VN800PS-E
High-side driver
Features
Type
RDS(on)
IOUT
VCC
VN800PS-E
135 mΩ
0.7 A
36 V
■
ECOPACK®: lead free and RoHS compliant
■
Automotive Grade: compliance with AEC
guidelines
■
Very low standby current
■
CMOS compatible input
■
Thermal shutdown protection and diagnosis
Description
■
Undervoltage shutdown
■
Overvoltage clamp
■
Load current limitation
■
Reverse battery protection
The VN800PS-E is monolithic device made by
using STMicroelectronics™ VIPower™ M0-3
technology, intended for driving any kind of load
with one side connected to ground.
■
Electrostatic discharge protection
SO-8
Active VCC pin voltage clamp protects the device
against low energy spikes. Active current
limitation combined with thermal shutdown and
automatic restart protect the device against
overload. Device automatically turns off in case of
ground pin disconnection.
This device is especially suitable for industrial
applications in norms conformity with IEC1131
(Programmable Controllers International
Standard).
Table 1.
Device summary
Order codes
Package
SO-8
September 2013
Doc ID 15610 Rev 4
Tube
Tape and reel
VN800PS-E
VN800PSTR-E
1/27
www.st.com
1
Contents
VN800PS-E
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1
4
6
2/27
3.1.1
Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 15
3.1.2
Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 16
3.2
Microcontroller I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.4
SO-8 maximum demagnetization energy . . . . . . . . . . . . . . . . . . . . . . . . . 19
Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1
5
GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 15
SO-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1
ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2
SO-8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.3
SO-8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Doc ID 15610 Rev 4
VN800PS-E
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Switching (VCC = 24 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Input pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
VCC - output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical transient requirements on VCC pin (part 1/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Electrical transient requirements on VCC pin (part 2/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Electrical transient requirements on VCC pin (part 3/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Doc ID 15610 Rev 4
3/27
List of figures
VN800PS-E
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
4/27
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Status timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Peak short circuit current test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Avalanche energy test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SO-8 maximum turn off current versus load inductance. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Demagnetization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SO-8 PC board(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
SO-8 Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . 20
SO-8 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Thermal fitting model of a single channel HSD in SO-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
SO-8 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
SO-8 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Doc ID 15610 Rev 4
VN800PS-E
1
Block diagram and pin description
Block diagram and pin description
Figure 1.
Block diagram
9&&
29(592/7$*(
'(7(&7,21
9&&
&/$03
81'(592/7$*(
'(7(&7,21
*1'
3RZHU&/$03
'5,9(5
287387
/2*,&
,1387
&855(17/,0,7(5
67$786
29(57(03(5$785(
'(7(&7,21
*$3*&)7
Figure 2.
Configuration diagram (top view)
9&&
1&
287387
67$786
287387
,1387
9&&
*1'
62
*$3*&)7
Table 2.
Suggested connections for unused and not connected pins
Connection/pin
Floating
To ground
Status
N.C.
Output
Input
X
X
X
X
X
Doc ID 15610 Rev 4
Through 10 KΩ resistor
5/27
Electrical specifications
2
VN800PS-E
Electrical specifications
Figure 3.
Current and voltage conventions
,6
9)
,,1
9&&
,1387
,67$7
,287
67$786
9&&
287387
*1'
9,1
967$7
9287
,*1'
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2.1
Absolute maximum ratings
Table 3.
Absolute maximum ratings
Value
Symbol
Parameter
Unit
SO-8
VCC
DC supply voltage
41
V
- VCC
Reverse DC supply voltage
-0.3
V
- IGND
DC reverse ground pin current
-200
mA
Internally limited
A
-6
A
+/- 10
mA
-3/+VCC
V
+VCC
V
4000
4000
5000
5000
V
V
V
V
Power dissipation TC = 25 °C
4.2
W
Maximum switching energy
(L = 77.5 mH; RL = 0 Ω; Vbat = 13.5 V; Tjstart = 150 °C; IL = 1.5 A)
121
mJ
IOUT
- IOUT
DC output current
Reverse DC output current
IIN
DC input current
VIN
Input voltage range
VSTAT
DC status voltage
VESD
Electrostatic discharge (human body model: R = 1.5 KΩ;
C = 100 pF)
- Input
- Status
- Output
- VCC
Ptot
EMAX
6/27
Doc ID 15610 Rev 4
VN800PS-E
Table 3.
Electrical specifications
Absolute maximum ratings (continued)
Value
Symbol
Parameter
Unit
SO-8
Tj
Junction operating temperature
Tc
Tstg
Internally limited
°C
Case operating temperature
-40 to 150
°C
Storage temperature
-55 to 150
°C
2.2
Thermal data
Table 4.
Thermal data
Value
Symbol
Parameter
Unit
SO-8
Rthj-lead
Rthj-amb
Thermal resistance junction-lead max
30
°C/W
93
(1)
°C/W
82
(2)
°C/W
Thermal resistance junction-ambient max
1. When mounted on FR4 printed circuit board with 0.5 cm2 of copper area (at least 35 µm thick) connected to all VCC pins.
2. When mounted on FR4 printed circuit board with 2 cm2 of copper area (at least 35 µm thick).
Doc ID 15610 Rev 4
7/27
Electrical specifications
2.3
VN800PS-E
Electrical characteristics
Values specified in this section are for 8 V< VCC < 36 V; -40 °C < Tj < 150 °C, unless
otherwise stated.
Table 5.
Symbol
Power
Parameter
Test conditions
Min.
Typ.
VCC
Operating supply
voltage
VUSD
Undervoltage shutdown
3
4
VOV
Overvoltage shutdown
36
42
RON
On-state resistance
IOUT = 0.5 A; Tj = 25 °C
IOUT = 0.5 A
Supply current
Off-state; VCC = 24 V; Tcase = 25 °C
On-state; VCC = 24 V
On-state; VCC = 24 V; Tcase = 100 °C
ILGND
Output current at turn-off
VCC = VSTAT = VIN = VGND = 24 V;
VOUT = 0 V
IL(off1)
Off-state output current
VIN = VOUT = 0 V
IL(off2)
Off-state output current
IL(off3)
Off-state output current
IS
Table 6.
Symbol
5.5
Max.
Unit
36
V
5.5
V
V
135
270
mΩ
mΩ
20
3.5
2.6
µA
mA
mA
1
mA
50
µA
VIN = VOUT = 0 V; VCC = 13 V;
Tj = 125 °C
5
µA
VIN = VOUT = 0 V; VCC = 13 V;
Tj = 25 °C
3
µA
10
1.5
0
Switching (VCC = 24 V)
Parameter
Test conditions
Min.
Typ.
Max.
Unit
td(on)
Turn-on delay time
RL = 48 Ω from VIN rising edge to
VOUT = 2.4 V
-
10
-
µs
td(off)
Turn-off delay time
RL = 48 Ω from VIN falling edge to
VOUT = 21.6 V
-
40
-
µs
dVOUT/dt(on)
Turn-on voltage slope
RL = 48 Ω from VOUT = 2.4 V to
VOUT = 19.2 V
-
See
relative
diagram
-
V/µs
dVOUT/dt(off)
Turn-off voltage slope
RL = 48 Ω from VOUT = 21.6 V to
VOUT = 2.4 V
-
See
relative
diagram
-
V/µs
Typ.
Max.
Unit
-
1.25
V
Table 7.
Symbol
8/27
Input pin
Parameter
VINL
Input low level
IINL
Low level input current
VINH
Input high level
Test conditions
VIN = 1.25 V
Doc ID 15610 Rev 4
Min.
1
-
µA
3.25
-
V
VN800PS-E
Table 7.
Symbol
Electrical specifications
Input pin (continued)
Parameter
IINH
High level input current
VI(hyst)
Input hysteresis voltage
IIN
Table 8.
Symbol
VF
Table 9.
Symbol
Input current
Test conditions
Min.
VIN=3.25 V
0.5
VIN = VCC = 36 V
Typ.
Max.
Unit
-
10
µA
-
V
-
200
µA
Min.
Typ.
Max.
Unit
-
-
0.6
V
VCC - output diode
Parameter
Forward on voltage
Test conditions
-IOUT = 0.6 A; Tj = 150 °C
Status pin
Parameter
Test conditions
Min.
Typ.
Max.
Unit
VSTAT
Status low output voltage ISTAT = 1.6 mA
-
-
0.5
V
ILSTAT
Status leakage current
Normal operation; VSTAT = VCC = 36 V
-
-
10
µA
CSTAT
Status pin input
capacitance
Normal operation; VSTAT = 5 V
-
-
30
pF
Table 10.
Symbol
Protections(1)
Min.
Typ.
Max.
Unit
Shutdown temperature
150
175
200
°C
TR
Reset temperature
135
Thyst
Thermal hysteresis
7
TSDL
Status delay in overload
condition
Tj>Tjsh
Ilim
DC short circuit current
VCC = 24 V; RLOAD = 10 mΩ
Turn-off output clamp voltage
IOUT = 0.5 A; L = 6 mH
TTSD
Vdemag
Parameter
Test conditions
0.7
°C
15
°C
20
µs
2
A
VCC - 47 VCC - 52 VCC - 57
V
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals
must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must
limit the duration and number of activation cycles.
Doc ID 15610 Rev 4
9/27
Electrical specifications
Figure 4.
VN800PS-E
Status timing
29(57(0367$7867,0,1*
7M!7MVK
9,1
967$7
W6'/
W6'/
*$3*&)7
Table 11.
10/27
Truth table
Conditions
Input
Output
Status
Normal operation
L
H
L
H
H
H
Current limitation
L
H
H
L
X
X
H
(Tj < TTSD) H
(Tj > TTSD) L
Over temperature
L
H
L
L
H
L
Undervoltage
L
H
L
L
X
X
Overvoltage
L
H
L
L
H
H
Doc ID 15610 Rev 4
VN800PS-E
Electrical specifications
Figure 5.
Switching time waveforms
9287
G9287GW RII
G9287GW RQ
WU
WI
W
9,1
7G RQ
7G RII
W
*$3*&)7
Doc ID 15610 Rev 4
11/27
Electrical specifications
Table 12.
VN800PS-E
Electrical transient requirements on VCC pin (part 1/3)
Test levels
ISO T/R 7637/1
test pulse
I
II
III
IV
Delays and
impedance
1
-25 V
-50 V
-75 V
-100 V
2 ms, 10 Ω
2
+25 V
+50 V
+75 V
+100 V
0.2 ms, 10 Ω
3a
-25 V
-50 V
-100 V
-150 V
0.1 µs, 50 Ω
3b
+25 V
+50 V
+75 V
+100 V
0.1 µs, 50 Ω
4
-4 V
-5 V
-6 V
-7 V
100 ms, 0.01 Ω
5
+26.5 V
+46.5 V
+66.5 V
+86.5 V
400 ms, 2 Ω
Table 13.
Electrical transient requirements on VCC pin (part 2/3)
Test levels results
ISO T/R 7637/1
Test pulse
I
II
III
IV
1
C
C
C
C
2
C
C
C
C
3a
C
C
C
C
3b
C
C
C
C
4
C
C
C
C
5
C
E
E
E
Table 14.
Electrical transient requirements on VCC pin (part 3/3)
Class
12/27
Contents
C
All functions of the device are performed as designed after exposure to
disturbance.
E
One or more functions of the device is not performed as designed after
exposure to disturbance and cannot be returned to proper operation without
replacing the device.
Doc ID 15610 Rev 4
VN800PS-E
Electrical specifications
Figure 6.
Peak short circuit current test circuit
9&&
Nё
67$786
&21752/
81,7
,1387
9&&
287387
5,1
*1'
5/ Pё
*1'
*$3*&)7
Figure 7.
Avalanche energy test circuit
9&&
Nё
67$786
&21752/
81,7
,1387
9&&
287387
5,1
*1'
/2$'
*1'
*$3*&)7
Doc ID 15610 Rev 4
13/27
Electrical specifications
Figure 8.
VN800PS-E
Waveforms
1250$/23(5$7,21
,1387
/2$'92/7$*(
67$786
81'(592/7$*(
986'K\VW
9&&
986'
,1387
/2$'92/7$*(
67$786
XQGHILQHG
29(592/7$*(
9&& 929
9&&!929
9&&
,1387
/2$'92/7$*(
67$786
29(57(03(5$785(
7M
776'
75
,1387
/2$'&855(17
67$786
*$3*&)7
14/27
Doc ID 15610 Rev 4
VN800PS-E
Application information
3
Application information
Figure 9.
Application schematic
9&&
9&&
9
9'&
5SURW
9ROW
5HJXODWRU
67$786Q
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3.1
GND protection network against reverse battery
3.1.1
Solution 1: resistor in the ground line (RGND only)
This can be used with any type of load.
The following is an indication on how to dimension the RGND resistor.
1) RGND ≤ 600 mV / (IS(on)max)
2) RGND ≥ (-VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device’s datasheet.
Power dissipation in RGND (when VCC < 0: during reverse battery situations) is:
PD= (-VCC)2/RGND
This resistor can be shared amongst several different HSD. Please note that the value of this
resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not common with the device ground then
the RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output
values. This shift varies depending on many devices are on in the case of several high side
drivers sharing the same RGND.
Doc ID 15610 Rev 4
15/27
Application information
VN800PS-E
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then the ST suggests to utilize Solution 2 (see Section 3.1.2).
3.1.2
Solution 2: diode (DGND) in the ground line
A resistor (RGND = 1 kΩ) should be inserted in parallel to DGND if the device is driving an
inductive load.
This small signal diode can be safely shared amongst several different HSD. Also in this
case, the presence of the ground network produces a shift (≈600 mV) in the input threshold
and the status output values if the microprocessor ground is not common with the device
ground. This shift not varies if more than one HSD shares the same diode/resistor network.
Series resistor in input and status lines are also required to prevent that, during battery
voltage transient, the current exceeds the absolute maximum rating.
Safest configuration for unused input and status pin is to leave them unconnected.
3.2
Microcontroller I/Os protection
If a ground protection network is used and negative transients are present on the VCC line,
the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent
the microcontroller I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of microcontroller
and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of
microcontroller I/Os.
-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH-VGND) / IIHmax
Calculation example:
For VCCpeak = -100 V and Ilatchup ≥ 20 mA; VOHµC ≥ 4.5 V
5k Ω ≤ Rprot ≤ 65 kΩ.
Recommended Rprot value is 10 kΩ.
16/27
Doc ID 15610 Rev 4
VN800PS-E
3.3
Application information
Electrical characteristics curves
Figure 10. Off-state output current
Figure 11.
IL(off1) (µA)
High level input current
Iih (µA)
2.5
8
2.25
7
Off state
Vcc=36V
Vin=Vout=0V
2
1.75
Vin=3.25V
6
5
1.5
1.25
4
1
3
0.75
2
0.5
1
0.25
0
0
-50
-25
0
25
50
75
100
125
150
-50
175
-25
0
25
50
75
100
125
150
175
Tc (ºC)
Tc (ºC)
Figure 12. Status leakage current
Figure 13. On-state resistance vs Tcase
Ilstat (µA)
Ron (mOhm)
0.1
400
0.09
350
Vstat=Vcc=36V
Iout=0.5A
Vcc=8V; 13V; 36V
0.08
300
0.07
0.06
250
0.05
200
0.04
150
0.03
100
0.02
50
0.01
0
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
50
Tc (ºC)
75
100
125
150
175
Tc (ºC)
Figure 14. On-state resistance vs VCC
Figure 15. Input high level
Ron (mOhm)
Vih (V)
400
3.6
3.4
350
Iout=0.5A
3.2
300
3
250
Tc= 150ºC
2.8
200
2.6
150
Tc= 25ºC
2.4
100
Tc= - 40ºC
50
2.2
2
0
5
10
15
20
25
30
35
40
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Vcc (V)
Doc ID 15610 Rev 4
17/27
Application information
VN800PS-E
Figure 16. Input low level
Figure 17. Turn-on voltage slope
Vil (V)
dVout/dt(on) (V/ms)
2.6
1600
2.4
1400
2.2
1200
2
1000
1.8
800
1.6
600
1.4
400
1.2
200
1
Vcc=24V
Rl=48Ohm
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Tc (°C)
50
75
100
125
150
175
Tc (ºC)
Figure 18. Overvoltage shutdown
Figure 19. Input hysteresis voltage
Vov (V)
Vhyst (V)
50
1.5
48
1.4
46
1.3
44
1.2
42
1.1
40
1
38
0.9
36
0.8
34
0.7
32
0.6
30
0.5
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Tc (°C)
50
75
100
125
150
175
100
125
150
175
Tc (°C)
Figure 20. Turn-off voltage slope
Figure 21. ILIM vs Tcase
Ilim (A)
dVout/dt(off) (V/ms)
2.5
800
2.25
700
Vcc=24V
Rl=48Ohm
600
Vcc=24V
Rl=10mOhm
2
1.75
500
1.5
1.25
400
1
300
0.75
200
0.5
100
0.25
0
0
-50
-25
0
25
50
75
100
125
150
175
18/27
-50
-25
0
25
50
75
Tc (ºC)
Tc (ºC)
Doc ID 15610 Rev 4
VN800PS-E
3.4
Application information
SO-8 maximum demagnetization energy
Figure 22. SO-8 maximum turn off current versus load inductance
ILMAX (A)
10
A
B
1
C
0.1
1
10
100
1000
L(mH )
Note:
Legend
A = Single pulse at TJstart = 150 ºC
B = Repetitive pulse at TJstart = 100 ºC
C = Repetitive Pulse at TJstart = 125 ºC
Conditions:
VCC = 13.5 V
Values are generated with RL = 0 Ω
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse
must not exceed the temperature specified above for curves B and C.
Figure 23. Demagnetization
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Doc ID 15610 Rev 4
19/27
Package and PCB thermal data
VN800PS-E
4
Package and PCB thermal data
4.1
SO-8 thermal data
Figure 24. SO-8 PC board(1)
1. Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm,
Cu thickness = 35 µm, Copper areas: 0.14 cm2, 2 cm2).
Figure 25. SO-8 Rthj-amb vs PCB copper area in open box free air condition
20/27
Doc ID 15610 Rev 4
VN800PS-E
Package and PCB thermal data
Figure 26. SO-8 thermal impedance junction ambient single pulse
ZT H (°C/W)
1000
0.5 cm2
100
2 cm2
10
1
0.1
0.0001
0.001
0.01
0.1
1
T ime (s)
10
100
1000
Figure 27. Thermal fitting model of a single channel HSD in SO-8
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
T_amb
Equation 1 Pulse calculation formula
Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ )
where
δ = tp ⁄ T
Doc ID 15610 Rev 4
21/27
Package and PCB thermal data
Table 15.
22/27
VN800PS-E
Thermal parameter
Area/island (cm2)
0.14
R1 (°C/W)
0.24
R2 (°C/W)
1.2
R3 (°C/W)
4.5
R4 (°C/W)
21
R5 (°C/W)
16
R6 (°C/W)
58
C1 (W.s/°C)
0.00015
C2 (W.s/°C)
0.0005
C3 (W.s/°C)
7.50E-03
C4 (W.s/°C)
0.045
C5 (W.s/°C)
0.35
C6 (W.s/°C)
1.05
Doc ID 15610 Rev 4
2
28
2
VN800PS-E
Package and packing information
5
Package and packing information
5.1
ECOPACK®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.2
SO-8 package information
Table 16.
SO-8 mechanical data
mm
Dim.
Min.
Typ.
A
a1
Max.
1.75
0.1
0.25
a2
1.65
a3
0.65
0.85
b
0.35
0.48
b1
0.19
0.25
C
0.25
0.5
c1
45
D
4.8
5
E
5.8
6.2
e
1.27
e3
3.81
F
3.8
4
L
0.4
1.27
M
0.6
S
8
L1
0.8
Doc ID 15610 Rev 4
1.2
23/27
Package and packing information
VN800PS-E
Figure 28. SO-8 package dimensions
0016023 D
24/27
Doc ID 15610 Rev 4
VN800PS-E
5.3
Package and packing information
SO-8 packing information
The devices can be packed in tube or tape and reel shipments (see the Device summary on
page 1).
Figure 29. SO-8 tube shipment (no suffix)
B
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
C
A
100
2000
532
3.2
6
0.6
All dimensions are in mm.
Figure 30. SO-8 tape and reel shipment (suffix “TR”)
REEL DIMENSIONS
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
2500
2500
330
1.5
13
20.2
12.4
60
18.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
All dimensions are in mm.
12
4
8
1.5
1.5
5.5
4.5
2
End
Start
Top
No components
Components
No components
cover
tape
500mm min
Empty components pockets
saled with cover tape.
500mm min
User direction of feed
Doc ID 15610 Rev 4
25/27
Revision history
6
VN800PS-E
Revision history
Table 17.
26/27
Document revision history
Date
Revision
Changes
21-Apr-2009
1
Initial release
31-May-2010
2
Updated Features list.
Updated Table 3: Absolute maximum ratings.
Reformatted entire document.
07-Feb-2011
3
Updated Features list.
Updated following tables:
– Table 4: Thermal data
– Table 16: SO-8 mechanical data
18-Sep-2013
4
Updated Disclaimer.
Doc ID 15610 Rev 4
VN800PS-E
Please Read Carefully:
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right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
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All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
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UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
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