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VN5E010AHTR-E

VN5E010AHTR-E

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO252-7

  • 描述:

    IC PWR DRIVER N-CHAN 1:1 6HPAK

  • 数据手册
  • 价格&库存
VN5E010AHTR-E 数据手册
VN5E010AH 10 m high-side driver with analog current sense for automotive applications Features Max supply voltage VCC 41 V Operating voltage range VCC 4.5 V to 28 V Typ. ON-state resistance RON 10 m Current limitation (typ) ILIMH 85 A IS 2 µA(1) OFF-state supply current – Reverse battery protection with self switch on of the Power MOSFET (see Figure 32) – Electrostatic discharge protection 1. Typical value with all loads connected • • • General – Inrush current active management by power limitation – Very low standby current – 3 V CMOS compatible inputs – Optimized electromagnetic emissions – Very low electromagnetic susceptibility – In compliance with the 2002/95/EC european directive – Very low current sense leakage Diagnostic functions – Proportional load current sense – High current sense precision for wide current range – Current sense disable – OFF-state open-load detection – Output short to VCC detection – Overload and short to ground (power limitation) indication – Thermal shutdown indication Protection – Undervoltage shutdown – Overvoltage clamp – Load current limitation – Self limiting of fast thermal transients – Protection against loss of ground and loss of VCC – Overtemperature shut down with autorestart (thermal shutdown) September 2013 Applications • All types of resistive, inductive and capacitive loads • Suitable as LED driver Description The VN5E010AH is a single-channel high-side driver manufactured in the ST proprietary VIPower M0-5 technology and housed in the tiny HPAK package. The VN5E010AH is designed to drive 12 V automotive grounded loads delivering protection, diagnostics and easy 3 V and 5 V CMOS compatible interface with any microcontroller. The device integrates advanced protective functions such as load current limitation, inrush and overload active management by power limitation, overtemperature shut-off with autorestart and overvoltage active clamp. A dedicated analog current sense pin is associated with every output channel in order to provide ehnanced diagnostic functions including fast detection of overload and short-circuit to ground through power limitation indication, overtemperature indication, short-circuit to Vcc diagnosis and ON- and OFF-state open-load detection. The current sensing and diagnostic feedback of the whole device can be disabled by pulling the CS_DIS pin high to allow sharing of the external sense resistor with other similar devices. Doc ID 15984 Rev 3 1/37 www.st.com 1 Contents VN5E010AH Contents 1 Block diagram and pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.5 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.1 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.2 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.3 Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.3.1 3.4 4 Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . . 27 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 4.1 5 Short to VCC and OFF-state open-load detection . . . . . . . . . . . . . . . . . 26 HPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.1 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.2 HPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.3 HPAK suggested land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 5.4 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 6 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 2/37 Doc ID 15984 Rev 3 VN5E010AH List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Switching (VCC = 13 V, Tj = 25 °C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Protection and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Current sense (8 V < VCC < 18 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Open load detection (8 V < VCC < 18 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 HPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Doc ID 15984 Rev 3 3/37 List of figures VN5E010AH List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. 4/37 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) not in scale. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Open-load OFF-state delay timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Delay response time between rising edge of ouput current and rising edge of current sense (CS enabled). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Output voltage drop limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 IOUT/ISENSE vs. IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Maximum current sense ratio drift vs. load current(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Intermittent overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 OFF-state open-load with external circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Short to VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 TJ evolution in overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 OFF-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 High-level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Low-level input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 High-level input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 ON-state resistance vs. Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 ON-state resistance vs. VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 ILIMH Vs. Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 High-level CS_DIS voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Low-level CS_DIS voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Maximum turn-off current versus inductance(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 PC board(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Rthj-amb vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 28 HPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Thermal fitting model of a single-channel HSD in HPAK(1) . . . . . . . . . . . . . . . . . . . . . . . . 29 HPAK package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 HPAK suggested pad layout(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 HPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 HPAK tape and reel (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Doc ID 15984 Rev 3 VN5E010AH 1 Block diagram and pin configuration Block diagram and pin configuration Figure 1. Block diagram VCC Reverse Battery Protection Signal Clamp Undervoltage Control & Diagnostic Power Clamp IN DRIVER VON Limitation Over temp. Current Limitation OFF State Open load CS_ DIS VSENSEH CS Current Sense OUT OVERLOAD PROTECTION (ACTIVE POWER LIMITATION) LOGIC GND Table 1. Pin functions Name Function VCC Battery connection OUT Power output (1) GND Ground connection IN Voltage controlled input pin with hysteresis, CMOS compatible. Controls output switch state CS Analog CS pin, delivers a current proportional to the load current CS_DIS Active high CMOS compatible pin, to disable the CS pin 1. Pins 1 and 7 must be externally tied together. Doc ID 15984 Rev 3 5/37 Block diagram and pin configuration Figure 2. Table 2. 6/37 VN5E010AH Configuration diagram (top view) not in scale 1 2 3 4 OUT GND IN Vcc 5 6 7 CS CS_DIS OUT Suggested connections for unused and not connected pins Connection / pin CS OUT IN CS_DIS Floating Not allowed X X X To ground Through 1 k resistor Through 22 k resistor Through 10 k resistor Through 10 k resistor Doc ID 15984 Rev 3 VN5E010AH 2 Electrical specifications Electrical specifications Figure 3. Current and voltage conventions IS VCC ICSD VCSD IIN VIN VCC IOUT CS_DIS OUT IN CS VOUT ISENSE VSENSE GND IGND 2.1 Absolute maximum ratings Stressing the device above the rating listed in the Table 3: Absolute maximum ratings may cause permanent damage to the device . These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE program and other relevant quality document. Table 3. Absolute maximum ratings Symbol Parameter Value Unit VCC DC supply voltage 41 V -VCC Reverse DC supply voltage 16 V IOUT DC output current Internally limited A -IOUT Reverse DC output current 20 A DC input current -1 to 10 mA DC current sense disable input current -1 to 10 mA VCC - 41 +VCC V V 645 mJ IIN ICSD VCSENSE Current sense maximum voltage (VCC > 0) EMAX Maximum switching energy (single pulse) (L = 2.2 mH; RL = 0; VBAT = 13.5 V; Tjstart = 150 °C; IOUT = IlimL(Typ.)) Doc ID 15984 Rev 3 7/37 Electrical specifications Table 3. VN5E010AH Absolute maximum ratings (continued) Symbol Value Unit VESD Electrostatic discharge (human body model: R = 1.5 k C = 100 pF) – IN – CS – CS_DIS – OUT – VCC 4000 2000 4000 5000 5000 V V V V V VESD Charge device model (CDM-AEC-Q100-011) 750 V Junction operating temperature -40 to 150 °C Storage temperature -55 to 150 °C Tj Tstg 2.2 Thermal data Table 4. Symbol 8/37 Parameter Thermal data Parameter Max. value Unit Rthj-case Thermal resistance junction-case 0.55 °C/W Rthj-amb Thermal resistance junction-ambient 67.7 °C/W Doc ID 15984 Rev 3 VN5E010AH 2.3 Electrical specifications Electrical characteristics Values specified in this section are for 8 V < VCC < 28 V, -40 °C < Tj < 150 °C, unless otherwise specified. Table 5. Power section Symbol Parameter Test conditions Min. Typ. Max. Unit VCC Operating supply voltage 4.5 13 28 V VUSD Undervoltage shutdown 3.5 4.5 V VUSDhyst Undervoltage shutdown hysteresis 0.5 IOUT = 6 A; Tj = 25 °C RON RON-Rev Vclamp IS IL(off) ON-state resistance 10 IOUT = 6 A; Tj = 150 °C 20 IOUT = 6 A; VCC = 5 V; Tj = 25 °C 13 RDSON in reverse battery VCC = -13 V; IOUT = -6 A; condition Tj = 25 °C Clamp voltage 41 OFF-state: VCC = 13 V; Tj = 25 °C; VIN = VOUT = VSENSE = 0 V ON-state: VCC = 13 V; VIN = 5 V; IOUT = 0 A OFF-state output current Table 6. 10 ICC = 20 mA; IOUT = 0 A Supply current V VIN = VOUT = 0 V; VCC = 13 V; Tj = 25 °C 0 VIN = VOUT = 0 V; VCC = 13 V; Tj = 125 °C 0 m m 46 52 V 2 5 µA 1.5 3 mA 0.01 3 µA 5 Switching (VCC = 13 V, Tj = 25 °C) Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time RL = 2.2  (see Figure 6) - 40 - µs td(off) Turn-off delay time RL = 2.2  (see Figure 6) - 28 - µs (dVOUT/dt)on Turn-on voltage slope RL = 2.2  - (see Figure 26) - Vµs (dVOUT/dt)off Turn-off voltage slope RL = 2.2  - (see Figure 28) - Vµs WON Switching energy losses at turn-on (twon) RL = 2.2  (see Figure 6) - 2 - mJ WOFF Switching energy losses at turn-off (twoff) RL = 2.2  (see Figure 6) - 0.6 - mJ Doc ID 15984 Rev 3 9/37 Electrical specifications Table 7. Symbol VN5E010AH Logic inputs Parameter Test conditions VIL Low-level input voltage IIL Low-level input current VIH High-level input voltage IIH High-level input current VI(hyst) Input hysteresis voltage VICL VIN = 0.9 V Low-level CS_DIS current VCSDH High-level CS_DIS voltage ICSDH High-level CS_DIS current Symbol Parameter IlimL Short-circuit current during thermal cycling TTSD Shutdown temperature TR Reset temperature TRS Thermal reset of status VON µA 2.1 V V 5.5 7 -0.7 VCSD = 0.9 V V µA 2.1 V 10 0.25 5.5 ICSD = -1 mA µA V 7 -0.7 Test conditions Min. Typ. Max. VCC = 13 V 60 85 120 5 V < VCC < 28 V VCC =13 V; TR < Tj < TTSD Output voltage drop limitation 21 V 150 175 TRS + 1 TRS + 5 Unit A A 200 135 Thermal hysteresis (TTSD - TR) Turn-off output voltage clamp 120 °C °C °C 7 °C IOUT = 2 A; VIN = 0; L = 6 mH VCC - 41 VCC - 46 VCC - 52 V IOUT = 0.5 A; Tj = -40 °C to 150 °C 25 mV 1. To ensure long term reliability under heavy overload or short-circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles 10/37 V 1 VCSD = 2.1 V ICSD = 1 mA µA Protection and diagnostics(1) Short-circuit current VDEMAG V 0.9 CS_DIS clamp voltage IlimH THYST 0.9 0.25 VCSD(hyst) CS_DIS hysteresis voltage Table 8. Unit 1 IIN = -1 mA ICSDL Max. 10 IIN = 1 mA Low-level CS_DIS voltage Typ. VIN = 2.1 V Input clamp voltage VCSDL VCSCL Min. Doc ID 15984 Rev 3 VN5E010AH Electrical specifications Table 9. Symbol Current sense (8 V < VCC < 18 V) Parameter Test conditions Min. Typ. Max. K0 IOUT/ISENSE IOUT = 0.25 A; VSENSE = 0.5 V Tj = -40 °C to 150 °C Tj = 25 °C to 150 °C 3000 3000 7410 12000 7410 11600 K1 IOUT/ISENSE IOUT = 6 A; VSENSE = 0.5 V Tj = -40 °C to 150 °C Tj = 25 °C to 150 °C 5350 5510 6740 6740 Current sense ratio drift IOUT = 6 A; VSENSE = 0.5 V; VCSD=0V; Tj = -40 °C to 150 °C IOUT/ISENSE IOUT = 10 A; VSENSE = 4 V Tj = -40 °C to 150 °C Tj = 25 °C to 150 °C Current sense ratio drift IOUT = 10 A; VSENSE= 4 V; VCSD = 0 V; Tj = -40 °C to 150 °C IOUT/ISENSE IOUT = 25 A; VSENSE = 4 V Tj = -40 °C to 150 °C Tj = 25 °C to 150 °C Current sense ratio drift IOUT = 25 A; VSENSE= 4 V; VCSD = 0 V; Tj = -40 °C to 150 °C -8 8 IOUT = 0 A; VSENSE = 0 V; VCSD = 5 V; VIN =0 V; Tj = -40 °C to 150 °C 0 1 IOUT = 0 A; VSENSE = 0 V; VCSD = 0 V; VIN = 5 V; Tj = -40 °C to 150 °C 0 2 dK1/K1(1) K2 dK2/K2(1) K3 dK3/K3(1) ISENSE0 Analog sense leakage current -15 5850 5800 -11 5915 5850 6420 6420 VSENSE % 7690 7195 11 IOUT = 2 A; VSENSE = 0 V; VCSD = 5 V; VIN = 5 V; Tj = -40 °C to 150 °C IOL 8500 7745 15 6570 6570 Unit % 7000 6755 % µA 1 Open load ON-state current detection threshold VIN = 5 V, 8 V < VCC < 18 V ISENSE = 5 µA 5 Max analog sense output voltage IOUT = 18 A; RSENSE = 3.9 k 5 80 mA V VSENSEH(2) Analog sense output V = 13 V; RSENSE = 3.9 k voltage in fault condition CC 8 V ISENSEH(2) Analog sense output current in fault condition 9 mA VCC = 13 V; VSENSE = 5 V Doc ID 15984 Rev 3 11/37 Electrical specifications Table 9. VN5E010AH Current sense (8 V < VCC < 18 V) (continued) Symbol Parameter Test conditions Min. Typ. Max. Unit tDSENSE1H Delay response time from falling edge of CS_DIS pin VSENSE < 4 V, 1.5 A < IOUT < 25 A ISENSE = 90% of ISENSE max (see Figure 4) 50 100 µs tDSENSE1L Delay response time from rising edge of CS_DIS pin VSENSE < 4 V, 1.5 A < IOUT < 25 A ISENSE=10% of ISENSE max (see Figure 4) 5 20 µs tDSENSE2H Delay response time from rising edge of IN pin VSENSE < 4 V, 1.5 A < IOUT < 25 A ISENSE=90% of ISENSE max (see Figure 4) 270 600 µs 310 µs 250 µs Delay response time between rising edge of tDSENSE2H output current and rising edge of current sense tDSENSE2L Delay response time from falling edge of IN pin VSENSE < 4V, ISENSE = 90% of ISENSEMAX, IOUT = 90% of IOUTMAX IOUTMAX= 3A (see Figure 7) VSENSE < 4 V, 1.5 A < IOUT < 25 A ISENSE=10% of ISENSE max (see Figure 4) 100 1. Parameter guaranteed by design, it is not tested. 2. Fault condition includes: power limitation, over-temperature and open load OFF-state detection. Table 10. Symbol VOL Open load detection (8 V < VCC < 18 V) Parameter Open-load OFF-state voltage detection threshold Output short-circuit to tDSTKON VCC detection delay at turn-off 12/37 Test conditions VIN = 0 V Min. Typ. Max. Unit 2 See Figure 5 4 V See Figure 5 180 1200 µs IL(off2)r OFF-state output current at VOUT = 4 V VIN = 0 V; VSENSE = 0 V VOUT rising from 0 V to 4 V -120 90 µA IL(off2)f OFF-state output current at VOUT = 2 V VIN = 0 V; VSENSE = VSENSEH; VOUT falling from VCC to 2 V -50 90 µA td_vol Delay response from output rising edge to VSENSE rising edge in open-load VOUT = 4 V; VIN = 0 V VSENSE = 90% of VSENSEH 20 µs Doc ID 15984 Rev 3 VN5E010AH Electrical specifications Figure 4. Current sense delay characteristics INPUT CS_DIS LOAD CURRENT CURRENT SENSE tDSENSE2H Figure 5. tDSENSE1L tDSENSE1H tDSENSE2L Open-load OFF-state delay timing OUTPUT STUCK TO VCC VIN VOUT > VOL VSENSEH VCS tDSTKON Figure 6. Switching characteristics VOUT tWon tWoff 90% 80% dVOUT/dt(off) dVOUT/dt(on) tr 10% tf t INPUT td(on) td(off) t Doc ID 15984 Rev 3 13/37 Electrical specifications Figure 7. VN5E010AH Delay response time between rising edge of ouput current and rising edge of current sense (CS enabled) VIN tDSENSE2H t IOUT IOUTMAX 90% IOUTMAX t ISENSE ISENSEMAX 90% ISENSEMAX t Figure 8. Output voltage drop limitation Vcc-Vout Tj=150oC Tj=25oC Tj=-40oC Von Von/Ron(T) 14/37 Doc ID 15984 Rev 3 Iout VN5E010AH Electrical specifications Figure 9. IOUT/ISENSE vs. IOUT IOUT/ISENSE 12800 11600 A 10400 B 9200 8000 C 6800 D 5600 4400 E 3200 2000 -2 1 4 7 10 13 16 19 22 25 28 IOUT (A) D: Min, Tj = 25 °C to 150 °C E: Min, Tj = -40 °C to 150 °C A: Max, Tj = -40 °C to 150 °C B: Max, Tj = 25 °C to 150 °C C: Typical, Tj = -40 °C to 150 °C Figure 10. Maximum current sense ratio drift vs. load current(1) dK/K (%) 20 15 A 10 5 0 -5 -10 B -15 -20 4 7 10 13 16 19 22 25 28 IOUT (A) A: Max, Tj = -40 °C to 150 °C B: Min, Tj = -40 °C to 150 °C 1. Parameter guaranteed by design; it is not tested. Doc ID 15984 Rev 3 15/37 Electrical specifications Table 11. VN5E010AH Truth table Input Output SENSE (VCSD = 0 V)(1) Normal operation L H L H 0 Nominal Overtemperature L H L L 0 VSENSEH Undervoltage L H L L 0 0 H X (no power limitation) Cycling (power limitation) Nominal Conditions Overload H VSENSEH Short-circuit to GND (power limitation) L H L L 0 VSENSEH Open load OFF-state (with external pull-up) L H VSENSEH Short-circuit to VCC (external pull-up disconnected) L H H H VSENSEH < Nominal Negative output voltage clamp L L 0 1. If the VCSD is high, the SENSE output is at a high-impedance, its potential depends on leakage currents and external circuit. 16/37 Doc ID 15984 Rev 3 VN5E010AH Electrical specifications Table 12. ISO 7637-2: 2004(E) Test pulse Electrical transient requirements (part 1) Test levels(1) III IV 1 -75 V -100 V 2a +37 V 3a Number of pulses or test times Burst cycle/pulse repetition time Delays and Impedance Min. Max. 5000 pulses 0.5 s 5s 2 ms, 10  +50 V 5000 pulses 0.2 s 5s 50 µs, 2  -100 V -150 V 1h 90 ms 100 ms 0.1 µs, 50  3b +75 V +100 V 1h 90 ms 100 ms 0.1 µs, 50  4 -6 V -7 V 1 pulse 100 ms, 0.01  +65 V +87 V 1 pulse 400 ms, 2  (2) 5b 1. The above test levels must be considered referred to VCC = 13.5 V except for pulse 5b. 2. Valid in case of external load dump clamp: 40 V maximum referred to ground. Table 13. Electrical transient requirements (part 2) ISO 7637-2: 2004(E) Test level results Test pulse III IV 1 C C 2a C C 3a C C 3b C C 4 C C 5b(1) C C 1. Valid in case of external load dump clamp: 40V maximum referred to ground. Table 14. Electrical transient requirements (part 3) Class Contents C All functions of the device are performed as designed after exposure to disturbance. E One or more functions of the device are not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device. Doc ID 15984 Rev 3 17/37 Electrical specifications 2.4 VN5E010AH Waveforms Figure 11. Normal operation INPUT Nominal load Nominal load IOUT VSENSE VCS_DIS Figure 12. Overload or short to GND INPUT ILimH > Power Limitation Thermal cycling ILimL > IOUT VSENSE VCS_DIS 18/37 Doc ID 15984 Rev 3 VN5E010AH Electrical specifications Figure 13. Intermittent overload INPUT Overload ILimH > ILimL > Nominal load IOUT VSENSEH> VSENSE VCS_DIS Figure 14. OFF-state open-load with external circuitry INPUT VOUT > VOL VOUT VOL IOUT VSENSEH > tDSTK(on) VSENSE VCS_DIS Doc ID 15984 Rev 3 19/37 Electrical specifications VN5E010AH Figure 15. Short to VCC Resistive Short to VCC Hard Short to VCC VOUT > VOL VOL VOUT IOUT tDSTK(on) tDSTK(on) VCS_DIS Figure 16. TJ evolution in overload or short to GND INPUT Self-limitation of fast thermal transients TTSD THYST TR TJ_START TJ ILimH > Power Limitation < ILimL IOUT 20/37 Doc ID 15984 Rev 3 VN5E010AH 2.5 Electrical specifications Electrical characteristics curves Figure 17. OFF-state output current Figure 18. High-level input current Iih [uA] Iloff [nA] 5 6000 4.5 5000 Vin= 2.1V 4 3.5 4000 3 2.5 3000 2 2000 1.5 1 1000 0.5 0 -50 -25 0 25 50 75 100 125 150 175 0 -50 -25 0 25 Tc [°C] 125 150 175 Vil [V] 7 2 6.8 1.8 1.6 Iin= 1m A 6.4 1.4 6.2 1.2 6 1 5.8 0.8 5.6 0.6 5.4 0.4 5.2 0.2 -25 0 25 50 75 100 125 150 175 0 -50 -25 0 25 50 75 100 125 150 175 Tc [°C] Tc [°C] Figure 21. High-level input voltage Figure 22. Input hysteresis voltage Vihyst [V] Vih [V] 1 4 0.9 3.5 0.8 3 0.7 2.5 0.6 2 0.5 1.5 0.4 0.3 1 0.2 0.5 0 -50 100 Figure 20. Low-level input voltage Vicl [V] 5 -50 75 Tc [°C] Figure 19. Input clamp voltage 6.6 50 0.1 -25 0 25 50 75 100 125 150 175 0 -50 Tc [°C] -25 0 25 50 75 100 125 150 175 Tc [°C] Doc ID 15984 Rev 3 21/37 Electrical specifications VN5E010AH Figure 23. ON-state resistance vs. Tcase Figure 24. ON-state resistance vs. VCC Ron [m Ohm ] Ron [m Ohm ] 80 30 70 25 60 50 20 Iout= 6A Vcc= 13V 40 30 Tc= 150°C 15 Tc= 125°C 10 Tc= 25°C 20 0 -50 Tc= -40°C 5 10 0 -25 0 25 50 75 100 125 150 175 0 5 10 15 Tc [°C] 20 25 30 35 40 Vcc [V] Figure 25. Undervoltage shutdown Figure 26. Turn-on voltage slope (dVout/dt)On [V/m s] Vusd [V] 1000 16 900 14 800 12 Vcc= 13V Rl= 13Ω 700 10 600 8 500 400 6 300 4 200 2 0 -50 100 -25 0 25 50 75 100 125 150 175 0 -50 -25 0 25 50 75 100 125 150 175 Tc [°C] Tc [°C] Figure 27. ILIMH Vs. Tcase Figure 28. Turn-off voltage slope Ilim h [A] (dVout/dt)Off [V/m s] 100 1000 900 Vcc= 13V 90 800 Vcc= 13V Rl= 13Ω 700 80 600 70 500 400 60 300 50 200 100 40 -50 -25 0 25 50 75 Tc [°C] 22/37 100 125 150 175 0 -50 -25 0 25 50 75 Tc [°C] Doc ID 15984 Rev 3 100 125 150 175 VN5E010AH Electrical specifications Figure 29. High-level CS_DIS voltage Figure 30. CS_DIS clamp voltage Vcsdh [V] Vcsdcl [V] 4 10 3.5 9 Iin= 1m A 8 3 7 2.5 6 2 5 1.5 4 3 1 2 0.5 0 -50 1 -25 0 25 50 75 100 125 150 175 0 -50 Tc [°C] -25 0 25 50 75 100 125 150 175 Tc [°C] Figure 31. Low-level CS_DIS voltage Vcsdl [V] 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175 Tc [°C] Doc ID 15984 Rev 3 23/37 Application information 3 VN5E010AH Application information Figure 32. Application schematic +5V VCC 20V Rprot CS_DIS Dld MCU Rprot IN Rprot OUT CS 45V RSENSE GND Cext 3.1 Load dump protection Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the VCC max DC rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2 2004 (E) table. 3.2 MCU I/Os protection When negative transients are present on the VCC line, the control pins is pulled negative to approximatly -1.5 V. ST suggests to insert a resistor (Rprot) in line to prevent the microcontroller I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of microcontroller and the current required by the HSD I/Os (input levels compatibility) with the latch-up limit of microcontroller I/Os. Equation 1 -VCCpeak / Ilatchup  Rprot  (VOHC - VIH ) / IIHmax Calculation example: For VCCpeak = - 1.5 V; Ilatchup  20 mA; VOHC  4.5 V 75   Rprot  240 k. Recommended values: Rprot =10 kCEXT =10 nF. 24/37 Doc ID 15984 Rev 3 VN5E010AH 3.3 Application information Current sense and diagnostic The current sense pin performs a double function (see Figure 33: Current sense and diagnostic): ? Current mirror of the load current in normal operation, delivering a current proportional to the load one according to a know ratio KX. The current ISENSE can be easily converted to a voltage VSENSE by means of an external resistor RSENSE. Linearity between IOUT and VSENSE is ensured up to 5 V minimum (see parameter VSENSE in Table 9: Current sense (8 V < VCC < 18 V)). The current sense accuracy depends on the output current (refer to current sense electrical characteristics Table 9: Current sense (8 V < VCC < 18 V)). ? Diagnostic flag in fault conditions, delivering a fixed voltage VSENSEH up to a maximum current ISENSEH in case of the following fault conditions (refer to Table 11: Truth table): – Power limitation activation – Overtemperature – Short to VCC in OFF-state – Open load in OFF-state with additional external components. A logic level high on CS_DIS pin sets at the same time all the current sense pins of the device in a high-impedance state, thus disabling the current monitoring and diagnostic detection. This feature allows multiplexing of the microcontroller analog inputs by sharing of sense resistance and ADC line among different devices. Figure 33. Current sense and diagnostic V PU V BAT V CC Main MOSn 41V PU_CMD Overtemperature IOUT /K X R PU + OL OFF ISENSEH V OL Pwr_Lim OUTn ILoff2r ILoff2f INPUTn V SENSEH CS_DIS CURRENT SENSEn R PROT To uC ADC R SENSE GND Load R PD V SENSE Doc ID 15984 Rev 3 25/37 Application information 3.3.1 VN5E010AH Short to VCC and OFF-state open-load detection Short to VCC A short-circuit between VCC and output is indicated by the relevant current sense pin set to VSENSEH during the device OFF-state. Small or no current is delivered by the current sense during the ON-state depending on the nature of the short-circuit. OFF-state open-load with external circuitry Detection of an open load in off mode requires an external pull-up resistor RPU connecting the output to a positive supply voltage VPU. It is preferable VPU to be switched off during the module standby mode in order to avoid the overall standby current consumption to increase in normal conditions, i.e. when load is connected. An external pull-down resistor RPD connected between output and GND is mandatory to avoid misdetection in case of floating outputs in OFF-state (see Figure 33: Current sense and diagnostic). RPD must be selected in order to ensure VOUT < VOLmin unless pulled-up by the external circuitry: Equation 2 VOUT Pullup _ OFF  RPD  IL(off2)f  VOLmin  2 V RPD 22 kis recommended. For proper open load detection in OFF-state, the external pull-up resistor must be selected according to the following formula: Equation 3 VOUT Pullup _ ON  RPD  VPU   RPU  RPD  IL(off2)r   VOLmax  4 V RPU  RPD  For the values of VOLmin ,VOLmax, IL(off2)r and IL(off2)f (see Table 10: Open load detection (8 V < VCC < 18 V)). 26/37 Doc ID 15984 Rev 3 VN5E010AH Maximum demagnetization energy (VCC = 13.5 V) Figure 34. Maximum turn-off current versus inductance(1) 100 A B C 10 I (A) 3.4 Application information 1 0,1 1 L (mH) 10 100 A: Tjstart = 150 °C (single pulse) B: Tjstart = 100 °C (repetitive pulse) C: Tjstart = 125 °C (repetitive pulse) VIN, IL Demagnetization Demagnetization Demagnetization t 1. Values are generated with RL = 0  In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. Doc ID 15984 Rev 3 27/37 Package and PC board thermal data VN5E010AH 4 Package and PC board thermal data 4.1 HPAK thermal data Figure 35. PC board(1) 1. Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness =1.8 mm, Cu thickness = 70 µm, Copper areas: from minimum pad lay-out to 8 cm2). Figure 36. Rthj-amb vs. PCB copper area in open box free air condition RTHj_amb(°C/W) 70 65 60 55 50 45 40 35 30 0 2 4 6 PCB Cu heatsink area (cm^2) 28/37 Doc ID 15984 Rev 3 8 10 VN5E010AH Package and PC board thermal data Figure 37. HPAK thermal impedance junction ambient single pulse ZTH (°C/W) 100 Cu=8 cm2 Cu=2 cm2 Cu=foot print 10 1 0.1 0.001 0.01 0.1 1 Time (s) 10 100 1000 Figure 38. Thermal fitting model of a single-channel HSD in HPAK(1) 1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered. Doc ID 15984 Rev 3 29/37 Package and PC board thermal data VN5E010AH Equation 4: pulse calculation formula Z TH  = R TH   + Z THtp  1 –   where  = tP/T Table 15. 30/37 Thermal parameter Area/island (cm2) Footprint R1 (°C/W) 0.01 R2 (°C/W) 0.15 R3 (°C/W) 0.5 R4 (°C/W) 8 R5 (°C/W) 4 8 28 22 12 R6 (°C/W) 31 25 16 C1 (W.s/°C) 0.005 C2 (W.s/°C) 0.05 C3 (W.s/°C) 0.1 C4 (W.s/°C) 0.4 C5 (W.s/°C) 0.8 1.4 3 C6 (W.s/°C) 3 6 9 Doc ID 15984 Rev 3 VN5E010AH Package and packing information 5 Package and packing information 5.1 ECOPACK® In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 5.2 HPAK mechanical data Figure 39. HPAK package dimension Doc ID 15984 Rev 3 31/37 Package and packing information Table 16. VN5E010AH HPAK mechanical data Data book mm Ref. dim Nom. Min. Max. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 b 0.40 0.55 b4 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 D 6.00 6.20 6.40 6.60 e1 1.60 1.80 e2 3.30 3.50 e3 5.00 5.20 H 9.35 10.10 L 1 D1 5.10 E E1 5.20 e 0.85 (L1) 2.80 L2 0.80 L4 R 1.00 0° 8° 0.20 V2 32/37 0.60 Doc ID 15984 Rev 3 VN5E010AH 5.3 Package and packing information HPAK suggested land pattern Figure 40. HPAK suggested pad layout(1) All dimensions are in mm. 1. The land pattern proposed is not intended to overrule User's PCB design, manufacturing and soldering process rules Doc ID 15984 Rev 3 33/37 Package and packing information 5.4 VN5E010AH Packing information The devices can be packed in tube or tape and reel shipments (see Table 17: Device summary). Figure 41. HPAK tube shipment (no suffix) A Base q.ty Bulk q.ty Tube length (± 0.5) A B C (± 0.1) C B 75 3000 532 6 21.3 0.6 All dimensions are in mm. Figure 42. HPAK tape and reel (suffix “TR”) REEL DIMENSIONS All dimensions are in mm. Base q.ty Bulk q.ty A (max) B (min) C (± 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 16.4 60 22.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape hole spacing Component spacing Hole diameter Hole diameter Hole position Compartment depth Hole spacing W P0 (± 0.1) P D (± 0.1/-0) D1 (min) F (± 0.05) K (max) P1 (± 0.1) All dimensions are in mm. 16 4 8 1.5 1.5 7.5 2.75 2 End Start Top cover tape No components Components 500mm min Empty components pockets saled with cover tape. User direction of feed 34/37 Doc ID 15984 Rev 3 No components 500mm min VN5E010AH 6 Order codes Order codes Table 17. Device summary Order codes Package 6 pins HPAK Tube Tape and reel VN5E010AH-E VN5E010AHTR-E Doc ID 15984 Rev 3 35/37 Revision history 7 VN5E010AH Revision history Table 18. 36/37 Document revision history Date Revision Changes 2-Jul-2009 1 Initial release. 02-Oct-2009 2 Updated Table 10: Open load detection (8 V < VCC < 18 V). 19-Sep-2013 3 Updated Disclaimer. Doc ID 15984 Rev 3 VN5E010AH Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 15984 Rev 3 37/37
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