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VN808SR_08

VN808SR_08

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

  • 描述:

    VN808SR_08 - Octal channel high side driver - STMicroelectronics

  • 数据手册
  • 价格&库存
VN808SR_08 数据手册
VN808SR Octal channel high side driver Features Type VN808SR ■ ■ ■ ■ ■ ■ ■ ■ ■ RDS(on) 150 mΩ Iout 0.7 A VCC 45 V VCC/2 compatible input Junction over-temperature protection Case over-temperature protection for thermal independence of the channels Current limitation Shorted load protection Undervoltage shut-down Protection against loss of ground Very low stand-by current Compliance to 61000-4-4 IEC test up to 4 kV PowerSO-36 Description The VN808SR is a monolithic device designed in STMicroelectronics VIPower M0-3 technology, intended for driving any kind of load with one side connected to ground. Figure 1. Block diagram Active current limitation combined with thermal shutdown and automatic restart, protect the device against overload. In overload condition, the channel turns OFF and back ON automatically so as to maintain the junction temperature between TTSD and TR. If this condition makes the case temperature reach TCSD, the overloaded channel is turned OFF and restarts only when the case temperature has decreased to TCR (see waveform 3 Figure 7 on page 10). Non overloaded channels continue to operate normally. The device automatically turns OFF in the case of a ground pin disconnection. This device is especially suitable for industrial applications and conforms to IEC 61131. July 2008 Rev 4 1/17 www.st.com 17 Contents VN808SR Contents 1 2 3 4 5 6 7 8 9 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Current, voltage conventions and internal diagram . . . . . . . . . . . . . . . 8 Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2/17 VN808SR Maximum ratings 1 Maximum ratings Table 1. Symbol VCC -IGND IOUT -IOUT IIN VIN VESD PTOT LMAX TJ TC TSTG DC supply voltage DC ground pin reverse current TRAN ground pin reverse current (pulse duration < 1 ms) DC output current Reverse DC output current DC Input current Input voltage range Electrostatic discharge (R = 1.5 kΩ; C = 100 pF) Power dissipation at Tc = 25 °C Max inductive load (VCC = 24 V, RLOAD = 48 Ω, TA = 100 °C) Junction operating temperature Case operating temperature Storage temperature Absolute maximum rating Parameter Value 45 -250 -6 Internally limited -2 ± 10 -3/+VCC 2000 96 2 Internally limited Internally limited -40 to 150 Unit V mA A A A mA V V W H °C °C °C Table 2. Symbol RthJC RthJA Thermal data Parameter Thermal resistance junction-case Thermal resistance junction-ambient (1) Value Max Max 1.3 50 Unit °C/W °C/W 1. When mounted on FR4 printed circuit board with 0.5 cm2 of copper area (at least 35 µm think) connected to all TAB pins. 3/17 Electrical characteristics VN808SR 2 Electrical characteristics (10.5 V < VCC < 32 V; -40 °C < TJ < 125 °C; unless otherwise specified) Table 3. Symbol VCC VUSD RON Power section Parameter Operating supply voltage Undervoltage shutdown On state resistance IOUT = 0.5 A; TJ = 25 °C IOUT = 0.5 A; OFF state; VCC = 24 V; TCASE = 25 °C ON state (all channels ON); VCC = 24 V, TCASE = 100 °C VCC = VSTAT = VIN = VGND = 24 V VOUT = 0 V VIN = VOUT = 0 V; Table 7. 0 1 Test conditions Min 10.5 7 150 Typ Max 45 10.5 185 280 150 12 Unit V V mΩ mΩ µA mA IS Supply current ILGND IL(off) td(Vccon) Output current at turn-off OFF state output current Power-on delay time from VCC rising edge 1 5 mA µA ms Table 4. Symbol tON tOFF Switching (VCC = 24 V) Parameter Turn-on time Turn-off time Test conditions RL = 48 Ω from 80% VOUT Figure 5. RL = 48 Ω to 10% VOUT Figure 5. RL = 48 Ω from VOUT = 2.4 V to VOUT = 19.2 V Figure 5. RL = 48 Ω from VOUT = 21.6 V to VOUT = 2.4 V Figure 5. Min Typ 50 75 0.7 1.5 Max 100 150 Unit µs µs V/µs V/µs dVOUT/dt(on) Turn-on voltage slope dVOUT/dt(off) Turn-off voltage slope 4/17 VN808SR Electrical characteristics Table 5. Symbol VINL IINL VINH IINH VI(HYST) IIN Input pin Parameter Input low level Low level input current Input high level High level input current Input hysteresis voltage Input current VIN = VCC = 32 V VIN = VCC / 2 + 1 V VIN = VCC / 2 - 1 V 80 VCC /2+1 150 0.6 300 260 Test conditions Min Typ Max VCC /2-1 Unit V µΑ V µΑ V µΑ Table 6. Symbol TCSD TCR TCHYST TTSD TR THYST Ilim Vdemag Protections Parameter Case shut-down temperature Case reset temperature Case thermal hysteresis Junction shutdown temperature Junction reset temperature Junction thermal hysteresis DC Short circuit current VCC = 24 V; RLOAD = 10 mΩ Test conditions Min 125 110 Typ 130 Max 135 Unit °C °C 7 150 135 7 0.7 15 175 200 °C °C °C 15 1.7 °C A V Turn-off output clamp IOUT = 0.5 A; L = 6mH voltage VCC-57 VCC-52 VCC-47 Table 7. Symbol IHSTAT ILSTAT VCLSTAT Status pin Parameter High level output current Leakage current Clamp voltage Test conditions VCC = 18...32 V; RSTAT = 1 kΩ (Fault condition) Normal operation; VCC = 32 V ISTAT = 1 mA ISTAT = -1 mA 6.0 6.8 -0.7 Min 2 Typ 3 Max 4 0.1 8.0 Unit mA µA V V 5/17 Pin connections VN808SR 3 Pin connections Figure 2. Connection diagram (top view) Table 8. Pin N° TAB 1 2,3,4,5 6 7 8 9 10 11 12 13 Pin functions Symbol VCC VCC NC Input 1 Input 2 Input 3 Input 4 Input 5 Input 6 Input 7 Input 8 NC GND STATUS Output 8 Output 7 Function Positive power supply voltage Positive power supply voltage Not connected Input of channel 1 Input of channel 2 Input of channel 3 Input of channel 4 Input of channel 5 Input of channel 6 Input of channel 7 Input of channel 8 Not connected Logic ground Common open source diagnostic for over-temperature High-side output of channel 8 High-side output of channel 7 14,15,16,17,18 19 20 21,22 23,24 6/17 VN808SR Table 8. Pin N° 25,26 27.28 29,30 31,32 33,34 35,36 Pin connections Pin functions (continued) Symbol Output 6 Output 5 Output 4 Output 3 Output 2 Output 1 Function High-side output of channel 6 High-side output of channel 5 High-side output of channel 4 High-side output of channel 3 High-side output of channel 2 High-side output of channel 1 7/17 Current, voltage conventions and internal diagram VN808SR 4 Current, voltage conventions and internal diagram Figure 3. Current and voltage conventions Figure 4. Equivalent internal block diagram (same structure for all channel) Table 9. Truth table Conditions INPUTn L H L H L H L H OUTPUTn L H L X L L L L STATUS L L L L L H X X Normal operation Current limitation Overtemperature (see waveforms 3, 4 Figure 7) -> TJ > TTSD Undervoltage 8/17 VN808SR Switching time waveforms 5 Switching time waveforms Figure 5. Turn-ON and turn-OFF Figure 6. VCC turn-ON 9/17 Switching time waveforms Figure 7. Waveforms VN808SR 10/17 VN808SR Figure 7. Waveforms (continued) Switching time waveforms 11/17 Reverse polarity protection VN808SR 6 Reverse polarity protection A schematic solution to protect the IC against a reverse polarity condition is proposed. This schematic is effective with any type of load connected to the outputs of the IC. The RGND resistor value can be selected according to the following conditions to be met: 1. 2. RGND ≤ 600 mV / (IS in ON state max). RGND ≥ (-VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. The power dissipation associated to RGNG during reverse polarity condition is: PD = (-VCC)2/RGND This resistor can be shared by several different ICs. In such case IS value on formula (1) is the sum of the maximum ON-state currents of the different devices. Please note that if the microprocessor ground and the device ground are separated then the voltage drop across the RGND (given by IS in ON state max * RGND) produce a difference between the generated input level and the IC input signal level. This voltage drop will vary depending on how many devices are ON in the case of several high side switches sharing the same RGND. Figure 8. Reverse polarity protection + Vcc Status Statusi Inputi GND Outputi RGND (Optional) Load 12/17 VN808SR Package mechanical data 7 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 10. Dim. Min A a1 a2 a3 b c D (1) D1 E E1 (1) E2 E3 e e3 G H h L N S 0° 0.80 0 15.50 5.8 0.65 11.05 0.10 15.90 1.10 1.10 10° 8° 0° 0.031 0.000 0.610 0 0.22 0.23 15.80 9.40 13.90 10.90 0.10 Typ Max 3.60 0.30 3.30 0.10 0.38 0.32 16.00 9.80 14.50 11.10 2.90 6.2 0.228 0.025 0.435 0.0039 0.6260 0.0433 0.0433 10° 8° 0 0.008 0.009 0.622 0.370 0.547 0.429 0.003 Min Typ Max 0.1417 0.0118 0.1299 0.0039 0.0150 0.0126 0.6299 0.3858 0.5709 0.4370 0.1142 0.2441 PowerSO-36 mechanical data mm inch 13/17 Package mechanical data Figure 9. PowerSO-36 drawings VN808SR 14/17 VN808SR Order codes 8 Order codes Table 11. Order codes Order codes VN808SR VN808SR13TR Package PowerSO-36 PowerSO-36 Packaging Tube Tape and reel 15/17 Revision history VN808SR 9 Revision history Table 12. Date 13-Sep-2005 01-Mar-2007 26-Mar-2007 07-Jul-2008 Document revision history Revision 1 2 3 4 Initial release Document reformatted Typo in Figure 3. Added Section 4 on page 8 Changes 16/17 VN808SR Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 17/17
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