VL53L5CXV0GC/1

VL53L5CX Datasheet Time-of-Flight 8x8 multizone ranging sensor with wide field of view Features • Product status link VL53L5CX • • Fast and accurate multizone distance ranging sensor – Multizone ranging output with either 4x4 or 8x8 separate zones – Autonomous Low-power mode with interrupt programmable threshold to wake up the host – Up to 400 cm ranging – Multitarget detection and distance measurement in each zone – 60 Hz frame rate capability – Histogram processing and algorithmic compensation minimizes or removes impact of cover glass crosstalk – Motion indicator for each zone to show if targets have moved and how they have moved Fully integrated miniature module with wide field of view (FoV) – Emitter: 940 nm invisible light vertical cavity surface emitting laser (VCSEL) and integrated analog driver – 63° diagonal square FoV using diffractive optical elements (DOE) on both transmitter and receiver – Receiving array of single photon avalanche diodes (SPADs) – Low-power microcontroller running Firmware – Size: 6.4 x 3.0 x 1.5 mm Easy integration – Single reflowable component – Flexible power supply options, single 3.3 V or 2.8 V operation or combination of either 3.3 V or 2.8 V AVDD with 1.8 V IOVDD – Compatible with wide range of cover glass materials Applications • • • • • • • • • • Scene understanding. Multizone and multi-object distance detection enables 3D room mapping and obstacle detection for robotics applications Wide FoV and multizone scanning allows content management (load in trucks, tanks, waste bins) Gesture recognition Liquid level control Keystone correction for video projectors Laser assisted autofocus (LAF). Enhances the camera AF system speed and robustness especially in difficult low light or low contrast scenes Augmented reality/virtual reality (AR/VR) enhancement. Dual camera stereoscopy and 3D depth assistance thanks to multizone distance measurement Smart buildings and smart lighting (user detection to wake up devices) IoT (user and object detection) Video focus tracking. 60 Hz ranging allows optimization of continuous focus algorithm DS13754 - Rev 8 - July 2022 For further information contact your local STMicroelectronics sales office. www.st.com VL53L5CX Description The VL53L5CX is a state of the art, Time-of-Flight (ToF), multizone ranging sensor enhancing the ST FlightSense product family. Housed in a miniature reflowable package, it integrates a SPAD array, physical infrared filters, and diffractive optical elements (DOE) to achieve the best ranging performance in various ambient lighting conditions with a range of cover glass materials. The use of a DOE above the vertical cavity surface emitting laser (VCSEL) allows a square FoV to be projected onto the scene. The reflection of this light is focused by the receiver lens onto a SPAD array. Unlike conventional IR sensors, the VL53L5CX uses ST's latest generation, direct ToF technology which allows absolute distance measurement whatever the target color and reflectance. It provides accurate ranging up to 400 cm and can work at fast speeds (60 Hz), which makes it the fastest, multizone, miniature ToF sensor on the market. Multizone distance measurements are possible up to 8x8 zones with a wide 63 ° diagonal FoV which can be reduced by software Thanks to ST Histogram patented algorithms, the VL53L5CX is able to detect different objects within the FoV. The Histogram also provides immunity to cover glass crosstalk beyond 60 cm. DS13754 - Rev 8 page 2/38 VL53L5CX Product overview 1 Product overview 1.1 Technical specifications Table 1. Technical specifications Feature Details Package Optical LGA16 Size 6.4 x 3.0 x 1.5 mm Ranging 2 to 400 cm per zone IOVDD: 1.8 or 2.8 V or 3.3 V Operating voltage 1.2 AVDD: 2.8 V or 3.3 V Operating temperature -30 to 85 °C Sample rate Up to 60 Hz Infrared emitter 940 nm I2C interface I2C: 400 kHz to 1 MHz serial bus, address: 0x52 Operating ranging mode Continuous or Autonomous (see UM2884 for more information) Field of view Rx (or collector) exclusion zone includes all modules assembly tolerances and is used to define the cover window dimensions. The cover window opening must be equal to or wider than the exclusion zone. The detection volume represents the applicative or system FoV in which a target is detected, and a distance measured. It is determined by the Rx lens or the Rx aperture, and is narrower than the exclusion zone. Figure 1. System FoV and exclusion zone description (not to scale) Table 2. FoV angles Horizontal Detection volume Collector exclusion zone 45 o 55.5 o Vertical Diagonal o 63 o 61 o 82 o 45 Note: Detection volume depends on the environment and sensor configuration as well as target distance, reflectance, ambient light level, sensor resolution, sharpener, ranging mode, and integration time. Note: The detection volume of Table 2. FoV angles has been measured with a white 88 % reflectance perpendicular target in full FoV, located at 1 m from the sensor, without ambient light (dark conditions), with an 8x8 resolution and 14 % sharpener (default value), in Continuous mode at 15 Hz. DS13754 - Rev 8 page 3/38 VL53L5CX Field of illumination 1.3 Field of illumination The VCSEL field of illumination (FoI) is shown in the figure below. The relative emitted signal power depends on the FoI angle, and corresponds to: • • 50 ° x 50 ° considering a beam with 75 % signal from maximum 65 ° x 65 ° considering a beam with 10 % signal from maximum Figure 2. VL53L5CX FoI DS13754 - Rev 8 page 4/38 VL53L5CX System block diagram 1.4 System block diagram Figure 3. VL53L5CX block diagram 1.5 Device pinout The figure below shows the pinout of the VL53L5CX. Figure 4. VL53L5CX pinout (bottom view) The VL53L5CX pin description is given in the table below. DS13754 - Rev 8 page 5/38 VL53L5CX Device pinout Table 3. VL53L5CX pin description Pin number Signal name Signal type Signal description I2C A1 I2C_RST Digital input interface reset pin, active high. Toggle this pin from 0 to 1, then back to 0 to reset the I2C slave. Connect to GND via 47 kΩ resistor. A2 RSVD4 Reserved Connect to ground A3 INT Digital input/output (I/O) Interrupt output, defaults to opendrain output (tristate), 47 kΩ pullup resistor to IOVDD required A4 IOVDD Power 1.8 V, 2.8 V or 3.3 V supply for digital core and I/O supply A5 LPn Digital input Comms enable. Drive this pin to logic 0 to disable the I2C comms when the device is in LP mode. Drive this pin to logic 1 to enable I2C comms in LP mode. Typically used when it is required to change the I2C adress in multidevice systems. A 47 kΩ pullup resistor to IOVDD is required. A6 RSVD1 Reserved Connect to ground A7 RSVD2 Reserved Connect to ground B1 AVDD Power 2.8 V or 3.3 V analog and VCSEL supply B4 THERMALPAD Ground Connect to a ground plane to allow good thermal conduction B7 AVDD Power 2.8 V or 3.3 V analog and VCSEL supply C1 GND Ground Ground C2 RSVD6 Reserved General purpose I/O, defaults to opendrain output (tristate), 47 kΩ pullup resistor to IOVDD required C3 SDA Digital I/O Data (bidirectional), 2.2 kΩ pullup resistor to IOVDD required C4 SCL Digital input Clock (input), 2.2 kΩ pullup resistor to IOVDD required C5 RSVD5 Reserved Do not connect C6 RSVD3 Reserved Connect to ground C7 GND Ground Ground Note: The THERMALPAD pin has to be connected to ground (for more information refer to AN5657). Note: All digital signals must be driven to the IOVDD level. Note: Toggling the I2C_RST pin resets the sensor I2C communication only. It does not reset the sensor itself. To reset the sensor please refer to the sensor reset management procedure (UM2884). DS13754 - Rev 8 page 6/38 VL53L5CX Application schematic 1.6 Application schematic The figures below show the application schematic of the VL53L5CX with different IOVDD and AVDD combinations. Figure 5. Typical application schematic IOVDD AVDD IOVDD = [1.8 V, 2.8 V, 3.3 V] AVDD = [2.8 V, 3.3 V] IOVDD 4.7uF 6.3V 100nF 10V 47k 47k A4 2.2 k B1 2.2 k B7 IOVDD U2 A1 Note: DS13754 - Rev 8 IOVDD AVDD AVDD C1 R7 47k INT I2C_RST THERMAL PAD A3 RSVD5 SDA GND C3 B4 Host MCU RSVD6 SCL GND C4 LPn C7 A5 47k RSVD1 RSVD2 RSVD3 RSVD4 C2 C5 A6 A7 C6 A2 ToF sensor Capacitors on the external supplies (AVDD and IOVDD) should be placed as close as possible to the module pins. page 7/38 VL53L5CX Functional description 2 Functional description 2.1 Software interface This section shows the software interface of the device. The host customer application controls the VL53L5CX using an application programming interface (API). The API implementation is delivered to the customer as a driver (C code and reference Linux driver). The driver provides the customer application with a set of high level functions that allow control of the VL53L5CX Firmware such as device initialization, ranging start/stop, mode select etc. Figure 6. VL53L5CX system functional description 2.2 Power state machine Figure 7. Power state machine Table 4. Power state description Device state Description Low power idle state with data retention LP idle RAM and register content retained Allows fast resume to HP idle I2C communication disabled if using LPn High power idle state HP idle Device needs to be in HP idle state to start ranging Power up state Ranging DS13754 - Rev 8 Full operation VCSEL is active (pulsing) page 8/38 VL53L5CX Power up sequence 2.3 Power up sequence The recommended power up sequence is shown in the figure below. When powering up the device, the IOVDD supply should be applied at the same time or after AVDD. When removing power, the AVDD supply should be removed at the same time or after IOVDD. Note: Avoid powering IOVDD while AVDD is unpowered to prevent increased leakage current. Figure 8. Power up sequence Table 5. Power up timing table DS13754 - Rev 8 Time Description Min. t1 IOVDD rise after AVDD 0s t2 IOVDD fall before AVDD 0s page 9/38 VL53L5CX Power up sequence 2.3.1 Power up slew To ensure proper operation of the module, the following minimum slew rates on the supplies must be met for correct operation of the power on reset (POR) circuitry. The POR circuitry triggers at 0.9 V, but the supplies should reach their operation levels in accordance with the slew rates listed in the table below. Figure 9. Power up slew Note: The minimum reset time is the minimum time required for the device ROM to load and boot up after IOVDD reaches the POR rising threshold. The supply must have reached the minimum operating level (1.6 V) within this time. Note: The minimum slew rate on the IOVDD is the same regardless of 1.8 V or 2.8 V operation. Note: The AVDD rise time is determined by the internal analogue levels which must be stable for correct operation. Table 6. Supply slew rate minimum limits 2.3.2 Supply status AVDD slew IOVDD slew Start together 0.001 V/µs 0.012 V/µs AVDD stable followed by IOVDD — 0.012 V/µs IOVDD stable followed by AVDD 0.001 V/µs — Power up and I2C access For correct operation of the device, the I2C interface assumes the power level has reached 1.62 V. DS13754 - Rev 8 page 10/38 VL53L5CX I2C control interface 3 I2C control interface This section specifies the control interface. The I2C interface uses two signals: serial data line (SDA) and serial clock line (SCL). Each device connected to the bus uses a unique address and a simple master / slave relationships exists. Both SDA and SCL lines are connected to a positive supply voltage using pull-up resistors located on the host. Lines are only actively driven low. A high condition occurs when lines are floating and the pull-up resistors pull lines up. When no data is transmitted both lines are high. Clock signal (SCL) generation is performed by the master device. The master device initiates data transfer. The I2C bus on the VL53L5CX has a maximum speed of 1 Mbits/s and uses a device 8-bit address of 0x52. Figure 10. Data transfer protocol Information is packed in 8-bit packets (bytes) always followed by an acknowledge bit, Ac for VL53L5CX acknowledge and Am for master acknowledge (host bus master). The internal data are produced by sampling SDA at a rising edge of SCL. The external data must be stable during the high period of SCL. The exceptions to this are start (S) or stop (P) conditions when SDA falls or rises respectively, while SCL is high. A message contains a series of bytes preceded by a start condition and followed by either a stop or repeated start (another start condition but without a preceding stop condition) followed by another message. The first byte contains the device address (0x52) and also specifies the data direction. If the least significant bit is low (that is, 0x52) the message is a master-write-to-the-slave. If the lsb is set (that is, 0x53) then the message is a master-read-from-the-slave. Figure 11. VL53L5CX I2C device address: 0x52 All serial interface communications with the Time-of-Flight sensor must begin with a start condition. The VL53L5CX module acknowledges the receipt of a valid address by driving the SDA wire low. The state of the read/write bit (lsb of the address byte) is stored and the next byte of data, sampled from SDA, can be interpreted. During a write sequence, the second byte received provides a 16-bit index which points to one of the internal 8-bit registers. DS13754 - Rev 8 page 11/38 VL53L5CX I2C control interface Figure 12. VL53L5CX data format (write) As data are received by the slave, they are written bit by bit to a serial/parallel register. After each data byte has been received by the slave, an acknowledge is generated, the data are then stored in the internal register addressed by the current index. During a read message, the contents of the register addressed by the current index is read out in the byte following the device address byte. The contents of this register are parallel loaded into the serial/parallel register and clocked out of the device by the falling edge of SCL. Figure 13. VL53L5CX data format (read) At the end of each byte, in both read and write message sequences, an acknowledge is issued by the receiving device (that is, the VL53L5CX for a write and the host for a read). A message can only be terminated by the bus master, either by issuing a stop condition or by a negative acknowledge (that is, not pulling the SDA line low) after reading a complete byte during a read operation. The interface also supports auto-increment indexing. After the first data byte has been transferred, the index is automatically incremented by 1. The master can therefore send data bytes continuously to the slave until the slave fails to provide an acknowledge or the master terminates the write communication with a stop condition. If the auto-increment feature is used the master does not have to send address indexes to accompany the data bytes. Figure 14. VL53L5CX data format (sequential write) DS13754 - Rev 8 page 12/38 VL53L5CX I2C interface - timing characteristics Figure 15. VL53L5CX data format (sequential read) 3.1 I2C interface - timing characteristics Timing characteristics are shown in the tables below. Please refer to the figure below for an explanation of the parameters used. Timings are given for all process, voltage and temperature (PVT) conditions. Table 7. I2C interface - timing characteristics for Fast mode plus (1 MHz) DS13754 - Rev 8 Symbol Parameter Minimum Typical Maximum Unit FI2C Operating frequency 0 — 1000 kHz tLOW Clock pulse width low 0.5 — — µs tHIGH Clock pulse width high 0.26 — — µs tSP Pulse width of spikes which are suppressed by the input filter — — 50 ns tBUF Bus free time between transmissions 0.5 — — µs tHD.STA Start hold time 0.26 — — µs tSU.STA Start setup time 0.26 — — µs tHD.DAT Data in hold time 0 — 0.9 µs tSU.DAT Data in setup time 50 — — ns tR SCL/SDA rise time — — 120 ns tF SCL/SDA fall time — — 120 ns tSU.STO Stop setup time 0.26 — — µs Ci/o Input/output capacitance (SDA) — — 10 pF Cin Input capacitance (SCL) — — 4 pF CL Load capacitance — 140 550 pF page 13/38 VL53L5CX I2C interface - timing characteristics Table 8. I2C interface - timing characteristics for Fast mode (400 kHz) Symbol Parameter Minimum Typical Maximum Unit FI2C Operating frequency 0 — 400 kHz tLOW Clock pulse width low 1.3 — — µs tHIGH Clock pulse width high 0.6 — — µs tSP Pulse width of spikes which are suppressed by the input filter — — 50 ns tBUF Bus free time between transmissions 1.3 — — ms tHD.STA Start hold time 0.26 — — µs tSU.STA Start setup time 0.26 — — µs tHD.DAT Data in hold time 0 — 0.9 µs tSU.DAT Data in setup time 50 — — ns tR SCL/SDA rise time — — 300 ns tF SCL/SDA fall time — — 300 ns tSU.STO Stop setup time 0.6 — — µs Ci/o Input/output capacitance (SDA) — — 10 pF Cin Input capacitance (SCL) — — 4 pF CL Load capacitance — 125 400 pF Figure 16. I2C timing characteristics stop start start ... SDA tBUF SCL tR VIH VIL tHD.STA tF VIH ... VIL tHD.STA DS13754 - Rev 8 tLOW stop tHD.DAT tHIGH tSU.DAT tSU.STA tSU.STO page 14/38 VL53L5CX Electrical characteristics 4 Electrical characteristics 4.1 Absolute maximum ratings Table 9. Absolute maximum ratings Parameter Min. Typ. Max. AVDD, IOVDD -0.5 — 3.6 SCL, SDA, LPn, INT and I2C_RST -0.5 — 3.6 Unit V Note: Stresses above those listed in Section 1 Product overview may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 4.2 Recommended operating conditions Table 10. Recommended operating conditions Parameter AVDD supply(1) IOVDD supply Min. Typ. Max. 2.8 V configuration 2.5 2.8 3.3 3.3 V configuration 3.0 3.3 3.6 1.8 V configuration 1.62 1.8 1.98 2.8 V configuration 2.5 2.8 3.3 3.3 V configuration 3.0 3.3 3.6 -30 — 85 Ambient temperature (normal operating) Unit V °C 1. AVDD is independent of IOVDD 4.3 Electrostatic discharge (ESD) The VL53L5CX is compliant with ESD values presented in the table below. Table 11. ESD performances DS13754 - Rev 8 Parameter Specification Conditions Human body model JEDEC JS-001-2014 ± 2 kV, 1500 Ohms, 100 pF Charged device model JEDEC JS-002-2014 ± 500 V page 15/38 VL53L5CX Current consumption 4.4 Current consumption The current consumption values are given in the table below. • • Typical values quoted are for nominal voltage, process, and temperature (23 oC). Maximum values are quoted for worst case conditions (process, voltage, and temperature) unless stated otherwise (70 oC). Table 12. Current consumption Average current consumption AVDD Device State IOVDD Unit Typ. Max. Typ. Max. LP idle 45 300 0.1 1 μA HP idle 1.3 1.6 2.8 35 mA Active ranging(1) 45 50 50 80 mA 1. Active ranging is when the device is actively ranging. The current consumption is not affected by 4x4 or 8x8 zone configuration IOVDD peak current will be the average value +10 mA. AVDD peak current will be the average current +10 mA. Table 13. Example of typical power consumption in Continuous mode Parameter 2V8/1V8 2V8/2V8 3V3/3V3 Unit Continuous mode (4x4 mode or 8x8 mode) 216 266 313 mW Table 14. Example of typical power consumption in Autonomous mode Parameter DS13754 - Rev 8 2V8/1V8 2V8/2V8 3V3/3V3 4x4 mode - 1 Hz frame rate with 5 ms integration time 2.8 3.7 4.5 4x4 mode - 5 Hz frame rate with 5 ms integration time 11 16 19 4x4 mode - 10 Hz frame rate with 45 ms integration time 95 133 156 8x8 mode - 1 Hz frame rate with 5 ms integration time 8 11 11 Unit mW page 16/38 VL53L5CX Digital input and output 4.5 Digital input and output The following tables summarize the digital I/O electrical characteristics. Table 15. INT, I2C_RST, LPn Symbol Parameter VIL Low level input voltage VIH High level input voltage VOL Low level output voltage (IOUT = 4 mA) VOH High level output voltage (IOUT = 4 mA) IOVDD configuration 1.8 V 2.8 V - 3.3 V 1.8 V 2.8 V - 3.3 V Min. Max. -0.3 0.35* IOVDD 0.65*IOVDD 1.8 V 2.8 V - 3.3 V — 1.8 V 1.22 2.8 V - 3.3 V 2.1 Unit 2.28 3.6 V 0.4 — Table 16. I2C interface (SDA/SCL) Symbol Parameter VIL Low level input voltage VIH High level input voltage VOL IIL/IH IOVDD configuration 1.8 V 2.8 V - 3.3 V 1.8 V 2.8 V - 3.3 V Low level output voltage 1.8 V (Iout = 4 mA) 2.8 V- 3.3 V -0.3 1.13 Max. 0.3*IOVDD 2.28 3.6 0.4 Leakage from IOVDD supply — 2.5 Leakage from IOVDD pad — 1 I2C pads use 1V8 switching thresholds for all IOVDD supplies Note: A maximum load of 12 mA is assumed in the above table Unit 0.54 — Note: DS13754 - Rev 8 Min. V μA page 17/38 VL53L5CX Ranging performance 5 Ranging performance 5.1 Zone mapping 5.1.1 Zone mapping 4x4 The figure below shows the zone definition in 4x4 mode. There are 16 zones in total which increment along a row first before starting a new row. The physical view is from the device top into the lens. The numbers of each zone, as indicated in the figure below, corresponds to the ZoneIDs returned by the sensor. Figure 17. Zone mapping in 4x4 mode 5.1.2 Zone mapping 8x8 The figure below shows the zone definition in 8x8 mode. There are 64 zones in total which increment along a row first before starting a new row. The physical view is from the device top into the lens. The numbers of each zone, as indicated in the figure below, correspond to the ZoneIDs returned by the sensor to the host. Figure 18. Zone mapping in 8x8 mode DS13754 - Rev 8 page 18/38 VL53L5CX Continuous ranging mode 5.1.3 Effective zone orientation The VL53L5CX module includes a lens over the RX aperture which flips (horizontally and vertically) the captured image of the target. As a consequence, the zone identified as zone 0 in the bottom left of the SPAD array is illuminated by a target located at the top right hand side of the scene. Figure 19. Effective orientation 5.2 5.2.1 Continuous ranging mode Measurement conditions The following criteria and test conditions apply to all the characterisation results detailed in this section unless specified otherwise: • • • The specified target fills 100 % of the field of view of the device (in all zones). Targets used are Munsell N4.75 (17 %) and Munsell N9.5 (88 %). AVDD is 2.8 V, IOVDD is 1.8 V. • Nominal ambient temperature is 23 oC. • • Maximum range capability is based on a 90 % detection rate (1). Range accuracy figures are based on 2.7 sigma ie 99.3 % of measurements are within the specified accuracy. • Tests are performed in the dark and at 2 W/m2 target illumination (940 nm). A 2 W/m2 target irradiance at 940 nm is equivalent to 5 kLux daylight. All tests are performed without coverglass. The sensor relies on default calibration data. The device is controlled through the API using the default driver settings. • • • 1. Detection rate is a statistical value indicating the worst case percentage of measurements that return a valid ranging. For example, taking 1000 measurements with 90% detection rate gives 900 valid distances. The 100 other distances may be outside the specification. DS13754 - Rev 8 page 19/38 VL53L5CX Continuous ranging mode 5.2.2 Maximum ranging distance 4x4 The table below shows the maximum ranging capability of the VL53L5CX under different conditions. Refer to Section 5.2.1 Measurement conditions for the general test conditions. Table 17. Maximum ranging capabilities when ranging continuously at 30 Hz Target reflectance level. Full FoV (reflectance %) Zone Inner White target (88%) Corner Inner Grey target (17%) Corner 5.2.3 Dark Ambient light (5 klux) Typical: 4000 mm Typical: 1700 mm Minimum: 4000 mm Minimum: 1400 mm Typical: 4000 mm Typical: 1400 mm Minimum: 4000 mm Minimum: 1100 mm Typical: 2400 mm Typical: 1000 mm Minimum: 1900 mm Minimum: 900 mm Typical: 2200 mm Typical: 950 mm Minimum: 1800 mm Minimum: 850 mm Maximum ranging distance 8x8 The table below shows the maximum ranging capability of the VL53L5CX under different conditions. Refer to Section 5.2.1 Measurement conditions for the general test conditions. Table 18. Max ranging capabilities when ranging continuously at 15Hz Target reflectance level. Full FoV (reflectance %) Zone Inner White target (88%) Corner Inner: Grey target (17%)(1) Corner Dark (0 klux) Ambient light (5 klux) Typical: 3500 mm Typical: 1100 mm Minimum: 2600 mm Minimum: 950 mm Typical: 3100 mm Typical: 1000 mm Minimum: 1700 mm Minimum: 800 mm Typical: 1300 mm Typical: 800 mm Minimum: 900 mm Minimum: 600 mm Typical: 1100 mm Typical: 650 mm Minimum: 600 mm Minimum: 400 mm 1. measured 13% in IR at 940 nm DS13754 - Rev 8 page 20/38 VL53L5CX Continuous ranging mode 5.2.4 Range accuracy - Continuous mode The figure below illustrates how range accuracy is defined over distance. Figure 20. Range accuracy vs distance Table 19. Range accuracy Distance Mode Target reflectance Zones Dark (0 klux) Ambient light (5 klux) 20 - 200 mm 8x8 15Hz Grey target (17%) All ±15 mm ±15 mm ±4% ±7% ±5% ±8% ±5% ±8% ±5% ±11% 4x4 30Hz 201 - 4000 mm 8x8 15Hz DS13754 - Rev 8 White target (88%) Grey target (17%) White target (88%) Grey target (17%) All page 21/38 VL53L5CX Autonomous ranging mode 5.3 Autonomous ranging mode 5.3.1 Measurement conditions The following criteria and test conditions apply to all the characterisation results detailed in this section unless specified otherwise: • • • The specified target fills 100 % of the field of view of the device (in all zones). Targets used are Munsell N4.75 (17 %) and Munsell N9.5 (88 %). AVDD is 2.8 V, IOVDD is 1.8 V. • Nominal ambient temperature is 23 oC. • • Maximum range capability is based on a 90 % detection rate (1). Range accuracy figures are based on 2.7 sigma ie 99.3 % of measurements are within the specified accuracy. • Tests are performed in the dark and at 2 W/m2 target illumination (940 nm). A 2 W/m2 target irradiance at 940 nm is equivalent to 5 kLux daylight. All tests are performed without coverglass. The sensor relies on default calibration data. The device is controlled thought the API using the default driver settings. • • • 1. Detection rate is a statistical value indicating the worst case percentage of measurements that return a valid ranging. For example, taking 1000 measurements with 90 % detection rate gives 900 valid distances. The 100 other distances may be outside the specification. 5.3.2 Maximum ranging distance 4x4 Table 20. Maximum ranging capabilities when ranging with Autonomous mode at 30 Hz – 4x4 – integration time 5 ms Target reflectance level. Full FoV (reflectance %) Zone Integration time (ms) Inner 5 Corner 5 Inner 5 Corner 5 White target (88 %) Grey target (17 %) Dark (0 klux) Ambient light (5 klux) Typical : 3000 mm Typical : 1300 mm Minimum : 2700 mm Minimum : 1100 mm Typical : 2700 mm Typical : 1200 mm Minimum : 2400 mm Minimum : 1000 mm Typical : 1100 mm Typical : 800 mm Minimum : 900 mm Minimum : 600 mm Typical : 1000 mm Typical : 700 mm Minimum : 800 mm Minimum : 500 mm Table 21. Maximum ranging capabilities when ranging with Autonomous mode at 15 Hz – 8x8 – integration time 5 ms Target reflectance level. Full FoV (reflectance %) Zone Integration time (ms) Inner 5 Corner 5 Inner 5 Corner 5 White target (88 %) Grey target (17 %) DS13754 - Rev 8 Dark (0 klux) Ambient light (5 klux) Typical : 1900 mm Typical : 900 mm Minimum : 1700 mm Minimum : 800 mm Typical : 1600 mm Typical : 800 mm Minimum : 1300 mm Minimum : 650 mm Typical : 800 mm Typical : 500 mm Minimum : 600 mm Minimum : 400 mm Typical : 600 mm Typical : 400 mm Minimum : 500 mm Minimum : 300 mm page 22/38 VL53L5CX Range offset drift over temperature 5.3.3 Range accuracy - Autonomous mode Table 22. Range accuracy – Autonomous mode Distance (mm) Mode Integration time (ms) Reflectance Dark (0 klux) Ambient light (5 klux) 20-200 mm 8x8 15 Hz 5 ms White 88 % ±17 mm ±20 mm 5 ms Grey 17 % ±6 % ±10 % 5 ms White 88 % ±5 % ±8 % 5 ms Grey 17 % ±8 % ±12 % 5 ms White 88 % ±7 % ±10 % 4x4 30 Hz 201-4000mm 8x8 15 Hz 5.4 Range offset drift over temperature Selfheating or a change in ambient temperature increases silicon temperature, which results in a range offset drift. This may be minimized by performing a periodic autocalibration, resulting in a typical drift of 0.05 mm/°C. DS13754 - Rev 8 page 23/38 VL53L5CX Outline drawings 6 Outline drawings The figures below gives details of the VL53L5CX module. All values are given in millimetres. Figure 21. Outline drawing (1/4) Note: SM stands for solder mask. Note: A thermal pad is required on the application board for thermal dissipation purpose. For more information, refer to AN5657. DS13754 - Rev 8 page 24/38 VL53L5CX Outline drawings Figure 22. Outline drawing (2/4) Note: For more information, refer to the pin description in Table 3. VL53L5CX pin description. Figure 23. Outline drawing (3/4) - Module with liner DS13754 - Rev 8 page 25/38 VL53L5CX Outline drawings Figure 24. Outline drawing (4/4) DS13754 - Rev 8 page 26/38 VL53L5CX Laser safety considerations 7 Laser safety considerations The VL53L5CX contains a laser emitter and corresponding drive circuitry. The laser output is designed to remain within Class 1 laser safety limits under all reasonably foreseeable conditions including single faults in compliance with IEC 60825-1:2007 and IEC 60825-1:2014. The laser output power must not be increased by any means and no optics should be used with the intention of focusing the laser beam. Caution: Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Figure 25. Class 1 laser label Figure 26. Laser notice 50: applies to IEC 60825-1:2007 Figure 27. Laser notice 56: applies to IEC 60825-1:2014 DS13754 - Rev 8 page 27/38 VL53L5CX Packaging and labeling 8 Packaging and labeling 8.1 Product marking See the figure below for the product marking area. The marking is L5C-. Figure 28. Product marking area A 2D product marking code is applied on the corner of the module cap as shown in the figure below. Note: The 2D marking code aligns with pin C7 of the module and is not an indicator of pin 1. Figure 29. 2D product marking code DS13754 - Rev 8 page 28/38 VL53L5CX Inner box labeling 8.2 Inner box labeling The labeling follows the ST standard packing acceptance specification. The following information is on the inner box label: • • • • • • 8.3 Assembly site Sales type Quantity Trace code Marking Bulk ID number Packing At customer/subcontractor level, it is recommended to mount the VL53L5CX in a clean environment. To help avoid any foreign material contamination at final assembly level the modules are shipped in a tape and reel format with a protective liner. The liner is compliant with reflow at 260 °C (as per JEDEC-STD-020E). Note: The liner must be removed during assembly of the customer device, just before mounting the cover glass. 8.4 Tape outline drawing Figure 30. VL53L5CX tape outline and reel packaging drawing DS13754 - Rev 8 page 29/38 VL53L5CX Pb-free solder reflow process 8.5 Pb-free solder reflow process The table and figure below show the recommended and maximum values for the solder profile. Customers have to tune the reflow profile depending on the PCB, solder paste and material used. We expect customers to follow the “recommended” reflow profile, which is specifically tuned for the VL53L5CX package. For any reason, if a customer must perform a reflow profile which is different from the “recommended” one (especially peak >240 °C), the new profile must be qualified by the customer at their own risk. In any case, the profile has to be within the “maximum” profile limit described in the table below. Table 23. Recommended solder profile Parameters Recommended Maximum Units Minimum temperature (TS min) 130 150 °C Maximum temperature (TS max) 200 200 °C Time ts (TS min to TS max) 90-110 60-120 s Temperature (TL) 217 217 °C Time (tL) 55-65 55-65 s Ramp up 2 3 °C/s Temperature (Tp-10) — 235 °C Time (tp-10) — 10 s Ramp up — 3 °C/s Peak temperature (Tp) 240 260 °C Time to peak 300 300 s Ramp down (peak to TL) -4 -6 °C/s Figure 31. Solder profile Note: The component should be limited to a maximum of three passes through this solder profile. Note: As the VL53L5CX package is not sealed, only a dry reflow process should be used (such as convection reflow). Vapor phase reflow is not suitable for this type of optical component. Note: The VL53L5CX is an optical component and as such, it should be treated carefully. This would typically include using a ‘no-wash’ assembly process. DS13754 - Rev 8 page 30/38 VL53L5CX Handling and storage precautions 8.6 Handling and storage precautions 8.6.1 Recommended solder pad dimensions Figure 32. Recommended solder pattern 8.6.2 Shock precautions Sensor modules house numerous internal components that are susceptible to shock damage. If a unit is subject to excessive shock, is dropped on the floor, or a tray/reel of units is dropped on the floor, it must be rejected, even if no apparent damage is visible. 8.6.3 Part handling Handling must be done with non-marring ESD safe carbon, plastic, or teflon tweezers. Ranging modules are susceptible to damage or contamination. The customer is advised to use a clean assembly process until a protective cover glass is mounted. 8.6.4 Compression force A maximum compressive load of 25 N should be applied on the module. 8.6.5 Moisture sensitivity level Moisture sensitivity is level 3 (MSL) as described in IPC/JEDEC JSTD-020-C. Note: If devices are stored out of the packaging for more than 168 hours, the devices should be baked before use. The optimum bake recommended is at + 90 °C for a minimum of 6 hours. 8.7 Storage temperature conditions Table 24. Recommended storage conditions DS13754 - Rev 8 Parameter Min. Typ. Max. Unit Temperature (storage) -40 23 90 °C page 31/38 VL53L5CX Ordering information 9 Ordering information The VL53L5CX is currently available in the formats below. More detailed information is available on request. Table 25. Order codes DS13754 - Rev 8 Order codes Package Packing Minimum order quantity VL53L5CXV0GC/1 Optical LGA16 with liner Tape and reel 3600 pcs page 32/38 VL53L5CX Package information 10 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DS13754 - Rev 8 page 33/38 VL53L5CX Acronyms and abbreviations 11 DS13754 - Rev 8 Acronyms and abbreviations Acronym/abbreviation Definition AF autofocus API application programming interface AR/VR augmented reality/virtual reality DOE diffractive optical element ESD electrostatic discharge FoV field of view FoI field of illumination GPIO general purpose input output HP high power I2C inter-integrated circuit (serial bus) LAF laser autofocus LGA land grid array LP low power NVM non-volatile memory PCB printed circuit board PDAF phase detection autofocus PLL phase-locked loop PVT process, voltage and temperature POR power on reset RAM random-access memory SPAD single photon avalanche diode SW software ToF Time-of-Flight UI user interface UM user manual VCSEL vertical cavity surface emitting laser page 34/38 VL53L5CX Revision history Table 26. Document revision history DS13754 - Rev 8 Date Version Changes 06-Jul-2021 1 Initial release 30-Aug-2021 2 Added Section 8.6.1 Recommended solder pad dimensions 13-Oct-2021 3 Section 3 I2C control interface: replaced “camera module” with “Time-ofFlight” sensor. 29-Oct-2021 4 Replaced Figure 20. Range accuracy vs distance 15-Dec-2021 5 Table 8. I2C interface - timing characteristics for Fast mode (400 kHz): updated parameters tR and tF. 29-Jun-2022 6 Updated Figure 14. VL53L5CX data format (sequential write). 30-Jun-2022 7 Aligned document revision number with Table 26. Document revision history 20-Jul-2022 8 Table 19. Range accuracy: added "±" to all values in the column "Ambient light (5 klux)". page 35/38 VL53L5CX Contents Contents 1 2 3 Product overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 1.1 Technical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Field of view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 Field of illumination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.4 System block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.5 Device pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.6 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 Software interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Power state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Power up sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Power up slew. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.3.2 Power up and I2C access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 I2C control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 3.1 4 2.3.1 I2C interface - timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 4.1 Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.3 Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.4 Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.5 Digital input and output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Ranging performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 5.1 5.2 5.3 DS13754 - Rev 8 Zone mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.1.1 Zone mapping 4x4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.1.2 Zone mapping 8x8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.1.3 Effective zone orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Continuous ranging mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.2.1 Measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.2.2 Maximum ranging distance 4x4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.2.3 Maximum ranging distance 8x8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.2.4 Range accuracy - Continuous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Autonomous ranging mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.3.1 Measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.3.2 Maximum ranging distance 4x4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 page 36/38 VL53L5CX Contents 5.3.3 5.4 Range accuracy - Autonomous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Range offset drift over temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 6 Outline drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 7 Laser safety considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 8 Packaging and labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 8.1 Product marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 8.2 Inner box labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.3 Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.4 Tape outline drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.5 Pb-free solder reflow process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 8.6 Handling and storage precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 8.7 8.6.1 Recommended solder pad dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 8.6.2 Shock precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 8.6.3 Part handling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 8.6.4 Compression force . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 8.6.5 Moisture sensitivity level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Storage temperature conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 9 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 10 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 11 Acronyms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 DS13754 - Rev 8 page 37/38 VL53L5CX IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2022 STMicroelectronics – All rights reserved DS13754 - Rev 8 page 38/38