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VN771K13TR

VN771K13TR

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

  • 描述:

    VN771K13TR - Quad smart power solid state relay for complete H-bridge configurations - STMicroelectr...

  • 数据手册
  • 价格&库存
VN771K13TR 数据手册
VN771K Quad smart power solid state relay for complete H-bridge configurations Features Type VN771K RDS(on) 95 mΩ(1) IOUT 9 A(2) VCC 36 V 1. Total resistance of one side in bridge configuration 2. Typical current limitation value ■ ■ ■ ■ ■ ■ ■ ■ Suited as low voltage bridge Linear current limitation Very low standby power dissipation Short circuit protected Status flag diagnostic (open drain) Integrated clamping circuits Undervoltage protection ESD protection SO-28 This device is suitable to drive a DC motor in a bridge configuration as well as to be used as a quad switch for any low voltage application. The dual high side switches have built-in thermal shutdown to protect the chips from over temperature and current limiter blocks to protect the device from short circuit. Status output is provided to indicate open load in off and on-state and over temperature. The low side switches are two OMNIFET II types (fully auto protected Power MOSFET in VIPower™ technology). They have built-in thermal shutdown, linear current limitation and overvoltage clamping. Fault feedback for thermal intervention can be detected by monitoring the voltage at the input pin. Description The VN771K is a device formed by three monolithic chips housed in a standard SO-28 package: a double high side and two low side switches. Both the double high side and low side switches are made using STMicroelectronics VIPower™ M0-3 Technology. Table 1. Device summary Order codes Package Tube SO-28 VN771K Tape and reel VN771K13TR July 2009 Doc ID 12534 Rev 4 1/33 www.st.com 1 Contents VN771K Contents 1 2 Block diagrams and pins descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 2.2 2.3 2.4 2.5 2.6 2.7 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical characteristics for dual high side switch . . . . . . . . . . . . . . . . . . . 9 Electrical characteristics for low side switches . . . . . . . . . . . . . . . . . . . . 11 Dual high-side switch timing data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Electrical characterization for dual high side switch . . . . . . . . . . . . . . . . . 16 Electrical characterization for low side switches . . . . . . . . . . . . . . . . . . . . 19 3 4 Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.1 4.2 SO-28 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Thermal calculation in clockwise and anti-clockwise operation in steady state mode 27 4.2.1 4.2.2 4.2.3 4.2.4 Thermal resistances definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Thermal calculation in transient mode . . . . . . . . . . . . . . . . . . . . . . . . . 27 Single pulse thermal impedance definition . . . . . . . . . . . . . . . . . . . . . . 27 Pulse calculation formula . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.1 5.2 5.3 SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 SO-28 tube shipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Tape and reel shipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2/33 Doc ID 12534 Rev 4 VN771K List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin definition and function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Dual high side switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Low side switch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power outputs (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Switching (per each channel) (VCC= 13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Logic input (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Status pin (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Protections (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Openload detection (per each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 On-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Source drain diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Thermal calculation in clockwise and anti-clockwise operation in steady state mode . . . . 27 Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Doc ID 12534 Rev 4 3/33 List of figures VN771K List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. Figure 45. Figure 46. Figure 47. Figure 48. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Open-load status timing (with external pull-up) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Over temperature status timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Openload on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Openload off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Static drain source on resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Derating curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Transconductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Transfer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Turn-on current slope (Vin=5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Turn-on current slope (Vin=3.5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Input voltage vs input charge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Capacitance variations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Switching time resistive load (Vin=5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Switching time resistive load (Rg=10Ohm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Output characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Step response current limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Source drain diode forward characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Static drian source on resistance vs Id . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Static drain source on resistance vs input voltage (Id=7A) . . . . . . . . . . . . . . . . . . . . . . . . . 21 Static drain source on resistance vs input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Normalized input threshold voltage vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Normalized on resistance vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Turn-off drain source voltage slope (Vin=3.5V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Turn-off drain source voltage slope (Vin=5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Current limit vs junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Application diagram bridge drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Recommended motor operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 SO-28 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Chipset configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4/33 Doc ID 12534 Rev 4 VN771K Figure 49. Figure 50. Figure 51. Figure 52. Figure 53. Figure 54. Figure 55. List of figures Auto and mutual Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . 26 SO-28 HSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . 28 SO-28 LSD thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . . 28 Thermal fitting model of an H-bridge in SO-28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 SO-28 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Tube dimensions (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Tape and reel dimensions (suffix “13TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Doc ID 12534 Rev 4 5/33 Block diagrams and pins descriptions VN771K 1 Figure 1. Block diagrams and pins descriptions Block diagram 6/33 Doc ID 12534 Rev 4 VN771K Table 2. No 1, 3, 25, 28 2 4, 11 5, 10, 19, 24 6 7 8 9 12, 14, 15, 18 13 16, 17 20, 21 22, 23 26, 27 Block diagrams and pins descriptions Pin definition and function Name DRAIN 3 INPUT 3 N.C. VCC GND INPUT 1 DIAGNOSTIC INPUT 2 DRAIN 4 INPUT 4 SOURCE 4 SOURCE 2 SOURCE 1 SOURCE 3 Function Drain of switch 3 (low-side switch) Input of switch 3 (low-side switch) Not connected Drain of switches 1 and 2 (high-side switches) and power supply voltage Ground of switches 1 and 2 (high-side switches) Input of switch 1 (high-side switches) Diagnostic of switches 1 and 2 (high-side switches) Input of switch 2 (high-side switch) Drain of switch 4 (low-side switch) Input of switch 4 (low-side switch) Source of switch 4 (low-side switch) Source of switch 2 (high-side switch) Source of switch 1 (high-side switch) Source of switch 3 (low-side switch) Figure 2. Connection diagram Doc ID 12534 Rev 4 7/33 Electrical specifications VN771K 2 2.1 Electrical specifications Thermal data Table 3. Symbol Rthj-case Rthj-case Rthj-amb Thermal data Parameter Thermal resistance junction-case (high side switch) Thermal resistance junction-case (low side switch) Thermal resistance junction-ambient (with 6 cm2 of Cu heat sink) Value Max (°C/W) 20 20 See Figure 49 2.2 Absolute maximum ratings Table 4. Symbol VCC -VCC -IGND IOUT -IOUT IIN ISTAT DC supply voltage Reverse DC supply voltage DC reverse ground pin current DC output current Reverse DC output current DC input current DC status current Electrostatic discharge (human body model: R = 1.5KΩ; C = 100pF) – Input – Status – Output – VCC Power dissipation (TC =25°C) Junction operating temperature Case operating temperature Storage temperature Dual high side switch Parameter Value 41 -0.3 -200 Internally limited -6 ±10 ±10 Unit V V mA A A mA mA VESD 4000 4000 5000 5000 6 Internally limited -40 to 150 -55 to 150 V V V V W °C °C °C Ptot Tj Tc Tstg Table 5. Symbol VDS VIN IIN Low side switch Parameter Drain source voltage (VIN = 0V) Input voltage Input current Value Internally clamped Internally clamped ±20 Unit V V mA 8/33 Doc ID 12534 Rev 4 VN771K Table 5. Symbol RIN MIN ID IR VESD1 VESD2 Ptot T j Electrical specifications Low side switch (continued) Parameter Minimum input series impedance Drain current Reverse DC output current Electrostatic discharge (R = 1.5KΩ, C = 100pF) Electrostatic discharge on output pin only (human body model: R = 330Ω, C = 150pF) Power dissipation (TC = 25°C) Operating junction temperature Case operating temperature Storage temperature Value 10 Internally limited -15 4000 5000 6 Internally limited Internally limited -55 to 150 Unit Ω A A V V W °C °C °C Tc Tstg 2.3 Electrical characteristics for dual high side switch 8V < VCC< 36V; -40°C < Tj < 150°C, unless otherwise specified. Table 6. Symbol VCC(1) VUSD(1) VOV(1) RON Power outputs (per each channel) Parameter Operating supply voltage Undervoltage shutdown Overvoltage shutdown On-state resistance IOUT =2A; Tj =25°C IOUT =2A; VCC >8V Off-state; VCC = 13V; VIN =VOUT =0V Off-state; VCC = 13V; VIN =VOUT =0V; Tj =25°C On-state; VCC = 13V; VIN =VOUT =0V; VCC =36V; Tj = 125°C VIN =0V; VOUT =3.5V VIN =VOUT =0V; VCC = 13V; Tj = 125°C VIN =VOUT =0V; VCC = 13V; Tj = 25°C Test conditions Min 5.5 3 36 Typ 13 4 12 12 5 0 -75 Max 36 5.5 60 120 40 25 7 50 0 5 3 Unit V V V mΩ mΩ µA µA mA µA µA µA µA IS(1) Supply current - IL(off1) IL(off2) IL(off3) IL(off4) Off-state output current Off-state output current Off-state output current Off-state output current 1. Per device. Doc ID 12534 Rev 4 9/33 Electrical specifications Table 7. Symbol td(on) td(off) dVOUT/dt(on) dVOUT/dt(off) VN771K Switching (per each channel) (VCC= 13V) Parameter Turn-on delay time Turn-off delay time Turn-on voltage slope Turn-off voltage slope Test conditions RL =6.5Ω from VIN rising edge to VOUT =1.3V RL =6.5Ω from VIN falling edge to VOUT = 11.7V RL =6.5Ω from VOUT = 1.3V to VOUT = 10.4V RL =6.5Ω from VOUT = 11.7V to VOUT =1.3V Min Typ 30 30 See relative diagram See relative diagram Max Unit µs µs V/µs V/µs Table 8. Symbol VIL IIL VIH IIH VI(hyst) VICL Logic input (per each channel) Parameter Input low level Low level input current VIN = 1.25V Input high level High level input current VIN = 3.25V Input hysteresis voltage Input clamp voltage IIN = 1mA IIN = -1mA Test conditions Min 1 3.25 0.5 6 Typ 6.8 -0.7 Max 1.25 10 8 Unit V µA V µA V V V Table 9. Symbol VSTAT ILSTAT CSTAT VSCL Status pin (per each channel) Parameter Status low output voltage Test conditions ISTAT = 1.6 mA Min 6 Typ 6.8 -0.7 Max 0.5 10 100 8 Unit V µA pF V V Status leakage current Normal operation; VSTAT = 5V Status pin input capacitance Status clamp voltage Normal operation; VSTAT = 5V ISTAT = 1mA ISTAT = -1mA Table 10. Symbol TTSD TR Thyst Protections (per each channel) Parameter Shutdown temperature Reset temperature Thermal hysteresis Test conditions Min 150 135 7 Typ 175 15 Max 200 Unit °C °C °C 10/33 Doc ID 12534 Rev 4 VN771K Table 10. Symbol tSDL Electrical specifications Protections (per each channel) (continued) Parameter Status delay in overload conditions Current limitation Test conditions Tj >TTSD Min 6 8.5 Typ 9 Max 20 15 15 15 Unit µs A A A V Ilim Tj = 125°C 5.5V < VCC TTSD) L H L X X H H L H H L Conditions Normal operation Current limitation Over temperature Undervoltage Overvoltage Output voltage > VOL Output current < IOL 14/33 Doc ID 12534 Rev 4 VN771K Figure 4. Open-load status timing (with external pull-up) Electrical specifications Figure 5. Over temperature status timing Doc ID 12534 Rev 4 15/33 Electrical specifications VN771K 2.6 Figure 6. Electrical characterization for dual high side switch Off-state output current Figure 7. Input clamp voltage Figure 8. High level input current Figure 9. Input high level voltage Figure 10. Input low level voltage Figure 11. Input hysteresis voltage 16/33 Doc ID 12534 Rev 4 VN771K Figure 12. Overvoltage shutdown Figure 13. ILIM vs Tcase Electrical specifications Figure 14. Turn-on voltage slope Figure 15. Turn-off voltage slope Figure 16. On-state resistance vs Tcase Figure 17. On-state resistance vs VCC Doc ID 12534 Rev 4 17/33 Electrical specifications Figure 18. Status leakage current Figure 19. Status low output voltage VN771K Figure 20. Openload on-state detection threshold Figure 21. Openload off-state voltage detection threshold Figure 22. Status clamp voltage 18/33 Doc ID 12534 Rev 4 VN771K Electrical specifications 2.7 Electrical characterization for low side switches Figure 24. Derating curve Figure 23. Static drain source on resistance Figure 25. Transconductance Figure 26. Transfer characteristics Figure 27. Turn-on current slope (Vin=5V) Figure 28. Turn-on current slope (Vin=3.5V) Doc ID 12534 Rev 4 19/33 Electrical specifications Figure 29. Input voltage vs input charge Figure 30. Capacitance variations VN771K Figure 31. Switching time resistive load (Vin=5V) Figure 32. Switching time resistive load (Rg=10Ohm) Figure 33. Output characteristics Figure 34. Step response current limit 20/33 Doc ID 12534 Rev 4 VN771K Figure 35. Source drain diode forward characteristics Electrical specifications Figure 36. Static drian source on resistance vs Id v Figure 37. Static drain source on resistance vs Figure 38. Static drain source on resistance vs input voltage (Id=7A) input voltage Figure 39. Normalized input threshold voltage Figure 40. Normalized on resistance vs vs temperature temperature Doc ID 12534 Rev 4 21/33 Electrical specifications VN771K Figure 41. Turn-off drain source voltage slope Figure 42. Turn-off drain source voltage slope (Vin=3.5V) (Vin=5V) Figure 43. Current limit vs junction temperature 22/33 Doc ID 12534 Rev 4 VN771K Application recommendations 3 Application recommendations Figure 44. Application diagram bridge drivers Most motor bridge drivers use a reverse battery protection diode (D) inside the supply rail. This diode prevents a reverse current flow back to VBATT in case the bridge becomes disabled via the logic inputs while motor inductance still carries energy. In order to prevent a hazardous overvoltage at circuit supply terminal (VCC), a blocking capacitor (C) is needed to limit the voltage overshoot. As basic orientation, 50µF per 1A load current is recommended. As an alternative, a Zener protection (Z) is also suitable. Even if a reverse polarity diode is not present, it is recommended to use a capacitor or Zener at VCC because a similar problem appears in case the supply terminal of the module has intermittent electrical contact to the battery or gets disconnected while the motor is operating. Doc ID 12534 Rev 4 23/33 Application recommendations Figure 45. Recommended motor operation VN771K 24/33 Doc ID 12534 Rev 4 VN771K Figure 46. Waveforms Application recommendations Doc ID 12534 Rev 4 25/33 Thermal data VN771K 4 4.1 Thermal data SO-28 thermal data Figure 47. SO-28 PC board Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad layout to 6cm2). Figure 48. Chipset configuration LOW SIDE CHIP channel 3 RthB RthBC Figure 49. Auto and mutual Rthj-amb vs PCB copper area in open box free air condition(a) RthAB HIGH SIDE CHIP channel 1,2 RthA RthAC LOW SIDE CHIP channel 4 RthC a. see definitions in Section 5.2 on page 31 26/33 Doc ID 12534 Rev 4 VN771K Thermal data 4.2 Table 19. HS1 On Off HS2 Off On Thermal calculation in clockwise and anti-clockwise operation in steady state mode Thermal calculation in clockwise and anti-clockwise operation in steady state mode LS3 Off On LS4 On Off TjHS12 PdHS1 x RthHS + PdLS4 x RthHSLS + Tamb PdHS2 x RthHS + PdLS3 x RthHSLS + Tamb TjLS3 TjLS4 PdHS1 x RthHSLS + PdLS4 PdHS1 x RthHSLS + PdLS4 x x RthLSLS + Tamb RthLS + Tamb PdHS2 x RthHSLS + PdLS3 PdHS2 x RthHSLS + PdLS3 x x RthLS + Tamb RthLSLS + Tamb 4.2.1 Thermal resistances definition Values according to the PCB heatsink area. RthHS = RthHS1 = RthHS2 = high side chip thermal resistance junction to ambient (HS1 or HS2 in on-state) RthLS = RthLS3 = RthLS4 = low side chip thermal resistance junction to ambient RthHSLS = RthHS1LS4 = RthHS2LS3 = mutual thermal resistance junction to ambient between high side and low side chips RthLSLS = RthLS3LS4 = mutual thermal resistance junction to ambient between low side chips 4.2.2 Thermal calculation in transient mode(b) TjHS12 = ZthHS x PdHS12 + ZthHSLS x (PdLS3 + PdLS4) + Tamb TjLS3 = ZthHSLS x PdHS12 + ZthLS x PdLS3 + ZthLSLS x PdLS4 + Tamb TjLS4 = ZthHSLS x PdHS12 + ZthLSLS x PdLS3 + ZthLS x PdLS4 + Tamb 4.2.3 Single pulse thermal impedance definition Values according to the PCB heatsink area. ZthHS = high side chip thermal impedance junction to ambient ZthLS = ZthLS3 = ZthLS4 = low side chip thermal impedance junction to ambient ZthHSLS = ZthHS12LS3 = ZthHS12LS4 = mutual thermal impedance junction to ambient between high side and low side chips ZthLSLS = ZthLS3LS4 = mutual thermal impedance junction to ambient between low side chips 4.2.4 Pulse calculation formula Z TH δ =R TH ⋅δ+Z THtp (1 – δ) where δ = tP/T b. Calculation is valid in any dynamic operating condition. Pd values set by user. Doc ID 12534 Rev 4 27/33 Thermal data Figure 50. SO-28 HSD thermal impedance junction ambient single pulse VN771K Figure 51. SO-28 LSD thermal impedance junction ambient single pulse 28/33 Doc ID 12534 Rev 4 VN771K Figure 52. Thermal fitting model of an H-bridge in SO-28 Thermal data Table 20. Thermal parameters(1) Footprint 1.5 2.6 2.6 15.5 10.5 62.28 150 1 0.00035 0.024 0.2 1.6 0.0009 1.61 1.7 3.25 52.28 44.28 32.28 1 2 6 Area/island (cm2) R1 = R6 (°C/W) R2 (°C/W) R12 = R17 (°C/W) R3 = R13 = R 18 (°C/W) R4 = R14 = R19 (°C/W) R5 = R15 = R20 (°C/W) R7 = R8 = R9 = R10 (°C/W) R11 = R16 (°C/W) C1 = C5 (W.s/°C) C2 = C7 = C11 (W.s/°C) C3 = C8 =C 12 (W.s/°C) C4 = C9 = C13 (W.s/°C) C6 = C10 (W.s/°C) 1. The blank space means that the value is the same as the previous one. Doc ID 12534 Rev 4 29/33 Package mechanical data VN771K 5 5.1 Package mechanical data SO-28 mechanical data Figure 53. SO-28 package outline Table 21. DIM SO-28 mechanical data mm Min. Typ Max. 2.65 0.1 0.35 0.23 0.5 45° (typ.) 17.7 10 1.27 16.51 7.4 0.4 7.6 1.27 0.291 0.016 8° (max.) 18.1 10.65 0.697 0.393 0.050 0.650 0.299 0.050 0.713 0.419 0.3 0.49 0.32 0.004 0.013 0.009 0.020 Min. inch Typ. Max. 0.104 0.012 0.019 0.012 A a1 b b1 C c1 D E e e3 F L S 30/33 Doc ID 12534 Rev 4 VN771K Package mechanical data 5.2 SO-28 tube shipment Figure 54. Tube dimensions (no suffix) 5.3 Tape and reel shipment Figure 55. Tape and reel dimensions (suffix “13TR”) Doc ID 12534 Rev 4 31/33 Revision history VN771K 6 Revision history Table 22. Date 01-Sep-2004 Document revision history Revision 1 Initial release. Document formatted into new ST template Dimensions updated, seeFigure 55: Tape and reel dimensions (suffix “13TR”) on page 31 Application diagram updated, seeFigure 44: Application diagram bridge drivers on page 23 Updated Table 3: Thermal data Updated note of Figure 47: SO-28 PC board. Updated Figure 48: Chipset configuration. Changes 31-Aug-2006 2 30-Jun-2009 10-Jul-2009 3 4 32/33 Doc ID 12534 Rev 4 VN771K Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 12534 Rev 4 33/33
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