargetDistance
× 100
TargetDistance
The ranging accuracy is a direct evaluation of the measurement, including offset errors and output noise.
At least 94% of the ranging values are within the declared ranges. This quality indicator includes measure-tomeasure and part-to-part dispersion.
Table 14. Ranging accuracy with 30 ms timing budget
Target reflectance level, full FoV
White target (88%)
Light gray target (54.5%)
Gray target (17%)
Distance (mm)
Indoor (no infrared)
Outdoor overcast
25-90
±10 mm
±10 mm
90-110
±5%
±9%
>110
±2.5%
±7%
25-90
±9 mm
±9 mm
90-110
±5%
±7%
>110
±3%
±8%
25-90
±7 mm
±7 mm
90-110
±5%
±8%
>110
±5%
±10%
Measurement conditions:
•
Offset correction made at 10 cm from sensor
•
Indoor: no infrared
•
Outdoor: eq. 5 kLux equivalent sunlight (10 kcps/SPAD)
•
Nominal voltage (2v8) and temperature (23°C)
•
All distances are for a complete FoV covered
•
Measurement is made on typical device bare modules
5.5
Ranging drift with temperature
When the temperature increases, the ranging value is affected by an offset of 1.3 mm per degree Celsius change.
This value is an offset and not a gain, and it does not depend on the target distance.
The VL53L3CX device embeds a feature that allows the temperature variation effect to be compensated, while
ranging.
When the ranging is started, the self-calibration is performed once and this allows to remove the ranging drift.
In order to get the best accuracy performances, it is recommended to perform a self-calibration when temperature
varies. This operation is realized calling in sequence the functions “stop” and “start”.
DS13204 - Rev 5
page 19/35
Outline drawings
VL53L3CX
2
3
4
CONTROLLED DOCUMENT
0
SEE INDIVIDUAL PARTS
5
6
0.50
IN 12 POS.
6
7
PAGE
1/4
DATE
DESCRIPTION
1 SEPT 2017
23 AUG 2017
8
ADDED: NOTE 5, SHEEET 2 - TOP VIEW DETAILS ON TWO
CAPS, NEW ISOMETRIC VIEWS ON SHEETS 3 AND 4.
REVISIONS
REV.
DRAFT NOTED ON PAGE 1. NEW NOTE 3 ON PAGE 1.
APERTURE DEPTHS FOR CAP ASSEMBLY DM00418317
NOTED ON PAGE 2.
7
3.00
DRAFT OMITTED ON PAGE 1. LINER THICKNESS UPDATED.
10
6
8
29 SEPT 2017
5.00
4.00
11
VL53L3CX A
PLLL YMM
5
8
Scale
25:1
Sheet
1 OF 4
Unauthorized reproduction and communication strictly prohibited
7
Drawn
Do Not Scale
ALL DIMENSIONS IN mm
MR LOPEZ BORBONES
Date
STMicroelectronics - Imaging Division
31 JUL 2017
Part No.
Title
DM00392521
VL53L3CX MODULE OUTLINE DRAWING
A
B
C
D
F
CONNECTION TABLE
PAD No.
FUNCTION
1
AVDDVCSEL
2
AVSSVCSEL
3
GND
4
GND2
5
XSHUT
E
6
GND3
7
GPIO1
8
DNC
9
SDA
10
SCL
11
AVDD
12
GND4
4
12
3
2
2.40
1
Z
0.31 ±0.04
NOTICE: This document may havebeenrevised since it was printed. Check Document Management System for latest version before using or copying.
Finish
3.20
1
1.60
1.60
0.80
0
0.15 ±0.10
0.80
4.40 ±0.05
3
PIN 1
+ 0.05
1 - 0.10
Notes:
1. DIMENSIONS MARKED
ARE INSPECTION DIMENSIONS CHECKED AT OQC.
2. UNSPECIFIED RADII 0.05.
3. DIMENSIONS TO EDGE OF MOUDLE ARE CORRECT AT DATUM "Z".
4. SHEET 3 SHOWS EXCLUSION CONES TO BE KEPT FREE OF MECHANICAL ITEMS WHICH
WILL INTERFERE WITH MODULE OPERATION; THEY ARE NOT SYSTEM PERFORMANCE
CONES.
5. METAL CONNECTION PADS 1-12 ARE ELECTROLYTIC PLATED 0.0003 THK GOLD OVER
0.005 THK NICKEL.
EITHER 8575850 OR DM00418317 CAN BE USED FOR EWOK EVO MODULE ASSEMBLY.
DRAWINGS ARE SHOWN WITH DM00418317 BUT THE SAME DIMENSIONS ARE
APPLICABLE TO 8575850, UNLESS SPECIFIED.
6.
0.35 ±0.10
0.08
0
A
0.665
3.70
0.08
1.85
3
Interpret drawing per BS8888, Material
3RD Angle Projection
2.10
B
1
2
PWB SOLDER PATTERN
Tolerances, unless otherwise stated
0.80
0.50
1.20
Linear
0 Place Decimals 0
±0.05
1 Place Decimals 0.0 ±0.05
2 Place Decimals 0.00 ±0.05
Angular
±2 degrees
Diameter
+0.05
Position
0.10
ST Restricted
0.25
C
D
E
F
0.80
Copyright STMicroelectronics
17-Oct-2017
5.0
ACTIVE
DM00392521
{pN_1}
2.40 ±0.05
0.50
9
page 20/35
DS13204 - Rev 5
Outline drawings
6
ST delivers any of the two alternative dual source cap assemblies as detailed in the drawings below. Both
versions are transparent for the customer, since the pad and substrate design are identical for both versions and
have no impact on customer PCB design. Ranging performances, reflow, and technical parameters are identical
for both module designs presented in the second figure below.
Figure 16. Outline drawing 1/4
Outline drawings
VL53L3CX
Figure 17. Outline drawing 2/4
A
B
C
D
E
F
{pN_1}
1
0.20 ±0.02
2
2
3
4
2.08
1.78
0.63
0.33
0
CONTROLLED DOCUMENT
0.201 ±0.015
2.20
0.40 ±0.02
1.90
6
3.11
0.58 ±0.10
0.01 0.01 DEEP
2.50
5
FEATURE IN 2 POS.
0.33
1.29
Part No.
Date
6
DM00392521
31 JUL 2017
MR LOPEZ BORBONES
Drawn
DM00418317 CAP ASSEMBLY
SCALE 15:1
0.38 ±0.10
0.01 0.01 DEEP
SEE INDIVIDUAL PARTS
0.63
NOTICE: This document may havebeenrevised since it was printed. Check Document Management System for latest version before using or copying.
Finish
0
3
FEATURE IN 2 POS.
0.40 ±0.02
3.12
Interpret drawing per BS8888, Material
3RD Angle Projection
8575850 CAP ASSEMBLY
SCALE 15:1
Tolerances, unless otherwise stated
Linear
0 Place Decimals 0
±0.05
1 Place Decimals 0.0 ±0.05
2 Place Decimals 0.00 ±0.05
Angular
±2 degrees
Diameter
+0.05
Position
0.10
1
ST Restricted
Copyright STMicroelectronics
17-Oct-2017
5.0
ACTIVE
DM00392521
1.28
3.78
Title
7
0.035 DEEP
IN 6 POS
PAGE
8
REV
Do Not Scale
STMicroelectronics - Imaging Division
ALL DIMENSIONS IN mm
4.08
8
2/4
5.00
Scale
25:1
Sheet
2 OF 4
Unauthorized reproduction and communication strictly prohibited
7
VL53L3CX MODULE OUTLINE DRAWING
A
B
C
D
E
F
page 21/35
DS13204 - Rev 5
0
Outline drawings
VL53L3CX
Figure 18. Outline drawing 3/4
A
B
C
D
E
1
2
0.665
COLLECTOR
EXCLUSION CONE
2
0.22 OF CONE
AT DATUM 'A'
Tolerances, unless otherwise stated
ST Restricted
Copyright STMicroelectronics
1
Linear
F 0 Place Decimals 0 ±0.05
1 Place Decimals 0.0 ±0.05
2 Place Decimals 0.00 ±0.05
Angular
±2 degrees
Diameter
+0.05
Position
0.10
{pN_1}
17-Oct-2017
5.0
ACTIVE
DM00392521
25°
3
3
Finish
4
35°
CONTROLLED DOCUMENT
5
EMITTER
EXCLUSION CONE
A
0.43 OF CONE
AT DATUM 'A'
SEE INDIVIDUAL PARTS
Interpret drawing per BS8888, Material
3RD Angle Projection
3
6
6
7
7
PAGE
8
REV
SCALE 20:1
SCALE 20:1
3/4
5.00
Scale
25:1
Sheet
3 OF 4
Unauthorized reproduction and communication strictly prohibited
8
Drawn
Do Not Scale
ALL DIMENSIONS IN mm
MR LOPEZ BORBONES
Date
STMicroelectronics - Imaging Division
31 JULY 2017
Part No.
Title
DM00392521
VL53L3CX MODULE OUTLINE DRAWING
NOTICE: This document may havebeenrevised since it was printed. Check Document Management System for latest version before using or copying.
A
B
C
D
E
F
page 22/35
DS13204 - Rev 5
1.20
Outline drawings
VL53L3CX
Figure 19. Outline drawing 4/4
A
B
C
D
E
F
{pN_1}
1
2
2
3
3
4
CONTROLLED DOCUMENT
SEE INDIVIDUAL PARTS
5
0.05
1.05
6
6
DM00392521
31 JUL 2017
Drawn
MR LOPEZ BORBONES
Date
Part No.
NOTICE: This document may havebeenrevised since it was printed. Check Document Management System for latest version before using or copying.
Finish
Interpret drawing per BS8888, Material
3RD Angle Projection
PROTECTIVE LINER
4
DELIVERED CONFIGURATION
0.20 ±0.20
R0.20
IN 4 POS
Tolerances, unless otherwise stated
1
Linear
0 Place Decimals 0
±0.05
1 Place Decimals 0.0 ±0.05
2 Place Decimals 0.00 ±0.05
Angular
±2 degrees
Diameter
+0.05
Position
0.10
ST Restricted
Copyright STMicroelectronics
17-Oct-2017
5.0
ACTIVE
DM00392521
7
SCALE 20:1
PAGE
8
REV
Do Not Scale
SCALE 20:1
ALL DIMENSIONS IN mm
STMicroelectronics - Imaging Division
Title
8
4/4
5.00
Scale
30:1
Sheet
4 OF 4
Unauthorized reproduction and communication strictly prohibited
7
VL53L3CX MODULE OUTLINE DRAWING
A
B
C
D
E
F
page 23/35
DS13204 - Rev 5
0.15 ±0.15
2.92
VL53L3CX
Laser safety considerations
7
Laser safety considerations
The device contains a laser emitter and corresponding drive circuitry. The laser output is designed to remain
within Class 1 laser safety limits under all reasonably foreseeable conditions including single faults in compliance
with IEC 60825-1:2014 (third edition).
The laser output remains within Class 1 limits as long as STMicroelectronic’s recommended device settings are
used and the operating conditions specified are respected (particularly the maximum timing budget, as described
in the product user manual).
The laser output power must not be increased by any means and no optics should be used with the intention of
focusing the laser beam.
Caution:
Use of controls or adjustments or performance of procedures other than those specified herein may result in
hazardous radiation exposure.
Figure 20. Class 1 laser product label
DS13204 - Rev 5
page 24/35
VL53L3CX
Packaging and labeling
8
Packaging and labeling
8.1
Product marking
A two-line product marking is applied on the backside of the module (i.e. on the substrate). The first line is the
silicon product code, and the second line, the internal tracking code (see figure below).
Figure 21. Example of prototype marking
8.2
Inner box labeling
The labeling follows the ST standard packing acceptance specification.
The following information is written on the inner box label:
•
Assembly site
•
Sales type
•
Quantity
•
Trace code
•
Marking
•
Bulk ID number
8.3
Packing
At customer/subcontractor level, it is recommended to mount the device in a clean environment to avoid foreign
material deposition.
To help avoid any foreign material contamination at phone assembly level, the modules ar shipped in a tape and
reel format, starting from production version (cut1.1). The tape is described in the Figure 22. Tape outline drawing.
The packaging is vacuum-sealed and includes a desiccant.
DS13204 - Rev 5
page 25/35
VL53L3CX
Tape and outline drawing
8.4
Tape and outline drawing
Figure 22. Tape outline drawing
DS13204 - Rev 5
page 26/35
VL53L3CX
Lead-free solder reflow process
8.5
Lead-free solder reflow process
The figure and table below show the recommended and maximum values for the solder profile.
Customers have to tune the reflow profile depending on the PCB, solder paste, and material used. Customers
must follow the “recommended” reflow profile, which is specifically tuned for this specific device package.
If a customer must perform a reflow profile which is different from the “recommended” one (especially peak
>240°C), this new profile is qualified by the customer at their own risk. In any case, the profile has to be within the
“maximum” profile limit described in the table below.
Table 15. Recommended solder profile
Parameters
Recommended
Maximum
Units
Minimum temperature (TS min)
130
150
°C
Maximum temperature (TS max)
200
200
°C
Time tS (TS min to TS max)
90-110
60 - 120
s
Temperature (TL)
217
217
°C
Time (tL)
55-65
55 - 65
s
Ramp up
2
3
°C/s
Temperature (Tp-10)
—
250
°C
Time (tp-10)
—
10
s
Ramp up
—
3
°C/s
Peak temperature (Tp)
240
260 max
°C
Time to peak
300
300
s
Ramp down (peak to TL)
-4
-6
°C/s
Figure 23. Solder profile
Note:
The temperature mentioned in the above table is measured at the top of the device package.
Note:
The component is limited to a maximum of three passes through this solder profile.
Note:
As the device package is not sealed, only a dry re-flow process should be used (such as convection re-flow).
Vapor phase re-flow is not suitable for this type of optical component.
Note:
The device is an optical component and as such, it should be treated carefully. This would typically include using
a ‘no-wash’ assembly process.
DS13204 - Rev 5
page 27/35
VL53L3CX
Handling and storage precautions
8.6
Handling and storage precautions
8.6.1
Shock precaution
Sensor modules house numerous internal components that are susceptible to shock damage. If a unit is subject
to excessive shock, is dropped on the floor, or a tray/reel of units is dropped on the floor, it must be rejected, even
if no apparent damage is visible.
8.6.2
Part handling
Handling must be done with non-marring ESD safe carbon, plastic, or teflon tweezers. Ranging modules are
susceptible to damage or contamination. The customer is advised to use a clean assembly process after
removing the tape from the parts, and until a protective cover glass is mounted.
The sensor apertures are protected by a liner. This liner must be removed to ensure proper performance in the
final device. The liner should be removed at the latest possible step of the assembly process to help protect the
sensor from foreign material during the assembly process.
8.6.3
Compression force
A maximum compressive load of 25 N should be applied on the module.
8.6.4
Moisture sensitivity level
Moisture sensitivity is level 3 (MSL) as described in IPC/JEDEC JSTD-020-C.
8.7
Storage temperature conditions
Table 16. Recommended storage conditions
DS13204 - Rev 5
Parameter
Min.
Typ.
Max.
Unit
Temperature (storage)
-40
23
85
°C
page 28/35
VL53L3CX
Package information
9
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
DS13204 - Rev 5
page 29/35
VL53L3CX
Ordering information
10
Ordering information
Table 17. Order codes
DS13204 - Rev 5
Order codes
Package
Packing
Minimum order quantity
VL53L3CXV0DH/1
Optical LGA12 with liner
Tape and reel
4500 pcs
page 30/35
VL53L3CX
Acronyms and abbreviations
11
DS13204 - Rev 5
Acronyms and abbreviations
Acronym/abbreviation
Definition
AF
autofocus
API
application programming interface
ESD
electrostatic discharge
FoV
field of view
FW
firmware
I2C
inter-integrated circuit (serial bus)
MSB
most significant bit
NVM
non volatile memory
PDAF
phase-detection autofocus
SCL
serial clock line
SDA
serial data line
SPAD
single photon avalanche diode
ToF
Time-of-Flight
VCSEL
vertical cavity surface emitting laser
page 31/35
VL53L3CX
Revision history
Table 18. Document revision history
DS13204 - Rev 5
Date
Version
Changes
20-Dec-2019
1
Initial release
07-Feb-2020
2
Update "Application" and "Description" on first page and following sections:
Section 5.2 Minimum ranging distance, Section 5.3 Maximum ranging
distance, and Section 5.4 Ranging accuracy
11-Mar-2021
3
Update Figure 21. Example of prototype marking
13-Oct-2021
4
Section 3 Control interface: replaced “camera module” with “Time-of-Flight”
sensor.
18-Mar-2022
5
Update Figure 22. Tape outline drawing
page 32/35
VL53L3CX
Contents
Contents
1
2
Product overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1
Technical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2
System block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3
Device pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.4
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1
System functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2
State machine description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3
Customer manufacturing calibration flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4
Device programming and control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.5
Ranging mode description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.6
Digital processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.7
Reading the results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.8
Power sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.8.1
3
4
5
Power up and boot sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.9
Ranging sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.10
Handshake management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Control interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.1
I²C interface - timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.2
I²C interface - reference registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
4.1
Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.2
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.3
Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4
Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.5
Digital input and output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Ranging performances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
5.1
Measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.2
Minimum ranging distance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
DS13204 - Rev 5
page 33/35
VL53L3CX
Contents
5.3
Maximum ranging distance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.4
Ranging accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.5
Ranging drift with temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6
Outline drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
7
Laser safety considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
8
Packaging and labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
8.1
Product marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
8.2
Inner box labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
8.3
Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
8.4
Tape and outline drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
8.5
Lead-free solder reflow process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8.6
Handling and storage precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.7
8.6.1
Shock precaution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.6.2
Part handling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.6.3
Compression force . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.6.4
Moisture sensitivity level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Storage temperature conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
9
Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
10
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
11
Acronyms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
DS13204 - Rev 5
page 34/35
VL53L3CX
IMPORTANT NOTICE – READ CAREFULLY
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products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment.
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2022 STMicroelectronics – All rights reserved
DS13204 - Rev 5
page 35/35
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