VN5R003H-E

VN5R003H-E 3 mΩ reverse battery protection switch Datasheet − production data Features Max supply voltage VCC -16 to 41 V Operating voltage range VCC -16 to 28 V On-state resistance RON 3 mΩ GA P GC FT00135 HPak ■ ■ General – Optimized electromagnetic emissions – Very low electromagnetic susceptibility – Compliant with European directive 2002/95/EC Description The VN5R003H-E is a device made using STMicroelectronics® VIPower® technology. It is intended for providing reverse battery protection to an electronic module. Protections – Automatic switch off in case of negative input voltage – Electrostatic discharge protection This device has two power pins (Drain and Source) and a control pin IN. If the IN voltage versus Drain is negative the device is turned on. Application ■ A negative voltage of Drain pin versus IN automatically turns off the device. When IN is left open, device is in OFF-state and behaves like a power diode between Source and Drain pins. Reverse battery protection of an electronic control unit Table 1. Device summary Order codes Package HPAK September 2013 This is information on a product in full production. Tube Tape and reel VN5R003H-E VN5R003HTR-E Doc ID 17602 Rev 6 1/20 www.st.com 1 Contents VN5R003H-E Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.1 5 6 2/20 HPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.1 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.2 HPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.3 HPAK suggested land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5.4 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Doc ID 17602 Rev 6 VN5R003H-E List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power section for reverse battery mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 HPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Doc ID 17602 Rev 6 3/20 List of figures VN5R003H-E List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. 4/20 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Maximum pulsed drain current (VBATT = 13 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Battery supplied systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Switched systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 12 HPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Thermal fitting model of a single-channel HSD in HPAK . . . . . . . . . . . . . . . . . . . . . . . . . . 13 HPAK package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 HPAK suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 HPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 HPAK tape and reel (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Doc ID 17602 Rev 6 VN5R003H-E 1 Block diagram and pin description Block diagram and pin description Figure 1. Block diagram SOURCE IN DRIVER DRAIN Table 2. Pin function Name Drain Source IN Function Power MOS drain Power MOS source Control pin Doc ID 17602 Rev 6 5/20 Block diagram and pin description Figure 2. VN5R003H-E Configuration diagram (top view)       1 - SOURCE 2 - SOURCE 3 - IN 4 - DRAIN 5 - NC 6 - SOURCE 7 - SOURCE TAB - DRAIN  *$3*&)7 6/20 Doc ID 17602 Rev 6 VN5R003H-E 2 Electrical specifications Electrical specifications Figure 3. Current and voltage conventions IS SOURCE ID DRAIN IN VIN 2.1 VCC VD VS IN Absolute maximum ratings Stressing the device above the rating listed in Table 3 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to the conditions in table below for extended periods may affect device reliability. Table 3. Absolute maximum ratings Symbol Value Unit -16 to 41 V Source or Drain current 60 A -IS, -ID Reverse currents 60 A EMAX Inductive clamp energy L = 2 mH, VD = 0 V, IN open, IS < 0, Tjstart = 25°C 0.9 J VESD Electrostatic discharge (Human Body Model: R = 1.5 KΩ; C = 100 pF) - All terminals 5000 V VESD Charge device model (CDM-AEC-Q100-011) 1000 V Junction operating temperature -40 to 150 °C Storage temperature -55 to 150 °C VS IS, ID Tj Tstg Parameter Source power terminal DC voltage (reverse battery mode) Doc ID 17602 Rev 6 7/20 Electrical specifications 2.2 VN5R003H-E Thermal data Table 4. Thermal data Symbol Parameter Rthj-case Thermal resistance junction-case Rthj-amb 2.3 Thermal resistance junction-ambient (mounted on FR4 using 6 cm2 copper pad) Unit 0.5 °C/W 42 °C/W Electrical characteristics Table 5. Power section for reverse battery mode(1) Symbol Parameter Test conditions Min. Typ. VS Operating supply voltage — -16 13 Max. Unit 28 V VCLPDS Drain-Source clamp voltage VD = 0 V, IN open, IS = -5 A 17 23 V VCLPDIN Drain input clamp voltage VIN = 0 V, ID = 20 mA 41 52 V Source drain voltage IN = open, IS = 10 A; Tj = 25°C VF RON IIN IIN(REV) On state resistance between SOURCE and Drain terminals 0.85 IS = 10 A; Tj = 25°C; 8 V < VCC < 28 V VS = 13 V , VIN = 0 V Reverse input current VS = -16 V, VIN = 0 V VS = -16 V, VD = 0 V, IN open 1. Operating conditions: 40°C < Tj < 150°C Doc ID 17602 Rev 6 V 3 mΩ IS = 10 A; Tj = 150°C; 8 V < VCC < 28 V Input current IOUT_rev Output reverse current 8/20 Max. 5.5 2 3 mA -2 0 mA -1.5 -0.5 mA VN5R003H-E Electrical specifications Table 6. ISO 7637-2: 2004(E) Test pulse Electrical transient requirements (part 1) Test levels(1) III IV 1(2) -75 V -100 V 2a +37 V 3a Number of pulses or test times Burst cycle/pulse repetition time Delays and Impedance Min. Max. 5000 pulses 0.5 s 5s 2 ms, 10 Ω +50 V 5000 pulses 0.2 s 5s 50 µs, 2 Ω -100 V -150 V 1h 90 ms 100 ms 0.1 µs, 50 Ω 3b +75 V +100 V 1h 90 ms 100 ms 0.1 µs, 50 Ω 4 -6 V -7 V 1 pulse — 100 ms, 0.01 Ω +65 V +87 V 1 pulse — 400 ms, 2 Ω (3) 5b 1. The above test levels must be considered referred to VCC = 13.5 V except for pulse 5b. 2. The device does not turn Off once the ISO pulse is applied. 3. Valid in case of external load dump clamp: 40 V maximum referred to ground. Table 7. Electrical transient requirements (part 2) Test level results(1) ISO 7637-2: 2004(E) Test pulse III IV 1 C C 2a C C 3a C C 3b C C 4 C C 5b(2) C C 1. Transient pulses have been applied with the INPUT pin grounded with R1>5Ω. 2. Valid in case of external load dump clamp: 40V maximum referred to ground. Table 8. Electrical transient requirements (part 3) Class Contents C All functions of the device are performed as designed after exposure to disturbance. E One or more functions of the device are not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device. Doc ID 17602 Rev 6 9/20 Electrical specifications Figure 4. VN5R003H-E Maximum pulsed drain current (VBATT = 13 V) 0D[LPXP3XOVHG'UDLQ&XUUHQW  ,PD[$  ƒ& ƒ&        3XOVHVHF  Note: PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm, Cu thickness = 35 mm, Copper areas: minimum pad lay-out and 2 cm2 10/20 Doc ID 17602 Rev 6   *$3*&)7 VN5R003H-E 3 Application information Application information Figure 5 shows the solution for systems supplied directly from the battery. If the system goes into Stand-by mode, the transistor T1 is switched off by the microcontroller with zero quiescent current. System is still supplied through the PowerMOS body diode. Figure 5. Battery supplied systems ,*1,7,216:,7&+ 6 7RV\VWHPVXSSO\ ' 92/7$*( 5(*8/$725 9EDW &+$5*(3803 &+$5*( 3803 —& ,1 5 7 ("1($'5 Figure 6 refers to a solution for systems supplied after the ignition switch. Low quiescent currents are not strictly required, so resistor R1 can be directly connected to ground. Figure 6. Switched systems 6 7RV\VWHPVXSSO\ ' 92/7$*( 5(*8/$725 9EDW &+$5*(3803 &+$5*( 3803 —& ,1 5 ("1($'5 Doc ID 17602 Rev 6 11/20 Package and PC board thermal data VN5R003H-E 4 Package and PC board thermal data 4.1 HPAK thermal data Figure 7. PC board Note: Layout condition of Rth and Zth measurements (Board finish thickness 1.6 mm +/- 10%, board double layer, board dimension 78 mm x 86 mm, board material FR4, Cu thickness = 70 µm (front and back side), thermal vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 25 µm, footprint dimension 6.4 mm x 7 mm). Figure 8. Rthj-amb vs PCB copper area in open box free air condition 57+MBDPEƒ&:           57+MDPE       3&%&XKHDWVLQNDUHDFPA ("1($'5 12/20 Doc ID 17602 Rev 6 VN5R003H-E Package and PC board thermal data Figure 9. HPAK thermal impedance junction ambient single pulse =7+ƒ&:  &X FP &X FP &X IRRWSULQW        7LPHV    *$3*&)7 Figure 10. Thermal fitting model of a single-channel HSD in HPAK GAPGCFT 00133 Note: The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered. Doc ID 17602 Rev 6 13/20 Package and PC board thermal data VN5R003H-E Equation 1: pulse calculation formula Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ ) where δ = tP/T Table 9. 14/20 Thermal parameter Area/island (cm2) Footprint R1 (°C/W) 0.01 R2 (°C/W) 0.15 R3 (°C/W) 1 R4 (°C/W) 8 R5 (°C/W) 4 8 28 21 12 R6 (°C/W) 31 24 16 C1 (W.s/°C) 0.005 C2 (W.s/°C) 0.05 C3 (W.s/°C) 0.08 C4 (W.s/°C) 0.4 C5 (W.s/°C) 0.8 1.4 3 C6 (W.s/°C) 3 6 9 Doc ID 17602 Rev 6 VN5R003H-E Package and packing information 5 Package and packing information 5.1 ECOPACK® In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 5.2 HPAK mechanical data Figure 11. HPAK package dimension GAPGCFT00134 Doc ID 17602 Rev 6 15/20 Package and packing information Table 10. VN5R003H-E HPAK mechanical data Data book mm Ref. dim 16/20 Typ Min. Max. A — 2.20 2.40 A1 — 0.90 1.10 A2 — 0.03 0.23 b — 0.45 0.60 b4 — 5.20 5.40 c — 0.45 0.60 c2 — 0.48 0.60 D — 6.00 6.20 D1 5.10 — — E — 6.40 6.60 E1 5.20 — — e 0.85 — — e1 — 1.60 1.80 e2 — 3.30 3.50 e3 — 5.00 5.20 H — 9.35 10.10 L — 1 — (L1) 2.80 — — L2 0.80 — — L4 — 0.60 1.00 R 0.20 — — V2 — 0° 8° Doc ID 17602 Rev 6 VN5R003H-E 5.3 Package and packing information HPAK suggested land pattern Figure 12. HPAK suggested pad layout(a) All dimensions are in mm. 5.4 Packing information Figure 13. HPAK tube shipment (no suffix) A C B Base q.ty Bulk q.ty Tube length (± 0.5) A B C (± 0.1) 75 3000 532 6 21.3 0.6 All dimensions are in mm. a. The land pattern proposed is not intended to over-rule User's PCB design, manufacturing and soldering process rules Doc ID 17602 Rev 6 17/20 Package and packing information VN5R003H-E Figure 14. HPAK tape and reel (suffix “TR”) REEL DIMENSIONS All dimensions are in mm. Base q.ty Bulk q.ty A (max) B (min) C (± 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 16.4 60 22.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape hole spacing Component spacing Hole diameter Hole diameter Hole position Compartment depth Hole spacing W P0 (± 0.1) P D (± 0.1/-0) D1 (min) F (± 0.05) K (max) P1 (± 0.1) 16 4 8 1.5 1.5 7.5 2.75 2 All dimensions are in mm. End Start Top No components Components No components cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 18/20 Doc ID 17602 Rev 6 500mm min VN5R003H-E 6 Revision history Revision history Table 11. Document revision history Date Revision Changes 23-Jun-2010 1 Initial release. 06-Jul-2010 2 Updated Table 4: Thermal data. 06-Oct-2010 3 Added Figure 4: Maximum pulsed drain current (VBATT = 13 V) 18-Nov-2010 4 Changed document status from target specification to datasheet. Table 3: Absolute maximum ratings: – Removed VD row Table 5: Power section for reverse battery mode – IIN: added maximum value Table 6: Electrical transient requirements (part 1) – Added Note 2 Updated Figure 5: Battery supplied systems and Figure 6: Switched systems 17-Apr-2012 5 Updated Figure 4: Maximum pulsed drain current (VBATT = 13 V) 19-Sep-2013 6 Updated Disclaimer Doc ID 17602 Rev 6 19/20 VN5R003H-E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 20/20 Doc ID 17602 Rev 6